SpecNo.JEFK243A-0001K-01
P1/10
Micro Chip Transformer DXW21BN7511□□ Reference Specification
1. Scope
This reference specification applies to Micro Chip Transformer.
2. Part Numbering
(ex.)
DX
W
21 B
N
(1)
(2) (3) (4) (5)
(1) Micro Chip Transformer
(2) Structure (W: Winding Type)
(3) Dimension (LW)
(4) Type of Transformer (B: Balun)
(5) Category
75
(6)
11
(7)
T
L
(8) (9)
(6) Port Impedance (75: 75ohm)
(7) Impedance ratio (11: one to one)
(8) Main Application (T: Televisions/ S: Satellite STB)
(9) Packing Code L:Taping / B:Bulk
3. Electrical Specification 1
Customer
Part Number
Freq.
Range
Murata
Part Number
DXW21BN7511TL
DXW21BN7511TB
DXW21BN7511SL
DXW21BN7511SB
Port
Impedance
[ohm]
Insertion Loss
[dB max.]
at Freq. Range
CMRR
[dB min.]
at Freq.
Range
DC
Resistance
[ohm max.]
75/75
50-870MHz:max.1.0
870-1200MHz: max.1.2
20
0.77
75/75
1.4
20
0.59
50-1200
MHz
1-1.5
GHz
Electrical Specification 2
Rated
Voltage
[DCV]
Withstand
Voltage
[DCV]
Rated
Power
[dBm]
Insulation
Resistance
[Mohm min.]
20
50
27
10
Operating Temperature : -40 to +85°C
Storage Temperature : -40 to +85°C
4. Standard Testing Condition
Temperature : 20 ± 2°C
Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
Temperature : Ordinary Temperature 15 to 35°C
Humidity : Ordinary Humidity 25 to 85%(RH)
5. Style and Dimensions
■Eqivalent Circuit
■Dimension
B1
1.2±0.2
2.0±0.2
B2
(4)
(0 .1 7 )
1 .2 ±0 .2
(2)
(1)
UB
No Polarity
■Unit Mass (typ.)
0.011g
(0.45)
(0.45)
(1)
(2)
(4)
(3)
6. Marking
No Marking.
MURATA MFG.CO., LTD
(0 .4 ) (0 .4 )
(3)
: Electrode
() : Reference Value
(in mm)
SpecNo.JEFK243A-0001K-01
7. Electrical Performance
No.
7.1
Item
Insertion
Loss
(IL)
Specification
Meet item 3.
P2/10
Definition and Measurement Method
Insertion Loss is given by Sds21 mag. extracted from the below circuit.
IL[dB] = 20log10(Sds21)
Where
Sds21 is S-parameter of single mode stimulus - Differential mode response
Parasitics and loss factors caused by the test board have to be removed.
UB
B1
PORT1
PORT2
B2
75Ω
37.5Ω
PORT3
37.5Ω
7.2
CMRR
Meet item 3.
CMRR is given by the following equation, S-parameters are extracted from
the below circuit.
CMRR[dB] = 20log10(Sds21/Scs21)=20log10{(S21+S31)/(S21-S31)}
Where
Sds21 is S-parameter of single mode stimulus - Differential mode response
Scs21 is S-parameter of single mode stimulus - Common mode response
Parasitics and loss factors caused by the test board have to be removed.
UB
B1
PORT1
PORT2
B2
75Ω
37.5Ω
PORT3
37.5Ω
7.3
Withstand
Voltage
No damage.
Test Voltage : 50V
Time : 5 seconds
Charge Current : 1mA max.
UB
B1
Terminal to be tested
B2
Terminal to be tested
7.4
DC
Resistance
(Rdc)
Meet item 3.
Measuring current : 10mA max.
(In case of doubt in the above mentioned standard condition, measure by
4 terminal method.)
Terminal to be tested
UB
B1
Terminal to be tested
B2
UB
and
B1
B2
Terminal to be tested
7.5
Insulation
Resistance
(I.R.)
Meet item 3.
Terminal to be tested
Measuring voltage : Rated Voltage
Measuring time : 1 minute max.
UB
B1
Terminal to be tested
B2
Terminal to be tested
MURATA MFG.CO., LTD
SpecNo.JEFK243A-0001K-01
P3/10
8. Mechanical Performance
No.
8.1
8.2
Item
Appearance
and
Dimensions
Bonding
Strength
Specification
Meet all dimension on item 5.
Test Method
Visual Inspection and measurement with microscope.
No evidence of coming off
substrate.
Products shall not be
mechanical damaged.
It shall be soldered on the substrate.
Applying Force(F) : 5N
Pressure
Applying Time : 5±1seconds
Substrate
Product
Test board fixture
8.3
Bending
Strength
Meet Table 1.
Table 1
Appearance
IL
No damaged
It shall be soldered on the Glass-epoxy substrate.
Deflection : 2mm
(t=1.0mm).
Keeping time : 5 seconds
Speed of Applying Force : 0.5mm/s
Pressure jig
CMRR
R230
DC Resistance
Meet Item 3.
I.R.
Withstand
Voltage
8.4
Drop
8.5
Vibration
8.6
Solderability
The electrodes shall be at least
90% covered with new solder
coating.
F
Deflection
45
45
Product
It shall be dropped on concrete or steel board.
Method : free fall
Height : 1 m
The Number of Times : 3 times
It shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1 minute
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions. (Total 6 hours)
Flux:Ethanol solution of rosin,25(wt)% includes
activator equivalent to 0.06 to 0.10(wt)% chlorine
Pre-Heating : 80 to 120°C 1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 245±3°C
Immersion Time : 4±1 seconds
Immersion and emersion rates : 25mm/s
Stainless tweezers
Please hold product
except these part.
8.7
Resistance
to Soldering
Heat
Meet Table 1.
Flux : Ethanol solution of rosin,25(wt)%
includes activator equipment to 0.06 to
0.10(wt)% chlorine
Pre-Heating : 80 to 120°C ,1minute
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 260±5°C
Immersion Time : 5±0.5 seconds
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room
condition for 4 to 48 hours.
MURATA MFG.CO., LTD
SpecNo.JEFK243A-0001K-01
P4/10
9. Environmental Performance(Products shall be soldered on the substrate.)
No.
9.1
Item
Temperature
Cycle
9.2
Humidity
9.3
Heat life
9.4
Cold
Resistance
Specification
Meet Table 1.
Test Method
1 Cycle
Step 1 -40°C(+0°C,-3°C) / 30±3 min
Step 2 Ordinary Temp. / 10 to 15 minutes
Step 3 +85°C(+3°C,-0°C) / 30±3 min
Step 4 Ordinary Temp. / 10 to 15 minutes
Total of 100 cycles
Then measured after exposure in the
room condition for 4 to 48 hours
Temperature : 40±2°C
Humidity : 90~95%(RH)
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Temperature : 85±2°C
Applying Rated Power
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Temperature : -40± 2°C
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
10. Specification of Packaging
Sprocket Hole
1.5± 0.1
0
0.25±0.05
0.3±0.05
2.0±0.05
4.0±0.1
2.25±0.1
3.5±0.05
8.0±0.3
1.75±0.1
10.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)
*Dimension of the Cavity is measured
at the bottom side.
1.4±0.1
1.45±0.1
4.0±0.1
Cavity
Direction of feed
10.2 Specification of Taping
(in mm)
(1)Packing quantity(Standard quantity) 2000 pcs. / reel
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Spliced point
The cover tape have no spliced point.
(4) Sprocket Hole
Sprocket hole shall be located on the left hand side toward the direction of feed.
(5)Missing components number
Missing components number within 0.025% of the number per reel or 1 pc, whichever is greater, and are
not continuous. The specified quantity per reel is kept.
10.3 Pull Strength of the Tape Package
Plastic Tape
Cover Tape
10.4 Peeling force of the Cover Tape
0.2 to 0.7N(Minimum value is Typical)
Peeling verosity is 300 mm / min
5N min.
10N min.
165 to 180 degree
MURATA MFG.CO., LTD
F
Cover tape
Plastic tape
SpecNo.JEFK243A-0001K-01
P5/10
10.5 Dimensions of Leader-tape, Trailer and Reel
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS Marking(2), Quantity, etc
1) « Expression of Inspection No. »
□□ OOOO
(1) Factory Code
(2) Date
(3) Serial No.
(1)
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
2) « Expression of RoHS Marking »
ROHS – Y (△)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(1) (2)
10.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS Marking (2), Quantity, etc
10.8 Specification of Outer Case
Label
H
D
W
11.
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity of an
order.
!
△
Caution
11.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also
flames or other serious trouble.
Ｚ
right direction
Ｚ
wrong direction
11.2 Limitation of Application
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life, body
or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability
requirements to the applications listed in the above.
MURATA MFG.CO., LTD
SpecNo.JEFK243A-0001K-01
P6/10
11.3 Corrosive gas
Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide,
sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with
the previously stated corrosive gas environment will result in deterioration of product quality or an open from
deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these
environments.
12. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1 Flux and Solder
Flux
Use rosin-based flux, (with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
12.2 Assembling
Flow soldering may cause deterioration in insulation resistance.
So, reflow soldering shall be applied for this product.
12.3 Cleaning Conditions
Do not clean after soldering. Some cleaning agents may degrade bonding strength,and characteristics of
products by detaching. If cleaning,please contact us.
12.4 Resin coating
The electrical performance may change due to high cure-stress of resin to be used for coating/molding
products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of
resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate
chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open
circuit. So, please pay your careful attention when you select resin in case of coating/molding the products
with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating
products mounted on your board.
12.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
a
b
〈 Poor example〉
Products shall be location the sideways
Direction (Length : a D *1
A > B
A > C
C
B
*1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB,
therefore A > D is invalid.
D
Slit
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Screw Hole
Recommended
12.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are far from the portion
of perforation.
Portion of
Perforation
×
P.C.B.
○
○
The portion of perforation shall be designed as narrow as possible
and shall be designed so as not to be applied the stress in the case
of P.C.B. separation.
Products shall not be arranged on the line of a series of holes when
there are big holes in P.C.B. (Because the stress concentrate on the
line of holes.)
Portion of
Perforation
Product
×
○
P.C.B.
×
Product
Hole
< Products Placing >
Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B.
during placing the products on the other side of P.C.B.
Pick- up nozzle
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
Product
P.C.B.
Support pin
MURATA MFG.CO., LTD
SpecNo.JEFK243A-0001K-01
P8/10
12.7 Standard Land Dimensions (Reflow)
1
1.2
0.4
2
3
Resist
Copper foil pattern
No pattern
(in mm)
0.8
1
2
3
4
2.6
If the pattern is made with wider than 1.2mm. It will result to let component turn around,
because melting speed is different. In the worst case, short circuit between lines may be occured.
If the pattern is made with less than 0.4mm , in the worst case , short circuit between lines may be
occurred deu to the spread of soldering paste or mount placeing accuracy.
If the pattern is made with wider than 0.8mm, the strength of bending will be reduced.
Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.
0 .5
1 .2
12.8 Standard Soldering Condition
1. Reflow Soldering
(1) Standard printing pattern for soldering.
Standard thickness of the solder paste should be 100 to 150µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard land dimensions.
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
Spread of soldering paste between lines may cause short circuit of lines.
0.8
2.6
(in mm)
(2) Soldering Temperature
Temperature difference between soldering and surface of components must be within 150°C, in preheating.
When components are immersed in liquid after soldering, temperature difference should be within 100°C. If
preheating is not enough, components may be cracked and cause deterioration in insulation resistance.
(3) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃/10s
245±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30～60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Standard Profile
150～180°C 、90s±30s
above 220°C、30s～60s
245±3°C
2 times
MURATA MFG.CO., LTD
Time（ｓ）
Limit Profile
above 230°C、60s max.
260°C、10s
2 times
SpecNo.JEFK243A-0001K-01
P9/10
2. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being
mounted by reflow soldering.
· Pre-heating: 150°C, 1 min
ꞏ Soldering iron output: 30W max.
· Tip temperature: 350°C max.
ꞏ Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. ꞏ Times : 2times max.
Notes: Do not touch the products directly with the soldering iron.
3. Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Upper limit
Recommendable
ｔ
T
1/3T≦t≦T (T:Tickness of electrode)
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
12.9 Caution for use
･When you hold products with a tweezer, please hold
like a figure of the right side, and sharp material,
such as a pair of tweezers, shall not be touched to
the winding portion to prevent the breaking of wire.
･Mechanical shock should not be applied to the products
mounted on the board to prevent the breaking
of the core.
tweezer
12.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush shall not
be touched to the winding portion to prevent the breaking of wire.
12.12 Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance,
such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
MURATA MFG.CO., LTD
SpecNo.JEFK243A-0001K-01
P10/10
12.13 Storage Condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
ꞏProducts should be stored in the warehouse on the following conditions.
Temperature ： -10 ~ +40°C
Humidity
： 15 to 85% relative humidity
No rapid change on temperature and humidity.
ꞏ Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration. Poor solderability due to the oxidized electrode.
ꞏ Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.
ꞏ Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
ꞏ Avoid storing the product by itself bare (i.e.exposed directly to air).
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
!
13.△
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
