CM1402-03CP

CM1402 SIM Card EMI Filter Array with ESD Protection Product Description The CM1402 is an EMI filter array with ESD protection, which integrates three pi filters (C−R−C) and two additional channels of ESD protection. The CM1402 has component values of 20 pF − 47  − 20 pF, and 20 pF − 100  − 20 pF. The parts include avalanche−type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±10 kV, beyond the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±25 kV. The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10 kV, well beyond the maximum requirement of the IEC 61000−4−2 international standard. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy−to−use pin assignments. In particular, the CM1402 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets. The CM1402 incorporates OptiGuardt coating which results in improved reliability at assembly. The CM1402 is available in a space−saving, low−profile Chip Scale Package. Features • • • • • • • • • • Functionally and Pin−Compatible with CSPEMI400 Device OptiGuardt Coated for Improved Reliability at Assembly Three Channels of EMI Filtering, Each with ESD Protection Two Additional Channels of ESD−Only Protection ±10 kV ESD Protection (IEC 61000−4−2, Contact Discharge) on All Pins ±25 kV ESD Protection (HBM) Greater than 30 dB of Attenuation at 1 GHz 10−Bump, 1.960 mm x 1.330 mm Footprint Chip Scale Package (CSP) Chip Scale Package Features Extremely Low Lead Inductance for Optimum Filter and ESD Performance These Devices are Pb−Free and are RoHS Compliant http://onsemi.com WLCSP10 CP SUFFIX CASE 567BL MARKING DIAGRAM CE MG G CE = CM1402−03CP M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping† CM1402−03CP CSP−10 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Applications • SIM Card Slot in Mobile Handsets • I/O Port Protection for Mobile Handsets, Notebook Computers, PDAs, etc. • EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook Computers © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 4 1 Publication Order Number: CM1402/D CM1402 ELECTRICAL SCHEMATIC R1 R2 A1 C1 C A2 C2 C C C GND R1 A3 A4 C3 C C4 C C C R1 = 100  R2 = 47  B1,B2 PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS Top View (Bumps Down View) 10−bump CSP Package Type Pin Description EMI Filter A1 EMI Filter with ESD Protection for RST Signal C1 EMI Filter with ESD Protection for RST Signal A2 EMI Filter with ESD Protection for CLK Signal C2 EMI Filter with ESD Protection for CLK Signal Device Ground B1 Device Ground B2 Device Ground EMI Filter A3 EMI Filter with ESD Protection for DAT Signal C3 EMI Filter with ESD Protection for DAT Signal ESD Channel A4 ESD Protection Channel − VCC Supply ESD Channel C4 ESD Protection Channel A 1 2 + 3 4 CE B C Bottom View (Bumps Up View) Orientation Marking A1 EMI Filter Orientation Marking A4 A3 A2 B2 C4 A1 B1 C3 C2 C1 CM1402 CSP Package with OptiGuard coating SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units –65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 300 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 CM1402 Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Min Typ Max Units R1 Resistance of R1 80 100 120  R2 Resistance of R2 38 47 56  C Capacitance VIN = 2.5 VDC, 1 MHz, 30 mV ac 16 20 24 pF Stand−off Voltage I = 10 A 6.0 ILEAK Diode Leakage Current VBIAS = 3.3 V 0.1 1.0 VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA 6.8 –0.8 9.0 −0.4 VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 (Notes 2 and 4) Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients (Notes 2, 3 and 4) fC1 Cut−off Frequency ZSOURCE = 50 , ZLOAD = 50  R = 100 , C = 20 pF fC2 Cut−off Frequency ZSOURCE = 50 , ZLOAD = 50  R = 47 , C = 20 pF VSTANDOFF VCL Parameter Conditions 5.6 −1.5 V A V kV ±25 ±10 V +12 −7 77 85 MHz MHz 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. 4. Unused pins are left open. http://onsemi.com 3 CM1402 PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 1. A1−C1 EMI Filter Performance Figure 2. A2−C2 EMI Filter Performance http://onsemi.com 4 CM1402 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment) Figure 3. A3−C3 EMI Filter Performance Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 VDC) http://onsemi.com 5 CM1402 APPLICATION INFORMATION The CM1402 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high−frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Typical Application Diagram for the SIM Card Interface. Note: One channel of the CM1402 with a zener diode is not shown on the diagram. Figure 5. Typical Application Diagram for the SIM Card Interface For best filter and ESD performance, both GND bumps (B1, B2) of the CM1402 should be directly connected to the Ground plane. A small capacitor of about 1 F is required next to the VCC pin of the SIM connector in order to improve stability of the SIM card supply rail. For information on the assembly of the CM1402 to the PCB (printed circuit board), please refer to the Chip Scale Package (CSP) Application Note AP217, or contact factory at 800−282−9855 for technical support. http://onsemi.com 6 CM1402 APPLICATION INFORMATION Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 m Solder Ball Side Coplanarity ±20 m Maximum Dwell Time Above Liquidous (183°C) 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 6. Recommended Non−Solder Mask Defined Pad Illustration Figure 7. Lead−free (SnAgCu) Solder Ball Reflow Profile OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC). http://onsemi.com 7 260°C MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP10, 1.96x1.33 CASE 567BL−01 ISSUE O SCALE 4:1 PIN A1 REFERENCE 2X ÈÈ D A DATE 26 JUL 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW ÉÉÉÉÉÉ OptiGuard Option 0.05 C A2 RECOMMENDED SOLDERING FOOTPRINT* A 0.05 C NOTE 3 A1 MILLIMETERS MIN MAX 0.72 0.56 0.21 0.27 0.40 REF 0.29 0.35 1.96 BSC 1.33 BSC 0.50 BSC 0.435 BSC C SIDE VIEW 0.25 SEATING PLANE A1 0.25 PACKAGE OUTLINE eD 10X 0.05 C A B 0.03 C 0.87 eD/2 b eE C 0.44 B 0.50 PITCH A 1 2 3 4 5 6 BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: 98AON49820E WLCSP10, 1.96X1.33 10X 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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