Spec No.: JENF243A_9115G-01
P1/9
CHIP FERRITE BEAD BLM31□□□□□SZ1□
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to chip ferrite bead BLM31_SZ series for automotive electronics based on AEC-Q200
except for power trains and safeties.
2. Part Numbering
(Ex.)
BL
M
31
PG
601
S
Z
1
Product Type Dimension Characteristics Impedance Performance Category Numbers
ID
(L × W)
(Typical value
(For
of circuit
at 100 MHz)
automotive)
L
Packaging
L: taping
3. Part Number and Rating
Operating temperature range
Storage temperature range
-55°C to +125°C
-55°C to +125°C
Rated current*1
(mA)
DC resistance
(Ω) max.
Murata
Part number
Impedance
(Ω)
at 100 MHz
BLM31PG330SZ1L
33±25%
6000
3500
0.009
0.018
2
BLM31PG500SZ1L
35 min.
3500
2300
0.015
0.03
2
BLM31PG121SZ1L
120±25%
3500
2000
0.02
0.04
2
BLM31PG391SZ1L
390±25%
2000
1250
0.05
0.10
2
BLM31PG601SZ1L
600±25%
1500
1000
0.08
0.16
2
BLM31SN500SZ1L
50±25%
12000
10000
0.0016
0.0021
2
Customer
Part number
ESD
rank
Ambient
Ambient
Values after 2: 2 kV
temperature temperature Initial values
testing
85°C
125°C
*1 As shown in the diagram below, derating is applied to the rated current based on the operating temperature.
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
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Spec No.: JENF243A_9115G-01
P2/9
5. Appearance and Dimensions
Equivalent circuit
Unit mass (typical value): 0.025 g
6. Marking
No marking.
7. Electrical Performance
No.
Item
7.1
Impedance
Meet chapter 3 ratings.
Specification
Measuring equipment: Keysight 4291A or the
equivalent
Measuring frequency: 100 MHz±1 MHz
Measuring fixture: Keysight 16192A or the equivalent
Test method
7.2
DC resistance
Meet chapter 3 ratings.
Measuring equipment: digital multimeter
Substrate wiring resistance is excluded.
8. AEC-Q200 Requirement
8.1 Performance [(based on table 13 for filter EMI suppressors/filters) AEC-Q200 Rev.D issued June 1,
2010]
AEC-Q200
No.
3
Stress
High
temperature
exposure
Murata specification/deviation
Test method
1000 h at 125°C
Set for 24 h at room condition, then
measured.
Meet table A after testing.
Table A
Appearance
No damage
Impedance change
(at 100 MHz)
Within ±30% (within ±50% for
BLM31SN)
DC Resistance
Meet chapter 3 ratings.
4
Temperature
cycling
1000 cycles
-55°C to +125°C
Set for 24 h at room condition, then
measured.
Meet table A after testing.
5
Destructive
physical
analysis
Per EIA469
No electrical tests
No defects
7
Biased humidity 1000 h at 85°C, 85% (RH).
Apply max rated current.
Set for 24 h at room condition, then
measured.
Meet table A after testing.
8
Operational life
Apply 125°C 1000 h
Set for 24 h at room condition, then
measured.
Meet table A after testing.
If the rated current of parts exceed 1A, the operating
temperature should be 85 °C.
9
External visual
Visual inspection
No abnormalities
10
Physical
dimension
Meet chapter 5, "Appearance and
Dimensions".
No defects
12
Resistance to
solvents
Per MIL-STD-202
Method 215
Not applicable
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Spec No.: JENF243A_9115G-01
P3/9
AEC-Q200
No.
Stress
13
Mechanical
shock
Murata specification/deviation
Test method
Per MIL-STD-202
Method 213
Condition F:
1500 g’s (14.7 N), 0.5 ms, half sine
Meet table B after testing.
Table B
Appearance
No damage
Impedance change
(at 100 MHz)
Within ±30%
DC Resistance
Meet chapter 3 ratings.
14
Vibration
5 g's (0.049 N) for 20 min, 12 cycles
each of 3 orientations
Test from 10 Hz to 2000 Hz
Meet table B after testing.
15
Resistance to
soldering heat
Solder temperature
260°C±5°C
Immersion time 10 s
Pre-heating: 150°C±10°C, 60 s to 90 s
Meet table A after testing.
17
ESD
Per AEC-Q200-002
Meet table A after testing.
ESD rank: Refer to chapter 3 ratings.
18
Solderability
Per J-STD-002
Method b: not applicable
95% of the terminations is to be soldered.
19
Electrical
Measured: impedance
characterization
No defects
20
Flammability
Per UL-94
Not applicable
21
Board flex
Epoxy-PCB (1.6 mm)
Deflection 2 mm (min.)
60 s minimum holding time
Meet table B after testing.
22
Terminal
strength
Per AEC-Q200-006
No defects
30
Electrical
transient
conduction
Per ISO-7637-2
Not applicable
9. Specification of Packaging
9.1 Appearance and dimensions of tape (8 mm width/plastic tape)
A
1.9±0.1
B
3.5±0.1
t
1.3±0.1
t'
0.2±0.1
(in mm)
* The dimensions of the cavity are measured at its bottom.
9.2 Taping specifications
Packing quantity
(Standard quantity)
3000 pcs/reel
Packing method
The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom
tape when the cavities of the carrier tape are punched type).
Feed hole position
The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
Joint
The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are
seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
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Spec No.: JENF243A_9115G-01
P4/9
9.3 Break down force of tape
Cover tape (or top tape)
10 N min.
Bottom tape (only when the cavities of the carrier tape are punched
type)
5 N min.
9.4 Peeling off force of tape
Speed of peeling off
Peeling off force
300 mm/min
0.2 N to 0.7 N (The lower limit is for typical value.)
9.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
9.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
(2) Date
□□
○○○○
First digit: year/last digit of year
(1)
(2)
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHSY
()
(2) Murata classification number
(1)
(2)
9.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
9.8 Specification of outer box
Label
H
D
W
Dimensions of outer box
(mm)
W
D
H
186
186
93
Standard reel quantity
in outer box (reel)
5
* Above outer box size is typical. It depends on a
quantity of an order.
MURATA MFG CO., LTD
Spec No.: JENF243A_9115G-01
10.
P5/9
Caution
10.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea
(4) Power plant
equipment
control equipment
(5) Medical equipment
(6) Transportation equipment (7) Traffic signal
(8) Disaster/crime
(trains, ships, etc.)
equipment
prevention
equipment
(9) Data-processing
(10) Applications of similar complexity and/or
equipment
reliability requirements to the applications listed in
the above
10.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
10.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the
abnormal function or the failure of our product.
10.4 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
10.5 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.
11. Precautions for Use
This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a
conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
11.1 Land dimensions
The following diagram shows the recommended land dimensions for flow and reflow soldering:
a
Flow
Reflow
2.4
2.0
b
4.7
4.3
c
1.2
1.8
(in mm)
Pattern thickness and
dimension d
Type
Rated
current
(A)
BLM31PG
1.5/2
BLM31PG
3.5
2.4
1.8
1.8
BLM31PG
6
6.4
3.3
1.8
BLM31SN
10 to 12
-
9.8
4.9
18 μm
35 μm
70 μm
1.8
1.8
1.8
If heat generation from patterns is large, please pay attention
since the joint of products with substrates may deteriorate.
(in mm)
*If products are mounted by 2.5 mm pitch flow soldering, design the pattern so the pattern is in a staggered arrangement as
shown below to prevent solder bridges.
MURATA MFG CO., LTD
Spec No.: JENF243A_9115G-01
P6/9
*For BLM31PG types, consider the pattern thickness
and rated current.
a
b
c
d
e
2.4
4.7
1.2
1.3
1.35
(in mm)
11.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 200 μm
If you want to use a flux other than the above, please consult our technical department.
11.3 Soldering conditions (flow, reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
(1) Flow
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
60s min.
Standard Profile
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C/60 s min.
150°C/60 s min.
Heating
250°C/4 s to 6 s
265°C±3°C/5 s
2 times
2 times
Number of flow cycles
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Spec No.: JENF243A_9115G-01
P7/9
(2) Reflow
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
150°C to 180°C/90 s±30 s
Heating
Above 220°C/30 s to 60 s
Above 230°C/60 s max.
245°C±3°C
260°C/10 s
2 times
2 times
Peak temperature
Number of reflow cycles
11.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
Pre-heating
Tip temperature of soldering iron
150°C/approx. 1 min
350°C max.
Power consumption of soldering iron
Tip diameter of soldering iron
Soldering time
Number of reworking operations
80 W max.
ø3 mm max.
3 s (+1 s, -0 s)
2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal
shock.
11.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
11.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
〈 Poor example〉
〈 Good example〉
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Spec No.: JENF243A_9115G-01
P8/9
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D*1
(2) Add slits in the board separation part.
A>B
(3) Keep the mounting position of the component away from the
board separation surface.
A>C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
11.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.8 Cleaning
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder
joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this
product.
MURATA MFG CO., LTD
Spec No.: JENF243A_9115G-01
P9/9
11.9 Storage and transportation
Storage period
Use the product within 6 months after delivery.
If you do not use the product for more than 6 months, check solderability before using it.
Storage conditions
• The products shall be stored in a room not subject to rapid changes in temperature and
humidity. The recommended temperature range is -10°C to +40°C. The recommended relative
humidity range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the
poor solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
11.10 Resin coating (including moisture-proof coating)
When the product is coated/molded with resin, its electrical characteristics may change.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc.
Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading
to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
11.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,
misalignment, or damage to the product.
11.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
11.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,
resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that
the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating
temperature for the product.
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD