BLM31KN601SN1L

Reference Only Spec. No. JENF243A-0006Z-01 P.1/9 Chip Ferrite Bead BLM31□□□□□SN1□ Reference Specification 1. Scope This reference specification applies to Chip Ferrite Bead BLM31_SN Series. 2. Part Numbering (ex.) BL M 31 PG 601 (1) (2) (3) (4) (5) (1)Product ID (2)Type (3)Dimension (L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz S N 1 L (6) (7) (8) (9) (6)Performance (7)Category (8)Numbers of Circuit (9)Packaging (L:Taping / B:Bulk) 3. Rating MURATA Part Number BLM31PG330SN1L BLM31PG330SN1B BLM31PG500SN1L BLM31PG500SN1B BLM31PG121SN1L BLM31PG121SN1B BLM31PG391SN1L BLM31PG391SN1B BLM31PG601SN1L BLM31PG601SN1B BLM31SN500SN1L BLM31SN500SN1B at 85°C at 125°C Initial Values Values After Testing 6000 3500 0.009 0.018 35 min. 3500 2300 0.015 0.03 120±25% 3500 2000 0.02 0.04 390±25% 2000 1250 0.05 0.10 600±25% 1500 1000 0.08 0.16 50±25% 12000 10000 0.0016 0.0021 Remark For DC power line • Operating Temperature: -55°C to +125°C • Storage Temperature: -55°C to +125°C （Note1）Rated Current is derated as right figure depending on the operating temperature. 85℃x Describe the Rated current as x[A] in case of more than 1A. 1 125℃ 0 85 125 Operating Temperature (°C) 4. Style and Dimensions 3.2±0.2 DC Resistance (Ω) max. 33±25% R a te d C u rr e n t ( A ) Customer Part Number Impedance (Ω) (at 100MHz, Under Standard Testing Condition) Rated Current (mA) (Note1) 1.6±0.2 1.1±0.2 ■ Equivalent Circuit 0.7±0.3 ( : Electrode ) Resistance element becomes dominant at high frequencies. ■ Unit Mass (Typical value) (in mm) MURATA MFG.CO., LTD. 0.025 g Reference Only Spec. No. JENF243A-0006Z-01 P.2/9 5.Marking No marking. 6. Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa 7. Specifications 7-1. Electrical Performance No. Item 7-1-1 Impedance Specification Meet item 3. 7-1-2 DC Resistance Meet item 3. Test Method Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire 7-2. Mechanical Performance No. Item 7-2-1 Appearance and Dimensions 7-2-2 Bonding Strength Specification Meet item 4. Test Method Visual Inspection and measured with Slide Calipers. Meet Table 1. It shall be soldered on the substrate. Applying Force(F) : 9.8N Applying Time : 5s±1s Applied direction:Parallel to substrate Table 1 Appearance Impedance Change (at 100MHz) DC Resistance No damage Ｆ Within ±30% Side view Ｆ R0.5 Meet item 3. Substrate 7-2-3 Bending Strength It shall be soldered on the substrate. Substrate: Glass-epoxy 100mm×40mm×1.6mm Deflection: 1.0mm Speed of Applying Force : 0.5mm/s Pressure jig Keeping Time : 30s R340 F Deflection 45mm MURATA MFG.CO., LTD. 45mm Product Reference Only Spec. No. JENF243A-0006Z-01 No. Item Specification 7-2-4 Vibration Meet Table 1. 7-2-5 Resistance to Soldering Heat Meet Table 2. 7-2-6 Drop 7-2-7 Solderability P.3/9 Table 2 Appearance Impedance Change (at 100MHz) DC Resistance Test Method No damage Within ±30% (for BLM31SN within ±50%) It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270°C±5°C Immersion Time : 10s±0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 48h±4h. Meet item 3. Products shall be no failure after It shall be dropped on concrete or steel board. tested. Method : free fall Height : 75cm Attitude from which the product is dropped : 3 direction The number of times : 3 times for each direction (Total 9 times) The electrodes shall be at least Flux : Ethanol solution of rosin,25(wt)% 95% covered with new solder Pre-Heating : 150°C±10°C, 60s～90s coating. Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 4s±1s Immersion and emersion rates : 25mm/s 7-3. Environmental Performance It shall be soldered on the substrate. No. Item Specification 7-3-1 Temperature Meet Table 2. Cycle 7-3-2 Humidity 7-3-3 Heat Life 7-3-4 Cold Resistance Test Method 1 cycle: 1 step: -55 °C(+0 °C,-3 °C) / 30min±3min 2 step: Ordinary temp. / 10min to 15min 3 step: +125 °C(+3 °C,-0 °C) / 30min±3min 4 step: Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48h±4h. Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. Temperature : 85°C±3°C Applying Current : Rated Current Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. Temperature : -55±2°C Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0006Z-01 P.4/9 2.0±0.05 4.0±0.1 4.0±0.1 1.75±0.1 8. Specification of Packaging 8-1. Appearance and Dimensions (8mm-wide plastic tape) φ 1.5+0.1 1.3±0.1 1.3±0.1 0.2±0.1 +0.3 1.9±0.1 8.0±0.3 3.5±0.1 3.5±0.05 -0 Direction of feed φ 1.0- 0 (in mm) *Dimension of the Cavity is measured at the bottom side. (1) Taping Products shall be packaged in the each embossed cavity of 8mm-wide, 4mm-pitch and plastic tape continuously and sealed by cover tape. (2) Sprocket hole : The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point : The cover tape has no spliced point. (4) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8-2. Tape Strength (1)Pull Strength Plastic tape Cover tape 5N min. 10N min. 165 to 180 degree (2) Peeling off force of Cover tape 0.2N to 0.7N (Minimum value is typical.) *Speed of Peeling off:300mm/min F Cover tape Plastic tape 8-3. Taping Condition (1) Standard quantity per reel Quantity per 180mm reel : 3000 pcs. / reel (2) There shall be leader-tape (cover tape only and empty tape ) and trailer- tape (empty tape) as follows. (3) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number (∗1), RoHS marking (∗2) , Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) (4) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2), Quantity, etc) MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0006Z-01 P.5/9 (5) Dimensions of reel and taping (leader-tape, trailer-tape) 8-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. 9. ！ Caution 9-1. Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (6)Disaster prevention / crime prevention equipment (2)Aerospace equipment (7)Traffic signal equipment (3)Undersea equipment (8)Transportation equipment (vehicles,trains,ships,etc.) (4)Power plant control equipment (9) Data-processing equipment (5)Medical equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1. Land pattern designing • Standard land dimensions (Flow and Reflow soldering) Chip Ferrite Bead c Rated Current (A) Type d BLM31PG BLM31SN 1.5/2 3.5 6 10～12 Land pad thickness and dimension d 18µm 1.8 2.4 6.4 - 35µm 1.8 1.8 3.3 9.8 70µm 1.8 1.8 1.8 4.9 (in mm) a *The excessive heat by land pads may cause deterioration at joint of products with substrate. b Solder Resist Pattern Type BLM31PG BLM31SN MURATA MFG.CO., LTD. Soldering Flow Reflow a 2.4 2.0 b 4.7 4.3 c 1.2 1.8 Reference Only Spec. No. JENF243A-0006Z-01 P.6/9 • Land dimensions on Flow soldering for 2.5mm pitch mounting Chip Ferrite Bead *As for BLM31PG type, taking land pad thickness and rated current into account. 2 .5 m m p itc h a 2.4 e e a c 1.2 d 1.3 e 1.35 (in mm) *The pattern shall be designed to above drawing to prevent causing the solder bridge when products are mounted by 2.5mm pitch flow soldering. c b b 4.7 d c e a Solder Resist e b Pattern d 10-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (3) soldering profile □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Pre-heating Heating Cycle of flow Standard Profile Time. (s) Standard Profile 150°C、60s min. 250°C、4～6s 2 times Limit Profile 265°C±3°C、5s max. 2 times MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0006Z-01 P.7/9 □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Limit Profile above 230°C、60s max. 260°C,10s 2 times 10-3. Reworking with soldering iron • Pre-heating: 150°C, 1 min • Tip temperature: 350°C max. • Soldering time : 3(+1,-0) seconds. • Soldering iron output: 80W max. • Tip diameter:φ3mm max. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 10-4. Solder Volume Solder shall be used not to be exceed as shown below. Upper Limit Recommendable t 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 10-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a Products shall be located in the sideways direction (Length:a D *1 A > B A > C C Perforation B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0006Z-01 P.9/9 10-9. Cleaning Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this product. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11. Storage Conditions (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions • Products should be stored the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Avoid storing the product by itself bare (i.e.exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.