Features
Description
• Compact 4-pin Surface Mount Package
(2.4 mm Maximum Standoff Height)
• Peak Blocking Voltage
– 250V (FODM301X)
– 400V (FODM302X)
– 600V (FODM305X)
• Safety and Regulatory Approvals:
– UL1577, 3,750 VACRMS for 1 Minute
The FODM301X, FODM302X, and FODM305X series
consists of a GaAs infrared emitting diode driving a
silicon bilateral switch housed in a compact 4-pin miniflat package. The lead pitch is 2.54 mm. They are
designed for interfacing between electronic controls and
power triacs to control resistive and inductive loads for
115 V/240 V operations.
– DIN-EN/IEC60747-5-5, 565 V Peak Working
Insulation Voltage
Applications
•
•
•
•
•
•
•
•
•
Industrial Controls
Traffic Lights
Vending Machines
Solid State Relay
Lamp Ballasts
Solenoid/Valve Controls
Static AC Power Switch
Incandescent Lamp Dimmers
Motor Control
Functional Schematic
Package Outlines
ANODE 1
MAIN
4 TERMINAL
CATHODE 2
MAIN
3 TERMINAL
Figure 1. Functional Schematic
©2003 Semiconductor Components Industries, LLC.
October-2017, Rev. 2
Figure 2. Package Outlines
Publication Order Number:
FODM3053-NF098/D
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
FODM3011, FODM3012, FODM3022, FODM3023,
FODM3052, FODM3053
4-Pin Full Pitch Mini-Flat Package Random-Phase Triac
Driver Output Optocouplers
As per DIN EN/IEC 60747-5-5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit
data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Parameter
Characteristics
< 150 VRMS
Installation Classifications per DIN VDE
0110/1.89 Table 1, For Rated Mains Voltage
I–IV
I–III
< 300 VRMS
Climatic Classification
40/100/21
Pollution Degree (DIN VDE 0110/1.89)
2
Comparative Tracking Index
Symbol
175
Value
Unit
Input-to-Output Test Voltage, Method A, VIORM x 1.6 = VPR,
Type and Sample Test with tm = 10 s, Partial Discharge < 5 pC
904
Vpeak
Input-to-Output Test Voltage, Method B, VIORM x 1.875 = VPR,
100% Production Test with tm = 1 s, Partial Discharge < 5 pC
1060
Vpeak
VIORM
Maximum Working Insulation Voltage
565
Vpeak
VIOTM
Highest Allowable Over-Voltage
VPR
DTI
TS
IS,INPUT
Parameter
6000
Vpeak
External Creepage
5
mm
External Clearance
5
mm
0.4
mm
Distance Through Insulation (Insulation Thickness)
Case
Temperature(1)
Input Current(1)
PS,OUTPUT Output Power(1)
RIO
Insulation Resistance at TS, VIO = 500
V(1)
Note:
1. Safety limit values – maximum values allowed in the event of a failure.
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2
150
°C
200
mA
300
mW
>
109
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Safety and Insulation Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. TA = 25°C unless otherwise specified.
Symbol
Parameter
Value
Unit
TSTG
Storage Temperature
-55 to +150
°C
TOPR
Operating Temperature
-40 to +100
°C
Junction Temperature
-40 to +125
°C
260 for 10 sec
°C
TJ
TSOL
Lead Solder Temperature
EMITTER
IF (avg)
Continuous Forward Current
60
mA
IF (pk)
Peak Forward Current (1 μs pulse, 300 pps.)
1
A
VR
Reverse Input Voltage
3
V
PD
Power Dissipation (No derating required over operating temp. range)
100
mW
On-State RMS Current
70
mA
(RMS)
DETECTOR
IT(RMS)
VDRM
Off-State Output Terminal Voltage
FODM3011, FODM3012
250
FODM3022, FODM3023
400
FODM3052, FODM3053
PD
Power Dissipation (No derating required over operating temp. range)
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3
V
600
300
mW
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Absolute Maximum Ratings
TA = 25°C unless otherwise specified.
Individual Component Characteristics
Symbol
Parameter
Test Conditions
Device
Min.
Typ.
Max.
Unit
EMITTER
VF
Input Forward Voltage
IF = 10 mA
All
1.20
1.50
V
IR
Reverse Leakage Current
VR = 3 V, TA = 25°C
All
0.01
100
μA
All
2
100
nA
FODM3011,
FODM3012,
FODM3022,
FODM3023
10
DETECTOR
IDRM
dV/dt
Peak Blocking Current Either Rated V
(2)
DRM, IF = 0
Direction
Critical Rate of Rise of
Off-State Voltage
IF = 0 (Figure 8)(3)
FODM3052,
FODM3053
V/μs
1,000
Notes:
2. Test voltage must be applied within dv/dt rating.
3. This is static dv/dt. See Figure 1 for test circuit Commutating dv/dt is function of the load-driving thyristor(s) only.
Transfer Characteristics
Symbol
IT
IH
VTM
Parameter
LED Trigger Current
Test Conditions
Main Terminal
Voltage = 3 V(4)
Device
Min.
Typ.
Max.
FODM3011,
FODM3022,
FODM3052
10
FODM3012,
FODM3023,
FODM3053
5
Unit
mA
Holding Current, Either
Direction
All
450
Peak On-State Voltage Either I = 100 mA peak
TM
Direction
All
2.2
µA
3
V
Notes:
4. All devices are guaranteed to trigger at an IF value of less than or equal to the max IFT specification. For optimum
operation over temperature and lifetime of the device, the LED should be biased with an IF that is at least 50%
higher than the maximum IFT specification. The IFT should not exceed the absolute maximum rating of 60 mA.
Example: For FODM0353M, the minimum IF bias should be 5 mA x 150% = 7.5 mA
Isolation Characteristics
Symbol
VISO
Parameter
Steady State Isolation
Voltage
Test Conditions
1 Minute,
R.H. = 40% to 60%
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4
Device
All
Min.
3,750
Typ.
Max.
Unit
VACRMS
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Electrical Characteristics
1.8
1000
IDRM - LEAKAGE CURRENT (nA)
VF - FORWARD VOLTAGE (V)
VDRM = 600 V
1.7
1.6
1.5
1.4
TA = -40 °C
1.3
25 °C
1.2
100 °C
1.1
10
1.
0.9
1
10
100
10
1
0.1
-40
100
-20
IF - FORWARD CURRENT (mA)
IFT (TA) / IFT (TA = 25 °C)
10
NORMALIZED TO TA = 25 °C
1
-20
0
20
40
60
20
40
60
80
100
Fig4.LeakageCurrentvs.AmbientTemperature
80
100
TA - AMBIENT TEMPERATURE (°C)
IFT(NORMALIZED)
IH(NORMALIZED)
IH (TA) / IH (TA = 25 °C)
Fig3.LEDForwardVoltagevs.ForwardCurrent
0.1
-40
0
TA - AMBIENT TEMPERATURE (°C)
1.4
VTM = 3 V
NORMALIZED TO TA = 25 °C
1.3
1.2
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE (°C)
Fig 5. Normalized Holding Current vs. Ambient Temperature
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5
Fig 6. Normalized Trigger Current vs. Ambient Temperature
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Typical Performance Characteristics
VDRM(NORMALIZED) = VDRM (TA) / VDRM (TA = 25 °C)
TA = 25 °C
NORMALIZED TO PWIN >> 100 µs
10
8
6
4
2
0
1
10
100
PWIN - LED TRIGGER PULSE WIDTH (µs)
Fig 7. LED Current Required to Trigger vs. LED Pulse Width
1.4
NORMALIZED TO TA = 25 °C
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
-40
-20
0
TA = 25 °C
200
100
0
-100
-200
-300
-400
-3
-2
-1
40
60
80
100
Fig 8. Normalized Off-State Output Terminal Voltage vs. Ambient Temperature
300
-4
20
TA - AMBIENT TEMPERATURE (°C)
400
ITM - ON-STATE CURRENT (mA)
IFT(NORMALIZED) = IFT (P
PWIN) / IFT (PWA >> 100 µs)
12
0
1
2
VTM - ON-STATE VOLTAGE (V)
Fig 9. On-State Characteristics
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6
3
4
FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Typical Performance Characteristics (Continued)
600 V (FODM3052)
(FODM3053)
400 V (FODM3022)
(FODM3023)
250 V (FODM3011)
(FODM3012)
RTEST
Vdc
R = 10 kΩ
CTEST
PULSE
INPUT
MERCURY
WETTED
RELAY
APPLIED VOLTAGE
WAVEFORM
X100
SCOPE
PROBE
D.U.T.
1. The mercury wetted relay provides a high speed
repeated pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst-case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current,
then removing the current. The variable RTEST allows the
dv/dt to be gradually increased until the D.U.T. continues
to trigger in response to the applied voltage pulse, even
after the LED current has been removed. The dv/dt is
then decreased until the D.U.T. stops triggering. τRC is
measured at this point and recorded.
Vmax = 600 V (FODM3052, FODM3053)
= 400 V (FODM3022, FODM3023)
= 250 V (FODM3011, FODM3012)
378 V (FODM3052, FODM3053)
252 V (FOMD3022, FODM3023)
158 V (FODM3011, FODM3012)
dv/dt =
0 VOLTS
0.63 Vmax
τRC
τRC
NOTE: This optoisolator should not be used to drive a load directly. It is
intended to be a trigger device only.
378
= τ
(FODM3053)
RC (FODM3052)
252
= τ
(FODM3023)
RC (FODM3022)
158
= τ
(FODM3011)
RC (FODM3012)
Figure 10. Static dv/dt Test Circuit
RL
Rin
1
VCC
2
4
FODM3011
FODM3012
FODM3022
FODM3023
FODM3052
FODM3053
180 Ω
120 V
60 Hz
3
Figure 11. Resistive Load
ZL
Rin
1
VCC
2
4
FODM3011
FODM3012
FODM3022
FODM3023
FODM3052
FODM3053
180 Ω
2.4 k Ω
120 V
60 Hz
0.1 μF
C1
3
Figure 12. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA)
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FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Typical Application Information
Rin
1
4
360 Ω
470 Ω
HOT
VCC
2
FODM3022
FODM3023
FODM3052
FODM3053
0.05 μF
39 Ω
3
240
VAC
0.01 μF
LOAD
GROUND
In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side.
The 39 Ω resistor and 0.01μF capacitor are for snubbing of the triac, and the 470 Ω resistor and 0.05 μF capacitor are
for snubbing the coupler. These components may or may not be necessary depending upon the particular and load used.
Figure 13. Typical Application Circuit
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FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Typical Application Information (Continued)
Temperature (°C)
TP
260
240
TL
220
200
180
160
140
120
100
80
60
40
20
0
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
tP
Tsmax
tL
Preheat Area
Tsmin
ts
120
240
360
Time 25°C to Peak
Time (seconds)
Profile Freature
Pb-Free Assembly Profile
Temperature Min. (Tsmin)
150°C
Temperature Max. (Tsmax)
200°C
Time (tS) from (Tsmin to Tsmax)
60–120 seconds
Ramp-up Rate (tL to tP)
3°C/second max.
Liquidous Temperature (TL)
217°C
Time (tL) Maintained Above (TL)
60–150 seconds
Peak Body Package Temperature
260°C +0°C / –5°C
Time (tP) within 5°C of 260°C
30 seconds
Ramp-down Rate (TP to TL)
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
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FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Reflow Profile
Part Number
Package
Packing Method
FODM3011
Full Pitch Mini-Flat 4-Pin
Tube (100 units)
FODM3011R2
Full Pitch Mini-Flat 4-Pin
Tape and Reel (2500 Units)
FODM3011V
Full Pitch Mini-Flat 4-Pin, DIN EN/IEC60747-5-5 Option
Tube (100 Units)
FODM3011R2V
Full Pitch Mini-Flat 4-Pin, DIN EN/IEC60747-5-5 Option
Tape and Reel (2500 Units)
Note:
The product orderable part number system listed in this table also applies to the FODM3012, FODM3022, FODM3023,
FODM3052, and FODM3053 products.
Marking Information
1
3011
V X YY
3
4
R
2
6
5
Figure 14. Top Mark
Table 1. Top Mark Definitions
1
ON Semiconductor Logo
2
Device Number
3
DIN EN/IEC60747-5-5 Option (only appears on component ordered with this option)
4
One-Digit Year Code, e.g., “6”
5
Digit Work Week, Ranging from “01” to “53”
6
Assembly Package Code
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FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Ordering Information
K0
P2
P0
t
D0
E
A0
W1
W
B0
d
F
D1
P
2.54 Pitch
Description
Symbol
Dimensions
Tape Width
W
12.00±0.4
Tape Thickness
t
0.35±0.02
Sprocket Hole Pitch
P0
4.00±0.20
Sprocket Hole Dia.
D0
1.55±0.20
Sprocket Hole Location
E
1.75±0.20
Pocket Location
F
5.50±0.20
P2
2.00±0.20
Pocket Pitch
P
8.00±0.20
Pocket Dimension
A0
4.75±0.20
Pocket Hole Dia.
B0
7.30±0.20
K0
2.30±0.20
D1
1.55±0.20
Cover Tape Width
W1
Cover Tape Thickness
d
Max. Component Rotation or Tilt
9.20
0.065±0.02
20° max
Devices Per Reel
2500
Reel Diameter
330 mm (13")
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FODM30XX — 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers
Tape Specifications
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