DFE32CAH4R7MR0L

Reference Only Spec No. JETE243A-9108A-01 P 1/9 CHIP COIL（CHIP INDUCTORS）DFE32CAH□□□□R0□ Murata Standard Reference Specification【AEC-Q200】 1. Scope This reference specification applies to DFE32CAH series for automotive electronics based on AEC-Q200. 2. Part Numbering (ex) DF E Product Type ID 32 CA H R47 M R 0 L special Applications Category Inductance Tolerance Dimension Packaging specification And (T) Characteristics Dimension (L×W) 3. Rating Operating Temperature Range (product temperature including self-temperature rise) Storage Temperature Range. Inductance Customer Part Number Murata Part Number -55 to +150°C -55 to +150°C *3 Rated Current (mA) DC Resistance (Ω Max.) *1 Based on Inductance change *2 Based on Temperature rise ESD Level （HBM） Nominal value (uH) Tolerance (%) DFE32CAHR47MR0L 0.47 ±20 0.014 8700 5900 2 DFE32CAHR68MR0L 0.68 ±20 0.017 7000 5000 1C DFE32CAH1R0MR0L 1.0 ±20 0.022 5900 4100 1C DFE32CAH1R5MR0L 1.5 ±20 0.030 4800 3500 1B DFE32CAH2R2MR0L 2.2 ±20 0.043 4000 2900 1B DFE32CAH3R3MR0L 3.3 ±20 0.067 3300 2300 1A DFE32CAH4R7MR0L 4.7 ±20 0.101 2800 1900 1A *1: The saturation allowable DC current value is specified when the decrease of the initial Inductance value at 30%. *2: When a rated current (based on Temperature rise) is applied, the temperature rise due to self-heating of the product is 40 °C or less. *3: Keep the product temperature (ambient temperature + self-heating) below 150 °C. The rated current value is the smaller of the rated current (based on Inductance change) or the rated current (based on Temperature rise). 4. Testing Conditions (Standard atmospheric conditions) Temperature : Ordinary Temperature (15 to 35°C) Humidity : Ordinary Humidity (25 to 85 %(RH)) Temperature Humidity Atmospheric Pressure : 20 ± 2°C : 60 to 70 %(RH) : 86 to 106 kPa 5. Appearance and Dimensions ■Unit mass (typical value): 0.0913 g (in mm) 6. Marking No marking MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9108A-01 P 2/9 7. Electrical Performance No. 7.1 Item. Inductance 7.2 DC Resistance 7.3 Rated Current (based on Inductance change) 7.4 Rated Current (based on Temperature rise) 7.5 withstand voltage Specification Meet item 3. Test Method Measuring Equipment: Keysight 4284A or equivalent Measurement signal level：0.5V Measuring Frequency: 1MHz Measuring Equipment: Digital multimeter The saturation allowable DC current value is specified when the decrease of the initial Inductance value at 30%. The temperature rise due to selfheating due to rated current application based on temperature rise is 40 °C or less. Inductance shall meet item 3. The rated current specified in Chapter 3 is applied. The rated current specified in Chapter 3 is applied. Testing Equipment: Impulse tester Applied voltage: 60~70V (by item) 8. Q200 Requirement Performance(based on Table 5 for Magnetics Inductors/Transformer) AEC-Q200 Rev.D issued June 1. 2010 AEC-Q200 No. Stress Test Method 3 High temperature 1000 h at 150°C exposure Set for 24 h at room condition, then measured. 4 Temperature cycling 1000 cycles -55°C to +150°C Set for 24 h at room condition, then measured. 7 Biased humidity 1000 h at 85°C, 85% (RH). Unpowered. Set for 24 h at room condition, then measured. 8 Operational life Apply 110°C 1000 h Set for 24 h at room condition, then measured. 9 External visual Visual inspection 10 Physical dimension 13 Mechanical shock 14 Vibration 15 Resistance to Soldering Heat Meet chapter 5, "Appearance and Dimensions". Per MIL-STD-202 Method 213 Condition C: 100 g's/6 ms/half sine Murata Specification / Deviation Appearance: No damage Inductance change rate: within ±10% Appearance: No damage Inductance change rate: within ±10% Appearance: No damage Inductance change rate: within ±10% Appearance: No damage Inductance change rate: within ±10% No abnormalities No defects Appearance: No damage Inductance change rate: within ±10% 5 g's for 20 min, 12 cycles each Appearance: No damage of 3 orientations Inductance change rate: within ±10% Test from 10 Hz to 2000 Hz Appearance: No damage Pre-heating：150 to 180°C / Inductance change rate: within ±10% 90±30sec Reflow soldering method above 220°C, 60±30 sec Temperature condition above 255°C, above 30sec Peak：above 260°C The specimen shall be subjected to the reflow process under the above condition 3times. Test board shall be 1.6 mm thick. Base material shall be glass epoxy resin. The specimen shall be stored at standard atmospheric conditions for 1 h in prior to the measurement. MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9108A-01 P 3/9 AEC-Q200 No. 17 ESD Stress 18 Solderability Per J-STD-002 Murata Specification / Deviation ESD Rank: Refer to chapter 3, "Part Number and Rating". Appearance: No damage 90% or more of the outer electrode shall be covered with new solder seamlessly. Measured: inductance Deviation for AEC-Q200 Method b: Not applicable Pre-heating: 150°C/60s No defects Per UL-94 Not applicable 21 Board Flex Epoxy-PCB (1.6 mm) Deflection 2 mm (min.) 60 s minimum holding time Appearance:No damage Inductance change rate: within ±10% 22 Terminal Strength Per AEC-Q200-006 A force of 17.7 N for 60 s Appearance: No damage 19 Electrical Characterization 20 Flammability 9. Test Method Per AEC-Q200-002 Specification of Packaging 9.1 Appearance and dimensions of tape (8 mm width/plastic tape) A B t t' (2.8) (3.5) (2.1) (0.25) (in mm) Dimensions A and B are at the bottom of the cavity. The A, B, t, t ' dimensions are reference values. 9.2 Taping specification Packing quantity (Standard quantity) 2000 pcs/reel Packing method The products are placed in cavities of a carrier tape and sealed by a cover tape. Feed hole position The feed holes on the carrier tape are on the right side when the cover tape is pulled toward the user. Joint The carrier tape and cover tape are seamless. Number of missing products Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Break down force of tape Cover tape 10N min. MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9108A-01 P 4/9 9.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 165 to 180 degree 300mm/min F Cover tape 0.1 to 0.7N (The lower limit is for typical value.) Plastic tape 9.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.) A φ180+0/-3 B 9±0.3 C 11.4±1 D φ60+1/-0 E φ13±0.2 F φ21±0.8 G 2.0±0.5 （in mm） 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(*1), RoHS marking(*2), Quantity etc ･･･ *1 Expression of inspection No.: (1) Factory code □□ ○○○○  (2) Date First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 9.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 9.8 Specification of Outer box Outer Case Dimensions (mm) Label H D W D H Standard Reel Quantity in Outer Case (Reel) 185 195 65 *5 *Above Outer Case size is typical. It depends on a quantity of an order. W MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9108A-01 10. P 5/9 Caution 10.1 Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster/crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and/or reliability requirements to the applications listed in the above 10.2 Precautions on rating Do not use over the rated temperature range or rated current. If used beyond the rating, serious defects such as wire breakage and burnout may occur. 10.3 Inrush current If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious fault. 10.4 Circuit voltage There is a possibility available for DCDC converters with a maximum voltage of 40V or less. Be sure to evaluate the actual machine in advance to check the quality of this product. 10.5 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 10.6 Corrosive gas Do not use this product when exposed to corrosive gases (Sulfur gases [Hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or in contact with oil (Cutting oil, silicone oil, etc.) exposed to corrosive gases. This may cause deterioration or degradation of the product electrode, resulting in opening. our company assumes no responsibility for use in this environment. 11. Precautions for Use This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. This product has a lower insulation resistance than conventional ferrite products, so care must be paid to its use. a) Do not make any through holes and copper pattern under the coil except a copper pattern to the electrode. b) Design/mount any components not to contact this product. MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9108A-01 P 6/9 11.1 Land dimensions The following diagram shows the recommended land dimensions for flow and reflow soldering: a b c 2.8 3.7 1.8 (in mm) 11.2 Flux and solder used ・Use rosin-based flux. Flux ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. Solder ・Use Sn-3.0Ag-0.5Cu solder ・Standard thickness of solder paste : 100μm to 150μm Other flux (except above) Please contact us for details, then use. 11.3 Soldering conditions (Reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile is as follows. Standard profile Pre-heating 150〜180°C/90 s±30 s Heating Above 230°C/30 s±10 s Peak temperature 250°C +5/-0°C Number of reflow 2times cycles 11.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating 150°C/approx. 1 min Tip temperature of soldering iron Power consumption of soldering iron Tip diameter of soldering iron 350°C max. 60 W max. ø3 mm max. Soldering time 3 s (+1 s, -0 s) Number of reworking operations 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9108A-01 P 7/9 11.5 Solder volume Solder shall be used not to increase the volume too much. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. 11.6 Product's location The following shall be considered when designing and laying out P.C.B.’s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways direction to the mechanical stress. b 〈 Poor example 〉 〈 Good example〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away A>C from the board separation surface. *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Perforation C B D A Slit (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9108A-01 P 8/9 11.7 Handling of substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.8 Cleaning When cleaning this product, observe the following conditions: (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) During ultrasonic cleaning, under some cleaning conditions, the resonation of PCB should be caused by its vibration. Be sure to do the test cleaning with actual cleaning equipment before production and confirm that product does not be damaged by cleaning. (3) Cleaner Alcohol-based cleaner: IPA (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. 11.9 Storage and transportation Storage period Storage conditions Transportation Use the product within 6 months after delivery. If you do not use the product for more than 6 months, check solderability before using it. • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor solderability. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. • Do not keep products in bulk packaging. Doing so may cause collision between the products or between the products and other products, resulting in chipping or wire breakage. • Avoid storing the product by itself bare (i.e. exposed directly to air). Excessive vibration and impact reduce the reliability of the products. Exercise caution when handling the products. 11.10 Resin coating (including moistureproof coating) Coating/molding the product with resin may change electrical characteristics. A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of conductor, leading to wire breakage. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9108A-01 P 9/9 11.11 Mounting Conditions ・Please check the mounting condition before using. ・Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 11.12 Operating Environment Do not use this product under the following environmental conditions as it may cause deterioration of product quality. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 11.13 Implementation density When placing this product near parts with heat generation, take sufficient heat radiation countermeasures. If the heat received from other parts is large, the characteristics of this product may deteriorate, causing circuit operational failure or deterioration of the joints. Be sure to use this product below the maximum rated operating temperature even when heat received from other parts is applied. 11.14 Handling of product Inductance could change due to the effect of magnetism. Do not use magnetized tweezers, magnets, or other similar tools when handling the product (instead, use tweezers with resin or ceramic tips). 11.15 Derating Max. current (DC, AC) as function of product temperature (derating curve) IOP : Loaded Current IR : Rated Current 12． Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD