0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
EMI8041BMUTAG

EMI8041BMUTAG

  • 厂商:

    MURATA-PS(村田)

  • 封装:

    UDFN-6

  • 描述:

    EMI804x 是共模过滤器 (CMF) 系列,带集成式 ESD 保护,这是业内首创。差分信号 I/O 现在可以在一个封装中同时拥有共模滤波和 ESD 保护。EMI804x 会根据 IEC61000?...

  • 数据手册
  • 价格&库存
EMI8041BMUTAG 数据手册
Common Mode Filter with ESD Protection > 900 MHz Common Mode Stop Band Attenuation for HDMI Interfaces EMI804x Series www.onsemi.com Functional Description The EMI804x is a family of Common Mode Filters (CMF) with integrated ESD protection, a first in the industry. Differential signaling I/Os can now have both common mode filtering and ESD protection in one package. The EMI804x protects against ESD pulses up to ±15 kV contact per the IEC61000−4−2 standard. The EMI804x is well−suited for protecting systems using high−speed differential ports such as USB 3.0, HDMI 1.3/1.4/2.0; corresponding ports in removable storage and other applications. The EMI804x is available in a RoHS−compliant, XDFN6 for 1 Differential Pair, XDFN10 for 2 Differential Pair and XDFN16 package for 3 Differential Pair. XDFN6 CASE 711AY 1 MARKING DIAGRAMS XX M G • Total Insertion Loss DMLOSS < 2.5 dB at 2.5 GHz • Large Differential Mode Cutoff Frequency f3dB > 5 GHz • High Common Mode Stop Band Attenuation: W2 M G 1 15 dB at 700 MHz, 30 dB at 2.4 GHz • Low Channel Resistance 6.0 W • Provides ESD Protection to IEC61000−4−2 Level 4, ±15 kV Contact • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant XDFN16 CASE 711AZ UDFN6 CASE 517DG Features • XDFN10 CASE 711AX 1 1 1 XXXMG G W3 M G XX = Specific Device Code M = Date Code G = Pb−Free Package ELECTRICAL SCHEMATICS Applications • • • • • USB 3.0 HDMI 1.3/1.4/2.0 MHL 2.0 ESATA Automotive Cameras EMI8042 EMI8043 Figure 1. EMI8041 Electrical Schematic ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2015 August, 2020 − Rev. 0 1 Publication Order Number: EMI8041/D EMI804x Series PIN FUNCTION DESCRIPTION Device Pin Pin Name EMI8041 EMI8042 EMI8043 Type In_1+ 1 1 1 I/O CMF Channel 1+ to Connector (External) In_1− 2 2 2 I/O CMF Channel 1− to Connector (External) Out_1+ 6 10 16 I/O CMF Channel 1+ to ASIC (Internal) Out_1− 5 9 15 I/O CMF Channel 1− to ASIC (Internal) In_2+ NA 4 4 I/O CMF Channel 2+ to Connector (External) In_2− NA 5 5 I/O CMF Channel 2− to Connector (External) Out_2+ NA 7 13 I/O CMF Channel 2+ to ASIC (Internal) Out_2− NA 6 12 I/O CMF Channel 2− to ASIC (Internal) In_3+ NA NA 7 I/O CMF Channel 3+ to Connector (External) In_3− NA NA 8 I/O CMF Channel 3− to Connector (External) Out_3+ NA NA 10 I/O CMF Channel 3+ to ASIC (Internal) Out_3− NA NA 9 I/O CMF Channel 3− to ASIC (Internal) VN 3,4 3, 8 3,6,14,11 GND Description Ground ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Symbol Value Unit Operating Temperature Range TOP −40 to +85 °C Storage Temperature Range TSTG −65 to +150 °C TL 260 °C ILINE 100 mA Parameter Maximum Lead Temperature for Soldering Purposes (1/8” from Case for 10 seconds) DC Current per Line Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com 2 EMI804x Series ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol VRWM Parameter Test Conditions Reverse Working Voltage VBR Breakdown Voltage ILEAK Channel Leakage Current RCH Channel Resistance (Pins 1−6, 2−5) − EMI8041 (Pins 1−10, 2−9, 4−7 and 5−6) − EMI8042 (Pins 1−16, 2−15, 4−13, 5−12, 7−10 and 8−9) − EMI8043 IT = 1 mA; (Note 4) Differential Mode Cut-off Frequency Fatten Common Mode Stop Band Attenuation VESD In-system ESD Withstand Voltage a) Contact discharge per IEC 61000-4-2 standard, Level 4 (External Pins) b) Contact discharge per IEC 61000-4-2 standard, Level 1 (Internal Pins) VCL Typ Max 3.3 4.0 TA = 25°C, VIN = 3.3 V, GND = 0 V Unit V 9.0 V 1.0 mA 6.0 W @ 2.5 GHz 2.5 dB 50 W Source and Load Termination 5.0 GHz @ 700 MHz 15 dB DMLOSS Differential Mode Insertion Loss f3dB Min (Note 3) (Notes 1 and 2) kV ±15 ±2 TLP Clamping Voltage Forward IPP = 8 A Forward IPP = 16 A Forward IPP = −8 A Forward IPP = −16 A 7.26 11.8 −3.5 −6.7 V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Standard IEC61000−4−2 with CDischarge = 150 pF, RDischarge = 330, GND grounded. 2. These measurements performed with no external capacitor. 3. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC or continuous peak operating voltage level. 4. VBR is measured at pulse test current IT. www.onsemi.com 3 EMI804x Series TYPICAL CHARACTERISTICS 0 0 m1 −1 m2 −2 −5 −10 m3 −15 dB (SCC21) dB (SDD21) −3 −4 −5 −6 −20 −25 −30 −7 −35 −8 −40 −9 −45 −50 −10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 FREQUENCY (Hz) FREQUENCY (Hz) Figure 2. Typical Differential Mode Attenuation vs. Frequency Figure 3. Typical Common Mode Attenuation vs. Frequency Interface Data Rate (Gb/s) Fundamental Frequency (GHz) EMI804x Insertion Loss (dB) HDMI 1.3/1.4 3.4 1.7 (m1) m1 = 1.65 USB 3.0 5.0 2.5 (m2) m2 = 2.13 HDMI 2.0 6.0 3.0 (m3) m3 = 2.41 www.onsemi.com 4 EMI804x Series TRANSMISSION LINE PULSE (TLP) MEASUREMENTS Transmission Line Pulse (TLP) provides current versus voltage (I−V) curves in which each data point is obtained from a 100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in Figure 4. TLP I−V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10 s of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 5 where an 8 kV IEC61000−4−2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP curve shows the voltage at which the device turns on as well as how well the device clamps voltage over a range of current levels. Typical TLP I−V curves for the EMI804x are shown in Figure 4. L Attenuator SW 50 W Coax Cable ÷ 50 W Coax Cable IM VM 10 MQ DUT VC Oscilloscope Figure 4. Simplified Schematic of a Typical TLP System 18 −18 16 −16 14 −14 12 −12 10 −10 I (A) I (A) Figure 5. Comparison Between 8 kV IEC61000-4-2 and 8 A and 16 A TLP Waveforms 8 −8 6 −6 4 −4 2 −2 0 0 2 4 6 8 10 Vclamp (V) 12 14 16 0 18 0 −2 −4 −6 Figure 6. Positive and Negative TLP Waveforms www.onsemi.com 5 −8 −10 Vclamp (V) −12 −14 −16 −18 EMI804x Series Pattern Generator (5 Gbps, PRBS31 Pattern) 50 GHz Sampling Oscilloscope ONsemi high speed test board (Rogers 4003 Material, Southwest Microwave 2.4mm Connectors) Figure 7. Eye Diagram Test Setup for 5Gbps Data Rate Figure 8. Eye Diagram 5Gbps with and without EMI804x Eye Height (mVppd) Rise Time (ps) Fall Time (ps) Jrms (ps) Jpp (ps) Reference (No Device)-Left Figure 724 30.4 29.6 1.997 9.6 EMI804x Right Figure 405 60 60.8 3.484 16 ORDERING INFORMATION Marking Package Shipping† EMI8041MUTAG, SZEMI8041MUTAG* WA XDFN6 (Pb−Free) 3000 / Tape & Reel EMI8042MUTAG, SZEMI8042MUTAG* W2 XDFN10 (Pb−Free) 3000 / Tape & Reel EMI8043MUTAG, SZEMI8043MUTAG* W3 XDFN16 (Pb−Free) 3000 / Tape & Reel EMI8041BMUTAG MA UDFN6 (Pb−Free) 3000 / Tape & Reel Orderable Part Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. www.onsemi.com 6 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6 1.6x1.35, 0.5P CASE 517DG ISSUE O 1 SCALE 4:1 PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C ÉÉ ÉÉ E TOP VIEW A 0.10 C 6X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. A B D A1 DETAIL A 0.08 C DIM A A1 b D E e L L2 DETAIL A 1 3 1 3X 3X L2 4 6X b e 0.10 C A B BOTTOM VIEW 0.05 C (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. NOTE 3 RECOMMENDED MOUNTING FOOTPRINT 0.50 PITCH XXXMG G XXX = Specific Device Code M = Date Code G = Pb−Free Package L 6 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.15 0.25 1.60 BSC 1.35 BSC 0.50 BSC 0.35 0.55 0.65 0.85 GENERIC MARKING DIAGRAM* SEATING PLANE C SIDE VIEW DATE 21 SEP 2015 3X 0.86 1.55 3X 1 6X 0.32 0.56 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON05041G UDFN6, 1.6X1.35, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS XDFN10 2.50x1.35, 0.5P CASE 711AX ISSUE A DATE 12 APR 2016 SCALE 4:1 A B D PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C ÇÇÇ ÇÇÇ L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP. L L1 E DETAIL A ALTERNATE CONSTRUCTIONS TOP VIEW DETAIL B ÉÉÉ ÉÉÉ ÇÇÇ EXPOSED Cu A (A3) 0.10 C DIM A A1 A3 b D E e L L1 0.08 C MOLD CMPD DETAIL B A1 SIDE VIEW C SEATING PLANE MILLIMETERS MIN MAX 0.40 0.50 0.00 0.05 0.15 REF 0.15 0.25 2.50 BSC 1.35 BSC 0.50 BSC 0.40 0.60 --0.15 GENERIC MARKING DIAGRAM* ALTERNATE CONSTRUCTION XX M G DETAIL A e 1 5 10X 10 L XX = Specific Device Code M = Date Code G = Pb−Free Package 6 10X BOTTOM VIEW b 0.10 M C A B 0.05 M C NOTE 3 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. RECOMMENDED MOUNTING FOOTPRINT 9X 10X 0.25 0.65 PACKAGE OUTLINE 1.55 1 0.47 0.50 PITCH DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: 98AON90283F XDFN10 2.50X1.35, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS XDFN6 1.50x1.35, 0.5P CASE 711AY ISSUE O SCALE 4:1 A B D PIN 1 REFERENCE 2X ÇÇÇ ÇÇÇ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. L L L1 E 0.10 C 2X DATE 09 SEP 2014 DETAIL A ALTERNATE CONSTRUCTIONS 0.10 C TOP VIEW A DETAIL B 0.10 C 6X DIM A A1 A3 b D E e L L1 L2 L3 ÉÉ ÉÉ ÇÇ EXPOSED Cu (A3) A1 MOLD CMPD DETAIL B 0.08 C C SIDE VIEW ALTERNATE CONSTRUCTION SEATING PLANE GENERIC MARKING DIAGRAM* e DETAIL A 1 3X 3 L 3X L2 XXMG G b XX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) L3 6 4 6X BOTTOM VIEW MILLIMETERS MIN MAX 0.40 0.50 0.00 0.05 0.15 REF 0.15 0.25 1.50 BSC 1.35 BSC 0.50 BSC 0.35 0.55 --0.15 0.65 0.85 0.15 REF 0.10 M C A B 0.05 M C NOTE 3 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. RECOMMENDED MOUNTING FOOTPRINT 0.50 PITCH 3X 0.86 3X 0.56 1.55 1 0.51 5X 0.32 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: 98AON90322F XDFN6 1.50X1.35, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS XDFN16 4.0x1.35, 0.5P CASE 711AZ ISSUE O 16 DATE 09 SEP 2014 1 SCALE 4:1 A B D 2X 0.10 C PIN ONE REFERENCE 2X ÉÉÉÉ ÉÉÉÉ 0.10 C L L L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS ÉÉÉ ÉÉÉ ÇÇÇ TOP VIEW EXPOSED Cu DETAIL B (A3) 0.10 C A MOLD CMPD DETAIL B 16X 0.08 C A1 SIDE VIEW C SEATING PLANE e/2 DETAIL A e 16X 8 1 ALTERNATE CONSTRUCTION NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DIM A A1 A3 b D E e L L1 L2 MILLIMETERS MIN MAX 0.40 0.50 0.00 0.05 0.15 REF 0.15 0.25 4.00 BSC 1.35 BSC 0.50 BSC 0.40 0.60 −−− 0.15 0.20 REF GENERIC MARKING DIAGRAM* XXXM G L 1 L2 16 9 16X XXX = Specific Device Code M = Month Code G = Pb−Free Package b 0.10 C A B 0.05 C BOTTOM VIEW NOTE 3 RECOMMENDED SOLDERING FOOTPRINT* 0.50 PITCH *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 16X 0.65 1.55 1 15X 0.48 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON90324F XDFN16 4.0X1.35, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
EMI8041BMUTAG 价格&库存

很抱歉,暂时无法提供与“EMI8041BMUTAG”相匹配的价格&库存,您可以联系我们找货

免费人工找货