BNX028-01L

Spec.No. Reference Only JENF243H-0008N-01 SMD Block Type EMIFIL P 1/ 15 BNX02□-01□ Reference Specification 1.Scope This reference specification applies to SMD Block Type EMIFIL. 2.Part Numbering BN Product ID X Type 022 Serial No. -01 Features L Packaging Code (L :Taping(178mm reel) / K :Taping(330mm reel) / B :Bulk) 3.Rating Customer’s Part Number Part Number BNX022-01L BNX022-01K BNX022-01B BNX023-01L BNX023-01K BNX023-01B BNX028-01L BNX028-01K BNX028-01B BNX029-01L BNX029-01K BNX029-01B Withstandin Rated DC Insulation Current Insertion Loss g Resistance Resistance  Voltage 35dB min. 0.43m 500M 125V 20A (1MHz to (DC) (DC) ±0.20m min. 1GHz) Capacitance Rated Voltage 1.0µF±15% 50V (DC) 1.0µF±15% 100V (DC) 250V (DC) 20A (DC) 0.43mΩ ±0.20mΩ 500MΩ min. 20 47μF±50% 16V (DC) 40V (DC) 20A (DC) 0.43mΩ ±0.20mΩ 1.1MΩ min. 20 100μF±50% 6.3V (DC) 15.8V (DC) 20A (DC) 0.43mΩ ±0.20mΩ 0.5MΩ min. 35dB min. (1MHz to 1GHz) 35dB min. （30KHz～ 1GHz） 35dB min. （15KHz～ 1GHz）  Rated current is derated according to operating temperature. BNX028-01 Rated Current (A) Rated Current (A) BNX022-01 BNX023-01 BNX029-01 15 20 15 20 1 1 85 85 65 125 Operating Temperature (°C) Operating Temperature (°C)  Operating Temperature : - 40 °C to + 125 °C 125 105 (BNX022-01/ BNX023-01/ BNX029-01) - 40 °C to + 105 °C (BNX028-01）  Storage Temperature : - 55 °C to + 125 °C 4.Standard Testing Condition Temperature : Ordinary Temp. 15 °C to 35 ºC Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) Temperature : 20 °C ± 2 °C Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure : 86kPa to 106kPa MURATA MFG.CO.,LTD. Voltage Drop 30 mV max. 45mV max. 45mV max. 45mV max. Spec.No. Reference Only JENF243H-0008N-01 5.Style and Dimensions ※Coplanarity 0.10mm max ■Equivalent Circuit Ｌ１ Ｌ３ ① Ｃ２ ①B ：Bias ②CB ：Circuit + Bias ③PSG ：Power Supply Ground ④CG ：Circuit Ground ② Ｃ１ Ｌ２ ④ ③ ■ Unit Mass (Typical value) 0.80g 6.Marking Filter shall be marked as follows. (1) Murata Mark : (2) Part Number : BNX022-01：（ BNX022 ） BNX023-01：（ BNX023 ） BNX028-01：（ BNX028 ） BNX029-01：（ BNX029 ） (3) Polarity Marking : ○ MURATA MFG.CO.,LTD. P 2/ 15 Spec.No. Reference Only JENF243H-0008N-01 P 3/ 15 7.Electrical Performance No. 7.1 Item Insertion Loss Specification Test Method Meet item 3. 50 10dB Attenuator Balun (1) (2) Specimen (3) 50 50 10dB Attenuator (4) E 50 ～ SG  Method of measurement based on MIL-STD-220 7.2 Capacitance 7.3 DC Resistance Insulation Resistance 7.4 7.5 Withstanding Voltage Filter shall be no failure. 7.6 Voltage Drop Meet item 3. Insertion Loss = -20 log E1/E0 (dB) E0 : Level without FILTER (short) E1: Level with FILTER Measured by the following condition between Terminal ①② and ③④. (see item 5.) Frequency : 1 ± 0.1kHz（BNX022/BNX023） 120±24Hz (BNX028/BNX029) Voltage : 1 V(rms) max. （BNX022/BNX023） 0.5±0.1V(rms). （BNX028/BNX029） Measuring Equipment : Agilent4278A or the equivalent（BNX022/BNX023） Agilent4284A or the equivalent（BNX028/BNX029） Measured by the way of 4 terminal method between ① and ② and between ③ and ④. (see item 5.) Measured at DC rated voltage between terminal ①② and ③④. (see item 5.) Time : 60 s max Charging current : 50 mA max. Measuring Equipment : R8340A or the equivalent Withstanding voltage shall be applied between terminal ①② and ③④. (see item 5.) Test Voltage : BNX022-01 125V(DC) BNX023-01 250 V(DC) BNX028-01 40 V(DC) BNX029-01 15.8 V(DC) Time : 5 ± 1 s Charging current : 50 mA max. After soldering the part on the test substrate, measure the voltage with passing the rated current as shown in the schematic below. A (1) V Specimen (2) Where the terminals of the part shall be connected as follows: Referring to the terminal No. shown in item 5, connect terminal No. ② and ④ by soldering copper wire with diameter more than 1mm / length less than 6mm. Then connect terminal No. ① as (1) and terminal No. ③ as (2) the measurement circuit as mentioned above. The probe for measuring the voltage shall be touched on the solder fillet of ①③. MURATA MFG.CO.,LTD. Spec.No. JENF243H-0008N-01 Reference Only P 4/ 15 8.Mechanical Performance No. 8.1 8.2 8.3 8.4 Item Appearance and Dimensions Marking Reflow Solderability Specification Meet item 5. Resistance to soldering iron Meet Table 1. Meet item 5. Appropriate solder fillet is formed. Table 1 Appearance Cap.Change I.R. Dielectric Strength 8.5 No damaged BNX022 within BNX023 ±7.5% BNX028 within BNX029 ±15% meet item 3 No failure Bending Strength Test Method Visual Inspection and measured with Micrometer caliper and Slide Caliper. Visual Inspection It shall be soldered with the Standard Profile condition as shown No.13.6(2) Soldering Condition. ･thickness of solder paste : 150 to 200 µm ･Land dimension : see No.13.5. Soldering iron : 100 W max. Tip Temperature : 450 °C ± 5 °C Soldering Time : 5 s , 2 Times Do not touch the products directly with the tip of the soldering iron. ꞏ Initial values: measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours. ꞏValues After Testing:measured after heat treatment (150± 0 10 °C, 1hour) and exposure in the room condition for 24±2 hours. It shall be soldered on the glass-epoxy substrate. (100mm×40mm×1.6mm) Pressure jig R230 F Deflection 45 45 Product Deflection : 2 mm Keeping Time : 30 s Speed : 0.5 mm/s 8.6 Drop Meet Table 2. Table 2 Appearance Cap.Change I.R. Dielectric Strength No damaged within ±15% meet item 3 No failure ꞏ Initial values: measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours. ꞏValues After Testing:measured after heat treatment (150± 0 10 °C, 1hour) and exposure in the room condition for 24±2 hours. It shall be dropped on concrete or steel board. Method : free fall Height : 1 m The Number of Time : 10 times ꞏ Initial values: measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours. ꞏValues After Testing:measured after heat treatment (150± 0 10 °C, 1hour) and exposure in the room condition for 24±2 hours. MURATA MFG.CO.,LTD. Spec.No. No. 8.7 8.8 JENF243H-0008N-01 Item Vibration Reference Only Specification Meet Table 2. P 5/ 15 Test Method It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minutes Total amplitude 3.0 mm or Acceleration amplitude 196 m/s2 whichever is smaller. Time : A period of 3 hours in each of 3 mutually perpendicular directions. (Total 9 hours) ꞏ Initial values: measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours. ꞏValues After Testing:measured after heat treatment (150± 0 10 °C, 1hour) and exposure in the room condition for 24±2 hours. It shall be soldered on the glass-epoxy substrate. Acceleration : 14700 m/s2 Normal duration: 0.5 ms Waveform : Half-sine wave Direction : 6 direction Testing Time : 3 times for each direction Shock ꞏ Initial values: measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours. ꞏValues After Testing:measured after heat treatment (150± 0 10 °C, 1hour) and exposure in the room condition for 24±2 hours. 9.Environmental Performance (It shall be soldeared on the substrate.) No. 9.1 Item Heat Shock Specification BNX022/BNX023:Meet Table 1. BNX028/BNX029:Meet Table 3. Test Method 1 Cycle 1 step : -55°C(+0°C,-3°C) / 30 min. (+3,-0) min. 2 step : Room Temperature / within 0.5 min. 3 step : 125(+3°C,-0°C) / 30 min. (+3,-0) min. (for BNX028: 105(+3°C,-0°C) / 30 min. (+3,-0) min.) 4 step : Room Temperature / within 0.5 min. Total cycles BNX022 1000cycles BNX023 100cycles BNX028 BNX029 Then measure values after exposure in the room condition for 48 ± 4 hours. ꞏ Initial values: measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours. ꞏValues After Testing:measured after heat treatment (150± 0 10 °C, 1hour) and exposure in the room condition for 24±2 hours. MURATA MFG.CO.,LTD. Spec.No. No. 9.2 JENF243H-0008N-01 Item Humidity Life ① Specification Meet Table 3. Table 3 Appearance Cap.Change I.R. Humidity Life ② 9.3 Heat Life Reference Only Meet Table 4. Table 4 Appearance Cap.Change I.R. No damaged BNX022 within ±12.5% BNX023 BNX028 within ±15% BNX029 BNX022 25MΩ min. BNX023 BNX028 0.11M Ω min. BNX029 0.05MΩ min. No damaged BNX022 within ±12.5% BNX023 BNX028 within ±15% BNX029 BNX022 50MΩ min. BNX023 BNX028 0.11M Ω min. BNX029 0.05MΩ min. P 6/ 15 Test Method Temperature : 60 ± 2 °C Humidity : 90  95 %(RH) Voltage : Rated Voltage Time : 1000 h (+ 48h , - 0h) Then measure values after exposure in the room condition for 48 ± 4 hours. ꞏ Initial values: measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours. ꞏValues After Testing:measured after heat treatment (150± 0 10 °C, 1hour) and exposure in the room condition for 24±2 hours. Temperature : 85 ± 2 °C Humidity : 80  85 %(RH) Voltage : Rated Voltage Time : 1000 h (+ 48h , - 0h) Then measure values after exposure in the room condition for 48 ± 4 hours. ꞏ Initial values: measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours. ꞏValues After Testing:measured after heat treatment (150± 0 10 °C, 1hour) and exposure in the room condition for 24±2 hours. Temperature : 125 ± 2 °C Voltage : Rated Voltage 2 Time : 1000 h (+ 48h , - 0h) Then measure values after exposure in the room condition for 48 ± 4 hours. ꞏ Initial values: measured after heat treatment (150± 010 °C, 1hour) and exposure in the room condition for 24±2 hours. ꞏValues After Testing:measured after heat treatment (150± 0 10 °C, 1hour) and exposure in the room condition for 24±2 hours. MURATA MFG.CO.,LTD. Spec.No. Reference Only JENF243H-0008N-01 P 7/ 15 10.Insertion Loss Characteristics (I.L.) (Typ.) BNX022-01／BNX023-01 BNX028-01 BNX029-01 11. Specification of Packaging 11.1 Appearance and Dimensions (24mm-wide plastic tape) (1) plastic tape 4.0×10pich=40.0±0.2 0.5  1.5± 0 12.4±0.1 11.5±0.1 0.1  1.5± 0 9.4±0.1 0.3±0.1 24.0±0.2 4.0±0.1 Cavity Sprocket Hole 1.75±0.1 2.0±0.1 3.3±0.1 T 12.0±0.1 Direction of feed Ｔ：3.5±0.1（BNX022/BNX023） (in:mm) 3.6±0.1（BNX028/BNX029） (in:mm) *Dimension of the Cavity is measured at the bottom side. MURATA MFG.CO.,LTD. Spec.No. Reference Only JENF243H-0008N-01 (2)Direction of the product 2 2 0 X N B 2 2 0 X N B 2 2 0 X N B MURATA logo mark 11.2 Specification of Taping (1) Packing quantity (standard quantity) 178mm reel : 400 pcs. / reel 330mm reel : 1500 pcs. / reel (2) Packing Method Products shall be packaged in the cavity of the plastic tape and sealed with cover tape. (3) Spliced point The cover tape have no spliced point. (4) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 11.3 Pull Strength of Plastic Tape and Cover Tape Plastic tape Cover tape 10N min. 165 to 180 degree F Cover tape 11.4 Peeling off force of Cover tape Plastic tape 0.2N to 0.7N (minimum value is typical)  Speed of Peeling off : 300 mm / min MURATA MFG.CO.,LTD. P 8/ 15 Spec.No. Reference Only JENF243H-0008N-01 P 9/ 15 11.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. [ Packaging Code:L (178mm reel) ] Trailer 160 min. 2.0±0.5 Leader 210 min. 190 min. Label Empty tape Cover tape  13.0±0.2  62± 0.5  21.0±0.8 Direction of feed 2.2±0.1  178±0.5 24.8～26.5 (in:mm) [ Packaging Code:K (330mm reel) ] Trailer 160 min. 2.0±0.5 Leader 190 min. Label Empty tape 210 min. Cover tape  13.0±0.2  100± 1.0  21.0±0.8 Direction of feed 2±0.2 25.5±0.5  330±2.0 (in:mm) 11.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking (2), Quantity, etc 1) « Expression of Inspection No. » (1) Factory Code (2) Date □□ (1) OOOO  (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O,N,D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number MURATA MFG.CO.,LTD. Spec.No. Reference Only JENF243H-0008N-01 P 10/ 15 11.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS discrimination(2) , Quantity , etc 11.8 Specification of Outer Case Label Reel H D W 178mm 330mm Outer Case Dimensions (mm) W D H 186 186 93 340 340 Standard Reel Quantity in Outer Case (Reel) 85 3 2 Above Outer Case size is typical. It depends on a quantity of an order. 12. ! Caution 12.1.Direction of mounting Please make sure of the direction of mounting and connect to the circuit properly. As shown in the equivalent circuit shown in item 5, this product has a directionality. Wrong connection to the circuit may cause open/short circuit of the part, burnout and serious accidents. 12.2.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment(automobiles,trains,ships,etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 12.3.ESD ESD to this product, exceeding condition of IEC61000-4-2 with 30kV, may cause short circuit and fuming or firing. 12.4 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 13.Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive.  13.1. Flux and Solder Flux Solder Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water soluble flux. Use Sn-3.0Ag-0.5Cu solder Other flux (except above) Please contact us for details, then use. MURATA MFG.CO.,LTD. Spec.No. Reference Only JENF243H-0008N-01 P 11/ 15 13.2. Note for Assembling When installing by the flow soldering, the degradation of the insulation resistance sometimes occurs. Products can only be soldered with reflow. The use in flow soldering be reserved. < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100 °C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. 13.3. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. 〔Products direction〕 a b 〈 Poor example〉 Products shall be locatedin the sideways direction (Length:ab) to the mechanical stress. 〈 Good example〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > Perforation A C C B D Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended MURATA MFG.CO.,LTD. Spec.No. JENF243H-0008N-01 Reference Only Portion of Perforation 13.4. Attention Regarding P.C.B. Design < The Arrangement of Products > P.C.B. shall be designed so that products are far from the portion of perforation. The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation.   Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) < Products Placing > Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B. × P.C.B. ○ ○ Portion of Perforation ○ P.C.B. Product × × Product Hole Pick up nozzle P.C.B. Support pin < P.C.B. Separation > P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. MURATA MFG.CO.,LTD. P 12/ 15 Spec.No. JENF243H-0008N-01 Reference Only P 13/ 15 13.5. Standard Land Dimensions 12.5 CG 10.2 9.9 9.6 B CB PSG CG 7.1 6.2 5.3 2.8 2.3 Copper foil pattern Copper foil pattern+Resist CG 0 Etchedarea Through hole 0 3.8 5.8 10.3 13.2 13.7 17.5 （in ： mm） (1)Design the land pads for this part as shown above on both side printed circuit board ( or a multiple layered substrate ). (2) This product is designed to meet large current. Please design PCB pattern which is connected to this product not to become too hot by applied large current. (3)Ground area of CG should be connected to ground layer on the other side (or ground layer of multiple layered substrate) with through holes as shown above. It is recommended to take the ground area as wide as possible. (4)It is recommended to use the connection to the ground layer with through holes and the ground layer to be circuit board wide. (5)Even in case that it isn't possible to use a both side printed circuit board ( or a multiple layered substrate ), the land pads for CG should be designed as wide as possible. 13.6. Reflow Soldering (1) Solder paste printing for reflow soldering ꞏ Standard thickness of solder paste should be 150 to 200 µm. Incidentally, depending on the reflow condition and the way of heat conduction, the solder would not wet up the terminal, being possible to lead to not enough connection between terminals and lands on the circuit board / open circuit in the circuit board. In case of use, always evaluate this part in your products with actual use condition. ꞏ For the solder paste printing pattern, use standard land dimensions. ꞏ For the resist and copper foil pattern, use standard land dimensions. ꞏ Use Sn / Pn = 60 / 40 or Sn-3.0Ag-0.5Cu solder MURATA MFG.CO.,LTD. Spec.No. Reference Only JENF243H-0008N-01 P 14/ 15 (2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Temp. (°C) 260°C 245°C±3°C 220°C 230°C Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time.(s) Standard Profile Limit Profile 150°C ~ 180°C , 90s ± 30s above 220°C , 30s ~ 60s above 230°C , 60s max. 245°C ± 3°C 260°C , 10s 2 times 2 times 13.7. Reworking with Soldering iron ꞏ The following conditions shall be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 450°C max. Soldering iron output 100W max. Soldering time 5s Time 2 times Note : Do not touch the products directly with the tip of the soldering iron. 13.8. Cleaning Conditions Don’t cleaning product due to non-waterproof construction. 13.9. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 13.10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO.,LTD. Spec.No. JENF243H-0008N-01 Reference Only P 15/ 15 13.11 Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition ꞏ Products should be stored in the warehouse on the following conditions. Temperature : - 10 °C to + 40 °C Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity ꞏ Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ꞏProducts should be stored on the palette for the prevention of the influence from humidity, dust and so on. ꞏProducts should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ꞏAvoid storing the product by itself bare (i.e.exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 14. ! Notes (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD.