TG-ETRX35X-LRS-PM-015109
Product Manual 1.09
Telegesis™
ETRX351-LRS and ETRX357-LRS
PRODUCT MANUAL
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ETRX35x-LRS ZIGBEE MODULES
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Telegesis™ is a trademark of Silicon Laboratories Inc.
©2019 Silicon Labs
ETRX35x-LRS Product Manual
ETRX351-LRS and ETRX357-LRS
Table of Contents
1
INTRODUCTION ......................................................................................................................5
2
Hardware Description ....................................................................................................... 5
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1.1
PRODUCT APPROVALS ........................................................................................................ 6
FCC Approvals ................................................................................................................. 6
IC (Industry Canada) Approvals........................................................................................ 7
European Certification ...................................................................................................... 8
ICASA Approvals ............................................................................................................. 8
Australia and New Zealand (C-Tick) ................................................................................. 8
Brazil ................................................................................................................................ 9
Declarations of Conformity ............................................................................................... 9
IEEE 802.15.4 .................................................................................................................. 9
The Zigbee Protocol ....................................................................................................... 10
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2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3
MODULE PINOUT .................................................................................................................11
4
HARDWARE DESCRIPTION ............................................................................................ 13
4.1
FIRMWARE DESCRIPTION.............................................................................................. 14
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Hardware Interface ......................................................................................................... 13
Token Settings ............................................................................................................... 15
Custom Firmware ........................................................................................................... 15
Boost Mode vs. Normal Mode ............................................................................................15
Software Interface .......................................................................................................... 16
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5.1
5.2
5.3
5.4
6
ABSOLUTE MAXIMUM RATINGS .................................................................................... 17
7
RECOMMENDED OPERATING CONDITIONS .................................................................... 17
8
DC ELECTRICAL CHARACTERISTICS ........................................................................... 18
9
DIGITAL I/O SPECIFICATIONS ........................................................................................ 19
10 A/D CONVERTER CHARACTERISTICS .......................................................................... 20
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11 AC ELECTRICAL CHARACTERISTICS ........................................................................... 20
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11.1 TX Power Characteristics ...................................................................................................22
11.2 Power Settings for Regulatory Compliance ..................................................................... 23
11.3 Temperature behaviour .................................................................................................. 24
12 PHYSICAL DIMENSIONS ................................................................................................. 25
SOLDERING TEMPERATURE TIME PROFILE (FOR REFLOW SOLDERING) ................27
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14 PRODUCT LABEL DRAWING .......................................................................................... 28
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15 RECOMMENDED FOOTPRINT ........................................................................................ 29
15.1 Recommended Placement ............................................................................................. 30
15.2 Example carrier board .................................................................................................... 32
16 RELIABILITY TESTS.............................................................................................................33
17 APPLICATION NOTES .........................................................................................................33
17.1 Safety Precautions ......................................................................................................... 33
17.2 Design Engineering Notes ..................................................................................................33
17.3 Storage Conditions ......................................................................................................... 34
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
PACKAGING..........................................................................................................................35
18.1
18.2
18.3
18.4
18.5
Embossed Tape ............................................................................................................. 35
Component Orientation .................................................................................................. 36
Reel Dimensions ............................................................................................................ 36
Packaging - bag ..................................................................................................................37
Packaging – carton......................................................................................................... 37
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18
ORDERING INFORMATION ............................................................................................. 38
20
ROHS DECLARATION ..........................................................................................................39
21
DATA SHEET STATUS .................................................................................................... 39
22
RELATED DOCUMENTS .................................................................................................. 39
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©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
The Telegesis ETRX351-LRS and ETRX357-LRS modules are
low power 2.4GHz Zigbee modules with an added frontend
module (SiGe SE2432L) containing both PA and LNA for highest
possible link budget.
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Based on the latest Ember EM351 and EM357 single chip
Zigbee solution the new long range modules are footprint
compatible with the ETRX351 and ETRX357, thus representing
a drop-in replacement for all applications where a high link
budget is required.
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Suggested Applications
Small form factor, SMT module 25mm x 19mm
Side Castellations for easy soldering and inspection
2 antenna options: Integrated chip antenna or U.FL
coaxial connector
Industry’s first ARM® Cortex-M3 based family of Zigbee
modules
Industry standard JTAG Programming and real time
network level debugging via the Ember InSight Port
192kB (ETRX357-LRS) and 128kB (ETRX351-LRS)
flash and 12kbytes of RAM
Lowest Deep Sleep Current of sub 1µA and multiple
sleep modes
Ultra Wide supply voltage range (2.1 to 3.6V)
32.768kHz watch crystal can be added externally
Module ships with standard Telegesis AT-style command
interface based on the Zigbee PRO feature set
Can act as an End Device, Router or Coordinator
22 general-purpose I/O lines including analogue inputs
Firmware upgrades via serial port or over the air
(password protected)
Hardware supported encryption (AES-128)
CE and FCC compliance, FCC modular approval
Operating temperature range: -40°C to +85°C
Standard version without LNA and PA available in the
same form factor
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AMR – Zigbee Smart Energy applications
Wireless Alarms and Security
Home/Building Automation
Wireless Sensor Networks
M2M Industrial Controls
Lighting and ventilation control
Remote monitoring
Environmental monitoring and control
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Module Features
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Image not shown actual size; enlarged to show detail.
The module’s unique AT-style command line interface allows
designers to quickly integrate Zigbee technology without
complex software engineering. For custom application
development the ETRX35x series integrates with ease into
Ember’s InSight development environment.
Development Kit
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New Development kit containing everything required to
set up a mesh network quickly and evaluate range and
performance of the ETRX35x and its long range
version.
AT-style software interface command dictionary can be
modified for high volume customers.
Custom software development available upon request.
Example AT-Style Commands
AT+BCAST
AT+UCAST:
AT+EN
AT+JN
Send a Broadcast
Send a Unicast
Establish PAN network
Join PAN
At power-up the last configuration is loaded from nonvolatile S-Registers, which can eliminate the need for an
additional host controller.
Radio Features
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• Based on the Ember EM351 and EM357 single chip
Zigbee / IEEE802.15.4 solutions
• 2.4GHz ISM Band
• 250kbit/s over the air data rate – NB: actual usable data
throughput with Zigbee is about 20kbps
• 15 channels (IEEE802.15.4 Channel 11 to 25)
• SiGe SE2432L integrated PA and LNA
• +20dBm output power (adjustable down to -41dBm)
• High sensitivity of -106dBm typ. @ 1% packet error rate
• RX Current: 33mA, TX Current: approx 140mA at 20dBm
• Robust Wi-Fi and Bluetooth coexistence
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
1 Introduction
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This document describes the Telegesis ETRX351-LRS and ETRX357-LRS Zigbee long range
modules which have been designed to be easily integrated into another device and to provide a fast,
simple and low cost wireless mesh networking interface.
The Telegesis ETRX3 series modules are based on the Ember Zigbee platform consisting of the
single chip EM351 or EM357 combined with the Zigbee PRO compliant EmberZNet meshing stack.
Integration into a wide range of applications is made easy using a simple AT style command interface
and advanced hardware design.
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The configurable functionality of the Telegesis AT Commandset often allows the ETRX3 series
Zigbee modules to be used without an additional host microcontroller saving even more integration
time and costs. In addition to the Telegesis AT Commandset, the ETRX351-LRS and ETRX357LRS modules can be used with custom-built firmware and they represent an ideal platform for custom
firmware development in conjunction with the Ember development kits. The ETRX3 series shares
the same R3xx Telegesis firmware as the ETRX2 and the two devices can be used in the same
network.
Hardware Description
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1.1
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No RF experience or expertise is required to add this powerful wireless networking capability to your
products. The ETRX351-LRS and ETRX357-LRS offer fast integration opportunities and the
shortest possible time to market for your product.
The main building blocks of the ETRX351-LRS and ETRX357-LRS are the single chip EM351 and
EM357 from Ember, a SiGe SE2432L frontend module combining a Power Amplifier with a Low
Noise Amplifier, a 24MHz reference crystal and RF front-end circuitry optimized for best RF
performance. The modules are available with on-board antenna or alternatively a U.FL connector
for attaching external antennae. Modules with the U.FL connector are identified by the “HR” suffix.
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The LNA and RF power amplifier of the LRS devices improve the output power by 12dB and the
sensitivity by 5dB which will increase the range by approximately 700% relative to the standard
devices (where local regulations permit the use of the maximum output power).
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The integrated antenna is an Antenova Rufa, and details of the radiation pattern etc are available
from the Antenova website [5].
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Module
ETRX351-LRS
ETRX351HR-LRS
ETRX357-LRS
ETRX357HR-LRS
Chip
EM351
EM351
EM357
EM357
Flash
128kB
128kB
192kB
192kB
RAM
12kB
12kB
12kB
12kB
Table 1: Memories
The ETRX351-LRS and ETRX357-LRS are used for Zigbee (www.zigbee.org) applications. If you
wish to create your own custom firmware, and not use the pre-loaded Telegesis AT-Command
interface, you will need the InSight toolchain, consisting of InSight Desktop™ together with a
comprehensive integrated development environment (IDE) and C-language compiler toolchain from
Ember. The Ember development environment is not suitable for an 802.15.4-only application that
does not use the Zigbee layer.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
2 Product Approvals
2.1
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The ETRX351-LRS and ETRX357-LRS as well as the ETRX351HR-LRS and ETRX357HR-LRS
have been designed to meet all national regulations for world-wide use. In particular the following
certifications have been obtained:
FCC Approvals
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The Telegesis ETRX351-LRS and ETRX357-LRS with integrated Antenna as well as the
ETRX351HR-LRS and the ETRX357HR-LRS including the antennae listed in Table 2 comply with
FCC CFR Part 15 (USA). The devices meet the requirements for modular transmitter approval as
detailed in the FCC public notice DA00.1407.transmitter. The maximum permitted power settings
are detailed in section 11.2 of this document.
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This device complies with Part 15 of the FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
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FCC ID: S4GEM35XB
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This module complies with the USA SAR requirements and is not intended to be operated within
20cm of the body. The following statement must be included as a CAUTION statement in manuals
for OEM products to alert users on FCC RF exposure compliance
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Part No.
BKR2400
BT-Stubby
(Straight)
BT-Stubby
(right-angle)
Rufa
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“WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a
separation distance of 20cm or more should be maintained between the antenna of this
device and persons during operation. To ensure compliance, operations at closer
distances than this are not recommended.”
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Manufacturer
Embedded Antenna Design Ltd.
Type
½ Wave
Impedance Gain
50Ω
2 dBi
50Ω
0 dBi
Embedded Antenna Design Ltd.
¼ Wave
Embedded Antenna Design Ltd.
¼ Wave
50Ω
Antenova
Chip
50Ω
0 dBi
2.1dBi
(peak)
Table 2. Approved Antennae
An end user deploying an ETRX35x-LRS or an ETRX35xHR-LRS module together with an antenna
as listed in Table 2 is not required to obtain a new authorization for the module – BUT this does not
preclude the possibility that some other form of authorization or testing may be required for the end
product depending upon local territorial regulations.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
The FCC requires the user to be notified that any changes or modifications made to this device that
are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the
equipment.
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When using the ETRX351HR-LRS and ETRX357HR-LRS with approved antennae, it is required to
prevent end-users from replacing them with non-approved ones. FCC Labelling Requirements
2.2
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When integrating the ETRX351-LRS, ETRX357-LRS, ETRX351HR-LRS and ETRX357HR-LRS into
a product if must be ensured that the FCC labelling requirements are met. This includes a clearly
visible label on the outside of the finished product specifying the Telegesis FCC identifier (FCC ID:
S4GEM35XB) as well as the notice above. This exterior label can use wording such as “Contains
Transmitter Module FCC ID: S4GEM35XB” or “Contains FCC ID: S4GEM35XB” although any
similar wording that expresses the same meaning may be used.
IC (Industry Canada) Approvals
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The Telegesis ETRX351-LRS, ETRX357-LRS, ETRX351HR-LRS and ETRX357HR-LRS modules
have been approved by Industry Canada to operate with the antenna types listed in Table 2 with
the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for
that type, are strictly prohibited for use with this device. The maximum permitted output power is
57mW (17.6dBm).
IC-ID: 8735A-EM35XB
• This device complies with Industry Canada license-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired
operation of the device.
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• Under Industry Canada regulations, this radio transmitter may only operate using an antenna
of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To
reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that
permitted for successful communication.
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• To comply with Industry Canada RF radiation exposure limits for general population, the
antenna(s) used for this transmitter must be installed such that a minimum separation
distance of 20cm is maintained between the radiator (antenna) and all persons at all times
and must not be co-located or operating in conjunction with any other antenna or transmitter.
• This device has been designed to operate with the antennas listed in Table 2, and having a
maximum gain of 2.0 dBi. Antennas not included in this list or having a gain greater than 2.0
dBi are strictly prohibited for use with this device. The required antenna impedance is 50
ohms.
The labelling requirements for Industry Canada are similar to those of the FCC. Again a clearly
visible label must be placed on the outside of the finished product stating something like “Contains
Transmitter Module, IC: 8735A-EM35XB”, although any similar wording that expresses the same
meaning may be used.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
2.3
European Certification
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The integrator is responsible for final product compliance with IC ICES-003 and FCC Part 15, Sub.
B – Unintentional Radiators.
The ETRX351-LRS, ETRX357-LRS, ETRX351HR-LRS and ETRX357HR-LRS modules are in
conformity with the essential requirements and other relevant requirements of the Radio Equipment
Directive (RED) (2014/53/EU). These include
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Safety:
EN 300 328 v2.1.1
EN 301 489-17 v3.1.1
EN 301 489-1 V2.1.1
IEC 60950-1:2005, IEC 60950-1:2005/AMD1:2009,
IEC 60950-1:2005/AMD2:2013
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Radio:
EMC:
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2.4
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Please note that every application using the modules will need to perform the radio EMC tests on the
end product, according to EN 301 489-17. It is ultimately the responsibility of the manufacturer to
ensure the compliance of the end product. The specific product assembly may have an impact to RF
radiated characteristics, and manufacturers should carefully consider RF radiated testing with the
end-product assembly. A formal DoC is available via www.silabs.com
The modules are in conformity with the essential requirements and other relevant requirements of
the Radio Equipment Directive (RED) at the maximum power setting defined in section 11.2 and
the antennae listed in Table 2.
ICASA Approvals
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The ETRX351-LRS, ETRX357-LRS, ETRX351HR-LRS and ETRX357HR-LRS have been certified
to be used in South Africa.
Australia and New Zealand (C-Tick)
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The ETRX351-LRS, ETRX357-LRS, ETRX351HR-LRS and ETRX357HR-LRS have been certified
to be used in Australia and New Zealand.
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In order to have a C-Tick mark on an end product integrating an ETRX3xx device, a company must
comply with a or b below.
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a). have a company presence in Australia.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
b). have a company/distributor/agent in Australia that will sponsor the importing of the en product.
Brazil
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2.6
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The ETRX357-LRS and ETRX357HR-LRS have been certified to be used in Brazil. The Anatel ID for
both module variants is 03188-19-03402. To comply to Brazilian regulations, it is required to display
Anatel related information including, but not limited to the graphics below in the end-product’s user
guide.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
2.7
Declarations of Conformity
2.8
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Telegesis (UK) Ltd has issued Declarations of Conformity for all ETRX3 series Zigbee RF Modules,
which cover Radio Emissions, EMC and Safety. These documents will be available from our website
or on request
IEEE 802.15.4
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IEEE 802.15.4 is a standard for low data rate, wireless networks (raw bit-rate within a radio packet
of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life
applications as well as mains-powered applications. It is the basis for the open Zigbee Protocol.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
2.9
The Zigbee Protocol
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The Zigbee Protocol is a set of standards for wireless connectivity for use between any devices over
short to medium distances. The specification was originally ratified in December 2004, paving the
way for companies to start making low-power networks a reality.
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Zigbee uses an IEEE 802.15.4 radio specification running on the 2.4 GHz band, plus three additional
layers for networking, security and applications. What makes the specification unique is its use of a
mesh network architecture which, in bucket chain style, passes data from one node to the next until
it lands at its destination. The network is self-healing and adapts its routing as link quality changes
or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers,
but can therefore be put into a low-power sleep state.
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Truly self healing mesh networking
Messages can now travel up to 30 hops
Source-Routing for improved point to multipoint message transmission
Improved security including Trust-Centre link keys
New message types and options
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The enhanced version of the Zigbee standard (or Zigbee 2006) was released in December 2006,
adding new features and improvements to the only global wireless communication standard enabling
the development of easily deployable low-cost, low-power, monitoring and control products for
homes, commercial buildings and industrial plant monitoring. In 2007 the Zigbee Alliance introduced
the PRO feature-set which offers advantages over earlier feature-sets, including
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The Telegesis AT Command-set, which by default ships on all ETRX3 series products is based on
the Zigbee PRO feature-set. For more information on the Telegesis AT Command-set please refer
to the separate documentation at www.silabs.com/telegesisdocuments.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
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3 Module Pinout
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Figure 1. ETRX3 series Module Pinout (top view)
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The table below gives details about the pin assignment for direct SMD soldering of the ETRX3 series
modules to the application board. For more information on the alternate functions please refer to
[2]. Also refer to the Telegesis AT Command-set documentation to understand how the preprogrammed firmware makes use of the individual I/Os.
All GND pads are connected within the module, but for best RF performance all of them should be
grounded externally.
Designation
Normal
function
1
GND
GND
2
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ETRX35x
pad
Alternat
e
EM35x
pin
GND
PC5 {1}
I/O
PC6
PC7
PA7 {5}
PB3 {2,3}
nReset {6}
PB4 {2,3}
PA0
PA1
PA2
PA3
GND
PA4
I/O
I/O
I/O
I/O
nReset
I/O
I/O
I/O
I/O
I/O
GND
I/O
15
PA5 {4}
I/O
27
16
PA6 {5}
I/O
29
17
PB1 {2}
TXD
30
18
PB2 {2}
RXD
31
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4
5
6
7
8
9
10
11
12
13
14
©2019 Silicon Labs
Ember designation
TX_ACTIVE
CTS
RTS
11
13
14
18
19
12
20
21
22
24
25
GND
26
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TX_ACTIVE. PC5 of the EM35x is used to
control the FEM
OSC32B, nTX_ACTIVE
OSC32A, OSC32_EXT
TIM1C4
SC1nCTS, SC1SCLK, TIM2C3
TIM2C4, SC1nRTS, SC1nSSEL
TIM2C1, SC2MOSI
TIM2C3, SC2SDA, SC2MISO
TIM2C4, SC2SCL, SC2SCLK
SC2nSSEL, TRACECLK, TIM2C2
ADC4, PTI_EN, TRACEDATA
ADC5, PTI_DATA, nBOOTMODE,
TRACEDATA3
TIM1C3
SC1MISO, SC1MOSI, SC1SDA, SC1TXD,
TIM2C1
SC1MISO, SC1MOSI, SC1SCL, SC1RXD,
TIM2C2
ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
Normal
function
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
GND
GND
JTCK
PC2
PC3
PC4
N/C{1}
PC1
PC0 {5}
PB7 {5}
PB6 {5}
PB5
GND
Vcc
GND
GND
GND
JTCK
I/O
I/O
I/O
N/C
I/O
I/O
I/O
I/O
I/O
GND
Vcc
GND
Alternat
e
ADC3
ADC2
ADC1
ADC0
EM35x
pin
GND
GND
32
33
34
35
36
38
40
41
42
43
GND
Vcc
GND
Ember designation
SWCLK
JTDO, SWO
JTDI
JTMS, SWDIO
PB0 of the EM35x is used to control the FEM
ADC3, SWO, TRACEDATA0
JRST, IRQD, TRACEDATA1
ADC2, IRQC, TIM1C2
ADC1, IRQB, TIM1C1
ADC0, TIM2CLK, TIM1MSK
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Designation
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ETRX35x
pad
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Table 3. Pin Information
Notes:
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{1} When the alternate GPIO function is selected, TX_ACTIVE becomes an output that indicates that the
EM35x radio transceiver is in transmit mode. PC5 must not be used in this mode as it is needed
internally as TX_ACTIVE to control the external RF front end and power amplifier. PB0 is not available
to the user.
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{2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively.
The device sends its data on TXD and receives on RXD.
{3} When using the Telegesis AT Command-set, RTS/CTS handshaking is selectable in firmware. See
the AT Command Manual.
{4} If PA5 is driven low at power-up or reset the module will boot up in the bootloader
{5} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 9)
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{6} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET is
low
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Alternate functions depend on the firmware, but the Telegesis R3xx AT Command-set functions are
indicated here for convenience.
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Important Note: The ETRX35x series and the ETRX35x-LRS series of modules are footprint
compatible, but on the ETRX35x-LRS series pins PB0 and PC5 of the EM357 are used internally to
control the front-end module and are not available to the user. PC5 is still available on Pad2, but it
is configured as TX_ACTIVE signal and cannot be used as a general purpose GPIO.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
Vcc
Vreg
I/O
LDO
1V8
1,8Vdc
integrated
antenna
A/D
UART
LDO
1V25
EM35x
es
ig
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4 Hardware Description
Match
RESET
Match
5
JTAG
RESET
D
FEM
I/O
24MHz
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rf
U.FL socket terminal
selection,
filtering and
matching
circuitry
programming
fo
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Figure 2. Hardware Diagram
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The ETRX351-LRS and ETRX357-LRS are based on the Ember EM351 and EM357 respectively in
addition to a frontend module containing a PA, LNA and RF switch in addition to the RF-Frontend.
The EM351 and EM357 are fully integrated 2.4GHz Zigbee transceivers with a 32-bit ARM® Cortex
M3TM microprocessor, flash and RAM memory, and peripherals.
The industry standard serial wire and JTAG programming and debugging interfaces together with
the standard ARM system debug components help to streamline any custom software development.
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In addition to this a number of MAC functions are also implemented in hardware to help maintain the
strict timing requirements imposed by the Zigbee and IEEE802.15.4 standards.
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The new advanced power management features allow faster wakeup from sleep and new powerdown modes allow this 3rd generation module to offer a longer battery life than any 2nd generation
modules on the market.
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The EM35x has fully integrated voltage regulators for both required 1.8V and 1.25V supply voltages.
The voltages are monitored (brown-out detection) and the built in power-on-reset circuit eliminates
the need for any external monitoring circuitry. A 32.768kHz watch crystal can be connected
externally to pads 3 and 4 in case more accurate timing is required.
4.1
Hardware Interface
All GPIO pins of the EM351 or EM357 except PB0 and PC5 are accessible on the module’s pads.
Whether signals are used as general purpose I/Os, or assigned to a peripheral function like ADC is
set by the firmware. When using the Telegesis AT Command-set please refer to the AT Commandset manual for this information and when developing custom firmware please refer to the EM35x
datasheet.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
5 Firmware Description
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The modules will be pre-loaded with a standalone bootloader by Ember, which supports over-the-air
bootloading as well as serial bootloading of new firmware.
In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and powercycle or reset the module. To avoid entering the standalone bootloader unintentionally make sure
not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. A pull-up is not
required).
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In addition to the standalone bootloader the modules also contain the current release of the
Telegesis AT-style command interface as described in the Telegesis AT command dictionary and
the Telegesis user guide. Check www.silabs.com/telegesisdocuments for updates. Each module
comes with a unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. The
commands and responses pass through the serial port of the ETRX35x-LRS as ASCII text, so a
simple terminal application will usually suffice. Telegesis Terminal is provided as a development
tool, but it is not an essential feature.
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The pre-loaded AT-style command interface firmware is based on the latest EmberZNet meshing
stack which implements routers/coordinators as well as (sleepy) end devices. [End devices have no
routing responsibility and therefore are allowed to go to sleep, whilst still being able to send and
receive messages via a parent router. In addition to a classical (sleepy) end device the module
firmware also supports mobile (sleepy) end devices capable of changing their parent quickly
whenever they change their position within the network.]
A router is typically a mains powered device whilst a sleepy end device (SED) can be battery
powered.
The module is also able to act as a PAN coordinator and Trust Centre through external host control.
The AT style command line supplies all the tools required to set up and manage a Zigbee network
by allowing easy access to the low-level functionality of the stack.
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The Telegesis firmware uses the meshing and self healing EmberZNet PRO stack to overcome
many of the limitations of the tree network topology of the Zigbee 2006 stack by using the Zigbee
PRO feature-set.
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The Telegesis firmware also allows low-level access to physical parameters such as radio channel
and power level. Parameters that define the functionality of the ETRX35x-LRS module and also
allow standalone functionality are saved in non-volatile memory organised in so-called S-Registers.
The SPI and I2C buses are not supported by the current firmware release, but can be used with
custom firmware.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
5.1
Token Settings
TG Default
TELEGESIS
0x1010
0XFFFD
D
Description
Option Bytes
Optional Version Number
Custom EUI
Device Specific String
Hardware Identifier
Manufacturer ID
Default Power Settings
Bootloader Key
EZSP related
SE Security
SE Installation
Crystal Bias
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Token
MFG_CIB_OBS
MFG_CUSTOM_VERSION
MFG_CUSTOM_EUI_64
MFG_STRING
MFG_BOARD_NAME
MFG_MANUF_ID
MFG_PHY_CONFIG
MFG_BOOTLOAD_AES_KEY
MFG_EZSP_STORAGE
MFG_CBKE_DATA
MFG_INSTALLATION_CODE
MFG_OSC24M_BIAS_TRIM
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The ETRX3 Series Modules’ tokens will be pre-programmed with the settings shown in the table
below.
Custom Firmware
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5.2
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Table 4. Manufacturing tokens
For high volume customers the firmware can be customised on request. Customers can use the
ETRX35x-LRS module as hardware only and develop application specific firmware based on the
EmberZNet stack. In order to develop custom firmware the Ember Insight tool-chain is required.
When writing firmware for the ETRX357-LRS it is important to ensure that pins PB0 and PC5 are
correctly configured in order that the RF front-end module can operate correctly. An application note
“Writing customised firmware for the ETRX35x-LRS” can be downloaded from
www.silabs.com/telegesisdocuments.
Boost Mode vs. Normal Mode
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5.3
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The Ember EM35x chips support a “boost mode” power setting next to the “normal mode” power
setting. The “boost mode” setting increases the sensitivity and output power of the radio transceiver,
however with the LRS variants enabling boost mode has no positive effect on neither the output
power nor the sensitivity and therefore it is recommended to not use boost mode on this platform.
The Telegesis AT Command-set firmware automatically disables boost mode on LRS series
modules.
Section 11.2 lists the requirements for power settings for use of the LRS family in different countries.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
5.4
Software Interface
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Using the default firmware the ETRX35x-LR is controlled using a simple AT-style command interface
and (mostly) non-volatile S-Registers. In order to get a full listing of all the available AT-Commands,
please refer to the AT command dictionary document which corresponds to the firmware revision
you intend to use.
In addition to the command dictionary there are user guides explaining the features of the firmware
in more detail. If you need to find out which firmware resides on your module simply type “ATI”
followed by a carriage return and you will be prompted with the module’s manufacturing information.
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The Development Kit manual describes how to upgrade the firmware either via a serial link or over
the air.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
6 Absolute Maximum Ratings
3.6V
-0.3V to Vcc + 0.3V
-40 to 85°C
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Supply:
Inputs:
Operating temperature:
No.
Item
Symbol
Absolute Maximum Ratings
Unit
1
Supply voltage
Voltage on any I/O[11:0] ,
SIF_CLK, SIF_MISO, SIF_MOSI,
SIF_LOADB, RESET
Voltage on any Pad pin (PA4, PA5,
PB5, PB6, PB7, PC1), when used as
an input to the general purpose ADC
with the low voltage range selected
Module storage temperature range
Operating temperature range
Reel storage temperature range
Input RF level
ESD on any pin {1} except the RF port
according to Human Body Model
(HBM) circuit description
ESD on RF Port
Reflow temperature
VCC
-0.3 to +3.6
Vdc
Vin
-0.3 to VCC +0.3
Vin
-0.3 to +2.0
Tstg
Top
Tstgreel
Pmax
-40 to +105
-40 to +85
0 to 75
15
VTHHBM
±1
VTHHBM
TDeath
500
Please refer to chapter 13
4
5
6
7
8
°C
°C
°C
dBm
kV
V
°C
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9
10
Vdc
D
3
Vdc
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2
Table 5. Absolute Maximum Ratings
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Note:
{1} Input must be current limited to the value specified.
The absolute maximum ratings given above should under no circumstances be violated. Exceeding
one or more of the limiting values may cause permanent damage to the device.
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Caution! ESD sensitive device. Precautions should be used when handling the device
in order to prevent permanent damage.
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7 Recommended Operating Conditions
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No.
1
2
3
4
Conditon/
Remark
Item
Value
Symbol
Min
Supply voltage
RF Input Frequency
RF Input Power
Operating temperature range
VCC
fC
pIN
2.1
2405
Top
-40
Typ
3.0
Unit
Max
3.6
2480
0
Vdc
MHz
dBm
+85
°C
Table 6. Recommended Operating Conditions
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
8 DC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated
4
Transmit current
consumption
7
8
9
12
13
14
15
16
17
Transmit current
consumption
Receive current
consumption
Receive current
consumption
MCU, RAM and flash,
FEM, radio off
MCU, RAM and flash,
FEM, radio off
Serial Controller
Timer
ADC
Wake time from deep
sleep
3.0
1
ISLEEP
1.2
ISLEEP
1.5
ITXVCC
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ns
Typ
2.1
Unit
Max
3.6
Vdc
µA
µA
µA
140
mA
52
mA
30
mA
IRX
31.5
mA
IMCU
7
mA
IMCU
8
mA
ISC
ITMR
0.2
0.25
1.1
100
mA
mA
mA
µs
5
µs
ITXVCC
IRX
Table 7. DC Electrical Characteristics
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Shutdown time
at +20dBm
module output
power
at min. module
output power
Total, 12MHz
clock speed
Total, 24MHz
clock speed
12MHz clock
speed
24MHz clock
speed
Max data rate
Max clock rate
Max sample rate
From wakeup
event to 1st
instruction
From last
instruction into
deep sleep
Min
ISLEEP
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5
Value
D
3
1
VCC
Module supply voltage
Quiescent current,
internal RC oscillator
disabled
Quiescent current,
internal RC oscillator
enabled
Quiescent current,
including 32.768kHz
oscillator
2
Symbol
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1
Condition /
Remark
Item
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No.
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Please Note: The average current consumption during operation is dependent on the firmware and
the network load, therefore these figures are given in the command dictionary of the respective
firmware.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
9 Digital I/O Specifications
VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated
Condition/Remark
Symbol
Low Schmitt switching
threshold
Schmitt input threshold
going from high to low
VSWIL
0.42 x
VCC
High Schmitt switching
threshold
Schmitt input threshold
going from low to high
VSWIH
0.62 x
VCC
Item
1
2
Value
3
Input current for logic 0
IIL
4
Input current for logic 1
IIH
6
Input Pull-up resistor
value
Input Pull-down resistor
value
Output voltage for logic 0
8
Output voltage for logic 1
9
Output Source Current
10
11
12
13
Output Sink current
Output Source Current
Output Sink current
Total output current
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0.8 x VCC
24
Vdc
MHz
-0.5
µA
0.5
µA
29
34
kΩ
29
34
kΩ
RIPD
24
VOL
0
0.18 x VCC
V
0.82 x
VCC
VCC
V
IOHS
4
mA
IOLS
IOHH
IOLH
IOH + IOL
4
8
8
40
mA
mA
mA
mA
IOH = 4mA (8mA)for
standard (high
current) pads
VOH
Standard current
pad
Standard current
pad
High current pad (1)
High current pad (1)
Max
0.5 x VCC
Table 8. Recommended Operating Conditions
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Notes
IOL = 4mA (8mA) for
standard (high
current) pads
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7
RIPU
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5
Typ
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Min
Unit
D
No.
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The digital I/Os of the ETRX35x module have the ratings shown below.
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1) High current pads are PA6, PA7, PB6, PB7, PC0
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
10 A/D Converter Characteristics
Item
A/D resolution
A/D sample time for 7-bit conversion
A/D sample time for 14-bit conversion
Reference Voltage
Max current drain from Vref pin
Up to 14 bits
5.33µs
682µs
1.2V
1mA
D
No.
1
2
3
4
5
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The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer
to section 10 of the EM35x datasheet.
Table 9. A/D Converter Characteristics
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11 AC Electrical Characteristics
No.
Receiver
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VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50Ω terminal load connected to the U.FL socket
Min
7
8
9
10
11
12
R
13
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6
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5
Frequency range
Sensitivity for 1% Packet Error Rate (PER)
Saturation (maximum input level for correct operation)
High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
2nd High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
2nd Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Channel Rejection for all other channels
(1% PER and desired signal –82dBm acc. to [1])
802.11g rejection centred at +12MHz or –13MHz
(1% PER and desired signal –82dBm acc. to [1])
Co-channel rejection
(1% PER and desired signal –82dBm acc. to [1])
Relative frequency error
(2x40ppm required by [1])
Relative timing error
(2x40ppm required by [1])
Linear RSSI range
Output power at highest power setting
NORMAL MODE
BOOST MODE
Output power at lowest power setting
Error vector magnitude as per IEEE802.15.4
Carrier frequency error
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1
2
4
14
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15
16
17
18
2400
-107
-3
Value
Typ
-106
2
Unit
Max
2500
-100
MHz
dBm
dBm
41
dB
40
dB
54
dB
52
dB
tbd
dB
tbd
dB
tbd
dBc
-120
120
ppm
-120
120
ppm
35
20
20
dB
21
21
21.5
21.5
dBm
7
-40
15
40 (1)
dBm
%
ppm
-40 (1)
Table 10. AC Electrical Characteristics
Notes
(1) Applies across the full ranges of rated temperature and supply voltage.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
No.
Synthesiser Characteristics
Limit
Typ
Min
2400
11.7
2500 MHz
kHz
100 µs
100 µs
D
Frequency range
Frequency resolution
Lock time from off state, with correct VCO DAC settings
Relock time, channel change or Rx/Tx turnaround
Phase noise at 100kHz offset
Phase noise at 1MHz offset
Phase noise at 4MHz offset
Phase noise at 10MHz offset
Unit
Max
-71dBc/Hz
-91dBc/Hz
-103dBc/Hz
-111dBc/Hz
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22
23
24
25
26
27
28
29
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ns
Please Note: For the relationship between EM35x power settings and module output power please
relate to chapter 11.1 of this document. When developing custom firmware the output power settings
described in this document relate directly to the EM35x power settings accessible via the Ember
stack API. When using the Telegesis AT Command-set firmware the settings mentioned in this
document directly relate to the settings in the S-Register S01 which is used for setting the output
power.
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Table 11. Synthesiser Characteristics
30
31
Power On Reset (POR) Specifications
VCC POR release
VCC POR assert
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No.
Min
Limit
Typ
Unit
Max
0.62
0.45
0.95
0.65
1.2
0.85
Limit
Typ
Max
Vdc
Vdc
Table 12. Power On Reset Specifications
No.
om
Reset Filter Time constant
Reset Pulse width to guarantee a reset
Reset Pulse width guaranteed not to cause reset
Input pull-up resistor value while the chip is not reset
Input pull-up resistor value while the chip is reset
Min
2.1
26
0
24
12
Unit
12
16
29
14.5
1
34
17
µs
µs
µs
kΩ
kΩ
Table 13. nReset Specifications
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32
33
34
35
36
nRESET Specifications
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
11.1 TX Power Characteristics
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The diagrams below show the typical output power and module current in dependency on EM35x
power setting in NORMAL MODE at 3.0V and room temperature.
Pin vs. Pout
25
20
D
Pout [dBm]
15
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10
5
-5
-30
-25
-20
-15
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0
-10
-5
0
5
Channel
11
Channel
19
10
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Pin setting of EM35x [dBm]
Figure 3. Output Power vs. Power Setting
Pin vs. Current Consumption
300
om
250
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I in mA
200
Channel
11
Channel
19
Channel
26
150
100
50
0
-30
-25
-20
-15
-10
-5
0
5
10
Pin setting of EM35x [dBm]
Figure 4. Module Current vs. Power Setting
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
11.2 Power Settings for Regulatory Compliance
Channels 19-24
-17dBm
-17dBm
-17dBm
Channel 25
-17dBm
-17dBm
-17dBm
Channel 26
-17dBm
-17dBm
-17dBm
D
Channels 11-18
-17dBm
-17dBm
-17dBm
N
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Antenna
1/2 Wave
1/4 Wave
On Board
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Because of the high gain of the frontend module output power of up to 22dBm can be achieved
When the antenna gain is included the output power of the EM35x transceivers needs to be
reduced for regulatory compliance. The following tables list the maximum permitted power setting
for the antenna types listed in Table 2. Note that this is the power out of the EM357 chip (set in
register S01 when using Telegesis R3xx firmware), and the power delivered to the antenna will be
higher by the gain of the RF power amplifier.
(VCC = 3.3V, TAMB = 25°C, NORMAL MODE)
Table 14: Maximum Power Settings for European Compliance
Finally Table 15 lists the maximum Power settings for FCC, IC and C-Tick compliance.
Channels 19-24
-7dBm
-7dBm
-7dBm
Channel 25
-7dBm
-7dBm
-7dBm
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Channels 11-18
-7dBm
-7dBm
-7dBm
Channel 26
-11dBm
-11dBm
-11dBm
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Antenna
1/2 Wave
1/4 Wave
On Board
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Table 15: Maximum Power Settings for FCC, IC Compliance
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
11.3 Temperature behaviour
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Figure 5 and Figure 6 illustrate the temperature behaviour of the ETRX35x-LRS series of modules.
Please note that although the temperature behaviour was measured to up to 100 degrees Celsius
the absolute maximum rating is 85 degrees Celsius.
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Figure 5. Sensitivity vs. Temperature
Figure 6. TX Power vs. Temperature
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
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12 Physical Dimensions
Figure 7. ETRX3 Physical Dimensions
Explanation
L
W
H
A1
A2
R1
R2
X1
X2
Length of the module
Width of the module
Height of the module
Distance centre of pad PCB edge
Pitch
Keep-out Zone from corner of PCB
Keep-out Zone from corner of PCB
Distance centre of Antenna connector PCB edge
Distance centre of Antenna connector PCB edge
Distance
25.0mm
19.0mm
3.8mm
0.9mm
1.27mm
17.5mm
4.1mm
3.8mm
2.8mm
Table 16. ETRX3 Physical Dimensions
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Symbol
N
ot
R
For ideal RF performance when using the on-board antenna, the antenna should be located at the
corner of the carrier PCB. There should be no components, tracks or copper planes in the “keepout” area which should be as large as possible. When using the U.FL RF connector the “keep-out”
area does not have to be kept. NB: The modules’ transmit/receive range will depend on the antenna
used and also the housing of the finished product.
©2019 Silicon Labs
- 25 -
ETRX35x-LRS Product Manual (Rev 1.09)
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ETRX351-LRS and ETRX357-LRS
Figure 8. Typical pad dimensions
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Module weight: 2.9-3.0g depending on variant
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
13 Soldering Temperature Time Profile (for reflow soldering)
Recommended temperature profile
for reflow soldering
Temp.[°C]
es
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60 +60-20s
230°C -250°C max.
220°C
N
ew
D
150°C – 200°C
90 ±30s
Time [s]
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Figure 9. Recommended Reflow Profile
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Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process.
Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent
and other residuals are remaining underneath the shielding can as well as in the gap between the
module and the host board.
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Please Note:
Maximum number of reflow cycles:
2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the
module on the bottom / underside of your PCB and re-flow).
©2019 Silicon Labs
- 27 -
ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
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14 Product Label Drawing
Figure 10. Product Label
The characters “HR” are only present on the versions with the Hirose connector,
Description
om
Imprint
Model:ETRX357-LRS
ec
CE
R
2D-Barcode
N
ot
YYWWTTTTTT
Module Order Code.
The CE Mark
QR Code containing information in the format YYWWMMABCDE
• YY: Last two digits of the assembly year
• WW: Two-digit workweek when the device was assembled
•
MMABCDE: Silicon Labs unit code.
Serial Number Code in the format YYWWTTTTTT
• YY: Last two digits of the assembly year
• WW: Two-digit workweek when the device was assembled
• TTTTTT: Manufacturing trace code. The first letter is the device revision
FCC ID: S4GEM35XB
IC: 8735A-EM35XB
The FCC ID
The IC ID
Anatel: 03190-1903402
The Anatel ID
Table 17. ETRX35x-LRS Label Details
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
15 Recommended Footprint
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In order to surface mount an ETRX3 series module, we recommend that you use pads which are
1mm wide and 1.2mm high. Unless using the “HR” variants the “keep-out” zone shown in section 12
must be retained, and it must be ensured that this area is free of copper tracks and/or copper
planes/layers.
You must also ensure that there is no exposed copper on your layout which may contact with the
underside of the ETRX3 series module.
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For best RF performance it is required to provide good ground connections to the ground pads of
the module. It is recommended to use multiple vias between each ground pad and a solid ground
plane to minimize inductivity in the ground path.
Figure 11. Recommended Footprint
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The land pattern dimensions above serve as a guideline.
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We recommend that you use the same pad dimensions for the solder paste screen as you have for
the copper pads. However these sizes and shapes may need to be varied depending on your
soldering processes and your individual production standards. We recommend a paste screen
thickness of 120μm to 150μm.
Figure 8 shows the typical pad dimensions of the module and Figure 12 - Figure 14 in section 15.1
show examples of how to align the module on its host PCB.
Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such as
through-hole vias, planes or tracks on your board component layer, should be located below the
ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use a multilayer PCB
containing an inner RF shielding ground plane, therefore there is no need to have an additional
copper plane directly under the ETRX3 series module.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
15.1 Recommended Placement
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When placing the module please either locate the antenna in the corner as shown in Figure 12 so
that the recommended antenna keepout zone is being followed, or add a no copper zone as
indicated in Figure 14.
Figure 13. How to not place the Module
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Figure 12. Typical placement
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ETRX35x-LRS Product Manual (Rev 1.09)
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ETRX351-LRS and ETRX357-LRS
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Figure 14. Adding a no copper / no component area
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
15.2 Example carrier board
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Since the RF performance of the module with the on board antenna is strongly dependent on the
proper location of the module on its carrier board. Figure 15 shows the reference carrier board which
was used during testing by Telegesis.
Figure 15. Reference Board
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For best performance it is recommended to locate the antenna towards the corner of the carrier
board and to respect the recommended keep-out areas as described in section 12.
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Finally to provide a good reference ground to the on board antenna, the carrier board should have
a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will suffice,
but a degradation in radio performance could be the result.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
16 Reliability Tests
No
Item
Limit
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The following measurements will be conducted after the module has been exposed to standard room
temperature and humidity for 1 hour.
Condition
Vibration test
Electrical parameter should be
in specification
2
Shock test
the same as the above
3
Heat cycle test
the same as the above
4
5
6
Moisture test
Low temp. test
High temp. test
the same as the above
the same as the above
the same as the above
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a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
Dropped onto hard wood from height of
50cm for 3 times
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
+60°C, 90% RH, 300h
-40°C, 300h
+85°C, 300h
Table 18. Reliability Tests
17.1 Safety Precautions
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17 Application Notes
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These specifications are intended to preserve the quality assurance of products as individual
components.
Before use, check and evaluate their operation when mounted on your products. Abide by
these specifications when using the products. These products may short-circuit. If electrical
shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit
occurs, then provide the following failsafe functions as a minimum:
(2)
Ensure the safety of the whole system by installing a protection circuit and a protection
device.
Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
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(1)
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17.2 Design Engineering Notes
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(1)
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(2)
(3)
(4)
Heat is the major cause of shortening the life of these products. Avoid assembly and
use of the target equipment in conditions where the product’s temperature may exceed
the maximum allowable.
Failure to do so may result in degrading of the product’s functions and damage to the
product.
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, before use, check and evaluate their operation when assembled onto your
products.
These products are not intended for other uses, other than under the special conditions
shown below. Before using these products under such special conditions, check their
performance and reliability under the said special conditions carefully, to determine
whether or not they can be used in such a manner.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid
may splash.
(6) In direct sunlight, outdoors, or in a dusty environment
(7) In an environment where condensation occurs.
(8) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2,
H2S, NH3, and NOx)
(9) If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
(10) Mechanical stress during assembly of the board and operation has to be avoided.
(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not
permitted.
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(5)
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17.3 Storage Conditions
(1)
(2)
The module must not be stressed mechanically during storage.
Do not store these products in the following conditions or the performance characteristics
of the product, such as RF performance, may well be adversely affected:
Storage in salty air or in an environment with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX
Storage in direct sunlight
Storage in an environment where the temperature may be outside the range of 5°C to
35°C range, or where the humidity may be outside the 45 to 85% range.
Storage (before assembly of the end product) of the modules for more than one year
after the date of delivery at your company even if all the above conditions (1) to (3) have
been met, should be avoided.
(3)
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(4)
(5)
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(6)
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
18 Packaging
Dimension of the tape
(2)
Cover tape peel force
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(1)
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18.1 Embossed Tape
Force direction
Speed = 300mm/min.
Cover tape peel force
=0.098～0.68N (10～70g)
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θ= 10deg
Empty pockets
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(3)
Direction of
g
Empty pockets
Components Empty pockets Top cover
NB: Empty pockets in the component packed area will be less than two per reel and those empty
pockets will not be consecutive.
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
18.2 Component Orientation
(top view)
Component Orientation
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Part No.
Direction
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Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of the
carrier tape
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18.3 Reel Dimensions
Quantity per reel: 600 pieces
Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on
the reel
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(4)
(5)
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
18.4 Packaging - bag
Each reel will be packed in a hermetically-sealed bag containing desiccant and a
humidity indicator card
Marking : Part No. / Quantity / Lot No. and manufacturer part# with bar-code
(7)
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(6)
18.5 Packaging – carton
(8)
Each reel and bag will be placed in a cardboard carton of nominal dimensions
343 x 338 x 68 mm.
Weight of carton containing reel of 600 modules: 2.51kg approx.
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(9)
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
19 Ordering Information
Description
ETRX351-LRS
ETRX357-LRS
Telegesis Long Range Zigbee Module with Ember Zigbee
Technology:
•
•
•
•
•
•
•
ETRX3DVK
Zigbee
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Telegesis Long Range Zigbee Module with Ember
Technology:
Based on Ember EM351 or EM357
Telegesis AT Style Command Interpreter and
EmberZNet meshing and self-healing Zigbee PRO
stack
U.FL Antenna Connector
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ETRX351HR-LRS
ETRX357HR-LRS
Based on Ember EM351 or EM357
Telegesis AT Style Command Interpreter and
EmberZNet meshing and self-healing Zigbee PRO
stack
Integrated 2.4GHz Antenna
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Ordering/Product Code
Telegesis Development Kit with:
3 x USB Development Boards
3 x USB Cable
2 x ETRX35x on Carrier-Board
2 x ETRX35xHR on Carrier-Board
2 x ETRX35x-LRS on Carrier-Board
2 x ETRX35xHR-LRS on Carrier-Board
1 x ETRX3USB stick
2 x Large Antenna
2 x Small Stubby Antenna
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•
•
•
•
•
•
•
•
•
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Notes:
• Customers’ PO’s must state the Ordering/Product Code.
• There is no “blank” version of the ETRX35x-LRS modules available. All Modules are preprogrammed with the Telegesis AT style command interpreter based on the EmberZNet
stack. (Where customers wish to add their own firmware they can erase and write it to the
flash memory of the EM35x).
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
ETRX351-LRS and ETRX357-LRS
20 RoHS Declaration
Declaration of environmental compatibility for supplied products:
Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
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•
•
•
•
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Hereby we declare based on the declaration of our suppliers that this product does not contain any
of the substances which are banned by Directive 2011/65/EU (RoHS2) or if they do, contain a
maximum concentration of 0,1% by weight in homogeneous materials for:
•
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And a maximum concentration of 0.01% by weight in homogeneous materials for:
Cadmium and cadmium compounds
21 Data Sheet Status
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Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to improve
the design and supply the best possible product. Please consult the most recently issued data sheet
before initiating or completing a design.
22 Related Documents
[1]
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[4]
[5]
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[2]
[3]
IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical
Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LRWPANs)
Datasheet EM35x, Silicon Labs. (www.silabs.com)
Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors Low Profile 1.9mm or 2.4mm Mated Height
The Zigbee specification (www.zigbee.org)
Specification for Antenova Rufa Antenna (www.antenova.com)
©2019 Silicon Labs
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ETRX35x-LRS Product Manual (Rev 1.09)
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Products
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Smart.
Connected.
Energy-Friendly.
www.silabs.com/products
Quality
Support and Community
www.silabs.com/quality
community.silabs.com
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Disclaimer
Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or
intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"
parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without
further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior
notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance
of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to
design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required
or Life Support Systems without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails,
can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no
circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs
disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.
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