Spec. No. JENF243A-0005AA-01
Reference Only
P.1/10
Chip Ferrite Bead BLM21□□□□□□N1□ Reference Specification
1. Scope
This reference specification applies to Chip Ferrite Bead BLM21_□N Series.
2. Part Numbering
(ex.)
BL
(1)
M
(2)
21
(3)
AG
(4)
(1)Product ID
(2)Type
(3)Dimension (L×W)
(4)Characteristics
(5)Typical Impedance at 100MHz
(6)Performance
121
(5)
S
(6)
N
(7)
1
(8)
D
(9)
(7)Category
(8)Numbers of Circuit
(9)Packaging
D:Taping(φ180mm Reel, Paper Tape)
L:Taping(φ180mm Reel, Plastic Tape)
B:Bulk
3. Rating
Customer
Part Number
Impedance (Ω)
DC Resistance
Rated Current
(at 100MHz,Under Standard
(Ω) max.
(mA)(*1)
MURATA
Testing Condition)
Initial
Values
Part Number
Values After
at
at
Typical
Testing
85°C 125°C
BLM21PG220SN1D
*1
*1
22±25%
22
0.009
0.018
6000 3300
BLM21PG220SN1B
BLM21PG300SN1D
*1
*1
20 min.
30
0.014
0.028
4000 2300
BLM21PG300SN1B
BLM21PG600SN1D
*1
*1
60±25%
60
0.02
0.04
3500 1900
BLM21PG600SN1B
BLM21PG121SN1D
*1
*1
120±25%
120
0.03
0.06
3000 1550
BLM21PG121SN1B
BLM21PG221SN1D
*1
*1
220±25%
220
0.045
0.09
2000 1250
BLM21PG221SN1B
BLM21PG331SN1D
*1
*1
330±25%
330
0.07
0.14
1500 1000
BLM21PG331SN1B
BLM21SN300SN1D
*1
*1
30±10Ω
30
0.004
0.005
8500 6000
BLM21SN300SN1B
BLM21SP700SN1D
*1
*1
70±25%
70
0.009
0.012
6000 4000
BLM21SP700SN1B
BLM21SP111SN1D
*1
*1
110±25%
110
0.013
0.016
5000 3300
BLM21SP111SN1B
BLM21SP181SN1D
*1
*1
180±25%
180
0.020
0.025
4000 2600
BLM21SP181SN1B
BLM21SP331SN1D
*1
*1
330±25%
330
0.040
0.051
2800 1900
BLM21SP331SN1B
BLM21SP471SN1D
*1
*1
470±25%
470
0.050
0.063
2500 1700
BLM21SP471SN1B
BLM21SP601SN1D
*1
*1
600±25%
600
0.060
0.074
2300 1500
BLM21SP601SN1B
BLM21SP102SN1D
*1
*1
1000±25%
1000
0.120
0.144
1600 1100
BLM21SP102SN1B
BLM21RK121SN1D
120±25%
120
200
0.15
0.25
BLM21RK121SN1B
BLM21RK221SN1D
220±25%
220
200
0.20
0.30
BLM21RK221SN1B
BLM21RK471SN1D
470±25%
470
200
0.25
0.35
BLM21RK471SN1B
BLM21RK601SN1D
600±25%
600
200
0.30
0.40
BLM21RK601SN1B
BLM21RK102SN1D
1000±25%
1000
200
0.50
0.60
BLM21RK102SN1B
MURATA MFG.CO., LTD.
Remark
For DC
power line
For
Digital
Interface
Spec. No. JENF243A-0005AA-01
Customer
Part Number
Reference Only
MURATA
Part Number
BLM21BB050SN1D
BLM21BB050SN1B
BLM21BB600SN1D
BLM21BB600SN1B
BLM21BB750SN1D
BLM21BB750SN1B
BLM21BB121SN1D
BLM21BB121SN1B
BLM21BD121SN1D
BLM21BD121SN1B
BLM21BB151SZ1D
BLM21BB151SZ1B
BLM21BD151SN1D
BLM21BD151SN1B
BLM21BB201SN1D
BLM21BB201SN1B
BLM21BB221SN1D
BLM21BB221SN1B
BLM21BD221SN1D
BLM21BD221SN1B
BLM21BB331SN1D
BLM21BB331SN1B
BLM21BD331SN1D
BLM21BD331SN1B
BLM21BD421SN1D
BLM21BD421SN1B
BLM21BB471SN1D
BLM21BB471SN1B
BLM21BD471SN1D
BLM21BD471SN1B
BLM21BD601SN1D
BLM21BD601SN1B
BLM21BD751SN1D
BLM21BD751SN1B
BLM21BD102SN1D
BLM21BD102SN1B
BLM21BD152SN1D
BLM21BD152SN1B
BLM21BD182SN1D
BLM21BD182SN1B
BLM21BD222SN1L
BLM21BD222SN1B
BLM21BD222TN1D
BLM21BD222TN1B
BLM21BD272SN1L
BLM21BD272SN1B
Total page 3/16
P.2/10
DC Resistance
Impedance (Ω)
(Ω) max.
(at 100MHz,Under Standard
Rated Current
Testing Condition)
Initial
Values
(mA)
Values After
Typical
Testing
5±25%
5
1000
0.02
0.04
60±25%
60
800
0.13
0.23
75±25%
75
700
0.16
0.26
120±25%
120
600
0.19
0.29
120±25%
120
350
0.25
0.35
150±25%
150
600
0.21
0.31
150±25%
150
350
0.25
0.35
200±25%
200
500
0.26
0.36
220±25%
220
500
0.26
0.36
220±25%
220
350
0.25
0.35
330±25%
330
400
0.33
0.43
330±25%
330
300
0.3
0.4
420±25%
420
300
0.3
0.4
470±25%
470
400
0.40
0.50
470±25%
470
300
0.35
0.45
600±25%
600
300
0.35
0.45
750±25%
750
250
0.4
0.5
1000±25%
1000
250
0.4
0.5
1500±25%
1500
250
0.45
0.55
1800±25%
1800
250
0.5
0.6
1600 min.
2250
250
0.6
0.7
2200±25%
2200
200
0.6
0.7
2700±25%
2700
200
0.8
0.9
MURATA MFG.CO., LTD.
Remark
For
high speed
signal line
Spec. No. JENF243A-0005AA-01
Customer
Part Number
Reference Only
MURATA
Part Number
Total page 3/16
P.3/10
DC Resistance
Impedance (Ω)
(Ω) max.
(at 100MHz,Under Standard
Rated Current
Testing Condition)
Initial
Values
(mA)
Values After
Typical
Testing
BLM21AG121SN1D
BLM21AG121SN1B
BLM21AG151SN1D
BLM21AG151SN1B
BLM21AG221SN1D
BLM21AG221SN1B
BLM21AG331SN1D
BLM21AG331SN1B
BLM21AG471SN1D
BLM21AG471SN1B
BLM21AG601SN1D
BLM21AG601SN1B
BLM21AG102SN1D
BLM21AG102SN1B
120±25%
120
1000
0.09
0.19
150±25%
150
1000
0.09
0.19
220±25%
220
900
0.12
0.22
330±25%
330
800
0.15
0.25
470±25%
470
700
0.18
0.28
600±25%
600
700
0.2
0.3
1000±25%
1000
600
0.27
0.37
For
general
use
• Storage Temperature : -55°C to +125°C
R a te d C u rr e n t ( A )
• Operating Temperature : -55°C to +125°C
Remark
(Note)As for Rated current marked with *1,
Rated Current is derated as right figure
depending on the operating temperature.
85℃
x
Describe the Rated current as x[A]
in case of more than 1A.
1
125℃
0
85
125
Operating Temperature (°C)
4. Style and Dimensions
L
W
■ Equivalent Circuit
T
E
:Electrode
(
)
Resistance element becomes
dominant at high frequencies.
■ Unit Mass (Typical value)
0.010g
0.014g ( for 21BD222SN1□/21BD272SN1□)
L
2.0±0.2
W
T
E
0.85±0.2
0.5±0.2
1.25±0.2 for 21BD222SN1□
21BD272SN1□ for 21BD272SN1□
1.25±0.2
0.3±0.2
(in mm)
5. Marking
No marking.
6.Standard Testing Conditions
< Unless otherwise specified >
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
< In case of doubt >
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005AA-01
Reference Only
P.4/10
7. Specifications
7-1.Electrical Performance
No.
Item
7-1-1 Impedance
Specification
Meet item 3.
7-1-2 DC Resistance
Meet item 3.
Test Method
Measuring Frequency : 100MHz±1MHz
Measuring Equipment :
KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
Measuring Equipment : Digital multi meter
* Except resistance of the Substrate and Wire
7-2. Mechanical Performance
No.
Item
7-2-1 Appearance and
Dimensions
7-2-2 Bonding
Strength
Specification
Meet item 4.
Test Method
Visual Inspection and measured with Slide Calipers.
Meet Table 1.
It shall be soldered on the substrate.
Applying Force(F) : 9.8N
Applying Time : 5s±1s
Applied direction:Parallel to substrate
Table 1
Appearance
Impedance
Change
(at 100MHz)
DC
Resistance
No damage
Side view
F
Within ±30%
F
R0.5
Meet item 3.
Substrate
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm×40mm×1.6mm
Deflection: 1.0mm
Speed of Applying Force : 0.5mm/s
Pressure jig
Keeping Time : 30s
R340
F
Deflection
45mm
7-2-4 Vibration
7-2-5 Resistance
to Soldering
Heat
Meet Table 2.
Table 2
Appearance
No damage
Impedance
Within ±30%
Change
(for BLM21SN
(at 100MHz) Within ±50%)
DC
Meet item 3.
Resistance
7-2-6 Drop
Products shall be no failure
after tested.
7-2-7 Solderability
The electrodes shall be at
least 95% covered with new
solder coating.
45mm
Product
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
Pre-Heating : 150°C±10°C, 60s~90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition
for 48h±4h.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction(Total 9 times)
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s~90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 4s±1s
Immersion and emersion rates : 25mm/s
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005AA-01
Reference Only
P.5/10
7-3. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
7-3-1 Temperature
Meet Table 2.
Cycle
Test Method
1 cycle :1 step : -55 °C(+0 °C,-3 °C) / 30min±3min
2 step : Ordinary temp. / 10min to 15min
3 step : +125 °C(+3 °C,-0 °C) / 30min±3min
4 step : Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : 125°C±3°C
(in case of Rated current is more than 1A,
do the test at : +85 °C±3°C)
Applying Current : Rated Current
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : -55°C±2°C
Total page 6/16
Time : 1000h(+48h,-0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-2 Humidity
7-3-3 Heat Life
7-3-4 Cold
Resistance
8. Specification of Packaging
8-1. Appearance and Dimensions
Appearance and Dimensions
Part Number
Type
BLM21
except
21BD222SN1L
21BD272SN1L
8mmwide
Paper
tape
1.1
max.
8mmBLM21BD222SN1L wide
BLM21BD272SN1L Plastic
tape
1.3
±0.1
+0.1
2.25±0.1
3.5±0.05
φ 1.5 -0
Plastic Tape
a
0.2±0.1
Paper Tape
8.0±0.3
2.0±0.05
4.0±0.1
4.0±0.1
1.75±0.1
a
1.45±0.1
There are holes in the cavity
of the Plastic tape φ 1.0 +0.3
-0
Direction of feed
a
*Dimension of the Cavity is measured at the bottom side.
(in mm)
Paper tape
Plastic tape
Products shall be packaged in the cavity of the base Products shall be packaged in the each embossed
cavity of 8mm-wide, 4mm-pitch plastic tape
tape of 8mm-wide, 4mm-pitch continuously and
continuously and sealed by cover tape.
sealed by top tape and bottom tape.
Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user.
Spliced point The base tape and top tape have no spliced point.
The cover tape has no spliced point.
-
Cavity
There shall not be burr in the cavity.
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater,
Missing
components and are not continuous. The specified quantity per reel is kept.
number
Taping
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005AA-01
Reference Only
P.6/10
8-2. Tape Strength
(1)Pull Strength
Paper tape
Plastic tape
Top tape
Bottom tape
Plastic tape
Cover tape
5N min.
5N min.
10N min.
(2) Peeling off force of Top tape・Cover tape
Speed of Peeling off
Paper tape
Plastic tape
* Minimum value is typical.
• Case of Paper tape
Peeling off force *
165 to 180 degree
Bottom tape
300mm/min
0.1N to 0.6N
0.2N to 0.7N
• Case of Plastic tape
Top tape
165 to 180 degree
F
Base tape
F
Cover tape
Plastic tape
8-3. Taping Condition
(1) Standard quantity per reel
Type
BLM21(except 21BD222SN1L/21BD272SN1L)
BLM21BD222SN1L/BLM21BD272SN1L
Quantity per 180mm reel
4000 pcs. / reel
3000 pcs. / reel
(2) There shall be leader-tape (cover tape/top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2), Quantity, etc)
∗1) « Expression of Inspection No. »
□□ OOOO ×××
(1) Factory Code
(2) Date
(3) Serial No.
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(1) (2)
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (∗2) ,Quantity, etc)
(6) Dimensions of reel and taping(leader-tape, trailer-tape)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-0005AA-01
P.7/10
8-4. Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
∗ Above Outer Case size is typical. It depends on a quantity of an
order.
9. ! Caution
9-1. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may
cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment
(6) Disaster prevention / crime prevention equipment
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment
(8) Transportation equipment (trains,ships,etc.)
(4) Power plant control equipment
(9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
• Standard land dimensions
< BLM21 series(except BLM21PG/BLM21S type) >
Chip Ferrite Bead
c
a
Solder Resist
b
Pattern
Soldering
Flow
Reflow
a
1.1
1.2
b
3.5
2.4
c
0.95
1.25
(in mm)
< For BLM21PG/BLM21S type >
Chip Ferrite Bead
Rated
Current
(A)
1.5
2
BLM21PG
3~4
6
BLM21S
1~8.5
Type
c
d
a
Land pad thickness
and dimension d
18µm
35µm
70µm
1.25
1.25
1.25
1.25
1.25
1.25
2.4
1.25
1.25
6.4
3.3
1.65
6.8
3.4
b
(in mm)
Solder Resist
Pattern
Soldering
Flow
Reflow
a
1.1
1.2
b
3.5
2.4
c
0.95
1.25
(in mm)
*The excessive heat by land pads may cause deterioration
at joint of products with substrate.
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005AA-01
Reference Only
P.8/10
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux, Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3) soldering profile
□Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
60s min.
Pre-heating
Heating
Cycle of flow
Standard Profile
Time. (s)
Standard Profile
150℃、60s min.
250℃、4~6s
2 times
Limit Profile
265℃±3℃、5s max.
2 times
□Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Standard Profile
150~180°C 、90s±30s
above 220°C、30s~60s
245±3°C
2 times
Time. (s)
Limit Profile
above 230°C、60s max.
260°C,10s
2 times
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005AA-01
Reference Only
P.9/10
10-3. Reworking with soldering iron
• Pre-heating: 150°C, 1 min
• Tip temperature: 350°C max.
• Soldering time : 3(+1,-0) seconds.
• Soldering iron output: 80W max.
• Tip diameter:φ3mm max.
• Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
10-4. Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
1/3T≦t≦T
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
t
Total page
10-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subjected to the mechanical stress for board warpage.
a
b
〈 Poor example 〉
Products shall be located in the sideways
direction (Length:a D *1
A > B
A > C
C
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes
as possible.
Screw Hole
Recommended
MURATA MFG.CO., LTD.
Spec. No. JENF243A-0005AA-01
Reference Only
P.10/10
10-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and
etc (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
10-9. Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or
broken solder joints. Before starting your production process, test your cleaning equipment / process to insure
it does not degrade this product.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
10-11 Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
• Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
• Avoid storing the product by itself bare (i.e.exposed directly to air).
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
11.
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Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve
our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.