DLW43SH510XK2K

Spec No.: JEFL243C_9101Q-01 P1/10 CHIP COMMON MODE CHOKE COIL DLW43SH□□□XK2□ Murata Standard Reference Specification [AEC-Q200] 1. Scope This reference specification applies to chip common mode choke coil DLW43SH_XK series for automotive electronics based on AEC-Q200. 2. Part Numbering (Ex.) DL W 43 Product Type Dimension ID (L × W) S Feature H Feature (H: for automotive electronics) 101 Inductance X Circuit K Feature 2 Number of line L Packaging L: taping (ø180) K: taping (ø330) *B: bulk *B: Bulk packing is also available (products sealed with carrier tape are put into plastic bags). 3. Part Number and Rating Operating temperature range -40°C to +125°C Storage temperature range -40°C to +125°C Murata Part number Common mode inductance (μH) Rated voltage (VDC) Withstanding voltage (VDC) Rated current (mA) DC resistance (Ω max.) Insulation resistance (MΩ min.) ESD rank 6: 25 kV DLW43SH110XK2L 11 (-30%/+50%) at 0.1 MHz 50 125 360 0.5 10 6 DLW43SH110XK2K 11 (-30%/+50%) at 0.1 MHz 50 125 360 0.5 10 6 DLW43SH220XK2L 22 (-30%/+50%) at 0.1 MHz 50 125 310 0.6 10 6 DLW43SH220XK2K 22 (-30%/+50%) at 0.1 MHz 50 125 310 0.6 10 6 DLW43SH510XK2L 51 (-30%/+50%) at 1 MHz 50 125 230 1.0 10 6 DLW43SH510XK2K 51 (-30%/+50%) at 1 MHz 50 125 230 1.0 10 6 DLW43SH101XK2L 100 (-30%/+50%) at 1 MHz 50 125 200 2.0 10 6 DLW43SH101XK2K 100 (-30%/+50%) at 1 MHz 50 125 200 2.0 10 6 Customer Part number 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C) Humidity: ordinary humidity [25% to 85% (RH)] In case of doubt Temperature: 20°C±2°C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa MURATA MFG CO., LTD Spec No.: JEFL243C_9101Q-01 P2/10 5. Appearance and Dimensions Equivalent circuit Unit mass (typical value): 0.17 g 6. Marking No marking. 7. Electrical Performance No. 7.1 Item Common mode inductance Specification Meet chapter 3 ratings. Test method Measuring equipment: Keysight 4294A or the equivalent Measuring frequency: 0.1 MHz 11 μH, 22 μH 1 MHz 51 μH, 100 μH Measuring method: see "Measuring method" in the Appendix. 7.2 Withstanding voltage Products shall not be damaged. Test voltage: 2.5 times for rated voltage Time: 1 s to 5 s Charge current: 1 mA max. Measuring method: see "Measuring method" in the Appendix. 7.3 DC resistance Meet chapter 3 ratings. Measuring current: 10 mA max. (In case of doubt in the above mentioned standard condition, measure by the 4-terminal method.) Measuring method: see "Measuring method" in the Appendix. 7.4 Insulation resistance Meet chapter 3 ratings. Measuring voltage: rated voltage Measuring time: 60 s max. Measuring method: see "Measuring method" in the Appendix. MURATA MFG CO., LTD Spec No.: JEFL243C_9101Q-01 P3/10 8. AEC-Q200 Requirement 8.1 Performance [(based on table 13 for ferrite EMI suppressors/filters) AEC-Q200 Rev. D issued June 1, 2010] AEC-Q200 No. 3 Stress High temperature exposure Murata specification/deviation Test method 1000 h at 125°C Set for 24 h at room temperature, then measured. Meet table A after testing. Table A Appearance Common mode inductance (at 0.1 MHz/11 μH, 22 μH) (at 1 MHz/51 μH, 100 μH) No damage Meet chapter 3 ratings. 4 Temperature cycling 1000 cycles -40°C to +125°C Set for 24 h at room temperature, then measured. Meet table A after testing. 5 Destructive physical analysis Per EIA469 No electrical tests Not applicable 7 Biased humidity 1000 h at 85°C, 85% (RH). Apply max rated current. Meet table A after testing. See "Measuring method" in the Appendix. 8 Operational life 1000 h at 125°C Apply rated current. Set for 24 h at room temperature, then measured. Meet table A after testing. See "Measuring method" in the Appendix. 9 External visual Visual inspection No abnormalities 10 Physical dimension Meet chapter 5, "Appearance and Dimensions". No defects 12 Resistance to solvents Per MIL-STD-202 Method 215 Not applicable 13 Mechanical shock Per MIL-STD-202 Method 213 Condition F: 1500 g’s (14.7 N), 0.5 ms, half sine Meet table A after testing. 14 Vibration 5 g's (0.049 N) for 20 min, 12 cycles each of 3 orientations Test from 10 Hz to 2000 Hz Meet table A after testing. 15 Resistance to soldering heat No-heating Solder temperature 260°C±5°C Immersion time 10 s Pre-heating: 150°C to 180°C, 90 s±30 s Meet table A after testing. 17 ESD Per AEC-Q200-002 ESD rank: Refer to chapter 3 ratings. Meet table A after testing. 18 Solderbility Per J-STD-002 Method b: not applicable 90% of the terminations is to be soldered (except partlyexposed wire). Flux: ethanol solution of rosin, 25(wt)% includes activator equivalent to 0.06(wt)% to 0.10(wt)% chlorine 19 Electrical Measured: common mode inductance characterization No defects 20 Flammability Per UL-94 Not applicable 21 Board flex Epoxy-PCB (1.6 mm) Deflection 2 mm (min.) 60 s minimum holding time Meet table A after testing. 22 Terminal strength Per AEC-Q200-006 A force of 17.7 N for 60 s No defects 30 Electrical transient conduction Per ISO-7637-2 Not applicable MURATA MFG CO., LTD Spec No.: JEFL243C_9101Q-01 P4/10 9. Specification of Packaging 9.1 Appearance and dimensions of tape (12 mm width/plastic tape) A 3.6±0.1 B 4.9±0.1 t 2.7±0.1 t' 0.3±0.05 (in mm) * The dimensions of the cavity are measured at its bottom. 9.2 Taping specifications Packing quantity (Standard quantity) 500 pcs/reel (ø180 mm reel) 2500 pcs/reel (ø330 mm reel) Packing method The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom tape when the cavities of the carrier tape are punched type). Feed hole position The feed holes on the carrier tape are on the right side when the cover tape (top tape when the cavities of the carrier tape are punched type) is pulled toward the user. Joint The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are seamless. Number of missing products Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Break down force of tape Cover tape (or top tape) 5 N min. Bottom tape (only when the cavities of the carrier tape are punched type) 5 N min. 9.4 Peeling off force of tape Speed of peeling off Peeling off force 300 mm/min 0.2 N to 0.7 N (The lower limit is for typical value.) 9.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape. (See the diagram below.) • Packaging: L (ø180 mm reel) MURATA MFG CO., LTD Spec No.: JEFL243C_9101Q-01 P5/10 • Packaging: K (ø330 mm reel) 9.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  □□ ○○○○ (2) Date First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 9.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 9.8 Specification of outer box Reel Label H D W 10. Dimensions of outer box (mm) Standard reel quantity in outer box (reel) W D H ø180 mm 186 186 93 4 ø330 mm 340 340 85 4 * Above outer box size is typical. It depends on a quantity of an order. Caution 10.1 Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea (4) Power plant equipment control equipment (5) Medical equipment (6) Transportation equipment (7) Traffic signal (8) Disaster/crime (trains, ships, etc.) equipment prevention equipment (9) Data-processing (10) Applications of similar complexity and/or equipment reliability requirements to the applications listed in the above 10.2 Precautions on rating Avoid using in exceeded the rated temperature range, rated voltage, or rated current. Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault. 10.3 Inrush current If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious fault. MURATA MFG CO., LTD Spec No.: JEFL243C_9101Q-01 P6/10 10.4 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 10.5 Mounting direction Mount the products in the correct direction. Mounting in a direction that is rotated 90° from the correct direction could result in an open or short circuit, and in some cases, burning or other serious accident could also occur. 10.6 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 11. Precautions for Use This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. 11.1 Land dimensions The following diagram shows the recommended land dimensions for reflow soldering: (Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.) a 3.0 (except DLW43SH101) *1 3.2 (only DLW43SH101) b 5.9 c 1.6 *2 d 3.4 *3 (in mm) *1 If the pattern is made wider than the specified dimensions, the strength of bending will be reduced. Also, if the pattern is made smaller than the specified dimensions, a short circuit may occur. *2 If the pattern is made smaller than the specified dimensions, a short circuit may occur due to the spread of soldering paste or mount placing accuracy. *3 If the pattern is made wider than the specified dimensions, the solder melting balance may become unbalanced, causing the product to rotate, and in the worst case, a short circuit between the adjacent lines may occur. 11.2 Flux and solder used Flux • Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux. Solder • Use Sn-3.0Ag-0.5Cu solder. • Standard thickness of solder paste: 150 μm If you want to use a flux other than the above, please consult our technical department. MURATA MFG CO., LTD Spec No.: JEFL243C_9101Q-01 P7/10 11.3 Soldering conditions (reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Standard profile Limit profile Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s Heating Above 220°C/30 s to 60 s Above 240°C/30 s max. 245°C±3°C 260°C/10 s 2 times 2 times Peak temperature Number of reflow cycles 11.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating Tip temperature of soldering iron Power consumption of soldering iron Tip diameter of soldering iron Soldering time Number of reworking operations 150°C/approx. 1 min 350°C max. 30 W max. ø3 mm max. 3 s (+1 s, -0 s) 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. 11.5 Solder volume Solder shall be used not to increase the volume too much. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. If the solder volume is large, it is recommended to apply a solder print pattern that is smaller than the land pattern size. * Solder fillet Solder fillet in lateral direction is not formed in some case because of product's structure, but it is not something that affects product's performance and reliability. MURATA MFG CO., LTD Spec No.: JEFL243C_9101Q-01 P8/10 11.6 Product's location The following shall be considered when designing and laying out PCBs. (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (length: a < b) to the mechanical stress. a b 〈 Poor example〉 〈 Good example〉 (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the board separation surface. A>C *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 11.7 Handling of substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG CO., LTD Spec No.: JEFL243C_9101Q-01 P9/10 11.8 Cleaning Use this product without cleaning. Cleaning may cause adhesives to come off and deterioration of product characteristics. 11.9 Storage and transportation Storage period Use the product within 12 months after delivery. If you do not use the product for more than 12 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor solderability. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. • Do not keep products in bulk packaging. Bulk storage could result in collisions between the products or between the products and other parts, resulting in chipping or wire breakage. • Avoid storing the product by itself bare (i.e. exposed directly to air). Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. 11.10 Resin coating (including moisture-proof coating) When the product is coated/molded with resin, its electrical characteristics may change. A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading to wire breakage. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.11 Mounting conditions Check the mounting condition before using. Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 11.12 Operating environment Do not use this product under the following environmental conditions as it may cause deterioration of product quality. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc) (2) In the atmosphere where liquid such as organic solvent, may splash on the products. (3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew. 11.13 Mounting density If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures. If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating temperature for the product. 11.14 Handling of product • To prevent wire breakage, sharp objects such as tweezers, bristles of cleaning brushes, and other objects must not contact the winding section or the electrode section. • Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 12. Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD Spec No.: JEFL243C_9101Q-01 P10/10 Appendix Measurement, voltage application, and current application are performed using the terminals shown in the table below. Item Terminal to be tested Common mode inductance (Measurement terminal) Withstanding voltage (Supply terminal) DC resistance (Measurement terminal) Insulation resistance (Measurement terminal) Heat life (Supply terminal) MURATA MFG CO., LTD