CM1451-06CP

CM1451 LCD and Camera EMI Filter Array with ESD Protection Description The CM1451 is an inductor−capacitor (L−C) based EMI filter array with integrated ESD protection in CSP. The CM1451−06 and CM1451−08 are configured in 6 and 8 channel formats respectively. Each channel is implemented as a 5−pole L−C filter with the component values 9.5 pF − 17 nH − 9.5 pF − 17 nF − 9.5 pF. The CM1451’s roll−off frequency at −10 dB attenuation is 500 MHz. It can be used in applications where the data rates are as high as 200 Mbps while providing greater than 35 dB attenuation over the 800 MHz to 2.7 GHz frequency range. The device has ESD protection diodes on every pin that provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports safely dissipate ESD strikes of ±15 kV, exceeding the Level 4 requirement of the IEC61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV. This device is particularly well−suited for portable electronics (e.g. wireless handsets, PDAs) because of its small package format and easy−to−use pin assignments. In particular, the CM1451 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in wireless handsets while maintaining the integrity of signals that have rise/fall times as fast as 2 ns. The CM1451 incorporates OptiGuard, a coating that results in improved reliability at assembly. The CM1451 is available in a space−saving, low−profile Chip Scale Package with RoHS compliant lead−free finishing. http://onsemi.com WLCSP15 CP SUFFIX CASE 567BT MARKING DIAGRAM N516 N518 CM1451−06 15−Bump CSP Package CM1451−08 20−Bump CSP Package N516 N518 • • • • • • Implementation OptiGuard Coating for Improved Reliability Chip Scale Package (CSP) Features Extremely Low Lead Inductance for Optimum Filter and ESD Performance 15 kV ESD Protection on Each Channel (IEC 61000−4−2 Level 4, Contact Discharge) 30 kV ESD Protection on Each Channel (HBM) Better than 40 dB of Attenuation at 1 GHz Maintains Signal Integrity for Signals that Have a Risetime and Falltime as Fast as 2 ns Device Package Shipping† CM1451−06CP CSP−15 (Pb−Free) 3500/Tape & Reel CM1451−08CP CSP−20 (Pb−Free) 3500/Tape & Reel • • • LCD and Camera Data Lines in Mobile Handsets • I/O Port Protection for Mobile Handsets, Notebook Package (CM1451−06CP) 20−Bump, 4.006 mm x 1.376 mm Footprint Chip Scale Package (CM1451−08CP) These Devices are Pb−Free and are RoHS Compliant • EMI Filtering for Data Ports in Cell Phones, PDAs or • • Computers, PDAs, etc. • Wireless Handsets / Cell Phones April, 2013 − Rev. 3 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. • 15−Bump, 3.006 mm x 1.376 mm Footprint Chip Scale Applications © Semiconductor Components Industries, LLC, 2013 = CM1451−06CP = CM1451−08CP ORDERING INFORMATION Features • High Bandwidth, High RF Rejection Filter Array • Six and Eight Channels of EMI Filtering • Utilizes Inductor−Based Design Technology for True L−C Filter WLCSP20 CP SUFFIX CASE 567CL 1 Notebook Computers Handheld PCs / PDAs LCD and Camera Modules Publication Order Number: CM1451/D CM1451 BLOCK DIAGRAM L1 L2 FILTERn* FILTERn* C1 C2 C3 GND (Pins B1−Bm) 1 of n EMI Filtering + ESD Channels (n = 6 for CM1451−06, 8 for CM1451−08, m=n/2) *See Package/Pinout Diagrams for expanded pin information. PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down View) Orientation Marking (see Note) + A 1 2 3 4 5 Bottom View (Bumps Up View) 6 C1 N516 B C3 B1 Orientation Marking C C2 C4 C5 B2 C6 B3 A1 A1 A2 A3 A4 A5 A6 C2 C3 C4 C5 C6 C7 CM1451−06CP 15−Bump CSP Package Orientation Marking (see Note) A + 1 2 4 3 5 6 7 8 C1 N518 B Orientation Marking C B1 A1 A1 B2 A2 A3 B3 A4 A5 C8 B4 A6 A7 A8 CM1451−08CP 20−Bump CSP Package Note: Lead−free devices are specified by using a “+” character for the top side orientation mark. Table 1. PIN DESCRIPTIONS CM1451−06 CM1451−08 CM1451−06 CM1451−08 Pin(s) Pin(s) Name Pin(s) Pin(s) A1 A1 FILTER1 Name Filter Channel 1 C1 C1 FILTER1 Filter Channel 1 A2 A2 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2 A3 A3 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3 A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4 A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5 A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6 − A7 FILTER7 Filter Channel 7 − C7 FILTER7 Filter Channel 7 − A8 FILTER8 Filter Channel 8 − C8 FILTER8 Filter Channel 8 B1−B3 B1−B4 GND Device Ground Description http://onsemi.com 2 Description CM1451 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C Current per Inductor 30 mA DC Package Power Rating 500 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units −40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Units LTOT Total Channel Inductance (L1 + L2) 34 nH L1, L2 Inductance 17 nH DC Channel Resistance 18 W RDC IN−OUT CTOT C1, C2, C3 fC fRO Total Channel Capacitance (C1 + C2 + C3) At 2.5 V DC, 1 MHz, 30 mV AC 22.8 28.5 34.2 pF Capacitance At 2.5 V DC, 1 MHz, 30 mV AC 7.6 9.5 11.4 pF Cut−off Frequency ZSOURCE = 50 W, ZLOAD = 50 W 260 Roll−off Frequency at −10 dB Attenuation ZSOURCE = 50 W, ZLOAD = 50 W 500 MHz MHz VDIODE Diode Standoff Voltage IDIODE = 10 mA 6.0 ILEAK Diode Leakage Current VDIODE = +3.3 V 0.1 1.0 VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA 6.8 −0.8 9.0 −0.4 VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 (Note 2) RDYN Dynamic Resistance Positive Negative 5.6 −1.5 http://onsemi.com 3 mA V kV 30 15 2.30 0.90 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. V W CM1451 PERFORMANCE INFORMATION Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2−C2 to GND B1) http://onsemi.com 4 CM1451 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 3. Insertion Loss vs. Frequency (A3−C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4−C4 to GND B2) http://onsemi.com 5 CM1451 PERFORMANCE INFORMATION (Cont’d) Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment) Figure 5. Insertion Loss vs. Frequency (A5−C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6−C6 to GND B3) http://onsemi.com 6 CM1451 [pF] PERFORMANCE INFORMATION (Cont’d) D. C.Vo ltag e Figure 7. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5 VDC and 255C) Transient Response Characteristics Figure 8. Simulated Transient Response (input signal risetime and falltime = 2 ns, clocked at 25, 50 and 75 MHz, 15 W Source Resistance, 5 pF Load) http://onsemi.com 7 CM1451 APPLICATION INFORMATION Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 9. Recommended Non−Solder Mask Defined Pad Illustration Temperature (5C) 250 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 10. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP15, 3.01x1.38 CASE 567BT−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X D ÈÈ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW ÉÉÉÉÉÉÉÉ OptiGuard Option 0.05 C A2 A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 A1 C SIDE VIEW eD/2 15X 0.05 C A B 0.03 C eE C SEATING PLANE PACKAGE OUTLINE A1 0.87 eD b 0.44 15X 0.50 PITCH B A 1 2 3 4 5 6 7 8 9 BOTTOM VIEW DOCUMENT NUMBER: DESCRIPTION: 98AON49827E WLCSP15, 3.01X1.38 MILLIMETERS MIN MAX 0.72 0.56 0.21 0.27 0.42 REF 0.29 0.35 3.01 BSC 1.38 BSC 0.50 BSC 0.435 BSC 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP20, 4.01x1.38 CASE 567CL−01 ISSUE O DATE 26 JUL 2010 SCALE 4:1 PIN A1 REFERENCE 2X D ÈÈ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW ÉÉÉÉÉÉÉÉÉÉ OptiGuard Option 0.05 C A2 MILLIMETERS MIN MAX 0.72 0.56 0.21 0.27 0.42 REF 0.29 0.35 4.01 BSC 1.38 BSC 0.50 BSC 0.435 BSC A 0.05 C NOTE 3 A1 C SIDE VIEW SEATING PLANE eD/2 eD b 20X 0.05 C A B 0.03 C eE C B A 1 2 3 4 5 6 7 8 9 10 11 12 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* A1 PACKAGE OUTLINE 0.87 0.44 20X 0.50 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON50484E WLCSP20, 4.01X1.38 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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