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FCP11N60N / FCPF11N60NT
N-Channel SupreMOS® MOSFET
600 V, 10.8 A, 299 mΩ
Features
Description
• RDS(on) = 255 mΩ (Typ.) @ VGS = 10 V, ID = 5.4 A
The SupreMOS® MOSFET is Fairchild Semiconductor’s next
generation of high voltage super-junction (SJ) technology
employing a deep trench filling process that differentiates it from
the conventional SJ MOSFETs. This advanced technology and
precise process control provides lowest Rsp on-resistance,
superior switching performance and ruggedness. SupreMOS
MOSFET is suitable for high frequency switching power converter applications such as PFC, server/telecom power, FPD TV
power, ATX power, and industrial power applications.
• Ultra Low Gate Charge (Typ. Qg = 27.4 nC)
• Low Effective Output Capacitance (Typ. Coss(eff.) = 130 pF)
• 100% Avalanche Tested
• RoHS Compliant
Application
• LCD/LED/PDP TV
• Lighting
• Solar Inverter
• AC-DC Power Supply
D
GD
S
G
G
D
S
TO-220
TO-220F
S
Absolute Maximum Ratings TC = 25oC unless otherwise noted.
Symbol
VDSS
Drain to Source Voltage
Parameter
VGSS
Gate to Source Voltage
FCP11N60N
FCPF11N60NT
600
±30
- Continuous (TC = 25oC)
Unit
V
V
10.8
10.8*
6.8
6.8*
ID
Drain Current
IDM
Drain Current
EAS
Single Pulsed Avalanche Energy
(Note 2)
IAR
Avalanche Current
(Note 1)
3.7
A
EAR
Repetitive Avalanche Energy
(Note 1)
0.94
mJ
100
V/ns
dv/dt
- Continuous (TC = 100oC)
- Pulsed
32.4
32.4*
Peak Diode Recovery dv/dt
(Note 3)
(TC = 25oC)
Power Dissipation
TJ, TSTG
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering,
1/8” from Case for 5 Seconds
- Derate Above 25oC
A
201.7
MOSFET dv/dt
PD
TL
(Note 1)
A
mJ
20
V/ns
94.0
32.1
W
0.75
0.26
W/oC
-55 to +150
oC
300
oC
*Drain current limited by maximum junction temperature.
Thermal Characteristics
FCP11N60N
FCPF11N60NT
RθJC
Symbol
Thermal Resistance, Junction to Case, Max.
Parameter
1.33
3.9
RθJA
Thermal Resistance, Junction to Ambient, Max.
62.5
62.5
©2009 Fairchild Semiconductor Corporation
FCP11N60N / FCPF11N60NT Rev. C1
1
Unit
oC/W
www.fairchildsemi.com
FCP11N60N / FCPF11N60NT — N-Channel SupreMOS® MOSFET
November 2013
Part Number
FCP11N60N
Top Mark
FCP11N60N
Package
TO-220
Packing Method
Tube
Reel Size
N/A
Tape Width
N/A
Quantity
50 units
FCPF11N60NT
FCPF11N60NT
TO-220F
Tube
N/A
N/A
50 units
Electrical Characteristics TC = 25oC unless otherwise noted.
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
600
-
-
V
-
0.73
-
V/oC
Off Characteristics
BVDSS
ΔBVDSS
/ ΔTJ
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate to Body Leakage Current
ID = 1 mA, VGS = 0 V, TC = 25oC
ID = 1 mA, Referenced to
25oC
VDS = 480 V, VGS = 0 V
-
-
10
VDS = 480 V, VGS = 0 V, TC = 125oC
-
-
100
VGS = ±30 V, VDS = 0 V
-
-
±100
μA
nA
On Characteristics
VGS(th)
RDS(on)
Gate Threshold Voltage
VGS = VDS, ID = 250 μA
2.0
-
4.0
V
Static Drain to Source On Resistance
VGS = 10 V, ID = 5.4 A
-
0.255
0.299
Ω
gFS
Forward Transconductance
VDS = 40 V, ID = 5.4 A
-
13.5
-
S
VDS = 100 V, VGS = 0 V,
f = 1 MHz
-
1130
1505
pF
-
45
60
pF
pF
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
-
3
5
Coss
Output Capacitance
VDS = 380 V, VGS = 0 V, f = 1 MHz
-
25
-
pF
Coss(eff.)
Effective Output Capacitance
VDS = 0 V to 480 V, VGS = 0 V
-
130
-
pF
Qg(tot)
Total Gate Charge at 10V
27.4
35.6
nC
Gate to Source Gate Charge
VDS = 380 V, ID = 5.4 A,
VGS = 10 V
-
Qgs
-
4.9
-
nC
-
8.8
-
nC
-
2.0
-
Ω
-
13.6
37.2
ns
-
9.1
28.2
ns
-
42.0
94.0
ns
-
10.0
30.0
ns
Qgd
Gate to Drain “Miller” Charge
ESR
Equivalent Series Resistance (G-S)
(Note 4)
f = 1 MHz
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
VDD = 380 V, ID = 5.4 A,
VGS = 10 V, RG = 4.7 Ω
(Note 4)
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain to Source Diode Forward Current
-
-
10.8
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
-
-
32.4
A
VSD
Drain to Source Diode Forward Voltage
VGS = 0 V, ISD = 5.4 A
-
-
1.2
V
trr
Reverse Recovery Time
268
-
ns
Qrr
Reverse Recovery Charge
VGS = 0 V, ISD = 5.4 A,
dIF/dt = 100 A/μs
-
3.1
-
μC
Notes:
1. Repetitive rating: pulse-width limited by maximum junction temperature.
2. IAS = 3.7 A, RG = 25 Ω, starting TJ = 25°C.
3. ISD ≤ 10.8 A, di/dt ≤ 200 A/μs, VDD = 380 V, starting TJ = 25°C.
4. Essentially independent of operating temperature typical characteristics.
©2009 Fairchild Semiconductor Corporation
FCP11N60N / FCPF11N60NT Rev. C1
2
www.fairchildsemi.com
FCP11N60N / FCPF11N60NT — N-Channel SupreMOS® MOSFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
60
VGS = 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
5.0 V
10
ID, Drain Current[A]
ID, Drain Current[A]
100
1
10
o
o
150 C
25 C
o
-55 C
1
*Notes:
1. 250μs Pulse Test
*Notes:
1. VDS = 20V
2. 250μs Pulse Test
o
0.1
0.1
2. TC = 25 C
1
VDS, Drain-Source Voltage[V]
10
0.1
20
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
0.6
IS, Reverse Drain Current [A]
RDS(ON) [Ω],
Drain-Source On-Resistance
8
100
0.5
VGS = 10V
0.4
VGS = 20V
0.3
o
*Notes: TC = 25 C
0
8
16
24
ID, Drain Current [A]
o
150 C
10
o
25 C
*Notes:
1. VGS = 0V
1
0.4
32
2. 250μs Pulse Test
0.6
0.8
1.0
1.2
VSD, Body Diode Forward Voltage [V]
1.4
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
6000
10
4000
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
VGS, Gate-Source Voltage [V]
Capacitances [pF]
4
6
VGS, Gate-Source Voltage[V]
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
0.7
0.2
2
Coss
*Notes:
1. VGS = 0V
2. f = 1MHz
2000
Ciss
8
VDS = 120V
VDS = 300V
VDS = 480V
6
4
2
Crss
0
0.1
1
10
100
VDS, Drain-Source Voltage [V]
©2009 Fairchild Semiconductor Corporation
FCP11N60N / FCPF11N60NT Rev. C1
0
600
3
*Notes: ID = 5.4A
0
5
10
15
20
25
Qg, Total Gate Charge [nC]
30
www.fairchildsemi.com
FCP11N60N / FCPF11N60NT — N-Channel SupreMOS® MOSFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
RDS(on), [Normalized]
Drain-Source On-Resistance
BVDSS, [Normalized]
Drain-Source Breakdown Voltage
1.2
1.1
1.0
0.9
*Notes:
1. VGS = 0V
2. ID = 1mA
0.8
-100
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
1.0
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
200
20μs
100μs
1ms
10ms
DC
Operation in This Area
is Limited by R DS(on)
*Notes:
0.1
o
1ms
Operation in This Area
is Limited by R DS(on)
10
100
VDS, Drain-Source Voltage [V]
DC
*Notes:
o
1. TC = 25 C
o
1
10ms
1
0.1
1. TC = 25 C
100μs
10
2. TJ = 150 C
3. Single Pulse
0.01
0.1
*Notes:
1. VGS = 10V
2. ID = 5.4A
0.5
100
ID, Drain Current [A]
ID, Drain Current [A]
1.5
Figure 10. Maximum Safe Operating Area
for FCPF11N60NT
20μs
10
1
2.0
0.0
-100
200
Figure 9. Maximum Safe Operating Area
for FCP11N60N
50
2.5
o
0.01
0.1
1000
2. TJ = 150 C
3. Single Pulse
1
10
100
VDS, Drain-Source Voltage [V]
1000
Figure 11. Maximum Drain Current
vs. Case Temperature
ID, Drain Current [A]
12
9
6
3
0
25
50
75
100
125
o
TC, Case Temperature [ C]
©2009 Fairchild Semiconductor Corporation
FCP11N60N / FCPF11N60NT Rev. C1
150
4
www.fairchildsemi.com
FCP11N60N / FCPF11N60NT — N-Channel SupreMOS® MOSFET
Typical Performance Characteristics (Continued)
FCP11N60N / FCPF11N60NT — N-Channel SupreMOS® MOSFET
Typical Performance Characteristics (Continued)
Figure 12. Transient Thermal Response Curve for FCP11N60N
1
0.5
θ JC
o
ZθJC
(t), Thermal
Response
Thermal
Response
[Z [ C/W]
]
2
0.2
PDM
0.1
0.1
t1
0.05
t2
*Notes:
0.02
o
1. ZθJC(t) = 1.33 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
0.01
Single pulse
0.01
-5
10
-4
-3
10
-2
-1
10
10
Rectangular
Pulse
t1, Rectangular
PulseDuration
Duration [sec]
[sec]
10
1
Figure 13. Transient Thermal Response Curve for FCPF11N60NT
ZθJC
(t), Thermal
Response
[o]
C/W]
Thermal
Response
[ZθJC
5
0.5
1
0.2
0.1
PDM
0.05
0.1
t1
0.02
*Notes:
0.01
o
1. ZθJC(t) = 3.3 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
Single pulse
0.01
-5
10
t2
-4
10
-3
10
-2
10
-1
10
1
10
2
10
3
10
[sec]
tRectangular
PulseDuration
Duration [sec]
1, RectangularPulse
©2009 Fairchild Semiconductor Corporation
FCP11N60N / FCPF11N60NT Rev. C1
5
www.fairchildsemi.com
FCP11N60N / FCPF11N60NT — N-Channel SupreMOS® MOSFET
IG = const.
Figure 14. Gate Charge Test Circuit & Waveform
VDS
RG
RL
VDS
VDD
VGS
VGS
DUT
V
10V
GS
90%
10%
td(on)
tr
t on
td(off)
tf
t off
Figure 15. Resistive Switching Test Circuit & Waveforms
VGS
Figure 16. Unclamped Inductive Switching Test Circuit & Waveforms
©2009 Fairchild Semiconductor Corporation
FCP11N60N / FCPF11N60NT Rev. C1
6
www.fairchildsemi.com
FCP11N60N / FCPF11N60NT — N-Channel SupreMOS® MOSFET
DUT
+
VDS
_
I SD
L
Driver
RG
VGS
VGS
( Driver )
Same Type
as DUT
VDD
• dv/dt controlled by RG
• ISD controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
I SD
( DUT )
di/dt
IRM
Body Diode Reverse Current
VDS
( DUT )
Body Diode Recovery dv/dt
VSD
VDD
Body Diode
Forward Voltage Drop
Figure 17. Peak Diode Recovery dv/dt Test Circuit & Waveforms
©2009 Fairchild Semiconductor Corporation
FCP11N60N / FCPF11N60NT Rev. C1
7
www.fairchildsemi.com
FCP11N60N / FCPF11N60NT — N-Channel SupreMOS® MOSFET
Mechanical Dimensions
Figure 18. TO-220, Molded, 3-Lead, Jedec Variation AB
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT220-003
©2009 Fairchild Semiconductor Corporation
FCP11N60N / FCPF11N60NT Rev. C1
8
www.fairchildsemi.com
FCP11N60N / FCPF11N60NT — N-Channel SupreMOS® MOSFET
Mechanical Dimensions
Figure 19. TO220, Molded, 3-Lead, Full Pack, EIAJ SC91, Straight Lead
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TF220-003
©2009 Fairchild Semiconductor Corporation
FCP11N60N / FCPF11N60NT Rev. C1
9
www.fairchildsemi.com
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
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Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
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Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I66
©2009 Fairchild Semiconductor Corporation
FCP11N60N / FCPF11N60NT Rev. C1
10
www.fairchildsemi.com
FCP11N60N / FCPF11N60NT — N-Channel SupreMOS® MOSFET
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Email: orderlit@onsemi.com
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