CM1205-08CP

CM1205 ESD Protection Diode Array Chip Scale Package, 8−Channel Description The CM1205 surge protection array provides a very high level of protection for sensitive electronic components that may be subjected to ESD. The CM1205 will safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000−4−2 international standard (Level 4, ±8 kV contact discharge). All I/Os are rated at ±25 kV using the IEC 61000−4−2 contact discharge method. Using the MIL−STD−883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than ±30 kV. The Chip Scale Package format of this device enables extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. The CM1205 features OptiGuardt coating for improved reliability at assembly and is available with RoHS compliant lead−free finishing. www.onsemi.com WLCSP10 CP SUFFIX CASE 567BM BLOCK DIAGRAM B1 B2 B3 B4 B5 A2 A3 A4 A5 Features • Functionally and Pin Compatible with ON Semiconductor’s A1 PACDN1408 ESD Protection Device CM1205−08CP • 8 surge protection in a Single Package • OptiguardTM Coated for Improved Reliability at Assembly • In−system Electrostatic Discharge (ESD) Protection to ±25 kV • • • Contact Discharge per IEC 61000−4−2 International Standard Compact Chip Scale Package (0.65 mm pitch) Format Saves Board Space and Eases Layout in Space Critical Applications Compared to Discrete Solutions and Traditional Wire Bonded Packages 10−bump CSP These Devices are Pb−Free and are RoHS Compliant Applications • • • • • • • • ESD Protection for Sensitive Electronic Equipment I/O Port, Keypad and Button Circuitry Protection for Portable Devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Cameras and Camcorders Notebooks Desktop PCs © Semiconductor Components Industries, LLC, 2011 August, 2017 − Rev. 4 1 MARKING DIAGRAM 120508 120508 = Specific Device Code ORDERING INFORMATION Device CM1205−08CP Package Shipping† CSP (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: CM1205/D CM1205 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking + BOTTOM VIEW (Bumps Up View) 120508 B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 CM1205−08 10−bump CSP Package SPECIFICATIONS Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature Range Rating Units −65 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 2. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units −40 to +85 °C Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions VREV Reverse Standoff Voltage IDIODE= 10 mA ILEAK Leakage Current VIN= 3.3 V DC VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD= 10mA In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 Note 2 Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients Note 2 Channel Capacitance At 2.5 V DC, f = 1 MHz VESD VCL C Min Typ Max 6.0 5.6 −1.2 6.8 −0.8 Units V 100 nA 8.0 −0.4 V kV ±30 ±25 +12 −8 39 V 47 1. TA = 25 °C unless otherwise specified. GND in this document refers to the lower supply voltage. 2. ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. www.onsemi.com 2 pF CM1205 APPLICATION INFORMATION Refer to Application Note ”The Chip Scale Package”, for a detailed description of Chip Scale Packages offered by ON Semiconductor. Table 4. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.275 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.350 mm Round Solder Stencil Thickness 0.125 − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature 260°C ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ Non−Solder Mask Defined Pad 0.275 mm DIA. Solder Stencil Opening 0.330 mm DIA. Solder Mask Opening 0.325 mm DIA. Figure 1. Recommended Non−Solder Mask Defined Pad Illustration Figure 2. Lead−free (SnAgCu) Solder Ball Reflow Profile www.onsemi.com 3 CM1205 MECHANICAL SPECIFICATIONS The CM1205−08CP is offered in a 10−bump custom Chip Scale Package (CSP). Dimensions are presented below. Table 5. CSP TAPE AND REEL SPECIFICATIONS Pocket Size (mm) Tape Width Part Number Chip Size (mm) B0 X A0 X K0 W Reel Diameter Qty per Reel P0 P1 CM1205−08CP 3.104 X 1.154 X 0.682 3.28 X 1.32 X 0.81 8 mm 178 mm (7″) 3500 4 mm 4 mm Po Top Cover Tape Ao + Ko For Tape Feeder Reference Only Including Draft, Concerning around B. 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Embossment Bo + P1 User Direction of Feed OptiGuardt is a trademark of Semiconductor Components Industries, LLC. www.onsemi.com 4 + Center Lines of Cavity W MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 3.10x1.15 CASE 567BM−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X 0.05 C 2X D ÈÈ ÈÈ A E 0.05 C DIM A A1 A2 b D E e TOP VIEW OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B ÉÉÉÉÉÉÉÉ A2 RECOMMENDED SOLDERING FOOTPRINT* A A1 0.05 C NOTE 3 10X e b 0.05 C A B C SIDE VIEW A1 e B 0.03 C MILLIMETERS MIN MAX 0.75 0.60 0.23 0.29 0.40 REF 0.34 0.39 3.10 BSC 1.15 BSC 0.65 BSC SEATING PLANE 0.65 PITCH PACKAGE OUTLINE 10X 0.25 0.65 PITCH DIMENSIONS: MILLIMETERS A 1 2 3 4 5 BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: 98AON49821E WLCSP10, 3.10X1.15 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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