Spec No. JEFL243E-0018F-01
Reference Only
Chip Common Mode Choke Coil
DLP0NS□□□□HL2□
P1/10
Reference Specification
1. Scope
This reference specification applies to Chip Common Mode Choke Coil DLP0NS Series.
2. Part Numbering
(ex.)
DL P 0N S
N
121
(1)
(2) (3) (4) (5)
(6)
(1) Chip Common Mode Choke Coil
(2) Structure (P : Film Type)
(3) Dimension (L×W)
(4) Type
(5) Category
N : General Use
C : mipi D-phy Use
(DSI、CSI、UniPro)
H
(7)
L 2 L
(8) (9) (10)
(6) Impedance (Typ. at 100MHz)
(7) Circuit H : Characteristic Impedance 100Ω system
(8) Features
(9) Number of Line
(10) Packaging Code
L : Taping / B : Bulk
3. Rating
Customer
Part Number
Murata
Part Number
Common Mode Impedance
(at 100MHz, Under
Standard Testing Condition)
DLP0NSN350HL2L
DLP0NSN350HL2B
DLP0NSN670HL2L
DLP0NSN670HL2B
DLP0NSN900HL2L
DLP0NSN900HL2B
DLP0NSN121HL2L
DLP0NSN121HL2B
DLP0NSC280HL2L
DLP0NSC280HL2B
DLP0NSC900HL2L
DLP0NSC900HL2B
Rated Withstanding Rated
Voltage
Voltage
Current
DC
Insulation
Resistance Resistance
100mA 1.2Ω±25%
35Ω±10Ω
67Ω ±20%
110mA
2.4Ω±25%
90Ω ±20%
100mA
3.0Ω±25%
90mA
3.8Ω±25%
5V(DC) 12.5V(DC)
120Ω ±20%
100mA 1.3Ω±25%
28Ω±20%
75mA
90Ω±35%
Operating Temperature : -40 to +85°C
100MΩ
min.
4.0Ω±30%
Storage Temperature : -40 to +85°C
4. Standard Testing Conditions
Temperature : 20 ± 2°C
Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
Temperature : Ordinary Temperature 15 to 35°C
Humidity : Ordinary Humidity 25 to 85%(RH)
5.Style and Dimensions
(1)
(2)
(4)
(3)
■ Equivalent Circuits
(Top View)
0.45±0.05
0.27±0.10
(Side View)
(1)
(2)
(4)
(3)
0.85±0.05
(Bottom View)
0.50±0.10
No polarity.
: Electrode
(in : mm)
0.20 +0.05/-0.10
6.Marking
0.65±0.05
No Marking.
MURATA MFG.CO., LTD
■ Unit Mass(Typical value)
0.001g
Spec No. JEFL243E-0018F-01
Reference Only
P2/10
7. Electrical Performance
No.
7.1
Item
Common Mode
Impedance
Specification
Meet item 3.
7.2
Withstanding
Voltage
Products shall not be damaged.
7.3
DC Resistance
(Rdc)
Meet item 3.
7.4
Insulation
Resistance (I.R.)
Test Method
Measuring Frequency : 100±1MHz (ref.item 10.)
Measuring Equipment : KEYSIGHT4291A or the
equivalents
(In case of doubt in standard condition, the heat
treatment(200°C, about 10 minutes)shall be applied.
Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
Charge Current : 1 mA max.(ref.item 10.)
Measuring current : 90mA max.(ref.item 10.)
Measuring voltage : Rated Voltage
Measuring time : 1 minute max. (ref.item 10.)
8.Mechanical Performance
No.
8.1
8.2
8.3
Item
Appearance and
Dimensions
Solderability
Specification
Meet item 5.
Test Method
Visual Inspection and measured with Slide Calipers.
The electrodes shall be at least
95% covered with new solder
coating.
Resistance to
Soldering Heat
Meet Table 1.
Table 1
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150±10°C, 60～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240±3°C
Immersion Time : 3±0.5s
Immersion and emersion rates : 25 mm / s
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150±10°C, 60～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270±5°C
Immersion Time : 5±1s
Immersion and emersion rates : 25 mm / s
Then measured arter exposure in the room condition
for 4 to 48 hours.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 1m
The Number of Times : 10 times
It shall be soldered on the substrate.
Oscillation Frequency : 10 to 2000 to 10Hz for 15
minutes
Total amplitude : 3.0 mm or Acceleration amplitude
196 m/s2 whichever is smaller.
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions.
Substrate : (t =1.0 mm).
Deflection : 3 mm
Speed of Applying Force : 1.0 mm / s
Keeping time : 5 seconds
8.4
Drop
8.5
Vibration
8.6
Bending
Strength
Appearance
Common Mode
Impedance
Change
I.R.
DC Resistance
Change
No damaged
within ± 20%
100MΩ min.
within ± 30%
Meet Table 2.
Table 2
Appearance
No damaged
DC Resistance
within ± 30%
Change
Pressure jig
R230
F
Deflection
45
MURATA MFG.CO., LTD
45
Product
Spec No. JEFL243E-0018F-01
Reference Only
P3/10
9.Environmental Performance (Products shall be soldered on the glass-epoxy substrate)
No.
9.1
Item
Temperature
Cycle
9.2
Humidity
9.3
Heat life
9.4
Cold Resistance
Specification
Meet Table 1.
Test Method
1 Cycle
Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min
Step 2 Ordinary Temp. / within 3 min
Step 3 +85(+3°C,-0°C) / 30(+3,-0) min
Step 4 Ordinary Temp. / within 3 min
Total of 100 cycles.
Then measured after exposure in the room condition
for 4 to 48 hours.
Temperature : 40±2°C
Humidity : 90 to 95 % (RH)
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
Temperature : 85±2°C
Test Voltage : 2 times for Rated Voltage
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
(ref. Item 10.)
Temperature : -40± 2°C
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
10. Terminal to be Tested.
When measuring and supplying the voltage,the following terminal is applied.
No.
10.1
10.2
10.3
Item
Common Mode
Impedance
Withstanding Voltage
Insulation Resistance
Heat Life
DC Resistance
Terminal to be Tested
ＩＮ
ＯＵＴ
ＩＮ
ＯＵＴ
ＩＮ
Ｏ ＵＴ
ＩＮ
ＯＵＴ
11. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance, residual
inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go Bo.
(2) Measure impedance of the fixture(shorted), Rs Xs.
(3) Measure admittance of the specimen, Gm Bm.
(4) Calculate corrected impedance Z using the formula below.
Z = (Rx2+Xx2) 1/2
Where
Rx =
Gm - Go
－ Rs
(Gm-Go)２ + (Bm-Bo)２
Xx =
- (Bm - Bo)
－ Xs
(Gm-Go)２ + (Bm-Bo)２
12. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except the
case of being specified special condition.
MURATA MFG.CO., LTD
Spec No. JEFL243E-0018F-01
Reference Only
13.Impedance Frequency Characteristics(Typical)
DLP0NSC Series
DLP0NSN Series
DLP0NSC280HL2
MURATA MFG.CO., LTD
P4/10
Reference Only
Spec No. JEFL243E-0018F-01
P5/10
+0.1
-0
φ 1.5
送 りHole
穴
Sprocket
(4)
(3)
*Dimension of the Cavity is measured
0 .95 ±0 .0 5
＊(1)(2)(3)(4) indicates
terminal number
2.0±0.1
at the bottom side.
8 .0 ±0 .2
(2)
0.25±0.05
3 .5 ±0 .0 5
(1)
Cavity
ｷｬﾋﾞﾃｨ
2.0±0.05
4.0±0.1
1 .7 5 ±0 .1
14.Specification of Packaging
14.1 Appearance and Dimensions ( 8mm-wide, 2mm pitch Plastic tape)
(in:mm)
0.55±0.05
0.75±0.05
引 き 出 しof
方feed
向
Direction
14.2
Specification of Taping
(1)Packing quantity(Standard quantity) 10000 pcs. / reel
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3)Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4)Spliced point
The cover tape have no spliced point.
(5)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
14.3
14.4
Pull Strength of Plastic Tape
Plastic Tape
Cover Tape
5N min.
10N min.
Peeling off force of Cover Tape
0.2 to 0.7N(Minimum value is Typical)
Speed of Peeling off : 300 mm/min.
165 to 180 degree
F
Cover tape
Plastic tape
14.5 Dimensions of Leader-tape, Trailer and Reel
Leader
Trailer
2.0±0.5
160 min.
190 min.
210 min.
Empty tape
Top tape
Label
φ 13.0±0.2
1
φ 60± 0
φ 21.0±0.8
9± 10
Direction of feed
13±1.4
0
φ 180± 3
(in:mm)
MURATA MFG.CO., LTD
Reference Only
Spec No. JEFL243E-0018F-01
P6/10
14.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc
∗1) « Expression of Inspection No. »
□□ OOOO ×××
(1) Factory Code
(2) Date
(3) Serial No.
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(1) (2)
14.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(∗2), Quantity, etc
14.8 Specification of Outer Case
Label
H
D
W
15.
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
∗ Above Outer Case size is typical. It depends on a quantity of an order.
!
△
Caution
15.1
Mounting Direction
Mount products in right direction.
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also flames or
other serious trouble.
Ｚ
right direction
15.2
Ｚ
wrong direction
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability
requirements to the applications listed in the above.
16. Notice
This product is designed for solder mounting. (reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1
Flux and Solder
Flux
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
MURATA MFG.CO., LTD
Spec No. JEFL243E-0018F-01
Reference Only
P7/10
16.2
Assembling
Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is
limited to 100°C MAX. Also cooling into solvent after soldering should be in such a way that the temperature
difference is limited to 100°C max.
16.3
Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
16.4
Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
Products shall be location the sideways
a
Direction (Length : awarping direction 2.
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
Perforation
A
C
B
D
Slit
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB,
therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Screw Hole
Recommended
16.5 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
Portion of
Perforation
×
P.C.B.
○
○
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Portion of
Perforation
MURATA MFG.CO., LTD
Product
×
Reference Only
Spec No. JEFL243E-0018F-01
○
P.C.B.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
P8/10
×
Product
Hole
< Products Placing >
Pick- up nozzle
Support pins shall be set under P.C.B .
Product
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
P.C.B.
< P.C.B. Separation >
Support pin
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
16.6
Attention Regarding P.C.B. Mounting
In case of mounting by use of mounting machine, please choose nozzle which can pick up
components of 1005 size or 0603 size.
16.7
Standard Land Dimensions
(1)
(2)
(4)
(3)
0.50
0.80
0.30
0.30
*(1)(2)(3)(4)Indicates terminal number
Resist
Copper foil pattern
No pattern
0.90
(in : mm)
16.8 Soldering(Reflow soldering)
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
2 times
Time (s)
Limit Profile
above 230°C、60s max.
260°C、10s
2 times
MURATA MFG.CO., LTD
(1) Standard printing pattern of solder paste
• Standard thickness of the solder paste should be 100 to 150µm.
• Use the solder paste printing pattern of the right pattern.
• For the resist and copper foil pattern, use standard land dimensions.
• Use Sn-3.0Ag-0.5Cu solder.
P9/10
0.50
Reference Only
0.30
Spec No. JEFL243E-0018F-01
0.30 0.30 0.30
(2) Reworking with Soldering iron
• The following conditions shall be strictly followed when using a soldering iron after being
mounted by reflow soldering.
· Pre-heating: 150°C, 1 min
· Soldering iron output: 30W max.
· Tip temperature: 380°C max.
· Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
• Do not touch the products directly with the tip of the soldering iron.
(in mm)
(in：mm)
(3) Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Upper Limit
Recommendable
Upper Limit
Recommendable
t
1/3 T ≦ t ≦ T （T : Chip thickness）
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
16.9
Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
・Power : 20W/ l max. ・Frequency : 28kHz to 40kHz ・Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner • Isopropyl alcohol (IPA)
2. Aqueous agent
• PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
16.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
16.11
Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance,
such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
MURATA MFG.CO., LTD
Spec No. JEFL243E-0018F-01
Reference Only
P10/10
16.12 Storage Conditions
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
• Products should be stored in the warehouse on the following conditions.
Temperature : -10 to +40°C
Humidity
: 15 to 85% relative humidity
No rapid change on temperature and humidity
• Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to prevent the
following deterioration.
Poor solderability due to the oxidized electrode.
• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
• Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
17.
!
△
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
