Reference Only
Spec. No. JEFL243C-0020F-01
P 1/10
Wire Wound Chip Common Mode Choke Coil
Reference Specification
DLW5BTM□□□SQ2□
1. Scope
This reference specification applies to Wire Wound Chip Common Mode Choke Coil.
2. Part Numbering
(ex.)
DL
(1)
W
5B
(2) (3)
T
M
(4) (5)
102
(6)
S
Q
(7) (8)
2
L
(9) (10)
(6) Impedance (Typ. at 100MHz)
(7) Circuit
(8) Features
(9) Number of Line
(10) Packaging Code L : Taping (φ180mm/reel) / K : Taping (φ330mm/reel)
B : Bulk
(1) Chip Common Mode Choke Coil
(2) Structure (W : Winding Type)
(3) Dimension (L×W)
(4) Type
(5) Category
3.Rating
Customer
Part Number
MURATA
Part Number
Impedance
at 10MHz,
Under Standard
Impedance
at 100MHz,
Under Standard
Voltage
Tesiting Conditions
Tesiting Conditions
V(DC)
(Ω min.)
(Ω Typ.)
100
Rated
Withstanding
Voltage
V(DC)
*
DC
Rated
Resistance
Current
(A)
(Rdc)
(Ωmax.)
1400
1.5
0.056
60
1000
2
0.034
30
500
4
0.027
20
250
5
0.020
10
100
6
0.013
Insulation
Resistance
(MΩ min.)
DLW5BTM142SQ2L
DLW5BTM142SQ2K
DLW5BTM142SQ2B
DLW5BTM102SQ2L
DLW5BTM102SQ2K
DLW5BTM102SQ2B
DLW5BTM501SQ2L
DLW5BTM501SQ2K
50
125
DLW5BTM501SQ2B
DLW5BTM251SQ2L
DLW5BTM251SQ2K
DLW5BTM251SQ2B
DLW5BTM101SQ2L
DLW5BTM101SQ2K
DLW5BTM101SQ2B
*As for DLW5BTM501,DLW5BTM251 and DLW5BTM101,Rated Current is derated as below figure depending on
the operating temperature.
· Operating Temperature : - 40 °C to + 85 °C
· Storage Temperature : - 40 °C to + 85 °C
Derating DLW5BTM501,DLW5BTM251,DLW5BTM101
7000
DLW5BTM101
6000
DLW5BTM251
mA
5000
4750
Current
4000
DLW5BTM501
3400
3000
2000
1000
0
0
20
40
60 65
Temperature °C
MURATA MFG CO.,LTD.
80 85
100
10
Reference Only
Spec. No. JEFL243C-0020F-01
P 2/10
4. Standard Testing Conditions
< Unless otherwise specified >
Temperature : Ordinary Temp. 15 ºC to 35 °C
Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH)
< In case of doubt >
Temperature : 20 °C ± 2 °C
Humidity : 60 %(RH) to 70 %(RH)
Atmospheric pressure : 86 kPa to 106 kPa
5. Style and Dimensions
0.5±0.3
(TOP)
0.5
min.
3.6 ±0.3
1.7
1.3
1.7
±0.3 ±0.3 ±0.3
: Electrode
④
6. Marking
0.21g
②
: Marking
1.3
±0.3
■ Unit Mass (Typical value)
(L)5.0 ±0.3
(W)5.0 ±0.3
①
2.35±0.15
0.45min.
3.0±0.5
■Equivalent Circuites
①
②
④
③
③
1.3
±0.3
0.9
±0.3
・Top of the tape
（in: mm）
Tape
Sprocket Hole
No polarity
marking
7. Electrical Performance
No.
7.1
7.2
7.3
7.4
DLW5BT
Item
Impedance
(|Z|) (at 10MHz)
Insulation
Resistance
(I.R.)
DC Resistance
(Rdc)
Specifications
Meet item 3.
Withstanding
Voltage
Products shall not be damaged.
Test Method
Measuring Equipment : Agilent 4191A or the equivalents.
Measuring Frequency : 10MHz
(ref. Item 10.)
Measuring Equipment : R8340A or the equivalents.
Test Voltage : 2times for Rated Voltage
Time : within 60 s
(ref. Item 10.)
Measuring Current : 100 mA max.
(ref. Item 10.)
(In case of doubt in the above mentioned standard
condition,measure by 4 terminal method.)
Voltage : 125 V(DC)
Time : 60 s
Charge Current : 1 mA max.
(ref. Item 10.)
MURATA MFG CO.,LTD.
Reference Only
Spec. No. JEFL243C-0020F-01
P 3/10
8. Mechanical Performance
No.
Item
8.1
Appearance and
Dimensions
Bonding Strength
and
Core Strength
8.2
Specifications
Meet item 5.
No evidence of chipping,breakage.
No evidence of coming off
glass-epoxy substrate.
Test Method
Visual Inspection and measured with Slide
Calipers.
Pressure jig
Applying Force (F) : 10N
Applying Time : 5 ± 1s F
Substrate
Test board fixture
Product
8.3
Body strength
No evidence of chipping,breakage.
Applying Force (F) : 10N
Applying Time : 5 ± 1s
F
Nozzle
Product
Test board fixture
8.4
Bending
Strength
Meet Table 1.
Table 1
Appearance
Impedance
change
(at 10MHz)
I.R.
Withstanding
Voltage
8.5
Vibration
8.6
Drop
8.7
Solderability
No damaged.
Substrate : Glass-epoxy (t=1.6mm)
Deflection : 2mm
Keeping Time : 30 s
Speed of Applying Force : 0.5 mm/s
Pressure jig
within ± 20%
R340
F
10MΩ min.
Deflection
No damaged.
The electrodes shall be at least
90% covered with new solder
coating.
Substrate
45
45
Product
(in mm)
Products shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1 min.
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of
3 mutually perpendicular
directions(Total 6 hours).
Products shall be dropped concrete or steel board.
Method : free fall
Height : 1m
The Number of Times : 10 Times
Flux : Ethanol solution of rosin,25(wt)%
Pre heating : 150 ± 10°C, 1 minute.
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245±5°C
Immersion Time : 4 ± 1s
Immersion and Immersion rates : 25mm/s
Stainless
tweezers
Product
8.8
Resistance to
Soldering heat
Meet Table 1.
Flux : Ethanol solution of rosin,25(wt)%
Pre heating : 150 ± 10°C, 1 minute.
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270 ± 5°C
Immersion Time : 5 ± 1s
Immersion and Immersion rates : 25mm/s
Then measured after exposure in the room
condition for 4 to 48 hours.
MURATA MFG CO.,LTD.
Reference Only
Spec. No. JEFL243C-0020F-01
P 4/10
9. Enviromental Performance (Product shall be solderd on the glass-epoxy substrate (t=1.6mm).)
No.
Item
9.1
Temperature
Cycle
9.2
Humidity
9.3
Humidity Load
9.4
Heat life
9.5
Cold Resistance
Specifications
10. Terminal to be Tested
No.
10.1
10.2
10.3
10.4
10.5
10.6
Test Method
Meet Table 1.
1 cycle
1 step : -40 °C (+0, -3)°C / 30min (+ 3,- 0) min
2 step : Ordinary temp. / 3 min max.
3 step : +85 °C (+3, -0)°C / 30min (+ 3,- 0) min
4 step : Ordinary temp. / 3 min max.
Total of 100 cycles
Then measured after exposure in the room
condition for 4 to 48 hours.
Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Time : 1000 h (+48 h , -0 h)
Then measured after exposure in the room
condition for 4 to 48 hours.
Temperature : 40 ± 2 °C
Humidity : 90 to 95 %(RH)
Test Voltage : Rated Voltage
Time : 1000 h (+48 h , -0 h)
Then measured after exposure in the room
condition for 4 to 48 hours.
(ref. Item 10.)
Temperature : 85 ± 2 °C
Test Voltage : 2times for Rated Voltage
Time : 1000 h (+48 h , -0 h)
Then measured after exposure in the room
condition for 4 to 48 hours.
(ref. Item 10.)
Temperature : - 40 ± 2 °C
Time : 1000 h (+48 h , -0 h)
Then measured after exposure in the room
condition for 4 to 48 hours.
(ref. Item 10.)
When measuring and suppling the voltage, the following terminal is applied.
Item
Impedance (|Z|)
(Measurement Terminal)
DC Resistance (Rdc)
(Measurement Terminal)
Insulation Resistance (I.R.)
(Measurement Terminal)
Withstanding Voltage
(Measurement Terminal)
Humidity Load (Supply Terminal)
Heat Life (Supply Terminal)
Terminal to be Tested
Terminal
Terminal
MURATA MFG CO.,LTD.
Terminal
Reference Only
Spec. No. JEFL243C-0020F-01
P 5/10
11. Impedance Frequency Characteristics (Typical)
10000
DLW5BTＭ142SQ2
Common mode
DLW5BTＭ102SQ2
1000
Impedance(ohm)
DLW5BTＭ501SQ2
DLW5BTＭ251SQ2
DLW5BTＭ101SQ2
100
DLW5BTＭ101SQ2
10
DLW5BTＭ251SQ2
DLW5BTＭ501SQ2
DLW5BTＭ102SQ2
DLW5BTＭ142SQ2
Differential mode
1
1
10
100
1000
Frequency(MHz)
12. Specification of Packaging
5.5±0.1
5.5
±0.05
0.4±0.05
5.5±0.1
8.0±0.1
12.0±0.2
0.1
φ1.5 ＋
－0 4.0±0.1 2.0±0.05
1.75±0.1
12.1. Appearance and Dimensions
Direction of feed
*Dimension of the Cavity is measured
at the bottom side.
2.7±0.1
(in mm)
12.2. Specification of Taping
(1) Packing quantity (Standard quantity) φ180 mm reel : 700 pcs. / reel φ330 mm reel :2500 pcs. / reel
(2) Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous.The specified quantity per reel is kept.
12.3. Pull Strength of Plastic Tape
Plastic Tape
Cover Tape
5 N min.
10 N min.
12.4. Peeling off force of Cover Tape
0.2N to 0.7N (minimum value is typical.)
Speed of Peeling off : 300 mm / min
165 to 180 degree
F
Cover tape
Plastic tape
MURATA MFG CO.,LTD.
Reference Only
Spec. No. JEFL243C-0020F-01
P 6/10
12.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
« Packaging Code : L (φ180mm reel) »
Trailer
160 min.
2.0±0.5
Leader
210 min.
190 min.
Empty Tape Cover tape
Label
13.0±0.2
60± 1
0
21.0±0.8
13± 1
0
Direction of feed
17±1.4
0
180± 3
(in mm)
« Packaging Code : K (φ330mm reel) »
2.0±0.5
Trailer
Leader
160 min.
190 min.
210 min.
Empty Tape Cover tape
Label
13.0±0.5
50 min.
21.0±0.8
Direction of feed
2.0±0.5
14±1.5
330±2.0
(in mm)
12.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc
1) « Expression of Inspection No. »
□□ OOOO
(1) Factory Code
(2) Date
(3) Serial No.
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
12.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking (2), Quantity, etc
12.8 Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
(mm)
Reel
W
D
H
186
186
93
Standard Reel
Quantity in
Outer Case
(Reel)
4
4
φ180mm
φ330mm
340
340
85
Above Outer Case size is typical. It depends on a quantity of an order.
△
13. ! Caution
13.1. Mounting Direction
Mount products in right direction.
Wrong direction which is 90 ° rotated from right direction cause not open or short circuit but also flames
or other serious trouble.
Z
right direction
MURATA MFG CO.,LTD.
Z
wrong direction
Spec. No. JEFL243C-0020F-01
Reference Only
P 7/10
13.2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles, rains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
14.Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
14.1. Flux and Solder
Flux
Use rosin-based flux.
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
14.2. Assembling
< Exclusive use of Reflow soldering >
Flow soldering may cause deterioration in insulation resistance.
So,reflow soldering shall be applied for this product.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C max. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body.
14.3. Cleaning Conditions
Do not clean after soldering. If cleaning, please contact us.
14.4. Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please
pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to
use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
14.5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
a
b
〈 Poor example〉
Products shall be location the sideways
direction (Length:ab) to the mechanical
stress.
〈 Good example 〉
(2) Products location on P.C.B. near seam for separation.
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of ACB D.
MURATA MFG CO.,LTD.
Seam
b
A
a
C
B
D
Slit
Lengh:a
•P.C.B. shall be designed so that products are
far from the portion of perforation.
•The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the case
of P.C.B. separation.
×
P.C.B.
○
○
Portion of
Perforation
•Products shall not be arranged on the
line of a series of holes when there
are big holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
Product
×
○
P.C.B.
×
Product
Hole
< Products Placing >
•Support pins shall be set under P.C.B.
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B..
Pick- up nozzle
Product
< P.C.B. Separation >
•P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
P.C.B.
Support pin
14.7. Standard Land Dimensions
3.3
4.7
①
1.3
②
* ① ② ③ ④ indicates terminal number.
Resist
Copper foil pattern
No pattern
(in mm)
14.8. Reflow Soldering
(1) Standard printing pattern of solder paste
・Standard thickness of solder paste
should be 150 to 200µm.
Solderability is subject to reflow condition
and thermal conductivity.
Please make sure that your product has been evaluated
in view of your specifications with our product being
mounted to your product.
・Use the solder paste printing pattern of the
right pattern.
・For the resist and copper foil pattern,
use standard land dimensions.
・Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
MURATA MFG CO.,LTD.
0.9
2.9
5.5
4.7
④
3.3
0.9
2.9
5.5
1.3
③
(in mm)
Spec No. JEFL243C-0020F-01
Reference Only
P 9/10
(2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(°C)
260°C
250±3°C
220°C
230°C
Limit Profile
180
150
Standard Profile
30～60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s
250±3°C
2 times
Time(s)
Limit Profile
above 230°C、60s max.
260°C, 10s
2 times
14.9. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being mounted
by reflow soldering.
· Pre-heating: 150°C, 1 min
· Soldering iron output: 30W max.
· Tip temperature: 350°C max.
· Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Notes: Do not touch the products directly with the soldering iron.
14.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or
tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
14.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
14.12. Operating Environment
Do not use this product under the following environmental conditions,on deterioration of the performance,
such as inslation resistance may result from the use.
(1) in corrosive gases (acidic gases,alkaline gases,chlorine,sulfur gases,organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent,may splash on the products.
MURATA MFG CO.,LTD.
Spec No. JEFL243C-0020F-01
Reference Only
P 10/10
14.13. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
· Products should be stored in the warehouse on the following conditions.
Temperature : -10 °C to +40 °C
Humidity
: 15 % to 85% relative humidity No rapid change on temperature and humidity.
·Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderabirity due to the oxidized electrode.
·Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
·Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
·Products should not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
!
15.△
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO.,LTD.
