Spec. No. JENF243A-9105K-01
Reference Only
P.1/9
Chip Ferrite Bead BLM31□□□□□SH1L
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM31_SH Series based on
AEC-Q200.
2. Part Numbering
(ex.)
BL
M
31
(1)
(2)
(3)
(1)Product ID
(2)Type
(3)Dimension (L×W)
PG
601
S
H
1
L
(4)
(5)
(6) (7) (8)
(9)
(4)Characteristics
(5)Typical Impedance at 100MHz
(6)Performance
(7)Category (for Automotive Electronics)
(8)Numbers of Circuit
(9)Packaging (L:Taping / B:Bulk)
3. Rating
Rated
Rated
DC
DC
Current
Current Resistance Resistance ESD Rank
Customer
MURATA
Initial
After
5B:12kV
at 85℃
at 125℃
Part Number
Part Number
Testing
Values
6:25kV
(mA)
(mA)
()max.
()max.
(Note1)
(Note1)
BLM31PG330SH1L
33±25%
6000
3500
0.009
0.018
6
BLM31PG330SH1B
33±25%
6000
3500
0.009
0.018
6
BLM31PG500SH1L
35 min.
3500
2300
0.015
0.03
6
BLM31PG500SH1B
35 min.
3500
2300
0.015
0.03
6
BLM31PG121SH1L
120±25%
3500
2000
0.02
0.04
6
BLM31PG121SH1B 120±25%
3500
2000
0.02
0.04
6
BLM31PG391SH1L
390±25%
2000
1250
0.05
0.10
6
BLM31PG391SH1B 390±25%
2000
1250
0.05
0.10
6
BLM31PG601SH1L
600±25%
1500
1000
0.08
0.16
6
BLM31PG601SH1B 600±25%
1500
1000
0.08
0.16
6
BLM31SN500SH1L
50±12.5Ω
12000
10000
0.0016
0.0021
6
BLM31SN500SH1B 50±12.5Ω
12000
10000
0.0016
0.0021
6
BLM31KN121SH1L 120±25%
6000
4000
0.009
0.011
6
BLM31KN121SH1B 120±25%
6000
4000
0.009
0.011
6
BLM31KN271SH1L 270±25%
4500
3000
0.016
0.019
6
BLM31KN271SH1B 270±25%
4500
3000
0.016
0.019
6
BLM31KN471SH1L 470±25%
4000
2700
0.02
0.024
6
BLM31KN471SH1B 470±25%
4000
2700
0.02
0.024
6
BLM31KN601SH1L
600±25%
2900
2000
0.038
0.045
6
BLM31KN601SH1B
600±25%
2900
2000
0.038
0.045
6
BLM31KN801SH1L
800±25%
2500
1700
0.05
0.06
6
BLM31KN801SH1B
800±25%
2500
1700
0.05
0.06
6
BLM31KN102SH1L 1000±25%
2000
1400
0.075
0.09
6
BLM31KN102SH1B 1000±25%
2000
1400
0.075
0.09
6
BLM31AJ601SH1L
600±25%
200
200
0.9
1.0
5B
BLM31AJ601SH1B
600±25%
200
200
0.9
1.0
5B
Operating Temperature: -55°C to +125°C
Storage Temperature: -55°C to +125°C
Impedance
()
(at 100MHz)
Standard Testing Conditions
(Note1) Rated Current is derated as right figure
depending on the operating temperature.
In case of doubt
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
R a te d C u r re n t ( A )
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
85℃x
Describe the Rated current as x[A]
in case of more than 1A.
1
125℃
0
85
125
Operating Temperature (°C)
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9105K-01
P.2/9
4. Style and Dimensions
3.2 ±0.2
1.6 ±0 .2
■ Equivalent Circuit
T
0 .7 ±0 .3
(
: Electrode
Item
BLM31PG***SH1*
BLM31SN***SH1*
BLM31KN***SH1*
BLM31AJ***SH1*
Dimension “T”
1.1±0.2
1.1±0.2
1.6±0.2
1.1±0.2
)
Resistance element becomes
dominant at high frequencies.
■ Unit Mass (Typical value)
BLM31PG***SH1* : 0.025 g
BLM31SN***SH1* : 0.025 g
BLM31KN***SH1* : 0.041 g
BLM31AJ***SH1* : 0.025 g
(in mm)
5.Marking
No marking.
6. Specifications
6-1. Electrical
No.
Item
6-1-1 Impedance
Specification
Meet item 3.
6-1-2 DC Resistance
Meet item 3.
Test Method
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
6-2. Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/ FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200
No.
Stress
Test Method
3 High
1000hours at 125 deg C
Temperature
Set for 24hours at room
Exposure
temperature, then
measured.
4 Temperature Cycling
Murata Specification / Deviation
Meet Table A after testing.
Table A
Appearance
Impedance
Change
(at 100MHz)
DC
Resistance
No damage
Within ±30%
(for BLM31SN, KN within±50%)
Meet item 3.
1000cycles
-55 deg C to +125 deg C
Set for 24hours at room
temperature, then
measured.
Per EIA469
No electrical tests
Meet Table A after testing.
7 Biased Humidity
1000hours at 85 deg C,
85%RH
Apply max rated current.
Meet Table A after testing.
8 Operational Life
Apply 125 deg C
1000hours
Set for 24hours at room
temperature, then
measured
Meet Table A after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
5 Destructive
Physical Analysis
No defects
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9105K-01
AEC-Q200
No.
Stress
9 External Visual
Murata Specification / Deviation
Test Method
Visual inspection
10 Physical Dimension
P.3/9
No abnormalities
Meet ITEM 4
No defects
(Style and Dimensions)
12 Resistance to Solvents Per MIL-STD-202 Method Not Applicable
215
13 Mechanical Shock
Per MIL-STD-202 Method Meet Table B after testing.
213
Table B
Condition F:
1500g’s(14.7N)/0.5ms/
Appearance
No damage
Half sine
Impedance
Change
Within ±30%
(at 100MHz)
DC
Meet item 3.
Resistance
14 Vibration
17 ESD
5g's(0.049N) for 20
minutes, 12cycles each of
3 orientations
Test from 10-2000Hz.
Solder temperature
260C+/-5 deg C
Immersion time 10s
Per AEC-Q200-002
18 Solderability
Per J-STD-002
19 Electrical
Characterization
20 Flammability
21 Board Flex
Measured : Impedance
15 Resistance
to Soldering Heat
Meet Table B after testing.
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table A after testing.
Meet Table A after testing.
ESD Rank: Refer to Item 3. Rating
Method b : Not Applicable
95% of the terminations is to be soldered.
No defects
Per UL-94
Not Applicable
Epoxy-PCB(1.6mm)
Meet Table B after testing.
Deflection 2mm(min)
60s minimum holding time
Per AEC-Q200-006
No defects
Per ISO-7637-2
Not Applicable
7. Specification of Packaging
7-1. Appearance and Dimensions (8mm-wide plastic tape)
1.5+0.1
-0
3.5±0.1
3.5±0.05
2.0±0.05
4.0±0.1
4.0±0.1
+0.3
1.0- 0
1.9±0.1
1.3±0.1
0.2±0.1
8.0±0.3
30 Electrical
Transient
Conduction
1.75±0.1
22 Terminal Strength
Direction of feed
Item
Dimension “T”
BLM31PG***SH1*
1.3±0.1
BLM31SN***SH1*
1.3±0.1
BLM31KN***SH1*
1.75±0.1
BLM31AJ***SH1*
1.3±0.1
(in mm)
*Dimension of the Cavity is measured at the bottom side.
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9105K-01
P.4/9
(1) Taping
Products shall be packaged in the each embossed cavity of 8mm-wide, 4mm-pitch and plastic tape
continuously and sealed by cover tape.
(2) Sprocket hole : Sprocket hole shall be located on the left hand side toward the direction of feed.
(3) Spliced point : The cover tape has no spliced point.
(4) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
7-2. Tape Strength
(1) Pull Strength
Plastic tape
Cover tape
5N min.
10N min.
165 to 180 degree
(2) Peeling off force of Cover tape
0.2N to 0.7N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
F
Cover tape
Plastic tape
7-3. Taping Condition
(1) Standard quantity per reel
Type
BLM31PG/BLM31SN/BLM31AJ
BLM31KN
Quantity per 180mm reel
3000 pcs. / reel
2500 pcs. / reel
(2) There shall be leader-tape (cover tape only and empty tape ) and trailer- tape (empty tape) as follows.
(3) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number (1), RoHS marking (2), Quantity, etc)
1) « Expression of Inspection No. »
□□ OOOO
(1) Factory Code
(2) Date
(3) Serial No.
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(1) (2)
(4) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2), Quantity, etc)
(5) Dimensions of reel and taping (leader-tape, trailer-tape)
Trailer
160 min.
2.0±0.5
Leader
Label
190 min.
210 min.
Empty tape
Cover tape
13.0±0.2
+1
60 -0
21.0±0.8
9.0 +1
-0
Direction of feed
13.0±1.4
(in mm)
+0
180 -3
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9105K-01
P.5/9
7-4. Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity of an order.
8. ! Caution
8-1. Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product
may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3. Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment
(6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment
(7)Traffic signal equipment
(3)Undersea equipment
(8)Transportation equipment (trains, ships, etc.)
(4)Power plant control equipment
(9)Applications of similar complexity and /or reliability requirements
(5)Medical equipment
to the applications listed in the above
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1. Land pattern designing
Standard land dimensions (Flow and Reflow soldering)
< BLM31AJ type >
Chip Ferrite Bead
1.2
Solder Resist
2.0
Pattern
4.2 to 5.2
(in mm)
< BLM31PG/BLM31SN/BLM31KN type >
Chip Ferrite Bead
Land pad thickness and
dimension a
18µm
35µm
70µm
1.5/2
1.2
1.2
1.2
BLM31PG
3.5
2.4
1.2
1.2
BLM31KN
6
6.4
3.3
1.65
-
9.8
4.9
BLM31SN 10~12
(in mm)
*The excessive heat by land pads may cause
deterioration at joint of products with substrate.
Type
a
1.2
2.0
4.2 to 5.2
Solder Resist
Pattern
MURATA MFG.CO., LTD.
Rated
Current
(A)
Reference Only
Spec. No. JENF243A-9105K-01
P.6/9
Land dimensions on Flow soldering for 2.5mm pitch mounting
Chip Ferrite Bead
*As for BLM31PG type, taking land pad thickness
and rated current into account.
2 .5 m m p itc h
a
2.0
e
e
a
c
1.2
d
1.3
e
1.35
(in mm)
*The pattern shall be designed to above drawing to
prevent causing the solder bridge when products
are mounted by 2.5mm pitch flow soldering.
c
b
b
4.2 to 5.2
d
c
e
a
Solder Resist
e
b
Pattern
d
9-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3) soldering profile
□Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
60s min.
Pre-heating
Heating
Cycle of flow
Standard Profile
150℃、60s min.
250℃、4~6s
2 times
Standard Profile
Time. (s)
Limit Profile
265℃±3℃、5s max.
2 times
MURATA MFG.CO., LTD.
Reference Only
Spec. No. JENF243A-9105K-01
□Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Standard Profile
150~180°C 、90s±30s
above 220°C、30s~60s
245±3°C
2 times
9-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min
Tip temperature: 350°C max.
Soldering time : 3 (+1, -0) seconds.
Time. (s)
Limit Profile
above 230°C、60s max.
260°C, 10s
2 times
Soldering iron output: 80W max.
Tip diameter: φ3mm max.
Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4. Solder Volume
Solder shall be used not to be exceed as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦T
(T: Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
9-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
a
Products shall be located in the sideways
direction (Length: ab) to the mechanical
stress.
b
〈 Poor example 〉
〈 Good example 〉
MURATA MFG.CO., LTD.
P.7/9
Reference Only
Spec. No. JENF243A-9105K-01
P.8/9
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
Perforation
Stress Level
A > D *1
A > B
A > C
C
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Screw Hole
Recommended
9-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to
use, please make the reliability evaluation with the product mounted in your application set.
MURATA MFG.CO., LTD.
Spec. No. JENF243A-9105K-01
Reference Only
P.9/9
9-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3) Cleaner
1.Alternative cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
9-11. Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10 .
! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD.