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EFM32ZG108 DATASHEET
F32/F16/F8/F4
• ARM Cortex-M0+ CPU platform
• High Performance 32-bit processor @ up to 24 MHz
• Wake-up Interrupt Controller
• Flexible Energy Management System
• 20 nA @ 3 V Shutoff Mode
• 0.5 µA @ 3 V Stop Mode, including Power-on Reset, Brown-out
Detector, RAM and CPU retention
• 0.9 µA @ 3 V Deep Sleep Mode, including RTC with 32.768 kHz
oscillator, Power-on Reset, Brown-out Detector, RAM and CPU
retention
• 48 µA/MHz @ 3 V Sleep Mode
• 114 µA/MHz @ 3 V Run Mode, with code executed from flash
• 32/16/8/4 KB Flash
• 4/4/2/2 KB RAM
• 17 General Purpose I/O pins
• Configurable push-pull, open-drain, pull-up/down, input filter, drive
strength
• Configurable peripheral I/O locations
• 11 asynchronous external interrupts
• Output state retention and wake-up from Shutoff Mode
• 4 Channel DMA Controller
• 4 Channel Peripheral Reflex System (PRS) for autonomous inter-peripheral signaling
• Timers/Counters
• 2× 16-bit Timer/Counter
• 2×3 Compare/Capture/PWM channels
• 1× 24-bit Real-Time Counter
• 1× 16-bit Pulse Counter
• Watchdog Timer with dedicated RC oscillator @ 50 nA
• Communication interfaces
• Universal Synchronous/Asynchronous Receiver/Transmitter
• UART/SPI/SmartCard (ISO 7816)/IrDA/I2S
• Triple buffered full/half-duplex operation
• Low Energy UART
• Autonomous operation with DMA in Deep Sleep
Mode
2
• I C Interface with SMBus support
• Address recognition in Stop Mode
• Ultra low power precision analog peripherals
• 1× Analog Comparator
• Capacitive sensing with up to 2 inputs
• Supply Voltage Comparator
• Ultra efficient Power-on Reset and Brown-Out Detector
• 2-pin Serial Wire Debug interface
• Pre-Programmed UART Bootloader
• Temperature range -40 to 85 ºC
• Single power supply 1.98 to 3.8 V
• QFN24 package
32-bit ARM Cortex-M0+, Cortex-M3 and Cortex-M4 microcontrollers for:
• Energy, gas, water and smart metering
• Health and fitness applications
• Smart accessories
• Alarm and security systems
• Industrial and home automation
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1 Ordering Information
Table 1.1 (p. 2) shows the available EFM32ZG108 devices.
Table 1.1. Ordering Information
Ordering Code
Flash (kB)
RAM (kB)
Max
Speed
(MHz)
Supply
Voltage
(V)
Temperature
(ºC)
Package
EFM32ZG108F4-QFN24
4
2
24
1.98 - 3.8
-40 - 85
QFN24
EFM32ZG108F8-QFN24
8
2
24
1.98 - 3.8
-40 - 85
QFN24
EFM32ZG108F16-QFN24
16
4
24
1.98 - 3.8
-40 - 85
QFN24
EFM32ZG108F32-QFN24
32
4
24
1.98 - 3.8
-40 - 85
QFN24
Visit www.silabs.com for information on global distributors and representatives.
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2 System Summary
2.1 System Introduction
The EFM32 MCUs are the world’s most energy friendly microcontrollers. With a unique combination
of the powerful 32-bit ARM Cortex-M0+, innovative low energy techniques, short wake-up time from
energy saving modes, and a wide selection of peripherals, the EFM32ZG microcontroller is well suited
for any battery operated application as well as other systems requiring high performance and low-energy
consumption. This section gives a short introduction to each of the modules in general terms and also
shows a summary of the configuration for the EFM32ZG108 devices. For a complete feature set and indepth information on the modules, the reader is referred to the EFM32ZG Reference Manual.
A block diagram of the EFM32ZG108 is shown in Figure 2.1 (p. 3) .
Figure 2.1. Block Diagram
ZG108F32/ 16/ 8/ 4
Clock Managem ent
Core and Mem ory
ARM Cortex ™ M0+ processor
Flash
Program
Mem ory
RAM
Mem ory
Debug
Interface
DMA
Controller
Energy Managem ent
High Freq
Crystal
Oscillator
High Freq
RC
Oscillator
Voltage
Regulator
Voltage
Com parator
Aux High Freq
RC
Oscillator
Low Freq
RC
Oscillator
Brown- out
Detector
Power- on
Reset
Low Freq
Crystal
Oscillator
Ultra Low Freq
RC
Oscillator
32- bit bus
Peripheral Ref lex Syst em
Serial Interfaces
USART
Low
Energy
Uart™
2
IC
I/ O Ports
Tim ers and Triggers
Analog Interfaces
Ex ternal
Interrupts
General
Purpose
I/ O
Tim er/
Counter
Real Tim e
Counter
Analog
Com parator
Pin
Reset
Pin
Wakeup
Pulse
Counter
Watchdog
Tim er
2.1.1 ARM Cortex-M0+ Core
The ARM Cortex-M0+ includes a 32-bit RISC processor which can achieve as much as 0.9 Dhrystone
MIPS/MHz. A Wake-up Interrupt Controller handling interrupts triggered while the CPU is asleep is included as well. The EFM32 implementation of the Cortex-M0+ is described in detail in ARM Cortex-M0+
Devices Generic User Guide.
2.1.2 Debug Interface (DBG)
This device includes hardware debug support through a 2-pin serial-wire debug interface .
2.1.3 Memory System Controller (MSC)
The Memory System Controller (MSC) is the program memory unit of the EFM32ZG microcontroller.
The flash memory is readable and writable from both the Cortex-M0+ and DMA. The flash memory is
divided into two blocks; the main block and the information block. Program code is normally written to
the main block. Additionally, the information block is available for special user data and flash lock bits.
There is also a read-only page in the information block containing system and device calibration data.
Read and write operations are supported in the energy modes EM0 and EM1.
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2.1.4 Direct Memory Access Controller (DMA)
The Direct Memory Access (DMA) controller performs memory operations independently of the CPU.
This has the benefit of reducing the energy consumption and the workload of the CPU, and enables
the system to stay in low energy modes when moving for instance data from the USART to RAM or
from the External Bus Interface to a PWM-generating timer. The DMA controller uses the PL230 µDMA
controller licensed from ARM.
2.1.5 Reset Management Unit (RMU)
The RMU is responsible for handling the reset functionality of the EFM32ZG.
2.1.6 Energy Management Unit (EMU)
The Energy Management Unit (EMU) manage all the low energy modes (EM) in EFM32ZG microcontrollers. Each energy mode manages if the CPU and the various peripherals are available. The EMU
can also be used to turn off the power to unused SRAM blocks.
2.1.7 Clock Management Unit (CMU)
The Clock Management Unit (CMU) is responsible for controlling the oscillators and clocks on-board
the EFM32ZG. The CMU provides the capability to turn on and off the clock on an individual basis to all
peripheral modules in addition to enable/disable and configure the available oscillators. The high degree
of flexibility enables software to minimize energy consumption in any specific application by not wasting
power on peripherals and oscillators that are inactive.
2.1.8 Watchdog (WDOG)
The purpose of the watchdog timer is to generate a reset in case of a system failure, to increase application reliability. The failure may e.g. be caused by an external event, such as an ESD pulse, or by a
software failure.
2.1.9 Peripheral Reflex System (PRS)
The Peripheral Reflex System (PRS) system is a network which lets the different peripheral module
communicate directly with each other without involving the CPU. Peripheral modules which send out
Reflex signals are called producers. The PRS routes these reflex signals to consumer peripherals which
apply actions depending on the data received. The format for the Reflex signals is not given, but edge
triggers and other functionality can be applied by the PRS.
2.1.10 Inter-Integrated Circuit Interface (I2C)
2
2
The I C module provides an interface between the MCU and a serial I C-bus. It is capable of acting as
both a master and a slave, and supports multi-master buses. Both standard-mode, fast-mode and fastmode plus speeds are supported, allowing transmission rates all the way from 10 kbit/s up to 1 Mbit/s.
Slave arbitration and timeouts are also provided to allow implementation of an SMBus compliant system.
2
The interface provided to software by the I C module, allows both fine-grained control of the transmission
process and close to automatic transfers. Automatic recognition of slave addresses is provided in all
energy modes.
2.1.11 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)
The Universal Synchronous Asynchronous serial Receiver and Transmitter (USART) is a very flexible
serial I/O module. It supports full duplex asynchronous UART communication as well as RS-485, SPI,
MicroWire and 3-wire. It can also interface with ISO7816 SmartCards, IrDA and I2S devices.
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2.1.12 Pre-Programmed UART Bootloader
The bootloader presented in application note AN0003 is pre-programmed in the device at factory. Autobaud and destructive write are supported. The autobaud feature, interface and commands are described
further in the application note.
2.1.13 Low Energy Universal Asynchronous Receiver/Transmitter
(LEUART)
TM
The unique LEUART , the Low Energy UART, is a UART that allows two-way UART communication on
a strict power budget. Only a 32.768 kHz clock is needed to allow UART communication up to 9600 baud/
s. The LEUART includes all necessary hardware support to make asynchronous serial communication
possible with minimum of software intervention and energy consumption.
2.1.14 Timer/Counter (TIMER)
The 16-bit general purpose Timer has 3 compare/capture channels for input capture and compare/PulseWidth Modulation (PWM) output.
2.1.15 Real Time Counter (RTC)
The Real Time Counter (RTC) contains a 24-bit counter and is clocked either by a 32.768 kHz crystal
oscillator, or a 32.768 kHz RC oscillator. In addition to energy modes EM0 and EM1, the RTC is also
available in EM2. This makes it ideal for keeping track of time since the RTC is enabled in EM2 where
most of the device is powered down.
2.1.16 Pulse Counter (PCNT)
The Pulse Counter (PCNT) can be used for counting pulses on a single input or to decode quadrature
encoded inputs. It runs off either the internal LFACLK or the PCNTn_S0IN pin as external clock source.
The module may operate in energy mode EM0 - EM3.
2.1.17 Analog Comparator (ACMP)
The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is higher. Inputs can either be one of the selectable internal references or from
external pins. Response time and thereby also the current consumption can be configured by altering
the current supply to the comparator.
2.1.18 Voltage Comparator (VCMP)
The Voltage Supply Comparator is used to monitor the supply voltage from software. An interrupt can
be generated when the supply falls below or rises above a programmable threshold. Response time and
thereby also the current consumption can be configured by altering the current supply to the comparator.
2.1.19 General Purpose Input/Output (GPIO)
In the EFM32ZG108, there are 17 General Purpose Input/Output (GPIO) pins, which are divided into
ports with up to 16 pins each. These pins can individually be configured as either an output or input. More
advanced configurations like open-drain, filtering and drive strength can also be configured individually
for the pins. The GPIO pins can also be overridden by peripheral pin connections, like Timer PWM
outputs or USART communication, which can be routed to several locations on the device. The GPIO
supports up to 11 asynchronous external pin interrupts, which enables interrupts from any pin on the
device. Also, the input value of a pin can be routed through the Peripheral Reflex System to other
peripherals.
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2.2 Configuration Summary
The features of the EFM32ZG108 is a subset of the feature set described in the EFM32ZG Reference
Manual. Table 2.1 (p. 6) describes device specific implementation of the features.
Table 2.1. Configuration Summary
Module
Configuration
Pin Connections
Cortex-M0+
Full configuration
NA
DBG
Full configuration
DBG_SWCLK, DBG_SWDIO,
MSC
Full configuration
NA
DMA
Full configuration
NA
RMU
Full configuration
NA
EMU
Full configuration
NA
CMU
Full configuration
CMU_OUT0, CMU_OUT1
WDOG
Full configuration
NA
PRS
Full configuration
NA
I2C0
Full configuration
I2C0_SDA, I2C0_SCL
USART1
Full configuration with I2S and IrDA
US1_TX, US1_RX, US1_CLK, US1_CS
LEUART0
Full configuration
LEU0_TX, LEU0_RX
TIMER0
Full configuration
TIM0_CC[2:0]
TIMER1
Full configuration
TIM1_CC[2:0]
RTC
Full configuration
NA
PCNT0
Full configuration, 16-bit count register
PCNT0_S[1:0]
ACMP0
Full configuration
ACMP0_CH[1:0], ACMP0_O
VCMP
Full configuration
NA
GPIO
17 pins
Available pins are shown in
Table 4.3 (p. 40)
2.3 Memory Map
The EFM32ZG108 memory map is shown in Figure 2.2 (p. 7) , with RAM and Flash sizes for the
largest memory configuration.
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Figure 2.2. EFM32ZG108 Memory Map with largest RAM and Flash sizes
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3 Electrical Characteristics
3.1 Test Conditions
3.1.1 Typical Values
The typical data are based on TAMB=25°C and VDD=3.0 V, as defined in Table 3.2 (p. 8) , by simulation and/or technology characterisation unless otherwise specified.
3.1.2 Minimum and Maximum Values
The minimum and maximum values represent the worst conditions of ambient temperature, supply voltage and frequencies, as defined in Table 3.2 (p. 8), by simulation and/or technology characterisation unless otherwise specified.
3.2 Absolute Maximum Ratings
The absolute maximum ratings are stress ratings, and functional operation under such conditions are
not guaranteed. Stress beyond the limits specified in Table 3.1 (p. 8) may affect the device reliability
or cause permanent damage to the device. Functional operating conditions are given in Table 3.2 (p.
8) .
Table 3.1. Absolute Maximum Ratings
Symbol
Parameter
Condition
Min
Typ
Max
-40
Unit
150
1
TSTG
Storage temperature range
TS
Maximum soldering
temperature
VDDMAX
External main supply voltage
0
3.8 V
VIOPIN
Voltage on any I/O
pin
-0.3
VDD+0.3 V
Latest IPC/JEDEC J-STD-020
Standard
°C
260 °C
1
Based on programmed devices tested for 10000 hours at 150ºC. Storage temperature affects retention of preprogrammed calibration values stored in flash. Please refer to the Flash section in the Electrical Characteristics for information on flash data retention for different temperatures.
3.3 General Operating Conditions
3.3.1 General Operating Conditions
Table 3.2. General Operating Conditions
Symbol
Parameter
TAMB
Ambient temperature range
VDDOP
Operating supply voltage
fAPB
Internal APB clock frequency
24 MHz
fAHB
Internal AHB clock frequency
24 MHz
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Min
Typ
-40
1.98
8
Max
Unit
85 °C
3.8 V
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3.4 Current Consumption
Table 3.3. Current Consumption
Symbol
IEM0
IEM1
Parameter
EM0 current. No
prescaling. Running
prime number calculation code from
Flash. (Production
test condition = 14
MHz)
EM1 current (Production test condition = 14 MHz)
Condition
Min
Typ
Max
Unit
24 MHz HFXO, all peripheral
clocks disabled, VDD= 3.0 V,
TAMB=25°C
115
132 µA/
MHz
24 MHz HFXO, all peripheral
clocks disabled, VDD= 3.0 V,
TAMB=85°C
117
136 µA/
MHz
21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=25°C
114
128 µA/
MHz
21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=85°C
116
132 µA/
MHz
14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=25°C
117
131 µA/
MHz
14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=85°C
118
133 µA/
MHz
11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=25°C
118
133 µA/
MHz
11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=85°C
120
135 µA/
MHz
6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=25°C
124
139 µA/
MHz
6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=85°C
125
142 µA/
MHz
1.2 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=25°C
155
177 µA/
MHz
1.2 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=85°C
162
181 µA/
MHz
24 MHz HFXO, all peripheral
clocks disabled, VDD= 3.0 V,
TAMB=25°C
48
57 µA/
MHz
24 MHz HFXO, all peripheral
clocks disabled, VDD= 3.0 V,
TAMB=85°C
49
59 µA/
MHz
21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=25°C
48
52 µA/
MHz
21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=85°C
49
53 µA/
MHz
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Symbol
IEM2
IEM3
IEM4
Parameter
Condition
Min
Typ
Max
Unit
14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=25°C
50
54 µA/
MHz
14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=85°C
51
56 µA/
MHz
11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=25°C
52
56 µA/
MHz
11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=85°C
53
58 µA/
MHz
6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=25°C
57
63 µA/
MHz
6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V,
TAMB=85°C
59
66 µA/
MHz
1.2 MHz HFRCO. all peripheral clocks disabled, VDD= 3.0 V,
TAMB=25°C
89
99 µA/
MHz
1.2 MHz HFRCO. all peripheral clocks disabled, VDD= 3.0 V,
TAMB=85°C
92
103 µA/
MHz
EM2 current with RTC
prescaled to 1 Hz, 32.768
kHz LFRCO, VDD= 3.0 V,
TAMB=25°C
0.9
1.25 µA
EM2 current with RTC
prescaled to 1 Hz, 32.768
kHz LFRCO, VDD= 3.0 V,
TAMB=85°C
1.7
2.35 µA
EM3 current (ULFRCO enabled, LFRCO/LFXO disabled),
VDD= 3.0 V, TAMB=25°C
0.5
0.9 µA
EM3 current (ULFRCO enabled, LFRCO/LFXO disabled),
VDD= 3.0 V, TAMB=85°C
1.3
2.0 µA
VDD= 3.0 V, TAMB=25°C
0.02
0.035 µA
VDD= 3.0 V, TAMB=85°C
0.29
0.700 µA
EM2 current
EM3 current
EM4 current
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3.4.1 EM0 Current Consumption
Figure 3.1. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 24 MHz
2.84
2.80
Idd [m A]
2.78
2.82
2.80
2.78
Idd [m A]
2.82
2.84
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
2.76
2.76
2.74
2.74
2.72
2.72
2.70
2.70
2.68
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
2.68
–40
3.8
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
–15
5
25
Tem perature [°C]
45
65
85
Figure 3.2. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 21 MHz
2.40
2.40
Idd [m A]
2.45
Idd [m A]
2.45
2.35
2.35
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
2.30
2.0
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
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3.4
3.6
2.30
3.8
–40
11
–15
5
25
Tem perature [°C]
45
65
85
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1.68
1.68
1.66
1.66
1.64
1.64
1.62
1.62
Idd [m A]
Idd [m A]
Figure 3.3. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 14 MHz
1.60
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
1.58
1.56
1.54
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
1.60
1.58
1.56
1.54
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
1.34
1.34
1.32
1.32
1.30
1.30
Idd [m A]
Idd [m A]
Figure 3.4. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 11 MHz
1.28
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
1.26
1.24
1.22
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
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3.4
3.6
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
1.28
1.26
1.24
1.22
–40
3.8
12
–15
5
25
Tem perature [°C]
45
65
85
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0.84
0.84
0.83
0.83
0.82
0.82
0.81
0.81
Idd [m A]
Idd [m A]
Figure 3.5. EM0 Current consumption while executing prime number calculation code from flash
with HFRCO running at 6.6 MHz
0.80
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
0.79
0.78
0.77
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
0.80
0.79
0.78
0.77
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
3.4.2 EM1 Current Consumption
Figure 3.6. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 24 MHz
1.20
1.18
1.20
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
1.18
Idd [m A]
1.16
Idd [m A]
1.16
1.14
1.14
1.12
1.12
1.10
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
2015-03-06 - EFM32ZG108FXX - d0063_Rev1.10
3.4
3.6
1.10
–40
3.8
13
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
–15
5
25
Tem perature [°C]
45
65
85
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1.04
1.04
1.03
1.03
1.02
1.02
1.01
1.01
Idd [m A]
Idd [m A]
Figure 3.7. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 21 MHz
1.00
0.99
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
0.98
0.97
0.96
0.95
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
1.00
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
0.99
0.98
0.97
0.96
0.95
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
0.73
0.73
0.72
0.72
0.71
0.71
0.70
0.70
Idd [m A]
Idd [m A]
Figure 3.8. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 14 MHz
0.69
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
0.68
0.67
0.66
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
2015-03-06 - EFM32ZG108FXX - d0063_Rev1.10
3.4
3.6
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
0.69
0.68
0.67
0.66
–40
3.8
14
–15
5
25
Tem perature [°C]
45
65
85
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0.59
0.59
0.58
0.58
0.57
0.57
Idd [m A]
Idd [m A]
Figure 3.9. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 11 MHz
0.56
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
0.55
0.54
0.53
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
0.56
0.55
0.54
0.53
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
0.395
0.395
0.390
0.390
0.385
0.385
0.380
0.380
Idd [m A]
Idd [m A]
Figure 3.10. EM1 Current consumption with all peripheral clocks disabled and HFRCO running
at 6.6 MHz
0.375
0.370
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
0.365
0.360
0.355
0.350
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
2015-03-06 - EFM32ZG108FXX - d0063_Rev1.10
3.4
3.6
0.375
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
0.370
0.365
0.360
0.355
0.350
–40
3.8
15
–15
5
25
Tem perature [°C]
45
65
85
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3.4.3 EM2 Current Consumption
Figure 3.11. EM2 current consumption. RTC prescaled to 1kHz, 32.768 kHz LFRCO.
2.0
2.0
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
1.8
1.6
1.4
Idd [uA]
Idd [uA]
1.6
1.8
1.2
1.4
1.2
1.0
1.0
0.8
0.8
0.6
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
0.6
–40
3.8
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
–15
5
25
Tem perature [°C]
45
65
85
5
25
Tem perature [°C]
45
65
85
3.4.4 EM3 Current Consumption
Figure 3.12. EM3 current consumption.
1.6
1.6
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
1.4
1.2
Idd [uA]
Idd [uA]
1.2
1.4
1.0
1.0
0.8
0.8
0.6
0.6
0.4
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
2015-03-06 - EFM32ZG108FXX - d0063_Rev1.10
3.4
3.6
0.4
–40
3.8
16
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
–15
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3.4.5 EM4 Current Consumption
Figure 3.13. EM4 current consumption.
0.5
Idd [uA]
0.3
0.4
0.3
Idd [uA]
0.4
0.5
- 40.0°C
- 15.0°C
5.0°C
25.0°C
45.0°C
65.0°C
85.0°C
0.2
0.2
0.1
0.1
0.0
0.0
–0.1
2.0
2.2
2.4
2.6
2.8
3.0
Vdd [V]
3.2
3.4
3.6
Vdd= 2.0V
Vdd= 2.2V
Vdd= 2.4V
Vdd= 2.6V
Vdd= 2.8V
Vdd= 3.0V
Vdd= 3.2V
Vdd= 3.4V
Vdd= 3.6V
Vdd= 3.8V
–0.1
–40
3.8
–15
5
25
Tem perature [°C]
45
65
85
3.5 Transition between Energy Modes
The transition times are measured from the trigger to the first clock edge in the CPU.
Table 3.4. Energy Modes Transitions
Symbol
Parameter
Min
Typ
Max
Unit
tEM10
Transition time from EM1 to EM0
0
HFCORECLK
cycles
tEM20
Transition time from EM2 to EM0
2
µs
tEM30
Transition time from EM3 to EM0
2
µs
tEM40
Transition time from EM4 to EM0
163
µs
3.6 Power Management
The EFM32ZG requires the AVDD_x, VDD_DREG and IOVDD_x pins to be connected together (with
optional filter) at the PCB level. For practical schematic recommendations, please see the application
note, "AN0002 EFM32 Hardware Design Considerations".
2015-03-06 - EFM32ZG108FXX - d0063_Rev1.10
17
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Table 3.5. Power Management
Symbol
Parameter
VBODextthr-
BOD threshold on
falling external supply voltage
VBODextthr+
BOD threshold on
rising external supply voltage
tRESET
Delay from reset
is released until
program execution
starts
CDECOUPLE
Voltage regulator
decoupling capacitor.
Condition
Min
Typ
Max
1.74
Unit
1.96 V
1.85
V
Applies to Power-on Reset,
Brown-out Reset and pin reset.
163
µs
X5R capacitor recommended.
Apply between DECOUPLE pin
and GROUND
1
µF
3.7 Flash
Table 3.6. Flash
Symbol
Parameter
ECFLASH
Flash erase cycles
before failure
Condition
Min
TAMB
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