DLM11SN900HZ2L

Reference Only Spec No. JEFL243C-9116F-01 P1/10 Chip Common Mode Choke Coil DLM11SN□□□HZ2□ Murata Reference Specification [AEC-Q200] 1.Scope This reference specification applies to Chip Common Mode Choke Coil DLM11S Series for Automotive Electronics based on AEC-Q200 except for Power train and Safety. 2.Part Numbering (ex.) DL M 11 S N 900 H (1) (2) (3) (4) (5) (6) (7) (1) Chip Common Mode Choke Coil (2) Structure (M : Monolithic Type) (3) Dimension (L×W) (4) Type S: Magnetically shielded one circuit type (5) Category Z 2 L (8) (9) (10) (6) Impedance (Typ. at 100MHz) (7) Circuit H : Characteristic Impedance 100Ω system (8) Features (9) Number of Line (10) Packaging Code L : Taping / B : Bulk 3.Rating Customer Part Number Murata Part Number Common Mode Impedance (at 100MHz, Under Standard Testing Condition) DLM11SN450HZ2L DLM11SN450HZ2B DLM11SN900HZ2L DLM11SN900HZ2B Rated Voltage Withstanding Voltage Rated Current 5V(DC) 12.5V(DC) 100mA 45Ω±25% 0.7Ω±25% 90Ω±25% Operating Temperature : -55 to +125°C DC Resistance 1.1Ω±25% Storage Temperature 4. Standard Testing Conditions Insulation Resistance ESD Rank 2:2kV 100MΩ min. 2 : -55 to +125°C Temperature : 20 ± 2°C Humidity : 60 to 70%(RH) Atmospheric Pressure : 86 to106kPa Temperature : Ordinary Temperature 15 to 35°C Humidity : Ordinary Humidity 25 to 85%(RH) 5.Style and Dimensions ■ Equivalent Circuits (1) (2) (4) (3) (1) (2) (4) (3) (Top View) 0.3 ± 0.1 0.5 ± 0.1 No polarity (Side View) ■ Unit Mass (Typical value) 0.55 ± 0.1 (Bottom View) 1.0 ± 0.1 0.004g ：Electrode （ In ： mm） 0.2 ± 0.15 1.25 ± 0.1 6.Marking No Marking. MURATA MFG.CO.,LTD Reference Only Spec No. JEFL243C-9116F-01 7. Electrical Performance P2/10 No. 7.1 Item Common Mode Impedance Specification Meet item 3. 7.2 Withstanding Voltage Products shall not be damaged. 7.3 DC Resistance (Rdc) Insulation Resistance (I.R.) Meet item 3. 7.4 Test Method Measuring Frequency : 100±1MHz (ref.item 9.) Measuring Equipment : KEYSIGHT 4991A or the equivalents (In case of doubt in standard condition, the heat treatment (200°C,about 10 minutes)shall be applied. Test Voltage : 2.5 times for Rated Voltage Time : 1 to 5 seconds Charge Current : 1 mA max.(ref.item 9.) Measuring current : 10mA max.(ref.item 9.) Measuring voltage : Rated Voltage Measuring time : 1 minute max. (ref.item 9.) 8. Q200 Requirement 8-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June 1. 2010 AEC-Q200 No. 3 Stress High Temperature Exposure Murata Specification / Deviation Test Method 1000hours at 125 deg C Meet Table A after testing. Set for 24hours at room temperature, then measured. Table A Appearance No damaged Common Mode Impedance within ±20% Change Rdc change I.R. Withstanding Voltage 4 Temperature Cycling 5 Destructive Physical Analysis 7 8 Biased Humidity Operational Life External Visual 10 Physical Dimension 9 within ±30% 100MΩ min. No damaged 1000cycles Meet Table A after testing. -55 deg C to +125 deg C Set for 24hours at room temperature, then measured. Per EIA469 No defects No electrical tests 1000hours at 85 deg C, 85%RH Apply max rated current. Apply 125 deg C 1000hours Set for 24hours at room temperature, then measured Visual inspection Meet ITEM 4 （Style and Dimensions） Meet Table A after testing. (ref.item 9) Meet Table A after testing. Apply rated current. (ref.item 9) No abnormalities No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Meet Table A after testing. Condition F: 1500g’s(14.7N)/0.5ms/ Half sine MURATA MFG.CO.,LTD Reference Only Spec No. JEFL243C-9116F-01 P3/10 AEC-Q200 No. Stress 14 Vibration 15 Resistance to Soldering Heat 17 ESD Test Method 5g's(0.049N) for 20 minutes, 12cycles each of 3 oritentations Test from 10-2000Hz. 12cycles each of 3 orientations Solder temperature 260C+/-5 deg C Immersion time 10s Per AEC-Q200-002 Murata Specification / Deviation Meet Table A after testing. Meet Table A after testing. ESD Rank: Refer to Item 3. Rating. Meet Table B after testing. Table B 18 Solderbility 19 Electrical Characterization 20 Flammability 21 Board Flex 22 Terminal Strength 30 Electrical Transient Conduction Per J-STD-002 Measured : Common mode Impedance Per UL-94 Epoxy-PCB(1.6mm) Deflection 2mm(min) 60 sec minimum holding time. Per AEC-Q200-006 A force of 17.7N for 60sec Per ISO-7637-2 Appearance No damaged Rdc change within ±30% Method b : Not Applicable 95% of the terminations is to be soldered. Flux:Ethanol solution of rosin,25(wt)% activator equivalent to 0.06 to 0.10(wt)% chlorine No defects Not Applicable Meet Table B after testing. 5N for 30s No defects Not Applicable 9. Terminal to be Tested. When measuring and supplying the voltage,the following terminal is applied. No. Item Terminal to be Tested 9.1 Common Mode Impedance Terminal 9.2 Withstanding Voltage Insulation Resistance Terminal Terminal Terminal 9.3 DC Resistance 9.4 Biased Humidity (Supply Terminal) 9.5 Operational Life (Supply Terminal) Terminal Terminal Terminal Terminal Terminal Terminal MURATA MFG.CO.,LTD includes Reference Only Spec No. JEFL243C-9116F-01 10. Measuring method for common mode impedance. P4/10 Measured common mode impedance may be included measurement error due to stray capacitance, residual inductance of test fixture. To correct this error, the common mode impedance should be calculate as follows; (1) Measure admittance of the fixture(opened), Go Bo. (2) Measure impedance of the fixture(shorted), Rs Xs. (3) Measure admittance of the specimen, Gm Bm. (4) Calculate corrected impedance Z using the formula below. Z = (Rx2+Xx2) 1/2 Where Rx = Gm - Go － Rs (Gm-Go)２ + (Bm-Bo)２ Xx = - (Bm - Bo) － Xs (Gm-Go)２ + (Bm-Bo)２ 11. P.C.B., Flux, Solder and Soldering condition Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except the case of being specified special condition. 12.Impedance Frequency Characteristics(Typical) DLM11SN450HZ2 DLM11SN900HZ2 DLM11SN450HZ2 DLM11SN900HZ2 MURATA MFG.CO.,LTD Reference Only Spec No. JEFL243C-9116F-01 P5/10 13. Specification of Packaging Appearance and Dimensions ( 8mm-wide,Plastic tape) 1 .4±0.05 0.25±0.05 0.25±0.05 *Dimension of the Cavity is measured 8.0±0.2 +0.1 φ 1.5 -0 4.0±0.1 Cavity 3.5 ±0.05 Sprocket Hole 1.75±0.1 13.1 at the bottom side. (in:mm) 0.65±0.05 0.65±0.05 4.0±0.1 2.0±0.05 1.15±0.05 Direction of feed 13.2 Specification of Taping (1)Packing quantity(Standard quantity) 4000 pcs. / reel Direction of feed (2)Packing Method Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3)Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4)Spliced point The cover tape have no spliced point. (5)Missing components number Missing components number within 0.025% of the number per reel or 1 pc.,whichever is greater,and are not continuous. The specified quantity per reel is kept. 13.3 13.4 Pull Strength of Plastic Tape Plastic Tape Cover Tape 5N min. 10N min. Peeling off force of Cover Tape 0.2 to 0.7N(Minimum value is Typical) Speed of Peeling off : 300 mm/min. 165 to 180 degree F Cover tape Plastic tape 13.5 Dimensions of Leader-tape, Trailer and Reel MURATA MFG.CO.,LTD Reference Only Spec No. JEFL243C-9116F-01 P6/10 13.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2), Quantity, etc ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day ∗2) « Expression of RoHS Marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) 13.7 Marking for Outside package Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS Marking (∗2), Quantity, etc 13.8 Specification of Outer Case Label H D Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. W 14. ! △ Caution 14.1 Mounting Direction Mount products in right direction. Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also flames or other serious trouble. Ｚ right direction 14.2 Ｚ wrong direction Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and / or reliability requirements to the applications listed in the above. 14.3 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 14.4 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. MURATA MFG.CO.,LTD Reference Only Spec No. JEFL243C-9116F-01 15. Notice P7/10 This product is designed for solder mounting. (reflow soldering only) Please consult us in advance for applying other mounting method such as conductive adhesive. 15.1 15.2 Flux and Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Use of Sn-Zn based solder will deteriorate performance of products. In case of using Sn-Zn based solder, please contact Murata in advance. Assembling Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. 15.3 Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 15.4 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 Products shall be location the sideways Direction (Length : a D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Perforation C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. MURATA MFG.CO.,LTD Reference Only Spec No. JEFL243C-9116F-01 P8/10 (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Recommended Screw Hole 15.5 Attention Regarding P.C.B. Design < The Arrangement of Products > P.C.B. shall be designed so that products are far from the portion of perforation. Portion of Perforation ○ ○ Portion of Perforation The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation. × P.C.B. P.C.B. Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) Product × ○ × Product Hole < Products Placing > Pick- up nozzle Support pins shall be set under P.C.B . Product to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B. P.C.B. < P.C.B. Separation > Support pin P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. 15.6 Attention Regarding P.C.B. Mounting In case of mounting by use of mounting machine, please choose nozzle which can pick up components of 1005 size or the equivalents. 15.7 Standard Land Dimensions (1) (2) (4) (3) 0.55 0.85 0.30 0.55 *(1)(2)(3)(4)Indicates terminal number 1.95 Resist Copper foil pattern No pattern (in : mm) MURATA MFG.CO.,LTD Reference Only Spec No. JEFL243C-9116F-01 P9/10 15.8 Soldering(Reflow soldering) Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Limit Profile above 230°C、60s max. 260°C、10s 2 times (1) Standard printing pattern of solder paste • Standard thickness of the solder paste should be 100 to 150µm. • Use the solder paste printing pattern of the right pattern. • For the resist and copper foil pattern, use standard land dimensions. • Use Sn-3.0Ag-0.5Cu solder. 0.55 Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times 0.30 Pre-heating Heating Peak temperature Cycle of reflow Time (s) 0.70 0.55 (2) Reworking with Soldering iron • The following conditions shall be strictly followed when using a soldering iron after being mounted by reflow soldering. · Pre-heating: 150°C, 1 min · Soldering iron output: 30W max. · Tip temperature: 380°C max. · Tip diameter:φ3mm max. · Soldering time : 3(+1,-0) seconds. · Times : 2times max. • Do not touch the products directly with the tip of the soldering iron. (3) Solder Volume Solder shall be used not to be exceed the upper limits as shown below. Upper Limit Upper Limit Recommendable Recommendable t ） 1/3 T ≦ ｔ ≦ T （T : Chip thickness） Accordingly increasing the solder volume, the mechanical stress to product is also increased. Excessive solder volume may cause the failure of mechanical or electrical performance. MURATA MFG.CO.,LTD 0.70 (in：mm) Reference Only Spec No. JEFL243C-9116F-01 P10/10 15.9 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B.. ・Power : 20W/ l max. ・Frequency : 28kHz to 40kHz ・Time : 5 minutes max. (3) Cleaner 1. Alternative cleaner • Isopropyl alcohol (IPA) 2. Aqueous agent • PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 15.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 15.11 Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 15.12 Storage Conditions (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition • Products should be stored in the warehouse on the following conditions. Temperature : -10 to +40°C Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity • Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to prevent the following deterioration. Poor solderability due to the oxidized electrode. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Avoid storing the product by itself bare (i.e.exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 16. ! △ Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD