DLW5BTH102TQ2L

Reference Only Spec. No. JEFL243C-9120-01 P 1/10 Wire Wound Chip Common Mode Choke Coil Reference Specification [AEC-Q200] DLW5BTH□□□TQ2□ 1. Scope This reference specification applies to Wire Wound Chip Common Mode Choke Coil DLW5BTH_TQ Series for Automotive Electronics based on AEC-Q200. 2. Part Numbering (ex.) DL (1) W 5B (2) (3) T H (4) (5) 102 (6) (1) Chip Common Mode Choke Coil (2) Structure (W : Winding Type) (3) Dimension (L×W) (4) Type (5) Category 3.Rating Customer Part Number MURATA Part Number T Q (7) (8) 2 L (9) (10) (6) Impedance (Typ. at 100MHz) (7) Circuit (8) Features (9) Number of Line (10) Packaging Code L : Taping (φ180mm/reel) K : Taping (φ330mm/reel) B : Bulk Impedance at 10MHz, Under Standard Tesiting Conditions (Ω min.) Impedance at 100MHz, Under Standard Tesiting Conditions (Ω Typ.) 10 Rated Voltage V(DC) Withstanding Voltage V(DC) Rated Current(*) (A) DC Resistance (Rdc) (Ωmax.) at 105℃ at 125℃ 100 4.0 2.5 0.013 20 250 3.0 2.0 0.020 30 500 2.5 1.5 0.027 60 1000 2.0 1.2 0.034 100 1400 1.5 1.0 0.056 Insulation Resistance (MΩ min.) ESD Rank 2.2kV 10 2 DLW5BTH101TQ2L DLW5BTH101TQ2K DLW5BTH101TQ2B DLW5BTH251TQ2L DLW5BTH251TQ2K DLW5BTH251TQ2B DLW5BTH501TQ2L DLW5BTH501TQ2K 50 125 DLW5BTH501TQ2B DLW5BTH102TQ2L DLW5BTH102TQ2K DLW5BTH102TQ2B DLW5BTH142TQ2L DLW5BTH142TQ2K DLW5BTH142TQ2B (*)As for DLW5BTH_TQ type Rated Current is derated as following figure depending on the operating temperature. Rated Current [A] Rated Current at 105℃ Rated Current at 125℃ 105 Operating Temperature (Ambient temperature)[℃] · Operating Temperature : - 40 °C to + 125 °C · Storage Temperature : - 40 °C to + 125 °C MURATA MFG CO., LTD. 125 Reference Only Spec. No. JEFL243C-9120-01 P 2/10 4. Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. 15 ºC to 35 °C Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) < In case of doubt > Temperature : 20 °C ± 2 °C Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure : 86 kPa to 106 kPa 5. Style and Dimensions 0.5±0.3 (TOP) 0.5 min. 3.6 ±0.3 ■ Unit Mass (Typical value) 0.21g (L)5.0 ±0.3 (W)5.0 ±0.3 ① 2.35±0.15 0.45min. 3.0±0.5 1.7 1.3 1.7 ±0.3 ±0.3 ±0.3 ② ■Equivalent Circuites : Marking ② ① : Electrode ④ ③ 1.3 ±0.3 1.3 ±0.3 （in: mm） ・Top of the tape 6. Marking ③ ④ No polarity 0.9 ±0.3 Tape Sprocket Hole marking DLW5BT 7. Electrical Performance No. Item 7.1 Impedance (|Z|) (at 10MHz) 7.2 Insulation Resistance (I.R.) DC Resistance (Rdc) 7.3 Specifications Meet item 3. Test Method Measuring Equipment : KEYSIGHT 4191A or the equivalents. Measuring Frequency : 10MHz (ref. Item 9.) Measuring Equipment : R8340A or the equivalents. Measuring voltage : Rated Voltage Time : within 60 s (ref. Item 9.) Measuring Current : 100 mA max. (ref. Item 9.) (In case of doubt in the above mentioned standard condition,measure by 4 terminal method.) MURATA MFG CO., LTD. Reference Only Spec. No. JEFL243C-9120-01 No. 7.4 Item Withstanding Voltage P 3/10 Specifications Products shall not be damaged. Test Method Test Voltage : 2.5 times for Rated Voltage Time : 1 to 5 seconds Charge Current : 1 mA max. (ref. Item 9.) 8. Q200 Requirement 7-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June 1. 2010 AEC-Q200 No. Stress 3 High Temperature Exposure Murata Specification / Deviation Test Method 1000hours at 125 deg C Meet Table A after testing. Set for 24hours at room temperature, Table A then measured. Appearance No damaged. Impedance change (at 10MHz) within ± 20% I.R. 10MΩ min. Withstanding Voltage 4 Temperature Cycling 1000cycles No damaged. Meet Table A after testing. -40 deg C to +125 deg C Set for 24hours at room temperature, then measured. 5 7 Destructive Physical Analysis Per EIA469 Biased Humidity 1000hours at 85 deg C, 85%RH Apply max rated voltage and current. Not Applicable No electrical tests Meet Table A after testing. Apply rated voltage. (ref.item 9) 8 Operational Life Apply 125 deg C Meet Table A after testing. 1000hours Apply derating of rated current. Set for 24hours at room temperature, then measured 9 10 External Visual Physical Dimension (ref.item 9) Visual inspection No abnormalities Meet ITEM 5 No defects （Style and Dimensions） 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Conditon F: 1500g’s(14.7N)/0.5ms/ Half sine Meet Table A after testing. 5g's(0.049N) for 20 minutes, 12cycles Meet Table A after testing. 14 Vibration each of 3 oritentations Test from 10-2000Hz. 12cycles each of 3 orientations 15 Resistance to Soldering Heat Pre-heating：150 to 180C / 90±30s Meet Table A after testing. No-heating Solder temperature 260C+/-5 deg C Immersion time 10s 17 ESD Per AEC-Q200-002 Meet Table A after testing. ESD Rank: Refer to Item 3. Rating. MURATA MFG CO., LTD. Reference Only Spec. No. JEFL243C-9120-01 P 4/10 AEC-Q200 No. Stress 18 Solderbility Method b : Not Applicable 90% of the terminations is to be soldered. (except partly-exposed wire) Flux:Ethanol solution of rosin,25(wt)% includes activator equivalent to 0.06 to 0.10(wt)% chlorine No defects Per J-STD-002 19 Electrical Characterization Measured : Impedance 22 Terminal Strength Per AEC-Q200-006 A force of 17.7N for 60sec Per ISO-7637-2 30 Electrical Transient Conduction 9. Terminal to be Tested No. 9.1 Murata Specification / Deviation Test Method No defects Not Applicable When measuring and supplying the voltage, the following terminal is applied. Item Terminal to be Tested 9.5 Impedance (|Z|) (Measurement Terminal) DC Resistance (Rdc) (Measurement Terminal) Insulation Resistance (I.R.) (Measurement Terminal) Withstanding Voltage (Measurement Terminal) Biased Humidity (Supply Terminal) 9.6 Operational Life (Supply Terminal) 9.2 9.3 9.4 Terminal Terminal Terminal Terminal Terminal Terminal Terminal Terminal 10. Impedance Frequency Characteristics (Typical) DLW5BTH _TQ series 10000 Common Mode DLW5BTH142TQ2 DLW5BTH102TQ2 DLW5BTH501TQ2 DLW5BTH251TQ2 DLW5BTH101TQ2 Impedance (ohm) 1000 100 10 Diffrential mode DLW5BTH142TQ2 DLW5BTH102TQ2 DLW5BTH501TQ2 DLW5BTH251TQ2 DLW5BTH101TQ2 1 1 10 100 Frequency (MHz) MURATA MFG CO., LTD. 1000 Reference Only Spec. No. JEFL243C-9120-01 P 5/10 11. P.C.B., Flux, Solder and Soldering condition Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 14 except the case of being specified special condition. 12. Specification of Packaging 5.5±0.1 5.5 ±0.05 0.4±0.05 5.5±0.1 8.0±0.1 12.0±0.2 0.1 φ1.5 ＋ －0 4.0±0.1 2.0±0.05 1.75±0.1 12.1. Appearance and Dimensions Direction of feed *Dimension of the Cavity is measured at the bottom side. 2.7±0.1 (in mm) 12.2. Specification of Taping (1) Packing quantity (Standard quantity) φ 180 mm reel : 700 pcs. / reel φ330 mm reel :2500 pcs. / reel (2) Packing Method Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point The cover tape have no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous.The specified quantity per reel is kept. 12.3. Pull Strength of Plastic Tape Plastic Tape Cover Tape 5 N min. 10 N min. 165 to 180 degree 12.4. Peeling off force of Cover Tape 0.2N to 0.7N (minimum value is typical.) Speed of Peeling off : 300 mm / min F Cover tape Plastic tape 12.5. Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. « Packaging Code : L (φ180mm reel) » 2.0±0.5 Trailer 160 min. Leader 210 min. 190 min. Empty Tape Cover tape Label φ 13.0±0.2 φ 60± 1 0 φ 21.0±0.8 13± 1 0 Direction of feed 17±1.4 0 φ 180± 3 (in mm) « Packaging Code : K (φ330mm reel) » 2.0±0.5 Trailer Leader 160 min. 190 min. 210 min. Empty Tape Cover tape Label φ 13.0±0.5 φ 50 min. φ 21.0±0.8 Direction of feed 2.0±0.5 14±1.5 φ 330±2.0 (in mm) MURATA MFG CO., LTD. Reference Only Spec. No. JEFL243C-9120-01 P 6/10 12.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity, etc ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 12.7 Marking for Outside package Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking (∗2), Quantity, etc 12.8 Specification of Outer Case Outer Case Dimensions (mm) Reel Label H D △ ! φ180mm φ330mm W D H 186 186 93 340 340 85 Standard Reel Quantity in Outer Case (Reel) 4 4 ∗ Above Outer Case size is typical. It depends on a quantity of an order. W Caution 13. 13.1. Mounting Direction Mount products in right direction. Wrong direction which is 90 ° rotated from right direction cause not open or short circuit but also flames or other serious trouble. Z right direction Z wrong direction 13.2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and / or reliability requirements to the applications listed in the above. 13.3 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 13.4 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. MURATA MFG CO., LTD. Reference Only Spec. No. JEFL243C-9120-01 P 7/10 14.Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 14.1. Flux and Solder Flux Solder Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ), but not highly acidic flux (with Halogen content exceeding 0.2(wt)% conversion to chlorine). Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder 14.2. Assembling < Exclusive use of Reflow soldering > Flow soldering may cause deterioration in insulation resistance. So,reflow soldering shall be applied for this product. < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body. 14.3. Cleaning Conditions Do not clean after soldering. If cleaning, please contact us. 14.4. Resin coating The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 14.5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 Products shall be location the sideways direction (Length:a D *1 A > B A > C Reference Only Spec. No. JEFL243C-9120-01 P 8/10 *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Recommended Screw Hole Portion of Perforation 14.6. Attention Regarding P.C.B. Design < The Arrangement of Products > •P.C.B. shall be designed so that products are far from the portion of perforation. •The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation. Portion of Perforation Pick- up nozzle Product 3.3 4.7 ① 1.3 × Hole 14.7. Standard Land Dimensions * ① ② ③ ④ indicates terminal number. Resist Copper foil pattern ④ ○ Product < P.C.B. Separation > •P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. 0.9 2.9 5.5 Product × P.C.B. < Products Placing > •Support pins shall be set under P.C.B. to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B.. ③ ○ ○ •Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) ② × P.C.B. No pattern (in mm) MURATA MFG CO., LTD. P.C.B. Support pin Reference Only 1.3 14.8. Reflow Soldering (1) Standard printing pattern of solder paste ・Standard thickness of solder paste should be 150 to 200µm. Solderability is subject to reflow condition and thermal conductivity. Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. ・Use the solder paste printing pattern of the right pattern. ・For the resist and copper foil pattern, use standard land dimensions. ・Use the Solder Sn-3.0Ag-0.5Cu for pattern printing. 0.9 2.9 5.5 4.7 P 9/10 3.3 Spec. No. JEFL243C-9120-01 (in mm) (2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (℃) 260℃ 250±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 250±3°C 2 times Time（ｓ） Limit Profile above 230°C、60s max. 260°C, 10s 2 times 14.9. Reworking with Soldering iron The following conditions must be strictly followed when using a soldering iron after being mounted by reflow soldering. · Pre-heating: 150°C, 1 min · Soldering iron output: 30W max. · Tip temperature: 350°C max. · Tip diameter:φ3mm max. · Soldering time : 3(+1,-0) seconds. · Times : 2times max. Notes: Do not touch the products directly with the soldering iron. MURATA MFG CO., LTD. Reference Only Spec. No. JEFL243C-9120-01 P 10/10 14.10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 14.11. Brushing of neighborhood of products When you clean the neighborhood of products such as connector pins, bristles of cleaning brush shall not be touched to the winding portion to prevent the breaking of wire. 14.12. Operating Environment Do not use this product under the following environmental conditions,on deterioration of the performance, such as inslation resistance may result from the use. (1) in corrosive gases (acidic gases,alkaline gases,chlorine,sulfur gases,organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent,may splash on the products. 14.13. Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment conditions · Products should be stored in the warehouse on the following conditions. Temperature : -10 °C to +40 °C Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity. ·Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases, to prevent the following deterioration. Poor solderabirity due to the oxidized electrode. ·Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ·Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ·Products should not be stored under the air tights packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 15. ! △ Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD.