Field Stop Trench IGBT
650 V, 40 A
FGAF40S65AQ
Description
Using novel field stop IGBT technology, ON Semiconductor’s new
series of field stop 4th generation of RC IGBTs offer the optimum
performance for PFC applications and welder where low conduction
and switching losses are essential.
Features
•
•
•
•
•
•
•
•
•
•
Maximum Junction Temperature: TJ = 175°C
Positive Temperature Co−efficient for Easy Parallel Operating
High Current Capability
Low Saturation Voltage: VCE(sat) = 1.6 V (Typ.) @ IC = 40 A
100% of the Parts Tested for ILM (Note 1)
High Input Impedance
Fast Switching
Tighten Parameter Distribution
IGBT with Monolithic Reverse Conducting Diode
This Device is Pb−Free and is RoHS Compliant
www.onsemi.com
VCES
IC
650 V
40 A
C
G
E
Applications
• PFC, Welder
TO−3PF
CASE 340AH
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2018
August, 2020 − Rev. 2
1
Publication Order Number:
FGAF40S65AQ/D
FGAF40S65AQ
PACKAGE MARKING AND ORDERING INFORMATION
Part Number
Device Marking
Package
Reel Size
Tape Width
Quantity per Tube
FGAF40S65AQ
FGAF40S65AQ
TO−3PF
−
−
30
Table 1. ABSOLUTE MAXIMUM RATINGS
Symbol
Description
FGAF40S65AQ
Unit
VCES
Collector to Emitter Voltage
650
V
VGES
Gate to Emitter Voltage
±20
V
Transient Gate to Emitter Voltage
±30
V
@ TC = 25°C
80
A
@ TC = 100°C
40
@ TC = 25°C
160
A
IC
Collector Current
ILM (Note 1)
Pulsed Collector Current
ICM (Note 2)
Pulsed Collector Current
IF
160
A
@ TC = 25°C
40
A
@ TC = 100°C
20
A
160
A
@ TC = 25°C
94
W
@ TC = 100°C
47
W
Operating Junction Temperature Range
−55 to +175
°C
Storage Temperature Range
−55 to +175
°C
300
°C
Diode Forward Current
IFM (Note 2)
PD
Pulsed Diode Maximum Forward Current
Maximum Power Dissipation
TJ
TSTG
TL
Maximum Lead Temp. for Soldering Purposes, 1/8″ from case for 5 sec
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. VCC = 400 V, VGE = 15 V, IC = 160 A, RG = 7 W, Inductive Load.
2. Repetitive rating: Pulse width limited by max. junction temperature.
Table 2. THERMAL CHARACTERISTICS
Symbol
RqJC (IGBT)
RqJA
Parameter
FGAF40S65AQ
Unit
Thermal Resistance, Junction to Case, Max.
1.6
_C/W
Thermal Resistance, Junction to Ambient, Max.
40
_C/W
www.onsemi.com
2
FGAF40S65AQ
Table 3. ELECTRICAL CHARACTERISTICS OF THE IGBT (TC = 25°C unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
VGE = 0 V, IC = 1 mA
650
−
−
V
VGE = 0 V, IC = 1 mA
−
0.5
−
V/°C
OFF CHARACTERISTICS
BVCES
Collector to Emitter Breakdown Voltage
DBVCES / DTJ Temperature Coefficient of Breakdown Voltage
ICES
Collector Cut−Off Current
VCE = VCES, VGE = 0 V
−
−
250
mA
IGES
G−E Leakage Current
VGE = VGES, VCE = 0 V
−
−
±400
nA
ON CHARACTERISTICS
VGE(th)
G−E Threshold Voltage
IC = 40 mA, VCE = VGE
2.6
5.3
6.6
V
VCE(sat)
Collector to Emitter Saturation Voltage
IC = 40 A, VGE = 15 V
−
1.6
2.1
V
IC = 40 A, VGE = 15 V,
TC = 175°C
−
1.9
−
V
VCE = 30 V, VGE = 0 V,
f = 1 MHz
−
2590
−
pF
−
35
−
pF
−
10
−
pF
−
17.8
−
ns
−
6.3
−
ns
Turn−Off Delay Time
−
81.6
−
ns
Fall Time
−
9.3
−
ns
Eon
Turn−On Switching Loss
−
132
−
mJ
Eoff
Turn−Off Switching Loss
−
62
−
mJ
Ets
Total Switching Loss
−
194
−
mJ
Td(on)
Turn−On Delay Time
−
19.5
−
ns
−
9.6
−
ns
Turn−Off Delay Time
−
76.8
−
ns
DYNAMIC CHARACTERISTICS
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
SWITCHING CHARACTERISTICS
Td(on)
Tr
Td(off)
Tf
Tr
Td(off)
Tf
Turn−On Delay Time
Rise Time
Rise Time
VCC = 400 V, IC = 10 A,
RG = 6 W, VGE = 15 V,
Inductive Load, TC = 25°C
VCC = 400 V, IC = 20 A,
RG = 6 W, VGE = 15 V,
Inductive Load, TC = 25°C
Fall Time
−
7.4
−
ns
Eon
Turn−On Switching Loss
−
296
−
mJ
Eoff
Turn−Off Switching Loss
−
111
−
mJ
Ets
Total Switching Loss
−
407
−
mJ
Td(on)
Turn−On Delay Time
−
17.5
−
ns
−
6.8
−
ns
Tr
Td(off)
Rise Time
VCC = 400 V, IC = 10 A,
RG = 6 W, VGE = 15 V,
Inductive Load, TC = 175°C
Turn−Off Delay Time
−
88
−
ns
Fall Time
−
9.7
−
ns
Eon
Turn−On Switching Loss
−
285
−
mJ
Eoff
Turn−Off Switching Loss
−
106
−
mJ
Ets
Total Switching Loss
−
391
−
mJ
Tf
www.onsemi.com
3
FGAF40S65AQ
Table 3. ELECTRICAL CHARACTERISTICS OF THE IGBT (TC = 25°C unless otherwise noted)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
−
19.1
−
ns
−
11.2
−
ns
Turn−Off Delay Time
−
81.6
−
ns
Fall Time
−
9.2
−
ns
Eon
Turn−On Switching Loss
−
552
−
mJ
Eoff
Turn−Off Switching Loss
−
186
−
mJ
Ets
Total Switching Loss
−
738
−
mJ
Qg
Total Gate Charge
−
75
−
nC
Qge
Gate to Emitter Charge
−
15
−
nC
Qgc
Gate to Collector Charge
−
18
−
nC
SWITCHING CHARACTERISTICS
Td(on)
Tr
Td(off)
Tf
Turn−On Delay Time
Rise Time
VCC = 400 V, IC = 20 A,
RG = 6 W, VGE = 15 V,
Inductive Load, TC = 175°C
VCE = 400 V, IC = 40 A,
VGE = 15 V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 4. ELECTRICAL CHARACTERISTICS OF THE DIODE (TC = 25°C unless otherwise noted)
Symbol
VFM
Erec
Parameter
Diode Forward Voltage
Reverse Recovery Energy
Trr
Diode Reverse Recovery Time
Qrr
Diode Reverse Recovery Charge
Test Conditions
IF = 20 A
IF = 20 A,
dIF/dt = 200 A/ms
www.onsemi.com
4
Min
Typ
Max
Unit
TC = 25°C
−
1.2
1.6
V
TC = 175°C
−
1.16
−
TC = 175°C
−
325
−
mJ
TC = 25°C
−
274
−
ns
TC = 175°C
−
362
−
TC = 25°C
−
1596
−
TC = 175°C
−
2651
−
nC
FGAF40S65AQ
TYPICAL CHARACTERISTICS
Figure 1. Typical Output Characteristics
Figure 2. Typical Output Characteristics
Figure 3. Typical Saturation Voltage Characteristics
Figure 4. Saturation Voltage vs. Case
Temperature at Variant Current Level
Figure 5. Saturation Voltage vs. VGE
Figure 6. Saturation Voltage vs. VGE
www.onsemi.com
5
FGAF40S65AQ
TYPICAL CHARACTERISTICS (Continued)
Figure 7. Capacitance Characteristics
Figure 8. Gate Charge Characteristics
Figure 9. Turn−on Characteristics vs.
Gate Resistance
Figure 10. Turn−off Characteristics
vs. Gate Resistance
Figure 11. Switching Loss vs.
Gate Resistance
Figure 12. Turn−on Characteristics vs.
Collector Current
www.onsemi.com
6
FGAF40S65AQ
TYPICAL CHARACTERISTICS (Continued)
Figure 13. Turn−off Characteristics vs.
Collector Current
Figure 14. Switching Loss vs.
Collector Current
Figure 15. Load Current vs. Frequency
Figure 16. SOA Characteristics
Figure 17. Forward Characteristics
Figure 18. Reverse Recovery Current
www.onsemi.com
7
FGAF40S65AQ
TYPICAL CHARACTERISTICS (Continued)
Figure 19. Reverse Recovery Time
Figure 20. Stored Charge
Figure 21. Transient Thermal Impedance of IGBT
www.onsemi.com
8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−3PF−3L
CASE 340AH
ISSUE A
DATE 09 JAN 2015
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 2009.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR UNCONTROLLED IN THIS AREA (6 PLACES).
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR GATE
PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO
EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE MEA
SURED AT THE OUTERMOST EXTREME OF THE PLASTIC BODY.
5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION.
LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.20.
SEATING
PLANE
P
E
A
A1
Q
H1
D
D2
L2
D3
L1
NOTE 3
L
1
3X
2
3
b2
3X
b
b3
DESCRIPTION:
MILLIMETERS
MIN
MAX
5.30
5.70
2.80
3.20
3.10
3.50
1.80
2.20
0.65
0.95
1.90
2.15
3.80
4.20
0.80
1.10
24.30
24.70
24.70
25.30
3.30
3.70
15.30
15.70
5.35
5.55
9.80
10.20
19.10
19.50
4.80
5.20
1.90
2.20
3.40
3.80
4.30
4.70
c
A3
A2
e
DOCUMENT NUMBER:
DIM
A
A1
A2
A3
b
b2
b3
c
D
D2
D3
E
e
H1
L
L1
L2
P
Q
98AON79755E
TO−3PF−3L
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
www.onsemi.com
1
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative