Reference Only
Spec No. JEFL243D-0004F-01
P1/8
Low signal distortion Chip Common Mode Choke Coil for audio
DLM11GN601SD2□
Reference
Specification
1.Scope
This reference specification applies to Chip Common Mode Choke Coil DLM11GN601SD2□ Series.
2.Part Numbering
(ex.)
DL M
11 G
N
(1)
(2) (3) (4) (5)
(1) Chip Common Mode Choke Coil
(2) Structure (M : Monolithic Type)
(3) Dimension (LW)
(4) Type
(5) Category
601 S D 2 D
(6)
(7) (8) (9) (10)
(6) Impedance (Typ. at 100MHz)
(7) Circuit
(8) Features
(9) Number of Line
(10) Packaging Code D : Taping / B : Bulk
3.Rating
Customer
Part Number
Comon Mode Impedance
(at 100MHz,Under Standard
Testing Conditions)
Murata
Part Number
DLM11GN601SD2D
600Ω±25%
DLM11GN601SD2B
Operating Temperature : -40 to +85°C
Temperature : Ordinary Temperature 15 to 35°C
Humidity : Ordinary Humidity 25 to 85%(RH)
④
③
100mA
0.8 0.9
max.
100M
max.
min.
: -40 to +85°C
■ Equivalent Circuits
0.65±0.1
③
④
25V(DC)
Temperature : 20 ± 2°C
Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
①
①
②
②
③
④
③
④
No polarity
0.35±0.15
②
5V(DC)
0.5±0.1
1.25±0.15
①
Insulation
Resistance
Testing
Storage Temperature
4. Standard Testing Conditions
5.Style and Dimensions
0.2±0.15
DC
Rated Withstanding Rated Resistance
Voltage
Voltage
Current
Initial After
■ Unit mass (Typical value)
0.004g
：Electrode
（in mm）
1.0±0.15
6.Marking
No Marking.
7.Electrical Performance
No.
7.1
7.2
7.3
Item
Common Mode
Impedance
(Zc)
Insulation
Resistance (I.R.)
DC Resistance
(Rdc)
Specification
Meet item 3.
Test Method
Measuring Frequency : 100±1MHz (ref.item 10.)
Measuring Equipment : Agilent 4291A or the equivalents
Test fixture : Agilent 16193A or the equivalents
Measuring voltage : Rated Voltage
Measuring time : 1 minute max. (ref.item 10.)
Measuring current : 10mA max.(ref.item 10.)
(In case of doubt in the above mentioned standard
condition,measure by 4 terminal method)
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243D-0004F-01
No.
7.4
Item
Withstanding
Voltage
Specification
Products shall not be damaged.
P2/8
Test Method
Test Voltage : 25V(DC)
Time : 1 to 5 seconds
Charge Current : 1 mA max.(ref.item 10.)
8.Mecanical Performance
No.
8.1
8.2
8.3
8.4
Item
Appearance and
Dimensions
Solderability
Specification
Meet item 5.
Test Method
Visual Inspection and measured with Slide Calipers.
The electrodes shall be at least
95% covered with new solder
coating.
Resistance to
Soldering Heat
Meet Table 1.
Table 1
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C, 1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245±3°C
Immersion Time : 2±1seconds
Immersion and emersion rates : 25 mm / s
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C ,1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270±5°C
Immersion Time : 10±0.5 seconds
Immersion and emersion rates : 25 mm / s
Then measured arter exposure in the room condition
for 4 to 48 hours.
Substrate : glass-epoxy(t =1.0 mm)
Deflection : 2 mm
Speed of Applying Force : 0.5 mm / s
Keeping time : 30 seconds
Bending
Strength
Appearance
Common Mode
Impedance
Change
I.R.
DC Resistance
No damaged
within ± 20%
100MΩ min.
Meet item 3.
Pressure jig
R340
F
Deflection
45
8.5
Drop
Products shall be no failure.
8.6
Bonding
Strength
Meet Table 1.
45
Product (in mm)
It shall be dropped on concrete or steel board.
Method : free fall
Height : 1m
The Number of Times : 3 times
It shall be soldered on the substrate.
Applying Force(F) : 10N
Applying Time : 30±1seconds
Pressure jig
Substrate
Products
Test board fixture
8.7
Vibration
It shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1 minute
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions. (Total 6 hours)
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243D-0004F-01
P3/8
9.Environmental Performance (Products shall be soldered on the glass-epoxy substrate)
No.
9.1
Item
Temperature
Cycle
Specification
Meet Table 1.
9.2
Humidity
9.3
Heat life
9.4
Cold Resistance
Test Method
1 Cycle
Step 1 -40°C(+0°C,-3°C) / 30±3 min
Step 2 Ordinary Temp. / 10 to 15 min
Step 3 +85(+3°C,-0°C) / 30±3 min
Step 4 Ordinary Temp. / 10 to 15 min
Total of 100 cycles.
Then measured after exposure in the room condition
for 4 to 48 hours.
Temperature : 40±2°C
Humidity : 90 to 95 % (RH)
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
Temperature : 85±2°C
Test Voltage : 2 times for Rated Voltage
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
(ref. Item
10.)
Temperature : -40± 2°C
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
10. Terminal to be Tested.
When measuring and suppling the voltage,the following terminal is applied.
No.
10.1
Item
Common Mode Impedance
(Measurement Terminal)
Terminal to be Tested
Terminal
10.2
Insulation Resistance
(Measurement Terminal)
10.3
Withstanding Voltage
(Measurement Terminal)
10.4
Heat Life (Supply Terminal)
10.5
DC Resistance (Measurement Terminal)
Terminal
Terminal
(-)
Terminal
(+)
Terminal
Terminal
Terminal
Terminal
11. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance,
residual inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go Bo.
(2) Measure impedance of the fixture(shorted), Rs Xs.
(3) Measure admittance of the specimen, Gm Bm.
(4) Calculate corrected impedance Z using the formula below.
Z = (Rx2+Xx2) 1/2
Where
Gm-Go
Rx =
- Rs
(Gm-Go)２ + (Bm-Bo)２
Xx =
-(Bm- Bo)
(Gm-Go)２ + (Bm-Bo)２
- Xs
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243D-0004F-01
P4/8
12. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are
specified in item 16 except the case of being specified special condition.
13.Impedance Frequency Characteristics(Typical)
Impedance(ohm)
10000
1000
Differential Mode
100
Common Mode
10
1
1
10
100
Frequency(MHz)
1000
3.5 ±0.05
4.0±0.1
1.20±0.05
2.0±0.05
8.0±0.2
Cavity
1.5± 0.1
0
1.45±0.05
Sprocket Hole
1.75±0.1
14. Specification of Packaging
14.1 Appearance and Dimensions (8mm width,papar tape)
0.8max.
(in mm)
Direction of Feed
14.2 Specification of Taping
(1)Packing quantity(Standard quantity) 10000 pcs. / reel
(2)Packing Method
Products shall be packaged in the cavity of the base tape of 8mm-wide,2 mm pitch continuously and
sealed by top tape and bottom tape.
(3)Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4)Spliced point
The base tape and top tape have no spliced point.
(5)Cavity
There shall not be burr in the cavity.
(6)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc.,whichever is greater,and are not
continuous.The specified quantity per reel is kept.
14.3 Pull Strength of Top Tape
Top Tape
5N min.
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243D-0004F-01
14.4 Peeling off force of Top Tape
0.1 to 0.6N(Minimum value is Typical)
Speed of Peeling off : 300 mm/min.
165 to 180 degree
P5/8
Top tape
F
Bottom tape
Base tape
14.5 Dimensions of Leader-tape, Trailer and Reel
Leader
Trailer
2.0±0.5
160 min.
190 min.
210 min.
Empty tape
Top tape
Label
13.0±0.2
1
60± 0
21.0±0.8
9± 10
Direction of feed
13±1.4
(in mm)
0
180± 3
14.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS Marking(2), Quantity, etc
1) « Expression of Inspection No. »
□□ OOOO
(1) Factory Code
(2) Date
(3) Serial No.
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
2) « Expression of RoHS Marking »
ROHS – Y (△)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(1) (2)
14.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS Marking (2), Quantity, etc
14.8 Specification of Outer Case
Label
H
D
W
15.
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity of an
order.
!
△
Caution
15.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life, body
or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment
(9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
MURATA MFG.CO.,LTD
Spec No. JEFL243D-0004F-01
Reference Only
P6/8
16. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1 Flux and Solder
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Flux
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
Solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
16.2 Assembling
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
16.3 Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
16.4 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
Products shall be location the sideways
a
Direction (Length : a
P.C.B. shall be designed so that products are
far from the portion of perforation.
A
C
B
D
Slit
Length:a b
a
Portion of
Perforation
×
P.C.B.
○
○
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line of a series
of holes when there are big holes in P.C.B.
(Because the stress concentrate on the line of holes.)
Portion of
Perforation
×
○
P.C.B.
< Products Placing >
Support pins shall be set under P.C.B .to prevent causing
a warp to P.C.B. during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
Product
×
Product
Hole
Pick- up nozzle
Product
P.C.B.
Support pin
MURATA MFG.CO.,LTD
Reference Only
Spec No. JEFL243D-0004F-01
P7/8
0.3
1.1
16.6 Standard Land Dimensions (Reflow)
：Copper foil pattern
0.3
1.5
(in mm)
16.7 Soldering
(1) Standard printing pattern of solder paste (Reflow)
Standard thickness of the solder paste should be 100 to 150µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard
land dimensions.
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
1.1
：Resist
0.5
0.5
1.5
(in mm)
(2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
2 times
Time (s)
Limit Profile
above 230°C、60s max.
260°C、10s
2 times
(3) Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron after
being mounted by reflow soldering.
· Pre-heating: 150°C, 1 min
· Soldering iron output: 30W max.
· Tip temperature: 350°C max.
· Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds.
· Times : 2times max.
Notes : Do not touch the products directly with the soldering iron.
(3) Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Upper Limit
Recommendable
Upper Limit
Recommendable
t
1/3 T
≦
ｔ
≦
T
（T : Chip thickness）
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO.,LTD
Spec No. JEFL243D-0004F-01
Reference Only
P8/8
16.8 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
Power : 20W/ l max.
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
(3) Cleaner
1. alcohol type cleaner Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning Please contact us.
16.9 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
16.10 Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance,
such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
16.11 Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
Products should be stored in the warehouse on the following conditions.
Temperature : -10 to +40°C
Humidity
: 15 to 85% relative humidity
No rapid change on temperature and humidity
Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to
prevent the following deterioration.
Poor solderability due to the oxidized electrode.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
17.
!
△
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD
