DLW5ATN501MQ2L

Reference Only Spec No. JEFL243C-0026J-01 P 1/12 Wire Wound Chip Common Mode Choke Coil ＤＬＷ５ＡＴＮ□□□ＭＱ２□ Reference Specification 1. Scope This reference specification applies to Wire Wound Chip Common Mode Choke Coil DLW5AT_MQ Series. 2. Part Numbering (ex.) DL W 5A T N 111 (1) (2) (3) (4) (5) (6) (1) Chip Common Mode Choke Coil (2) Structure (W : Winding Type) (3) Dimension (L×W) (4) One Circuit and Low Height Type (5) Category M Q (7) (8) 3.Rating Customer Part Number MURATA Part Number DLW5ATN500MQ2L DLW5ATN500MQ2K 2 L (9) (10) (6) Impedance (Typ. at 100MHz) (7) Circuit (8) Features (9) Number of Line (10) Packaging Code L : Taping (φ180mm/reel) K : Taping (φ330mm/reel) B : Bulk Impedance at 10MHz, Under Standard Impedance at 100MHz, Under Standard Testing Conditions Testing Conditions (min. Ω) (ΩTyp.) 4.6 Rated Voltag e Withstanding Voltage V(DC) *Rated Current DC Resistance (A) (Rdc) (Ωmax.) 50 6.0 0.013 11 150 5.0 0.020 20 330 4.0 0.027 35 500 2.5 0.034 50 1100 2.0 0.056 V(DC) Insulation Resistance (MΩ min.) DLW5ATN500MQ2B DLW5ATN151MQ2L DLW5ATN151MQ2K DLW5ATN151MQ2B DLW5ATN331MQ2L DLW5ATN331MQ2K 100 250 DLW5ATN331MQ2B DLW5ATN501MQ2L DLW5ATN501MQ2K DLW5ATN501MQ2B DLW5ATN112MQ2L DLW5ATN112MQ2K DLW5ATN112MQ2B ꞏ Operating Temperature : - 40 °C to + 105 °C ꞏ Storage Temperature : - 40 °C to + 105 °C Derating MURATA MFG CO.,LTD. 10 Reference Only Spec No. JEFL243C-0026J-01 P 2/12 4. Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. 15 ºC to 35 °C Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) < In case of doubt > Temperature : 20 °C ± 2 °C Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure : 86 kPa to 106 kPa (T)2.20±0.15 0.45 min. 5. Style and Dimensions 0.5 min. (L)5.0±0.3 (W)3.6 ±0.3 ② 1.7 1.3 ±0.3 ±0.3 1.7 ±0.3 ① : Electrode ④ ③ 1.3 ± 0.3 1.3 ±0.3 (in mm) 0.9 ±0.3 ■Equivalent Circuits ■ Unit Mass (Typical value) ① ② ④ ③ 0.140g No polarity 6. Marking No marking. 7. Electrical Performance No. Item 7.1 Impedance (|Z|) (at 10MHz) 7.2 Insulation Resistance (I.R.) DC Resistance (Rdc) 7.3 7.4 Withstanding Voltage Specifications Meet item 3. Products shall not be damaged. Test Method Measuring Equipment : KEYSIGHT 4191A or the equivalents. Measuring Frequency : 10MHz (ref. Item 10.) Measuring Equipment : R8340A or the equivalents. Test Voltage : 100V Time : within 60 s (ref. Item 10.) Measuring Current : 100 mA max. (ref. Item 10.) (In case of doubt in the above mentioned standard condition,measure by 4 terminal method.) Voltage : 250 V(DC) Time : 60 s Charge Current : 1 mA max. (ref. Item 10.) MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C-0026J-01 P 3/12 8. Mechanical Performance No. Item 8.1 Appearance and Dimensions Bonding Strength and Core Strength 8.2 Specifications Meet item 5. No evidence of chipping,breakage. No evidence of coming off glass-epoxy substrate. Test Method Visual Inspection and measured with Slide Calipers. Pressure jig Applying Force (F) : 10N F Applying Time : 5±1s Substrate Test board fixture Product 8.3 Body strength No evidence of chipping,breakage. Applying Force (F) : 10N Applying Time : 5±1s F Nozzle Product Test board fixture 8.4 Bending Strength Meet Table 1. Table 1 Appearance Impedance change (at 10MHz) I.R. Withstanding Voltage 8.5 Vibration 8.6 Drop 8.7 Solderability No damaged. Substrate : Glass-epoxy (t=1.6mm) Deflection : 2mm Keeping Time : 30 s Speed of Applying Force : 0.5 mm/s Pressure jig within ± 20% R340 F 10MΩ min. Deflection No damaged. The electrodes shall be at least 90% covered with new solder coating. Substrate 45 45 Product (in mm) Products shall be soldered on the substrate. Oscillation Frequency : 10 to 55 to 10Hz for 1 min. Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions(Total 6 hours). Products shall be dropped concrete or steel board. Method : free fall Height : 1m The Number of Times : 10 Times Flux : Ethanol solution of rosin,25(wt)% Pre heating : 150 ± 10°C, 1 minute. Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 245±5°C Immersion Time : 4±1s Immersion and Immersion rates : 25mm/s Stainless tweezers Product 8.8 Resistance to Soldering heat Meet Table 1. Flux : Ethanol solution of rosin,25(wt)% Pre heating : 150 ± 10°C, 1 minute. Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 ± 5°C Immersion Time : 5±1s Immersion and Immersion rates : 25mm/s Then measured after exposure in the room condition for 4 to 48 hours. MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C-0026J-01 P 4/12 9. Enviromental Performance (Product shall be soldered on the glass-epoxy substrate (t=1.6mm).) No. Item 9.1 Temperature Cycle 9.2 Humidity 9.3 Humidity Load 9.4 Heat life 9.5 Cold Resistance Specifications 10. Terminal to be Tested No. 10.1 10.2 10.3 10.4 10.5 10.6 Test Method Meet Table 1. 1 cycle 1 step : -40 °C (+0, -3)°C / 30min (+ 3,- 0) min 2 step : Ordinary temp. / 3 min max. 3 step : +105 °C (+3, -0)°C / 30min (+ 3,- 0) min 4 step : Ordinary temp. / 3 min max. Total of 100 cycles Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 40 ± 2 °C Humidity : 90 to 95 %(RH) Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 40 ± 2 °C Humidity : 90 to 95 %(RH) Test Voltage : Rated Voltage Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 4 to 48 hours. (ref. Item 10.) Temperature : 105 ± 2 °C Test Voltage : 2times for Rated Voltage Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 4 to 48 hours. (ref. Item 10.) Temperature : - 40 ± 2 °C Time : 1000 h (+48 h , -0 h) Then measured after exposure in the room condition for 4 to 48 hours. (ref. Item 10.) When measuring and supplying the voltage, the following terminal is applied. Item Impedance (|Z|) (Measurement Terminal) DC Resistance (Rdc) (Measurement Terminal) Insulation Resistance (I.R.) (Measurement Terminal) Withstanding Voltage (Measurement Terminal) Humidity Load (Supply Terminal) Heat Life (Supply Terminal) Terminal to be Tested Terminal Terminal MURATA MFG CO.,LTD. Terminal Reference Only Spec No. JEFL243C-0026J-01 P 5/12 11. Impedance Frequency Characteristics (Typical) DLW5ATN_MQ Series 0.1 5.4±0.1 5.5 ±0.05 φ1.5 ＋ －0 4.0±0.1 2.0±0.05 4.1±0.1 8.0±0.1 0.3±0.05 12.0±0.2 12.1 Appearance and Dimensions 1.75±0.1 12. Specification of Packaging Direction of feed *Dimension of the Cavity is measured at the bottom side. 2.7±0.1 (in mm) 12.2 Specification of Taping (1) Packing quantity (Standard quantity) φ180 mm reel : 700 pcs. / reel φ330 mm reel :2500 pcs. / reel (2) Packing Method Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point The cover tape have no spliced point. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 12.3 Pull Strength of Plastic Tape Plastic Tape Cover Tape 5 N min. 10 N min. 12.4 Peeling off force of Cover Tape 0.2N to 0.7N (minimum value is typical.) Speed of Peeling off : 300 mm / min 165 to 180 degree F Cover tape Plastic tape MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C-0026J-01 P 6/12 12.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. « Packaging Code : L (φ180mm reel) » 2.0±0.5 Trailer 160 min. Leader 210 min. 190 min. Empty Tape Cover tape Label  13.0±0.2  60± 1 0  21.0±0.8 13± 1 0 Direction of feed 17±1.4 0  180± 3 (in mm) « Packaging Code : K (φ330mm reel) » 2.0±0.5 Trailer Leader 160 min. 190 min. 210 min. Empty Tape Cover tape Label  13.0±0.5  50 min.  21.0±0.8 2.0±0.5 14±1.5 Direction of feed  330±2.0 (in mm) 12.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc 1) « Expression of Inspection No. » □□ OOOO  (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O,N,D Third, Fourth digit : Day 2) « Expression of RoHS marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) 12.7 Marking for Outside package Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking(2), Quantity, etc 12.8 Specification of Outer Case Label H D W Reel Outer Case Dimensions (mm) W D H Standard Reel Quantity in Outer Case (Reel) 4 4 186 186 93 φ180mm φ330mm 340 340 85  Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C-0026J-01 P 7/12 △ 13. ! Caution 13.1 Mounting Direction Mount products in right direction. Wrong direction which is 90 ° rotated from right direction cause not open or short circuit but also flames or other serious trouble. Z Z 13.2 Limitation of Applications right direction wrong direction Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment (8)Disaster prevention / crime prevention equipment (9)Data-processing equipment (10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above 13.3 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 14. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 14.1 Flux and Solder Flux Solder Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ), but not highly acidic flux (with Halogen content exceeding 0.2(wt)% conversion to chlorine). Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder 14.2 Assembling Products can be applied to reflow and flow soldering. < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body. 14.3 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power:20W/ I max. Frequency:28kHz to 40kHz Time:5 min max. (3) Cleaner 1. Cleaner ꞏIsopropyl alcohol (IPA) 2.Aqueous agent ꞏPINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C-0026J-01 P 8/12 14.4 Resin coating The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 14.5 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 Products shall be location the sideways direction (Length:ab) to the mechanical stress. 〈 Good example 〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Perforation A C B D Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C-0026J-01 P 9/12 Portion of Perforation 14.6 Attention Regarding P.C.B. Design < The Arrangement of Products > •P.C.B. shall be designed so that products are far from the portion of perforation. •The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation. × P.C.B. ○ ○ Portion of Perforation •Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) Product × ○ P.C.B. × Product Hole < Products Placing > •Support pins shall be set under P.C.B. to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B.. < P.C.B. Separation > •P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. Pick- up nozzle Product P.C.B. Support pin 14.7 Standard Land Dimensions 〈Reflow〉 3.3 4.7 ① 1.3 ② * ① ② ③ ④ indicates terminal number. Resist Copper foil pattern ③ 0.9 2.9 5.5 No pattern ④ (in mm) 〈Flow〉 ① 1.3 6.0 ② ③ 1.9 ④ 6.9 (in mm) MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C-0026J-01 P 10/12 Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. ・Use the solder paste printing pattern of the right pattern. ・For the resist and copper foil pattern, use standard land dimensions. ・Use the Solder Sn-3.0Ag-0.5Cu for pattern printing. 4.7 1.3 and thermal conductivity. 3.3 14.8 Solder paste printing for reflow ・Standard thickness of solder paste should be 150 to 200µm. Solderability is subject to reflow condition 0.9 2.9 5.5 (in mm) (2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. 〈Reflow〉 Temp. (°C) 260°C 250±3°C 220°C 230°C Limit Profile 180 150 Standard Profile 30～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 250±3°C 2 times Time(s) Limit Profile above 230°C、60s max. 260°C, 10s 2 times MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C-0026J-01 P 11/12 〈Flow〉 Temp. (°C) 265±3°C 250°C Limit Profile 150 Heating Time 60s min. Standard Profile Pre-heating 150°C, 60s min. Heating Cycle of flow 250°C, 4~6s 2 times Standard Profile Time(s) Limit Profile 265±3°C, 5s max. 2 times (3)Printing of Adhesive (Flow Soldering) Adhesive amount should be around 0.5mg /a chip. -To get enough bonding strength - To avoid spreading of adhesive onto a land. Because soldering failure may be caused by adhesive on the land. The adhesive position is as follows. 接着剤塗布位置 adhesive position 14.9 Reworking with Soldering iron The following conditions must be strictly followed when using a soldering iron after being mounted by reflow soldering. · Pre-heating: 150°C, 1 min ꞏ Soldering iron output: 30W max. · Tip temperature: 350°C max. ꞏ Tip diameter:φ3mm max. · Soldering time : 3(+1,-0) seconds. ꞏ Times : 2times max. Notes: Do not touch the products directly with the soldering iron. 14.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 14.11 Brushing of neighborhood of products When you clean the neighborhood of products such as connector pins, bristles of cleaning brush shall not be touched to the winding portion to prevent the breaking of wire. 14.12 Operating Environment Do not use this product under the following environmental conditions,on deterioration of the performance, such as inslation resistance may result from the use. (1) in corrosive gases (acidic gases,alkaline gases,chlorine,sulfur gases,organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent,may splash on the products. MURATA MFG CO.,LTD. Reference Only Spec No. JEFL243C-0026J-01 P 12/12 14.13 Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment conditions ꞏ Products should be stored in the warehouse on the following conditions. Temperature : -10 °C to +40 °C Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity. ꞏProducts should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases, to prevent the following deterioration. Poor solderabirity due to the oxidized electrode. ꞏProducts should be stored on the palette for the prevention of the influence from humidity, dust and so on. ꞏProducts should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ꞏAvoid storing the product by itself bare (i.e.exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. ! 15.△ Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO.,LTD.