DLW5ATN111SQ2L

Reference Only Spec No. JEFL243C – 0017G-01 P 1/10 Wire Wound Chip Common Mode Choke Coil ＤＬＷ５ＡＴＮ□□□ＳＱ２□ Reference Specification 1. Scope This reference specification applies to Wire Wound Chip Common Mode Choke Coil DLW5AT_SQ Series. 2. Part Numbering (ex.) DL (1) W (2) 5A (3) T N (4) (5) 111 (6) S Q (7) (8) 2 L (9) (10) (6) Impedance (Typ. at 100MHz) (7) Circuit (8) Features (9) Number of Line (10) Packaging Code L : Taping (φ180mm/reel) K : Taping (φ330mm/reel) B : Bulk (1) Chip Common Mode Choke Coil (2) Structure (W : Winding Type) (3) Dimension (L×W) (4) One Circuit and Low Height Type (5) Category 3.Rating Customer Part Number MURATA Part Number Impedance at 10MHz, Under Standard Impedance at 100MHz, Under Standard Voltage Testing Conditions Testing Conditions V(DC) (Ω+/-25%) (ΩTyp.) 12 Rated Withstanding Voltage V(DC) *Rated Current DC Resistance (A) (Rdc) (Ωmax.) 110 5.0 0.020 35 400 2.0 0.034 55 500 1.5 0.056 60 850 1.5 0.073 100 2700 1.0 0.12 Insulation Resistance (MΩ min.) DLW5ATN111SQ2L DLW5ATN111SQ2K DLW5ATN111SQ2B DLW5ATN401SQ2L DLW5ATN401SQ2K DLW5ATN401SQ2B DLW5ATN501SQ2L DLW5ATN501SQ2K 50 125 DLW5ATN501SQ2B DLW5ATN851SQ2L DLW5ATN851SQ2K DLW5ATN851SQ2B DLW5ATN272SQ2L DLW5ATN272SQ2K DLW5ATN272SQ2B *As for DLW5ATN111, DLW5ATN851 and DLW5ATN272,Rated Current is derated as below figure depending on the operating temperature. · Storage Temperature : - 40 °C to + 85 °C Rated Current [mA] Rated Current [mA] · Operating Temperature : - 40 °C to + 85 °C 4. Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. 15 ºC to 35 °C Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) < In case of doubt > Temperature : 20 °C ± 2 °C Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure : 86 kPa to 106 kPa MURATA MFG CO.,LTD. 10 Reference Only Spec No. JEFL243C – 0017G-01 P 2/10 5. Style and Dimensions 0.45 min. (T)2.20±0.15 0.5 min. (W)3.6±0.3 (L)5.0±0.3 ② ① 1.7±0.3 1.3±0.3 1.7±0.3 : Electrode ③ ④ 1.3±0.3 (in mm) 1.3±0.3 0.9±0.3 ■Equivalent Circuits ■ Unit Mass (Typical value) ① ② ④ ③ 0.125g No polarity 6. Marking No marking. 7. Electrical Performance No. Item 7.1 Impedance (|Z|) (at 10MHz) 7.2 Insulation Resistance (I.R.) DC Resistance (Rdc) 7.3 7.4 Withstanding Voltage Specifications Meet item 3. Products shall not be damaged. Test Method Measuring Equipment : Agilent 4191A or the equivalents. Measuring Frequency : 10MHz (ref. Item 10.) Measuring Equipment : R8340A or the equivalents. Test Voltage : 2times for Rated Voltage Time : within 60 s (ref. Item 10.) Measuring Current : 100 mA max. (ref. Item 10.) (In case of doubt in the above mentioned standard condition,measure by 4 terminal method.) Voltage : 125 V(DC) Time : 60 s Charge Current : 1 mA max. (ref. Item 10.) MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C – 0017G-01 P 3/10 8. Mechanical Performance No. Item 8.1 Appearance and Dimensions Bonding Strength and Core Strength 8.2 Specifications Meet item 5. No evidence of chipping,breakage. No evidence of coming off glass-epoxy substrate. Test Method Visual Inspection and measured with Slide Calipers. Pressure jig Applying Force (F) : 10N F Applying Time : 5±1s Substrate Test board fixture Product 8.3 Body strength No evidence of chipping,breakage. Applying Force (F) : 10N Applying Time : 5±1s F Nozzle Product Test board fixture 8.4 Bending Strength Meet Table 1. Table 1 Appearance Impedance change (at 10MHz) I.R. Withstanding Voltage 8.5 Vibration 8.6 Drop 8.7 Solderability No damaged. Substrate : Glass-epoxy (t=1.6mm) Deflection : 2mm Keeping Time : 30 s Speed of Applying Force : 0.5 mm/s Pressure jig within ± 20% R340 F 10MΩ min. Deflection No damaged. The electrodes shall be at least 90% covered with new solder coating. Substrate 45 45 Product (in mm) Products shall be soldered on the substrate. Oscillation Frequency : 10 to 55 to 10Hz for 1 min. Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions(Total 6 hours). Products shall be dropped concrete or steel board. Method : free fall Height : 1m The Number of Times : 10 Times Flux : Ethanol solution of rosin,25(wt)% Pre heating : 150 ± 10°C, 1 minute. Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 245±5°C Immersion Time : 4±1s Immersion and Immersion rates : 25mm/s Stainless tweezers Product 8.8 Resistance to Soldering heat Meet Table 1. Flux : Ethanol solution of rosin,25(wt)% Pre heating : 150 ± 10°C, 1 minute. Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 ± 5°C Immersion Time : 5±1s Immersion and Immersion rates : 25mm/s Then measured after exposure in the room condition for 4 to 48 hours. MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C – 0017G-01 P 4/10 9. Enviromental Performance (Product shall be solderd on the glass-epoxy substrate (t=1.6mm).) No. Item 9.1 Temperature Cycle 9.2 Humidity 9.3 Humidity Load 9.4 Heat life 9.5 Cold Resistance Specifications 10. Terminal to be Tested No. 10.1 10.2 10.3 10.4 10.5 10.6 Test Method Meet Table 1. 1 cycle 1 step : -40 °C (+0, -3)°C / 30min (+ 3,- 0) min 2 step : Ordinary temp. / 3 min max. 3 step : +85 °C (+3, -0)°C / 30min (+ 3,- 0) min 4 step : Ordinary temp. / 3 min max. Total of 100 cycles Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 40 ± 2 °C Humidity : 90 to 95 %(RH) Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 40 ± 2 °C Humidity : 90 to 95 %(RH) Test Voltage : Rated Voltage Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 4 to 48 hours. (ref. Item 10.) Temperature : 85 ± 2 °C Test Voltage : 2times for Rated Voltage Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 4 to 48 hours. (ref. Item 10.) Temperature : - 40 ± 2 °C Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 4 to 48 hours. (ref. Item 10.) When measuring and suppling the voltage, the following terminal is applied. Item Impedance (|Z|) (Measurement Terminal) DC Resistance (Rdc) (Measurement Terminal) Insulation Resistance (I.R.) (Measurement Terminal) Withstanding Voltage (Measurement Terminal) Humidity Load (Supply Terminal) Heat Life (Supply Terminal) Terminal to be Tested Terminal Terminal MURATA MFG CO.,LTD. Terminal Reference Only Spec No. JEFL243C – 0017G-01 P 5/10 11. Impedance Frequency Characteristics (Typical) 0.1 5.4±0.1 5.5 ±0.05 φ1.5 ＋ －0 4.0±0.1 2.0±0.05 4.1±0.1 8.0±0.1 0.3±0.05 12.0±0.2 12.1 Appearance and Dimensions 1.75±0.1 12. Specification of Packaging Direction of feed *Dimension of the Cavity is measured at the bottom side. 2.7±0.1 (in mm) 12.2 Specification of Taping (1) Packing quantity (Standard quantity) φ180 mm reel : 700 pcs. / reel φ330 mm reel :2500 pcs. / reel (2) Packing Method Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3) Sprocket Hole Sprocket hole shall be located on the left hand side toward the direction of feed. (4) Spliced point The cover tape have no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 12.3 Pull Strength of Plastic Tape Plastic Tape Cover Tape 5 N min. 10 N min. 12.4 Peeling off force of Cover Tape 0.2N to 0.7N (minimum value is typical.) Speed of Peeling off : 300 mm / min 165 to 180 degree F Cover tape Plastic tape MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C – 0017G-01 P 6/10 12.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. « Packaging Code : L (φ180mm reel) » 2.0±0.5 Trailer 160 min. Leader 210 min. 190 min. Empty Tape Cover tape Label  13.0±0.2  60± 1 0  21.0±0.8 13± 1 0 Direction of feed 17±1.4 0  180± 3 (in mm) « Packaging Code : K (φ330mm reel) » 2.0±0.5 Trailer Leader 160 min. 190 min. 210 min. Empty Tape Cover tape Label  13.0±0.5  50 min.  21.0±0.8 2.0±0.5 14±1.5 Direction of feed  330±2.0 (in mm) 12.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc 1) « Expression of Inspection No. » □□ OOOO  (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O,N,D Third, Fourth digit : Day 2) « Expression of RoHS marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) 12.7 Marking for Outside package Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking(2), Quantity, etc 12.8 Specification of Outer Case Reel Label H D W Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 4 4 φ180mm φ330mm 340 340 85  Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG CO.,LTD. Spec No. JEFL243C – 0017G-01 13. Reference Only P 7/10 △ Caution ! 13.1 Mounting Direction Mount products in right direction. Wrong direction which is 90 ° rotated from right direction cause not open or short circuit but also flames or other serious trouble. Z Z right direction wrong direction 13.2 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 14. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 14.1 Flux and Solder Flux Solder Use rosin-based flux. (with Halogen content exceeding 0.2(wt)% conversion to chlorine). Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder 14.2 Assembling < Exclusive use of Reflow soldering > Flow soldering may cause deterioration in insulation resistance. So,reflow soldering shall be applied for this product. < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body. 14.3 Cleaning Conditions Do not clean after soldering. If cleaning, please contact us. 14.4 Resin coating The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 14.5 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 Products shall be location the sideways direction (Length:ab) to the mechanical stress. 〈 Good example 〉 MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C – 0017G－01 P 8/10 (2) Products location on P.C.B. near seam for separation. Seam Products (A,B,C,D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. Because they may be subjected the mechanical stress in order of ACB  D. b A C B D Slit Lengh:a •P.C.B. shall be designed so that products are far from the portion of perforation. •The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation. × P.C.B. ○ ○ Portion of Perforation •Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) Product × ○ P.C.B. × Product Hole < Products Placing > •Support pins shall be set under P.C.B. to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B.. Pick- up nozzle Product < P.C.B. Separation > •P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. P.C.B. Support pin 14.7 Standard Land Dimensions 3.3 4.7 ① 1.3 ② * ① ② ③ ④ indicates terminal number. Resist Copper foil pattern No pattern (in mm) 14.8 Reflow Soldering (1) Standard printing pattern of solder paste ・Standard thickness of solder paste should be 150 to 200µm. Solderability is subject to reflow condition and thermal conductivity. Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. ・Use the solder paste printing pattern of the right pattern. ・For the resist and copper foil pattern, use standard land dimensions. ・Use the Solder Sn-3.0Ag-0.5Cu for pattern printing. MURATA MFG CO.,LTD. 0.9 2.9 5.5 4.7 ④ 3.3 0.9 2.9 5.5 1.3 ③ (in mm) Reference Only Spec No. JEFL243C – 0017G－01 P 9/10 (2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (°C) 260°C 250±3°C 220°C 230°C Limit Profile 180 150 Standard Profile 30～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 250±3°C 2 times Time(s) Limit Profile above 230°C、60s max. 260°C, 10s 2 times 14.9 Reworking with Soldering iron The following conditions must be strictly followed when using a soldering iron after being mounted by reflow soldering. · Pre-heating: 150°C, 1 min · Soldering iron output: 30W max. · Tip temperature: 350°C max. · Tip diameter:φ3mm max. · Soldering time : 3(+1,-0) seconds. · Times : 2times max. Notes: Do not touch the products directly with the soldering iron. 14.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 14.11 Brushing of neighborhood of products When you clean the neighborhood of products such as connector pins, bristles of cleaning brush shall not be touched to the winding portion to prevent the breaking of wire. 14.12 Operating Environment Do not use this product under the following environmental conditions,on deterioration of the performance, such as inslation resistance may result from the use. (1) in corrosive gases (acidic gases,alkaline gases,chlorine,sulfur gases,organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent,may splash on the products. MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C – 0017G－01 P 10/10 14.13 Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment conditions · Products should be stored in the warehouse on the following conditions. Temperature : -10 °C to +40 °C Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity. ·Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases, to prevent the following deterioration. Poor solderabirity due to the oxidized electrode. ·Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ·Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ·Products should not be stored under the air tights packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. ! 15.△ Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO.,LTD.