CSPEMI204
EMI Filter with ESD
Protection
Product Description
The CSPEMI204 is an L−R−C EMI filter array with ESD protection
that integrates two Pi−filters (C−L−R−C) to suppress EMI/RFI Noise.
CSPEMI204 includes ESD protection diodes on all input/output pins,
and provides a very high level of protection for sensitive electronic
components against possible electrostatic discharge (ESD). The ESD
diodes connected to the filter ports safely dissipate ESD strikes of
±30 kV, which is beyond the maximum requirement of the
IEC61000−4−2 international standard.
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WLCSP5
FC SUFFIX
CASE 567MA
Features
•
•
•
•
•
Two Channels of EMI Filtering
±30 kV ESD Protection (IEC 61000−4−2, Contact Discharge)
±30 kV ESD Protection (IEC 61000−4−2, Air Discharge)
Greater than 45 dB of Attenuation at 900 MHz
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
Filter#1
A3
C1
Filter#2
C3
GND B1
MARKING DIAGRAM
MAXIMUM RATINGS (TA = 25°C)
Symbol
Value
Unit
ESD Discharge IEC61000−4−2
Contact Discharge
Air Discharge
Vpp
RMS Current per Line
ILine
350
mA
Operating Temperature Range
TJ
−40 to +125
°C
Storage Temperature Range
Tstg
−55 to +150
°C
Lead Solder Temperature
(10 second duration)
TL
260
°C
30
30
© Semiconductor Components Industries, LLC, 2015
ATM
kV
AT
M
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
August, 2015 − Rev. 0
A1
GND B1
• Mobile Phones
Rating
BLOCK DIAGRAM
1
= Specific Device Code
= Date Code
ORDERING INFORMATION
Device
Package
Shipping†
CSPEMI204FCTAG
WLCSP5
(Pb−Free)
5000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
CSPEMI204/D
CSPEMI204
PACKAGE/PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
Name
A1
Filter #1
Filter #1 Input/Output
Description
C1
Filter #1
Filter #1 Input/Output
A3
Filter #2
Filter #2 Input/Output
C3
Filter #2
Filter #2 Input/Output
B2
GND
Top View
(Bumps Down View)
C
B
Bottom View
(Bumps Up View)
Orientation
Marking
A
+
Pin
+ A1
1
AT
Device Ground
C1
B2
2
3
A3
C3
Max
Unit
WLCSP5 Package
Table 2. ELECTRICAL OPERATING CHARACTERISTICS (TA = 25°C unless otherwise noted)
Parameter
Symbol
VRWM
Test Conditions
Min
Working Voltage
VBR
Breakdown Voltage
ILEAK
Channel Leakage Current
RCH
Channel Resistance
(Pins A1 – A3, C1 – C3)
Typ
3.0
IT = 1 mA; (Note 4)
V
6.0
V
VIN = 3.0 V, GND = 0 V
W
Ct
Line Capacitance
VR = 0 V, f = 1 MHz
Cutoff Frequency
450 W Source and
10 kW Load Termination
2.0
MHz
f3dB
Cutoff Frequency
50 W Termination
25
MHz
@ 700 MHz
@ 900 MHz
40
47
dB
Stop Band Attenuation
VESD
Insystem ESD Withstand Voltage
a) Contact discharge per IEC 6100042 standard, Level 4
(External Pins)
b) Contact discharge per IEC 6100042 standard, Level 1
(Internal Pins)
VCL
TLP Clamping Voltage
250
nA
3.0
f3dB
Fatten
185
400
(Notes 1 and 2)
315
pF
kV
±30
±30
Forward IPP = 8 A
Forward IPP = 16 A
Forward IPP = ±8 A
Forward IPP = ±16 A
9.8
11.5
−9.7
−11.7
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Standard IEC61000−4−2 with CDischarge = 150 pF, RDischarge = 330, GND grounded.
2. These measurements performed with no external capacitor.
3. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC
or continuous peak operating voltage level.
4. VBR is measured at pulse test current IT.
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2
CSPEMI204
PERFORMANCE INFORMATION
Typical Filter Performance
0
0
−10
−10
−20
−30
S21 (dB)
−30
−40
−40
−50
−60
−70
−80
−50
−90
−60
1.E+05
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10
−100
1.E+05
1.E+06
1.E+07
1.E+08
1.E+09
1.E+10 1.E+11
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 1. Typical Insertion Loss (50 W
Termination)
Figure 3. Typical Insertion Loss (450 W Source
and 10 kW Load Termination)
−80
−85
−90
THD+N (dB)
S21 (dB)
−20
−95
−100
−105
−110
−115
−120
20
200
2000
FREQUENCY (Hz)
Figure 2. Typical THD+N at 1.8 Vpp
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3
20000
CSPEMI204
IEC61000−4−2 Waveform
IEC 61000−4−2 Spec.
Ipeak
Level
Test Voltage (kV)
First Peak
Current
(A)
Current at
30 ns (A)
Current at
60 ns (A)
1
2
7.5
4
2
2
4
15
8
4
3
6
22.5
12
6
4
8
30
16
8
100%
90%
I @ 30 ns
I @ 60 ns
10%
tP = 0.7 ns to 1 ns
Figure 4. IEC61000−4−2 Spec
ESD Gun
Oscilloscope
TVS
50 W
Cable
50 W
Figure 5. Diagram of ESD Clamping Voltage Test Setup
The following is taken from Application Note
AND8308/D − Interpretation of Datasheet Parameters
for ESD Devices.
systems such as cell phones or laptop computers it is not
clearly defined in the spec how to specify a clamping voltage
at the device level. ON Semiconductor has developed a way
to examine the entire voltage waveform across the ESD
protection diode over the time domain of an ESD pulse in the
form of an oscilloscope screenshot, which can be found on
the datasheets for all ESD protection diodes. For more
information on how ON Semiconductor creates these
screenshots and how to interpret them please refer to
AND8307/D.
ESD Voltage Clamping
For sensitive circuit elements it is important to limit the
voltage that an IC will be exposed to during an ESD event
to as low a voltage as possible. The ESD clamping voltage
is the voltage drop across the ESD protection diode during
an ESD event per the IEC61000−4−2 waveform. Since the
IEC61000−4−2 was written as a pass/fail spec for larger
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4
25
−25
20
−20
TLP CURRENT (A)
TLP CURRENT (A)
CSPEMI204
15
10
−15
−10
−5
5
0
0
0
NOTE:
2
4
6
8
10
12
14
0
−2
−4
−6
−8
−10
−12
−14
VC, VOLTAGE (V)
VC, VOLTAGE (V)
Figure 6. Positive TLP I−V Curve (Preliminary)
Figure 7. Negative TLP I−V Curve (Preliminary)
TLP parameter: Z0 = 50 W, tp = 100 ns, tr = 300 ps, averaging window: t1 = 30 ns to t2 = 60 ns. VIEC is the equivalent voltage
stress level calculated at the secondary peak of the IEC 61000−4−2 waveform at t = 30 ns with 2 A/kV. See TLP description
below for more information.
Transmission Line Pulse (TLP) Measurement
L
Transmission Line Pulse (TLP) provides current versus
voltage (I−V) curves in which each data point is obtained
from a 100 ns long rectangular pulse from a charged
transmission line. A simplified schematic of a typical TLP
system is shown in Figure 8. TLP I−V curves of ESD
protection devices accurately demonstrate the product’s
ESD capability because the 10s of amps current levels and
under 100 ns time scale match those of an ESD event. This
is illustrated in Figure 9 where an 8 kV IEC 61000−4−2
current waveform is compared with TLP current pulses at
8 A and 16 A. A TLP I−V curve shows the voltage at which
the device turns on as well as how well the device clamps
voltage over a range of current levels.
S Attenuator
÷
50 W Coax
Cable
10 MW
IM
50 W Coax
Cable
VM
DUT
VC
Oscilloscope
Figure 8. Simplified Schematic of a Typical TLP
System
Figure 9. Comparison Between 8 kV IEC 61000−4−2 and 8 A and 16 A TLP Waveforms
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5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP5, 1.26x0.89
CASE 567MA
ISSUE O
SCALE 4:1
PIN A1
REFERENCE
2X
E
A
ÈÈ
ÈÈ
DATE 07 JUL 2015
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
4. DIMENSION b IS MEASURED AT THE MAXIMUM
BALL DIAMETER PARALLEL TO DATUM C.
B
D
0.10 C
2X
0.10 C
DIM
A
A1
A2
b
D
E
e
e1
TOP VIEW
A2
0.10 C
A
GENERIC
MARKING DIAGRAM*
0.05 C
NOTE 3
A1
C
SIDE VIEW
e
b
0.10 C A B
0.05 C
SEATING
PLANE
XXM
e/2
5X
MILLIMETERS
MIN
MAX
−−−
0.50
0.18
0.22
0.255 REF
0.235
0.295
1.26 BSC
0.89 BSC
0.50 BSC
0.435 BSC
e1
C
B
A
1 2 3
BOTTOM VIEW
XX = Specific Device Code
M = Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
5X
0.87
PITCH
0.27
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON00069G
WLCSP5, 1.26X0.89
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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