DLW32SH101XF2L

Reference Only Spec No.: JEFL243C-9127-01 P1/9 Wire Wound Chip Common Mode Choke Coil DLW32SH□□□XF2□ Murata Standard Reference Specification【AEC-Q200】 1. Scope This reference specification applies to Wire Wound Chip Common Mode Choke Coil DLW32SH_XF Series for Automotive Electronics based on AEC-Q200. 2. Part Numbering (ex) DL (1) W (2) 32 (3) S (4) (1) Chip Common Mode Choke Coil (2) Structure (W: Winding Type) (3) Dimension (L×W) (4) Type (5) Category H (5) 101 (6) X (7) F (8) 2 (9) L (10) (6) Inductance (7) Circuit (8) Features (9) Number of Line (10) Packaging Code L : Taping (Φ180mm/reel) B : Bulk ∗Bulk packing also available. (A product is put in the plastic bag under the taping conditions.) 3. Rating Operating Temperature : Storage Temperature : Customer Part Number -40 to +125°C -40 to +125°C Murata Part Number Common Mode Inductance (uH) (at 0.1MHz) DLW32SH101XF2L 100 (-30%/+50%) 4. Standard Testing Condition Temperature Humidity ：Ordinary Temperature / 15°C to 35°C ：Ordinary Humidity / 25%(RH) to 85%(RH) Rated Withstanding Rated Voltage Current Voltage (mA) V(DC) V(DC) 50 125 115 Temperature Humidity Atmospheric Pressure Insulation DC Resistance Resistance ESD Rank (MΩ min.) (Ω max.) 2.1 10 ：20°C±2°C ：60%(RH) to 70%(RH) ：86kPa to 106 kPa 5. Style and Dimensions ■ Equivalent Circuits (1) (2) (4) (3) No polarity ■ Unit Mass (Typical value) 0.069g 6. Marking No Marking. MURATA MFG.CO., LTD 5B (12kV(AD) < 16kV(AD)) Reference Only Spec No.: JEFL243C-9127-01 7. Electrical Performance No. 7.1 Item Common Mode Inductance (Lc) Specification Meet item 3. 7.2 Insulation Resistance (I.R.) Withstanding Voltage Meet item 3. DC Resistance (Rdc) Meet item 3. 7.3 7.4 Products shall not be damaged. P2/9 Test Method Measuring Equipment : KEYSIGHT 4294A or the equivalent Measuring Frequency:0.1MHz (ref.item 9.1) Measuring voltage : Rated Voltage Measuring time : 1 min max. (ref.item 9.3) Test Voltage : 2.5 times for Rated Voltage Time : 1 to 5 s Charge Current : 1 mA max. (ref.item 9.2) Measuring current : 10mA max. (ref.item 9.4) (In case of doubt in the above mentioned standard condition, measure by 4 terminal method.) 8.Q200 Requirement 8-1.Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June 1. 2010 AEC-Q200 No. Stress 3 High Temperature Exposure Test Method 1000hours at 125 deg C Set for 24hours at room temperature, then measured. 4 Temperature Cycling 1000cycles -40 deg C to +125 deg C Set for 24hours at room temperature, then measured. 5 Destructive Per EIA469 Physical Analysis No electrical tests 7 Biased Humidity 1000hours at 85 deg C, 85%RH Apply max rated current. Set for 24hours at room temperature, then measured. 8 Operational Life 1000hours at 125 deg C Apply max rated current Set for 24hours at room temperature, then measured. 9 External Visual Visual inspection 10 Physical Dimension Meet ITEM 5 （Style and Dimensions） 12 Resistance Per MIL-STD-202 Method 215 to Solvents 13 Mechanical Shock Per MIL-STD-202 Method 213 Condition F: 1500g's(14.7N)/0.5ms/Half sine 14 Vibration 5g's(0.049N) for 20 minutes, 12cycles each of 3 oritentations Test from 10-2000Hz. 15 Resistance No-heating to Soldering Heat Solder temperature 260C+/-5 deg C Immersion time 10s Murata Specification / Deviation Meet Table A after testing. Table A Appearance Common Mode Inductance Change (at 0.1MHz) No damage Within ±20% Meet Table A after testing. Not Applicable Meet Table A after testing. (ref.item 9.5) Meet Table A after testing. (ref.item 9.6) No abnormalities No defects Not Applicable Meet Table A after testing. Meet Table A after testing. Pre-heating:150 to 180 deg C / 90±30s Meet Table A after testing. MURATA MFG.CO., LTD Reference Only Spec No.: JEFL243C-9127-01 AEC-Q200 No. Stress Murata Specification / Deviation Test Method 17 ESD Per AEC-Q200-002 18 Solderability Per J-STD-002 19 Electrical Characterization Measured: Common mode inductance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm) Deflection 2mm(min) Holding time 60s Per AEC-Q200-006 A force of 17.7N for 60s Per ISO-7637-2 Meet Table A after testing. 22 Terminal Strength 30 Electrical Transient Conduction P3/9 ESD Rank: Meet Item 3 (Rating) Meet Table A after testing. Method b : Not Applicable The External electrodes for mounting land patterns shall be at least 95% covered with new solder coating.(Except for Wire) Flux:Ethanol solution of rosin,25(wt)% includes activator equivalent to 0.06 to 0.10(wt)% chlorine No defects Not Applicable 9. Terminal to be Tested. When measuring and supplying the voltage, the following terminal is applied. No. 9.1 9.2 Item Insulation Resistance (Measurement Terminal) 9.4 DC Resistance (Measurement Terminal) 9.6 Terminal Withstanding Voltage (Measurement Terminal) 9.3 9.5 Terminal to be Tested Common Mode Inductance (Measurement Terminal) Terminal Terminal Terminal Biased Humidity (Supply Terminal) Operational Life (Supply Terminal) Terminal Terminal Terminal Terminal Terminal Terminal 10. P.C.B., Flux, Solder and Soldering condition Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 13 except the case of being specified special condition. MURATA MFG.CO., LTD Spec No.: JEFL243C-9127-01 11. Specification of Packaging Reference Only P4/9 11.1 Appearance and Dimensions ( 12mm-wide,Plastic tape) *Dimension of the Cavity is measured at the bottom side. 11.2. Specification of Taping (1) Packing quantity (Standard quantity) φ 180 mm reel :1500 pcs. / reel (2) Packing Method Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point The cover tape have no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 11.3. Pull Strength of Plastic Tape Plastic Tape Cover Tape 5 N min. 10 N min. 11.4. Peeling off force of Cover Tape 0.2N to 0.7N (minimum value is typical.) Speed of Peeling off : 300 mm / min 165 to 180 degree F Cover tape Plastic tape 11.5. Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. « Packaging Code : L (Φ180mm reel) » MURATA MFG.CO., LTD Reference Only Spec No.: JEFL243C-9127-01 P5/9 11.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2), Quantity, etc ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS Marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 11.7 Marking for Outside package Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS Marking(∗2), Quantity, etc 11.8 Specification of Outer Case Reel W Label H D Outer Case Dimensions (mm) D H Standard Reel Quantity in Outer Case (Reel) 186 186 93 4 φ180mm *Above Outer Case size is typical. It depends on a quantity of an order. W 12. ! △ Caution 12.1 Mounting Direction Mount products in right direction. Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also flames or other serious trouble. Ｚ Ｚ right direction wrong direction 12.2 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 12.3 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 12.4 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 13. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 13.1 Flux and Solder Flux Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ), but not highly acidic flux (with Halogen content exceeding 0.2(wt)% conversion to chlorine). Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of the solder paste should be 150µm. MURATA MFG.CO., LTD Reference Only Spec No.: JEFL243C-9127-01 P6/9 13.2 Assembling Flow soldering may cause deterioration in insulation resistance. So, reflow soldering shall be applied for this product. 13.3 Cleaning Conditions Do not clean after soldering. Some cleaning agents may degrade bonding strength,and characteristics of products by detaching. If cleaning,please contact us. 13.4 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 13.5 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 Products shall be location the sideways Direction (Length : a D *1 A > B A > C *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended MURATA MFG.CO., LTD Spec No.: JEFL243C-9127-01 Reference Only P7/9 Portion of Perforation 13.6 Attention Regarding P.C.B. Design < The Arrangement of Products > P.C.B. shall be designed so that products are far from the portion of perforation. × P.C.B. ○ ○ The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation. Portion of Perforation P.C.B. Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) < Products Placing > Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B. < P.C.B. Separation > P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. Product × ○ × Product Hole Pick- up nozzle Product P.C.B. Support pin 13.7 Standard Land Dimensions (Reflow) *1 *2 ∗1 If the pattern is made with less than 0.4mm , in the worst case , short circuit between lines may be occurred due to the spread of soldering paste or mount placeing accuracy. ∗2 If the pattern is made with wider, the strength of bending will be reduced. Moreover, if the pattern is made with less than 2mm , in the worst case short circuit may be occurred. ∗3 Do not use gilded pattern. A copper wire may cause open by dissolution of metallization. 13.8 Standard Soldering Condition 1.Reflow Soldering (1) Standard printing pattern of solder paste • Standard thickness of the solder paste should be 150 µm. • Use the solder paste printing pattern of the right pattern. • For the resist and copper foil pattern, use standard land dimensions. • Use the Solder Sn-3.0Ag-0.5Cu for pattern printing. • Spread of soldering paste between lines may cause short circuit of lines. MURATA MFG.CO., LTD (in mm) Spec No.: JEFL243C-9127-01 Reference Only P8/9 (2) Soldering Temperature Temperature difference between soldering and surface of components must be within 150°C, in preheating. When components are immersed in liquid after soldering, temperature difference should be within 100°C. If preheating is not enough, components may be cracked and cause deterioration in insulation resistance. (3) Soldering Condition Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the eterioration of product quality. Soldering Profile for Lead Free solder (Sn-3.0Ag-0.5Cu solder ) Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Limit Profile above 230°C、60s max. 260°C,10s 2 times 2. Reworking with Soldering iron The following conditions must be strictly followed when using a soldering iron after being mounted by reflow soldering. · Pre-heating: 150°C, 1 min · Soldering iron output: 30W max. · Tip temperature: 350°C max. · Tip diameter:φ3mm max. · Soldering time : 3(+1,-0) s. · Times : 2times max. Notes : Do not touch the products directly with the soldering iron. 3. Solder Volume Solder shall be used not to be exceeded the upper limits as shown below. 1/3T≦t≦T Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. In case if the solder volume is much, we recommend to make the size of the solder paste with less than the land pattern. 4.Solder fillet Solder fillet in lateral direction is not formed in some case because of product's structure, but it is not something that affects product's performance and reliability. MURATA MFG.CO., LTD Spec No.: JEFL243C-9127-01 Reference Only 13.9 Caution for use ･When you hold products with a tweezer, please hold like a figure of the right side, and sharp material, such as a pair of tweezers, shall not be touched to the winding portion to prevent the breaking of wire. ･Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. P9/9 tweezer 13.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 13.11 Brushing of neighborhood of products When you clean the neighborhood of products such as connector pins, bristles of cleaning brush shall not be touched to the winding portion to prevent the breaking of wire. 13.12 Mounting Conditions ・Please check the mounting condition before using. ・Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 13.13 Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 13.14 Storage Condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment conditions ·Products should be stored in the warehouse on the following conditions. Temperature ： -10 ~ +40°C Humidity ： 15 to 85% relative humidity No rapid change on temperature and humidity. · Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases, to prevent the following deterioration. Poor solderability due to the oxidized electrode. · Products should be stored on the palette for the prevention of the influence from humidity,dust and so on. · Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. · Products should not be stored under the air tights packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 14. △! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD