EMI7204MUTAG

EMI7204MU, EMI7206MU, EMI7208MU Four-Six-Eight -Channel EMI Filter with Integrated ESD Protection The EMI720xMU Series is a family of LC EMI filters with integrated ESD protection. Its typical component values of L = 17 nH and C = 12 pF deliver a cutoff frequency of 250 MHz and stop band attenuation greater than −23 dB from 800 MHz to 6.0 GHz. This performance makes the part ideal for parallel interfaces with data rates up to 125 Mbps in applications where wireless interference must be minimized. The specified attenuation range is very effective in minimizing interference from 2G/3G, GPS, Bluetooth® and WLAN signals. The EMI720xMU Series is available in the low−profile 4, 6, and 8 lead, 0.5 mm thick UDFN surface mount packages with 0.4 mm lead pitch. http://onsemi.com MARKING DIAGRAMS 8 1 12 1 • • • Contact Discharge) L/C Values of 17 nH and 12 pF Deliver Exceptional S21 Performance Characteristics of 250 MHz f3dB and −23 dB Stop Band Attenuation from 800 MHz to 6.0 GHz Integrated EMI/ESD System Solution in UDFN Package Offers Exceptional Cost, System Reliability and Space Savings These are Pb−Free Devices Applications 74 MG G 1 76 MG G UDFN12 CASE 517BD 1 Features/Benefits • $16 kV ESD Protection on Each Channel (IEC61000−4−2 Level 4, UDFN8 CASE 517BC 16 1 XX M G UDFN16 CASE 517BE 78 MG G 1 = Specific Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. L = 17 nH Filter + ESDn Cd = 12 pF Filter + ESDn S21 (dB) • Wireless Handsets • EMI Filtering for LCD and Camera Data Lines • EMI Filtering and Protection for I/O Ports and Keypads Cd = 12 pF See Table 1 for pin description FREQUENCY (Hz) Figure 1. Electrical Schematic © Semiconductor Components Industries, LLC, 2010 September, 2010 − Rev. 0 Figure 2. Typical Insertion Loss Curve 1 Publication Order Number: EMI7204MU/D EMI7204MU, EMI7206MU, EMI7208MU 1 2 3 4 1 2 3 4 5 6 1 2 3 4 5 6 7 8 GND GND GND 8 7 6 5 EMI7204MU 12 1110 9 8 7 EMI7206MU 1615141312 11 10 9 EMI7208MU Figure 3. Pin Diagram (Bottom View) Table 1. FUNCTIONAL PIN DESCRIPTION Filter Device Pins Description EMI7204MU EMI7206MU EMI7208MU Filter 1 1&8 1 & 12 1 & 16 Filter + ESD Channel 1 Filter 2 2&7 2 & 11 2 & 15 Filter + ESD Channel 2 Filter 3 3&6 3 & 10 3 & 14 Filter + ESD Channel 3 Filter 4 4&5 4&9 4 & 13 Filter + ESD Channel 4 Filter 5 5&8 5 & 12 Filter + ESD Channel 5 Filter 6 6&7 6 & 11 Filter + ESD Channel 6 Filter 7 7 & 10 Filter + ESD Channel 7 Filter 8 8&9 Filter + ESD Channel 8 GND Ground Ground Pad GND GND MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter ESD IEC61000−4−2 (Contact Discharge) Symbol Value Unit VPP $16 kV ESD Human Body Model MIL−STD−−883 VPP $16 kV Operating Temperature Range TOP −40 to 85 °C Storage Temperature TSTG −65 to 150 °C TL 260 °C Maximum Lead Temperature for Soldering Purpose (1.8 in from case for 10 seconds) Current per inductor IC 30 mA DC package power rating Pp 500 mW Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (TJ = 25° unless otherwise noted). Parameter Symbol Test Conditions Min Typ Max Unit Maximum reverse Working Voltage VRWM 5.0 V Breakdown Voltage Positive Clamp VBR IR = 1.0 mA 5.6 6.8 9.0 V Breakdown Voltage Negative Clamp VBR IR = 1.0 mA −1.5 −0.08 −0.04 V Leak Current IR VRWM = 3.3 V 0.1 1.0 mA Resistance RA Inductance L Diode Capacitance C1 Line Capacitance Ct 3dB Cut−Off Frequency (Note 1) f3dB VR = 2.5 V, f = 1.0 MHz, 30 mVAC 18.8 10 W 17 nH 12 pF 24.2 28.2 pF Above this frequency, appreciable attenuation occurs 250 MHz 800 MHz to 6.0 GHz 23 dB Stop Band Attenuation 1. 50 W source and 50 W load termination. http://onsemi.com 2 EMI7204MU, EMI7206MU, EMI7208MU Theory of Operation From this it can be seen that a square wave consists of odd order harmonics and to fully construct a square wave n must go to infinity. However, to retain an acceptable portion of the waveform, the first two terms are generally sufficient. These two terms contain about 85% of the signal amplitude and allow a reasonable square wave to be reconstructed. Therefore, to reasonably pass a square wave of frequency x the minimum filter bandwidth necessary is 3x. All ON Semiconductor EMI filters are rated according to this principle. Attempting to violate this principle will result in significant rounding of the waveform and cause problems in transmitting the correct data. For example, take the filter with the response shown in Figure 4 and apply three different data waveforms. To calculate these three different frequencies, the 3 dB, 6 dB, and 9 dB bandwidths will be used. The EMI720X combines ESD protection and EMI filtering conveniently into a small package for today’s size constrained applications. The capacitance inherent to a typical protection diode is utilized to provide the capacitance value necessary to create the desired frequency response based upon the series resistance in the filter. By combining this functionality into one device, a large number of discrete components are integrated into one small package saving valuable board space and reducing BOM count and cost in the application. Application Example The accepted practice for specifying bandwidth in a filter is to use the 3 dB cutoff frequency. Utilizing points such as the 6 dB or 9 dB cutoff frequencies results in signal degradation in an application. This can be illustrated in an application example. A typical application would include EMI filtering of data lines in a camera or display interface. In such an example it is important to first understand the signal and its spectral content. By understanding these things, an appropriate filter can be selected for the desired application. A typical data signal is pattern of 1’s and 0’s transmitted over a line in a form similar to a square wave. The maximum frequency of such a signal would be the pattern 1−0−1−0 such that for a signal with a data rate of 100 Mbps, the maximum frequency component would be 50 MHz. The next item to consider is the spectral content of the signal, which can be understood with the Fourier series approximation of a square wave, shown below in Equations 1 and 2 in the Fourier series approximation. Equation 1: x(t) + a 1 2 1 ) sinǒ(2n * 1) w 0tǓ 2 p n + 1 2n * 1 S ƪ ƫ (eq. 1) Equation 2 (Simplified form of Equation 1): x(t) + 1 ) 2 ǒ Ǔ 2 sin w 0t p ƪ 1 (eq. 2) ) p20 sinǒ3w 0tǓ 3 ) p20 sinǒ5w 0tǓ 5 )AAA ƫ −3 dB MAGNITUDE (dB) −6 dB −9 dB f1 100k 1M 10M f2 f3 100M 1G 10G FREQUENCY (Hz) Figure 4. Filter Bandwidth multiply the result by two). The following table gives the bandwidth values and the corresponding maximum supported frequencies and the third harmonic frequencies. From the above paragraphs it is shown that the maximum supported frequency of a waveform that can be passed through the filter can be found by dividing the bandwidth by a factor of three (to obtain the corresponding data rate http://onsemi.com 3 EMI7204MU, EMI7206MU, EMI7208MU the third harmonic term is significantly attenuated. This serves to round the signal edges and skew the waveform, as is shown in Figure 5b. In the case that a 100 MHz signal is input to this filter, the third harmonic term is attenuated even further and results in even more rounding of the signal edges as is shown in Figure 5c. The result is the degradation of the data being transmitted making the digital data (1’s and 0’s) more difficult to discern. This does not include effects of other components such as interconnect and other path losses which could further serve to degrade the signal integrity. While some filter products may specify the 6 dB or 9 dB bandwidths, actually using these to calculate supported frequencies (and corresponding data rates) results in significant signal degradation. To ensure the best signal integrity possible, it is best to use the 3 dB bandwidth to calculate the achievable data rate. Table 2. FREQUENCY CHART Bandwidth Maximum Supported Frequency Third Harmonic Frequency 3 dB − 100 MHz 33.33 MHz (f1) 100 MHz 6 dB − 200 MHz 66.67 MHz (f2) 200 MHz 9 dB − 300 MHz 100 MHz (f3) 300 MHz Considering that 85% of the amplitude of the square is in the first two terms of the Fourier series approximation most of the signal content is at the fundamental (maximum supported) frequency and the third harmonic frequency. If a signal with a frequency of 33.33 MHz is input to this filter, the first two terms are sufficiently passed such that the signal is only mildly affected, as is shown in Figure 5a. If a signal with a frequency of 66.67 MHz is input to this same filter, Input Waveform Output Waveform a) Frequency = f1 Input Waveform b) Frequency = f2 Input Waveform Output Waveform Output Waveform c) Frequency = f3 Figure 5. Input and Output Waveforms of Filter ORDERING INFORMATION Package Shipping† EMI7204MUTAG UDFN8 (Pb−Free) 3000 / Tape & Reel EMI7206MUTAG UDFN12 (Pb−Free) 3000 / Tape & Reel EMI7208MUTAG UDFN16 (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 EMI7204MU, EMI7206MU, EMI7208MU PACKAGE DIMENSIONS UDFN8, 1.7x1.35, 0.4P CASE 517BC−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X ÉÉÉ ÉÉÉ ÇÇ ÇÇ ÉÉ MOLD CMPD EXPOSED Cu A1 E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A3 DETAIL B ALTERNATE CONSTRUCTIONS 0.10 C TOP VIEW A DETAIL B 0.05 C 8X L L1 DETAIL A 0.05 C NOTE 4 SIDE VIEW DETAIL A 8X L (A3) L A1 C SEATING PLANE ALTERNATE TERMINAL CONSTRUCTIONS MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.70 BSC 1.10 1.30 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 RECOMMENDED SOLDERING FOOTPRINT* D2 1 DIM A A1 A3 b D D2 E E2 e K L L1 E2 1.40 8X 0.40 8X 8 K e e/2 PACKAGE OUTLINE 8X b 0.10 C A B 0.05 C NOTE 3 1.55 BOTTOM VIEW 0.50 8X 0.25 1 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 EMI7204MU, EMI7206MU, EMI7208MU PACKAGE DIMENSIONS UDFN12, 2.5x1.35, 0.4P CASE 517BD−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X ÉÉÉ ÉÉÉ 0.10 C L1 DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW EXPOSED Cu A DETAIL B (A3) 0.05 C 12X A1 0.05 C NOTE 4 12X A1 SIDE VIEW 6 1 C SEATING PLANE ÇÇ ÉÉ ÉÉ MOLD CMPD A3 DETAIL B OPTIONAL CONSTRUCTION DETAIL A D2 L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L 12 7 e E2 BOTTOM VIEW 12X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 2.50 BSC 1.90 2.10 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE K DIM A A1 A3 b D D2 E E2 e K L L1 2.20 12X 0.40 b 0.10 C A B 0.05 C 1.55 NOTE 3 0.50 12X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 EMI7204MU, EMI7206MU, EMI7208MU PACKAGE DIMENSIONS UDFN16, 3.3x1.35, 0.4P CASE 517BE−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X 0.10 C ÉÉÉ ÉÉÉ L1 DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW EXPOSED Cu A DETAIL B 0.05 C (A3) 16X A1 0.05 C NOTE 4 16X A1 SIDE VIEW 8 1 C SEATING PLANE ÇÇ ÉÉ 16 9 e DIM A A1 A3 b D D2 E E2 e K L L1 MOLD CMPD A3 OPTIONAL CONSTRUCTION E2 16X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 3.30 BSC 2.70 2.90 1.35 BSC 0.30 0.50 0.40 BSC 0.15 −−− 0.20 0.30 −−− 0.05 RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DETAIL B DETAIL A D2 L L L 3.00 16X 0.40 b BOTTOM VIEW 1.55 0.10 C A B 0.05 C NOTE 3 0.50 16X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Bluetooth is a registered trademark of Bluetooth SIG. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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