EMI6316FCTBG

EMI6316FCTBG EMI Filter with ESD Protection for MicroSD Card Applications Product Description http://onsemi.com The EMI6316 is a 4 x 4, 15−bump EMI filter with ESD protection device for MicroSD card applications in a 0.4 mm pitch CSP form factor. It is fully compliant with IEC 61000−4−2. The EMI6316 is also RoHS II compliant. MARKING DIAGRAM WLCSP15 CASE 567FX A1 Corner Indicator PACKAGE / PINOUT DIAGRAMS 1 2 3 4 A B C 4 3 2 1 A 63 YW D B 63 Y W G 63 YW G = Specific Device Code = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 3 of this data sheet. C D Top View (Bumps Down View) © Semiconductor Components Industries, LLC, 2012 September, 2012 − Rev. 1 Bottom View (Bumps Up View) 1 Publication Order Number: EMI6316/D EMI6316FCTBG External (B2) (B1) Internal (B4) (C1) (C4) (A1) (A4) (A2) (A3) (D2) (D3) (D1) (D4) External (B3, C3) Figure 1. Electrical Schematic Table 1. PIN DESCRIPTIONS Pin Description Pin Description Pin Description Pin Description A1 dat0 Internal B1 clk Internal C1 cmd Internal D1 data3 Internal A2 dat1 Internal B2 VCC External D2 data2 Internal A3 SDdat1 External B3 GND C3 GND D3 SDdata2 External A4 SDdat0 External B4 SDclk External C4 SDcmd External D4 SDdata3 External http://onsemi.com 2 EMI6316FCTBG ELECTRICAL SPECIFICATIONS AND CONDITIONS Table 2. PARAMETERS AND OPERATING CONDITIONS Parameter Rating Unit Storage Temperature Range −55 to +150 °C Operating Temperature Range −40 to +85 °C Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Unit R1 R2 R3 R4 R5 R6 Resistance 34 40 46 W R9 R10 R11 R12 Resistance 42.5 50 57.5 kW R13 Resistance 12.75 15 17.25 kW 10 100 nA 11.5 14 pF ILEAK C VB VESD Leakage Current per Channel VIN = 3.0 V Line Capacitance At 1 MHz, VIN = 0 V 9 At 1 MHz, VIN = 1.8 V (Note 2) 8 pF At 1 MHz, VIN = 2.5 V 7 pF Breakdown Voltage (Positive) IR = 1 mA ESD Protection Peak Discharge Voltage at A3, A4, B2, B4, C4, D3 and D4 pins a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 3) ESD Protection Peak Discharge Voltage at A1, A2, B1, C1, D1 and D2 pins a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 3) 6 7 9 V kV ±8 ±15 ±2 ±2 1. All parameters specified at TA = 25°C unless otherwise noted. 2. MicroSD version 3.0 SDR104 compliant. 3. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W. Table 4. CSP TAPE AND REEL SPECIFICATIONS† Part Number EMI6316FCTBG Chip Size (mm) Package Shipping† 1.56 x 1.56 x 0.50 WLCSP15 (Pb−Free) 5000 / Tape & Reel † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com 3 EMI6316FCTBG RF CHARACTERISTICS 2.5V 0V Figure 2. S21 Attenuation Simulation http://onsemi.com 4 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP15, 1.56x1.56 CASE 567FX ISSUE O SCALE 4:1 ÈÈ ÈÈ D PIN A1 REFERENCE 2X A B DATE 07 JUN 2012 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E DIM A A1 A2 b D E e 0.10 C 2X 0.10 C TOP VIEW A2 0.10 C GENERIC MARKING DIAGRAM* A 0.05 C NOTE 3 15X A1 0.05 C A B 0.03 C C SIDE VIEW e XX Y W G e D XX YW G SEATING PLANE e/2 b MILLIMETERS MIN MAX 0.47 0.53 0.185 0.205 0.305 REF 0.24 0.29 1.56 BSC 1.56 BSC 0.40 BSC e/2 C = Specific Device Code = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. B A 1 2 3 4 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* 0.40 PITCH A1 PACKAGE OUTLINE 15X 0.23 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON81359E WLCSP15, 1.56X1.56 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 www.onsemi.com 1 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative