ERB32Q5C2H510GDX1L

A p p l i c at i o n S p e c i f i c Ca pa c i t o rs High Frequency Ceramic Capacitors ERB Product Summary ERB Series: Exhibiting a capacitance range of 0.5 to 1,000pF, the ERB series of capacitors comes with higher Q and lower ESR which is better than the standard products of equivalent packages. For high performance, medium power RF designs, this series offers low ESR in the 1MHz to 1GHz frequency range. The temperature stability of the C0G dielectrics ensures low power dissipation. The ERB series is designed with precious metal inner electrodes. These surface mount capacitors are available in voltages up to 500VDC in a 1210 EIA size. Features: ERB Series Size: 0603, 0805, and 1210  Voltage: 50, 100, 250, 300, 500VDC  Cap Range: 0.5 to 1000pF  Internal Electrode: Pd/Ag  Termination: Pd/Ag + Ni/Sn plating  ESR: Low  Power: Medium Power (5-15W)  Frequency Range: 1MHz –1GHz  Tolerance: Tight Tolerance Available ([W]=+/-0.05pF for 200+10C C: Nominal Capacitance (puff) Appearance: No marking defects Capacitance Change Within ±3% or ±0.3pF (Whichever is larger) C30pFmin.: >Q 350 10pFC30pF: Q > 275+5C/2C High Temperature Load 10pF: Q > 200+10C    C: Nominal Capacitance (pF) Table A-1 Char. Nominal Values (ppm/°C) Note 5C 0 ± 30 Max . – 55C 0.58 Apply 200% (500V only 150%) of the rated voltage for 1000±12 hours at the maximum operating temperature ±3°C. Capacitance Change from 25°C（%） −30C Max. Min. Min. -0.24 0.4C -0.17 Max. 0.25 —10C Min. -0.11 ERB Series Note: Nominal values denote the temperature coefficient within a range of 25°C to 125°C. C-29-C  w w w . m u r a t a . c o m  Innovator in Electronics – 53 A p p l i c at i o n S p e c i f i c Ca pa c i t o rs High CERAMIC Frequency Ceramic Capacitors Technical Data (Typical) HIQ CAPACITOR ERB Technical Data (Typical) High Frequency Type ERB Series Capacitance - Temperature Characteristics C0G Characteristics (ERB) 2.0 CAPACITANCE CHANGE (%) 1.5 1.0 0.5 Spec. (upper) 0.0 Spec. (lower) -0.5 -1.0 -1.5 -75 -50 -25 0 25 50 75 100 125 150 TEMPERATURE (°C) Self Resonant Frequency - Capacitance Resonant Frequency Characteristics ERB Series Measurement Equipment HP8753D 10G RESONANT FREQUENCY (Hz) ERB Series -2.0 1G 100M 1 10 100 CAPACITANCE (pF) 54 – Innovator in Electronics  w w w . m u r a t a . c o m  C-29-C 9 A p p l i c at i o n S p e c i f i c Ca pa c i t o rs High Frequency Ceramic Capacitors CERAMIC HIQ CAPACITOR Technical Data (Typical) ERB Technical Data (Typical) ERB ESR-FrequencyCharacteristics ESR - Frequency Characteristics ERB18 Series 10 1pF 10pF Measurement Equipment Boontoon Resonant Coaxial Line 34A 100pF ESR (ohm) 1 0 .1 0 .0 1 100M 1 01 00 0G0 M 1 0 010GM F R E Q U E N C Y (H z ) ERB21 Series ERB Series 10 1pF 10pF 100pF ESR (ohm) 1 0 .1 0 .0 1 100M 1 01 00 0G0 M 10 GM 100 F R E Q U E N C Y (H z ) ERB32 Series 10 3 .3 p F 10pF 100pF ESR (ohm) 1 0 .1 0 .0 1 100M 1 0 010GM 1 01 00 0G0 M F R E Q U E N C Y (H z ) C-29-C  w w w . m u r a t a . c o m  Innovator in Electronics – 55 A p p l i c at i o n S p e c i f i c Ca pa c i t o rs High Frequency Ceramic Capacitors ERB Technical Data (Typical) CERAMIC HIQ CAPACITOR Technical Data (Typical) QQ- -Frequency FrequencyCharacteristics Characteristics ERB18 Series 10000 Measurement Equipment Boonton Resonant Coaxial-Line 34A 1pF 10pF 100pF 1000 Q 100 10 1 100M 1G 10G FREQUENCY (Hz) ERB21 Series 1pF 10pF 100pF 1000 Q 100 10 1 100M 1G 10G FREQUENCY (Hz) ERB32 Series 10000 3.3pF 10pF 100pF 1000 Q ERB Series 10000 100 10 1 100M 1G 10G FREQUENCY (Hz) 56 – Innovator in Electronics  w w w . m u r a t a . c o m  C-29-C A p p l i c at i o n S p e c i f i c Ca pa c i t o rs High Frequency Ceramic Capacitors CERAMIC HIQ CAPACITOR Technical Data (Typical) ERB Technical Data (Typical) ERB Temperature Rise-CurrentCharacteristics Temperature Rise - Current Characteristics ERB18 Series (1GHz) 60 50 TEMP. RISE (°C) 40 2.4pF 10pF 82pF 30 20 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 ERB Series 10 0.8 CURRENT (Arms) ERB21Series Series (1GHz) ERB21 (1GHz) 60 50 Temp.RISE Rise ((°C) ) TEMP. 40 2.4pF 10pF 82pF 30 20 10 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 CURRENT (Arms) CURRENT (Arms) 12 C-29-C  w w w . m u r a t a . c o m  Innovator in Electronics – 57 A p p l i c at i o n S p e c i f i c Ca pa c i t o rs High Frequency Ceramic Capacitors PDF catalog is downloaded from!CAUTION the website (for of Murata Manufacturing co., ltd. Therefore, itís specifications areinsubject to change or oursmoking productsand/or in it may be discontinued without advance notice. Please check with our • Please read rating and storage, operating, rating, soldering, mounting and handling) this catalog to prevent burning, etc. !Note ï This !Note C02E.pdf 07.2.6 sales representatives or product engineers before ordering. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. ERB Soldering and Mounting !Caution ■ !Caution (Soldering and Mounting) 1. Mounting Position Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. Component Direction Locate chip horizontal to the direction in which stress acts Chip Mounting Close to Board Separation Point Perforation C Chip arrangement Worst A-C-(B~D) Best B D A Slit 2. Chip Placing ERB Series An excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting, causing cracked chips. So adjust the suction nozzle's bottom dead point by correcting warp in the board. Normally, the suction nozzle's bottom dead point must be set on the upper surface of the board. Nozzle pressure for chip mounting must be a 1 to 3N static load. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving smoothly. This imposes great force on the chip during mounting, causing cracked chips. And the locating claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained, checked and replaced periodically. Incorrect Suction Nozzle Deflection Board Correct Board Guide 13 Support Pin Continued on the following page. 83 58 – Innovator in Electronics  w w w . m u r a t a . c o m  C-29-C A p p l i c at i o n S p e c i f i c Ca pa c i t o rs High Frequency Ceramic Capacitors is downloaded from the website (for of Murata Manufacturing co., ltd. Therefore, it’s specifications areinsubject to change or oursmoking productsand/or in it may be discontinued without advance notice. Please check with our • Please read rating and CAUTION storage, operating, rating, soldering, mounting and handling) this catalog to prevent burning, etc. Note • This PDF Notecatalog C02E.pdf 07.2.6 sales representatives or product engineers before ordering. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. • This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. ERBCaution Soldering and Mounting Continued from the preceding page. 3. Reflow Soldering When sudden heat is applied to the components, the mechanical strength of the components should go down because remarkable temperature change causes deformity inside components. In order to prevent mechanical damage in the components, preheating should be required for both of the components and the PCB board. Preheating conditions are shown in Table 1. It is required to keep temperature differential between the soldering and the components surface ($T) as small as possible. Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin melting point is used. Please confirm the solderability of Tin plating termination chip before use. When components are immersed in solvent after mounting, be sure to maintain the temperature difference ($T) between the component and solvent within the range shown in the Table 1. Standard Conditions for Reflow Soldering Infrared Reflow Temperature (%) Gradual Cooling 200oC 170oC 150oC 130oC $T Preheating 60-120 seconds 30-60 seconds Time Vapor Reflow Temperature (%) Soldering Peak Temperature Temperature Differential Gradual Cooling $T Preheating GRM02/03/15/18/21/31 GJM03/15 ERB18/21 LLL15/18/21/31 $T-190% 60-120 seconds ERB18/21 Time 20 seconds max. GQM18/21 GRM32/43/55 Allowable Soldering Temperature and Time 13 ERB32 LLM21/31 Soldering Temperature (%) LLA18/21/31 $T-130% GNM ERB32 Recommended Conditions Pb-Sn Solder Infrared Reflow Vapor Reflow Lead Free Solder Peak Temperature 230-250oC 230-240oC 240-260oC Atmosphere Air Air Air or N2 280 270 260 250 240 230 220 0 30 60 90 120 Soldering Time (sec.) In case of repeated soldering, the accumulated soldering time must be within the range shown above. Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu 4. Optimum Solder Amount for Reflow Soldering Overly thick application of solder paste results in excessive fillet height solder. This makes the chip more susceptible to mechanical and thermal stress on the board and may cause cracked chips. Too little solder paste results in a lack of adhesive strength on the outer electrode, which may result in chips breaking loose from the PCB. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm min. Optimum Solder Amount for Reflow Soldering 0.2mm min. Inverting the PCB Make sure not to impose an abnormal mechanical shock on the PCB. Continued on the following page. 84 C-29-C  w w w . m u r a t a . c o m  Innovator in Electronics – 59 ERB Series 170oC 150oC 130oC Table 1 Part Number Soldering Peak Temperature Continued from the preceding page. 4. Leaded A p p lComponent i c atInsertion i o n S p e c i f i c Ca pa c i t o rs If the PCB is flexed when leaded components (such as High Frequency Ceramic Capacitors transformers and ICs) are being mounted, chips may crack and solder joints may break. Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping. ERB Soldering and Mounting 5. Flow Soldering When sudden heat is applied to the components, the mechanical strength of the components should go down because remarkable temperature change causes deformity inside components. And an excessively long soldering time or high soldering temperature results in leaching of the outer electrodes, causing poor adhesion or a reduction in capacitance value due to loss of contact between electrodes and end termination. In order to prevent mechanical damage in the components, preheating shoud be required for the both components and the PCB board. Preheating conditions are shown in Table 2. It is required to keep temperature differential between the soldering and the components surface ($T) as small as possible. When components are immersed in solvent after mounting, be sure to maintain the temperature difference between the component and solvent within the range shown in Table 2. Do not apply flow soldering to chips not listed in Table 2. Standard Conditions for Flow Soldering Temperature (%) Preheating 60-120 seconds Time 5 seconds max. Soldering Temperature (%) Allowable Soldering Temperature and Time 280 270 260 250 240 230 220 0 10 20 ERB Series GRM18/21/31 13 30 40 Soldering Time (sec.) Temperature Differential LLL21/31 ERB18/21 ERB18/21 Gradual Cooling $T 170oC 150oC 130oC Table 2 Part Number Soldering Peak Temperature In case of repeated soldering, the accumulated soldering time must be within the range shown above. $T-150% GQM18/21 Recommended Conditions Pb-Sn Solder Lead Free Solder Peak Temperature 240-250oC 250-260oC Atmosphere Air N2 Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu Optimum Solder Amount for Flow Soldering The top of the solder fillet should be lower than the thickness of components. If the solder amount is excessively big, the risk of cracking is higher during board bending or under any other stressful conditions. Up to Chip Thickness Adhesive Continued on the following page. 85 60 – Innovator in Electronics  w w w . m u r a t a . c o m  C-29-C A p p l i c at i o n S p e c i f i c Ca pa c i t o rs High Frequency Ceramic Capacitors PDF catalog is downloaded from!CAUTION the website (for of Murata Manufacturing co., ltd. Therefore, itís specifications areinsubject to change or oursmoking productsand/or in it may be discontinued without advance notice. Please check with our • Please read rating and storage, operating, rating, soldering, mounting and handling) this catalog to prevent burning, etc. !Note ï This !Note C02E.pdf 07.2.6 sales representatives or product engineers before ordering. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. ERB Soldering and Mounting !Caution PDF catalog is downloaded from!CAUTION the website (for of Murata Manufacturing co., ltd. Therefore, itís specifications areinsubject to change or oursmoking productsand/or in it may be discontinued without advance notice. Please check with our • Please read rating and storage, operating, rating, soldering, mounting and handling) this catalog to prevent burning, etc. !Note ï This !Note C02E.pdf 07.2.6 sales representatives or product engineers before ordering. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. Continued from the preceding page. 6.!Caution Correction with a Soldering Iron (1) For Chip Type Capacitors When sudden heat is applied to the components by 6. soldering Correction with Soldering Iron of the iron, the a mechanical strength (1)components For Chip Type Capacitors should go down because remarkable When suddenchange heat iscauses applieddeformity to the components by temperature inside components. soldering the mechanical In order toiron, prevent mechanical strength damage of in the the components go down because remarkable components,should preheating should be required for both of temperature change inside components. the components and causes the PCBdeformity board. Preheating In order to are prevent mechanical damage in the to keep conditions shown in Table 3. It is required components, preheatingbetween should be forand boththe of temperature differential therequired soldering the components and (∆T) the PCB board. components surface as small asPreheating possible. After conditions shown in Table 2. Ititisdown required to keep soldering, itare is not allowed to cool rapidly. temperature differential between the soldering and the components surface (∆T) as small as possible. After soldering, it is not allowed to cool it down rapidly. Table 3 Part Number Temperature Differential Peak Temperature Atmosphere Temperature Differential ∆TV190D Peak 300°C max. 3Temperature seconds max. / termination Atmosphere Air Table 2 GRM15/18/21/31 GJM15 Part Number ERB18/21 LLL15/18/21/31 GRM15/18/21/31 GQM18/21 GJM15 ERB18/21 LLL15/18/21/31 GRM32/43/55 ∆TV190D GQM18/21 GNM ERB18/21 ERB32 LLA18/21/31 ∆TV130D GRM32/43/55 LLM21/31 300°C max. 3 seconds max. / termination 270°C max. 3 seconds max. / termination Air Air GNM ERB32 270°C max. LLA18/21/31 ∆TV130D 3 seconds max. *Applicable for both Pb-Sn and Lead Free Solder. / termination Pb-Sn Solder: Sn-37Pb LLM21/31 Air Lead Free Solder: Sn-3.0Ag-0.5Cu ERB32 13 Up to Chip Thickness Up to Chip Thickness RESULT, WORST CASE, IN A SHORT CIRCUIT AND FUMING WHEN THE PRODUCT IS USED. FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY RESULT, WORST CASE, IN A SHORT CIRCUIT AND FUMING WHEN THE PRODUCT IS USED. 86 C-29-C 86  w w w . m u r a t a . c o m  Innovator in Electronics – 61 ERB Series 13 *Applicable for both Pb-Sn and Lead Free Solder. Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu Optimum Solder Amount when Corrections Are Made Using a Soldering lron The top of the solder fillet should be lower than the Optimum Amount when AreisMade thickness Solder of components. If theCorrections solder amount Using a Soldering lron excessively big, the risk of cracking is higher during The top of the solder fillet should lower than the board bending or under any otherbe stressful conditions. thickness components. If the solder is Soldering of iron ø3mm or smaller shouldamount be required. And excessively big,tothe riska of cracking is higher during it is necessary keep distance between the soldering board bending or under any otherdirect stressful conditions. iron and the components without touch. Thread Soldering ø3mmororsmaller smallerisshould be for required. And required soldering. solder withiron ø0.5mm it is necessary to keep a distance between the soldering iron and the components without direct touch. Thread with ø0.5mm or smaller is required for soldering. 7. solder Washing Excessive output of ultrasonic oscillation during cleaning causes PCBs to resonate, resulting in cracked chips or 7. broken Washing solder. Take note not to vibrate PCBs. Excessive output of ultrasonic oscillation during cleaning causes PCBs to resonate, resulting in cracked chips or broken TO solder. Take note to vibrate PCBs. MAY FAILURE FOLLOW THEnot ABOVE CAUTIONS A p p l i c at i o n S p e c i f i c Ca pa c i t o rs High Frequency Ceramic Capacitors DESIGN ENGINEERING ERB Design EngineeringKITS Kits CERAMIC CHIP CAPACITORS ASCAP Hi-Frequency N Miniature sizes & stable C0G temperature coefficient N Very high Q at high frequencies N 0603, 0805 and 1210 sizes N Low Power Consumption for Mobile Telecommunication N Base Station, Terminal applications, Wireless equipment and High frequency radio N Miniature sizes & stable C0G temperature coefficient N Very high Q at high frequencies N 0603, 0805 and 1210 sizes N Low Power Consumption for Mobile Telecommunication N Base Station, Terminal applications, Wireless equipment and High frequency radio ERB18-HIQ0603KIT-E 0603 - (250 VDC) ERB21-HIQ0805KIT-E 0805 - (250VDC) ERB Series No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Description 0603/COG/1.0pF/250V 0603/COG/1.1pF/250V 0603/COG/1.2pF/250V 0603/COG/1.3pF/250V 0603/COG/1.5pF/250V 0603/COG/1.6pF/250V 0603/COG/1.8pF/250V 0603/COG/2.0pF/250V 0603/COG/2.4pF/250V 0603/COG/2.7pF/250V 0603/COG/3.0pF/250V 0603/COG/3.3pF/250V 0603/COG/3.6pF/250V 0603/COG/3.9pF/250V 0603/COG/4.3pF/250V 0603/COG/4.7pF/250V 0603/COG/5.1pF/250V 0603/COG/5.6pF/250V 0603/COG/6.2pF/250V 0603/COG/6.8pF/250V 0603/COG/7.5pF/250V 0603/COG/8.2pF/250V 0603/COG/9.1pF/250V 0603/COG/10pF/250V 0603/COG/12pF/250V 0603/COG/15pF/250V 0603/COG/18pF/250V 0603/COG/22pF/250V 0603/COG/27pF/250V 0603/COG/33pF/250V 0603/COG/39pF/250V 0603/COG/47pF/250V 0603/COG/56pF/250V 0603/COG/68pF/250V 0603/COG/82pF/250V 0603/COG/100pF/250V 62 – Innovator in Electronics Murata Global P/N ERB1885C2E1R0BDX1 ERB1885C2E1R1BDX1 ERB1885C2E1R2BDX1 ERB1885C2E1R3BDX1 ERB1885C2E1R5BDX1 ERB1885C2E1R6BDX1 ERB1885C2E1R8BDX1 ERB1885C2E2R0BDX1 ERB1885C2E2R4BDX1 ERB1885C2E2R7BDX1 ERB1885C2E3R0CDX1 ERB1885C2E3R3CDX1 ERB1885C2E3R6CDX1 ERB1885C2E3R9CDX1 ERB1885C2E4R3CDX1 ERB1885C2E4R7CDX1 ERB1885C2E5R1CDX1 ERB1885C2E5R6CDX1 ERB1885C2E6R2CDX1 ERB1885C2E6R8CDX1 ERB1885C2E7R5CDX5 ERB1885C2E8R2CDX5 ERB1885C2E9R1CDX5 ERB1885C2E100JDX5 ERB1885C2E120JDX5 ERB1885C2E150JDX5 ERB1885C2E180JDX5 ERB1885C2E220JDX5 ERB1885C2E270JDX5 ERB 1885C2E330JDX5 ERB1885C2E390JDX5 ERB1885C2E470JDX5 ERB1885C2E560JDX5 ERB1885C2E680JDX5 ERB1885C2E820JDX5 ERB1885C2E101JDX5  w w Qty. 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 w No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Description 0805/COG/1.2pF/250V 0805/COG/1.5pF/250V 0805/COG/1.8pF/250V 0805/COG/2.2pF/250V 0805/COG/2.7pF/250V 0805/COG/3.3pF/250V 0805/COG/3.9pF/250V 0805/COG/4.7pF/250V 0805/COG/5.6pF/250V 0805/COG/6.8pF/250V 0805/COG/8.2pF/250V 0805/COG/10pF/250V 0805/COG/12pF/250V 0805/COG/15pF/250V 0805/COG/18pF/250V 0805/COG/22pF/250V 0805/COG/27pF/250V 0805/COG/33pF/250V 0805/COG/39pF/250V 0805/COG/47pF/250V 0805/COG/56pF/250V 0805/COG/68pF/250V 0805/COG/82pF/250V 0805/COG/100pF/250V Murata Global P/N ERB21 B5C2E1R2CDX1 ERB21 B5C2E1R5CDX1 ERB21 B5C2E1R8CDX1 ERB21B5C2E2R2CDX1 ERB21B5C2E2R7CDX1 ERB21B5C2E3R3CDX1 ERB21B5C2E3R9CDX1 ERB21B5C2E4R7CDX1 ERB21B5C2E5R6DDX1 ERB21B5C2E6R8DDX1 ERB82185C2E8R2DDX1 ERB21B5C2E100JDX1 ERB21B5C2E120JDX1 ERB21B5C2E150JDX1 ERB21B5C2E180JDX1 ERB21B5C2E220JDX1 ERB21B5C2E270JDX1 ERB21B5C2E330JDX1 ERB21B5C2E390JDX1 ERB21B5C2E470JDX1 ERB21B5C2E560JDX1 ERB21B5C2E680JDX1 ERB21B5C2E820JDX1 ERB21B5C2E101JDX1 Qty. 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 ERB32-HIQ1210KIT-E 1210 - (500VDC) No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 . m u Description 1210/C0G/3.3pF/500V 1210/C0G/3.9pF/500V 1210/C0G/4.7pF/500V 1210/C0G/5.6pF/500V 1210/C0G/6.8pF/500V 1210/C0G/8.2pF/500V 1210/C0G/10pF/500V 1210/C0G/12pF/500V 1210/C0G/15pF/500V 1210/C0G/18pF/500V 1210/C0G/22pF/500V 1210/C0G/27pF/500V 1210/C0G/33pF/500V 1210/C0G/39pF/500V 1210/C0G/47pF/500V 1210/C0G/56pF/500V 1210/C0G/68pF/500V 1210/C0G/82pF/500V 1210/C0G/100pF/500V r a t a . c Murata Global P/N ERB32Q5C2H3R3CDX1 ERB32Q5C2H3R9CDX1 ERB32Q5C2H4R7CDX1 ERB32Q5C2H5R6DDX1 ERB32Q5C2H6R8DDX1 ERB32Q5C2H8R2DDX1 ERB32Q5C2H100JDX1 ERB32Q5C2H120JDX1 ERB32Q5C2H150JDX1 ERB32Q5C2H180JDX1 ERB32Q5C2H220JDX1 ERB32Q5C2H270JDX1 ERB32Q5C2H330JDX1 ERB32Q5C2H390JDX1 ERB32Q5C2H470JDX1 ERB32Q5C2H560JDX1 ERB32Q5C2H680JDX1 ERB32Q5C2H820JDX1 ERB32Q5C2H101JDX1 o m  Qty. 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 C-29-C A p p l i c at i o n S p e c i f i c Ca pa c i t o rs High Frequency Ceramic Capacitors ERB Series ERB Notes C-29-C  w w w . m u r a t a . c o m  Innovator in Electronics – 63