FPF2286UCX

ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. FPF2286UCX 28 V / 4 A Rated OVP with Low On-resistance FPF2286 is an OVP with integrated low on−resistance single channel switch. The device contains an N−MOSFET that can operate over an input voltage range of 2.8 V to 23 V and can support a maximum continuous current of 4 A. When the input voltage exceeds the over−voltage threshold, the internal FET is turned off immediately to prevent damage to the protected downstream components. FPF2286 is available in a small 6−bump WLCSP package and operate over the free−air temperature range of −40°C to +85°C. www.onsemi.com WLCSP6 CASE 567UV Features • Over−voltage Protection Up to +28 V • Internal Low RDS(on) NMOS Transistors: Typical 25 mW • Programmable Over−voltage Lockout (OVLO) • • • • • • MARKING DIAGRAM ♦ Externally Adjustable via OVLO Pin Active−low Enable Pin (OVLO) for Device Super Fast OVLO Response Time: Typical 40 ns Short Circuit Protection and Auto−restart Over Temperature Protection (Thermal Shutdown) Robust ESD Performance ♦ 2 kV Human Body Model (HBM) ♦ 1 kV Charged Device Model (CDM) ♦ VIN Tolerant to 35 V Residue−voltage during Surge Event These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 3FMG 3F M G = Specific Device Code = Month Code = Pb−Free Package PIN CONNECTIONS 2 1 IN OUT A IN OUT B OVLO GND C Typical Applications • Mobile Phones • PDAs • GPS (Bottom View) ORDERING INFORMATION See detailed ordering, marking and shipping information on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2018 April, 2019 − Rev. 0 1 Publication Order Number: FPF2286UCX/D FPF2286UCX Travel Adapter VBUS HV Battery Charger OUT IN 1uF 1uF FPF2286 R1 Legacy USB / USB Type C connector OVLO R2 GND Figure 1. Application Schematic − Adjustable Option IN OUT Gate Drive 1 . 2V Control OVLO 0 .3 V GND Figure 2. Simplified Block Diagram Table 1. PIN FUNCTION DESCRIPTION Pin No. Pin Name A2, B2 IN Description A1, B1 OUT C2 OVLO OVLO Input: Over Voltage Lockout Adjustment Input C1 GND Ground Power Input: Switch Input and Device Supply Power Output: Switch Output to Load www.onsemi.com 2 FPF2286UCX Table 2. MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage Range (Note 1) Vin −0.3 to 28 V Output Voltage Range Vout −0.3 to (Vin + 0.3) V Adjustable Input Range VOVLO −0.3 to 23 V Internal FET continuous current IOUT 0 to 4 A Maximum Junction Temperature TJ(max) 150 °C TSTG −65 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2 kV ESD Capability, Charged Device Model (Note 2) ESDCDM 1 kV TSLD 260 °C Storage Temperature Range Lead Temperature Soldering Reflow (SMD Styles Only), Pb−Free Versions (Note 3) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe Operating parameters. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Charged Device Model tested per AEC−Q100−011 (EIA/JESD22−C101) Latch−up Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78 3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Table 3. THERMAL CHARACTERISTICS Rating Thermal Characteristics, WLCSP−6 (Note 4) Thermal Resistance, Junction−to−Air (Note 5) Symbol Value Unit RθJA 121.7 °C/W 4. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe Operating parameters. 5. Values based on 2S2P JEDEC std. PCB. Table 4. RECOMMENDED OPERATING RANGES Rating Supply Voltage on VIN I/O pins Symbol Min Max Unit Vin 2.8 23 V VOVLO 0 5.5 V Output Current Iout 0 3.5 A IN Capacitor Cin 0.1 mF OUT Capacitor Cout 0.1 mF TA −40 Ambient Temperature 85 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3 FPF2286UCX Table 5. ELECTRICAL CHARACTERISTICS VIN = 2.8 to 23 V, CIN = 0.1 mF, COUT = 0.1 mF, TA = −40 to 85°C; For typical values VIN = 5.0 V, IIN v 3 A, CIN = 0.1 mF, TA = 25°C, for min/max values TA = −40°C to 85°C; unless otherwise noted. (Note 6) Parameter Test Conditions Symbol Min Typ Max Unit LEAKAGE AND QUIESCENT CURRENTS Input Quiescent Current on VIN VIN = 5 V, VOVLO = 0.6 V IQ 85 VIN = 20 V, VOVLO = 0.6 V mA 200 Supply Current during Over Voltage VIN = 23 V, VOVLO = 3.0 V, VOUT = 0 V IIN_Q 215 OVLO Input Leakage Current VOVLO = VOVLO_TH IOVLO −100 2.3 mA 100 nA 2.7 V OVER VOLTAGE AND UNDER VOLTAGE LOCKOUT Under−Voltage Rising Trip Level for VIN VIN rising, TA = −40 to 85°C VIN_UV_R Under−Voltage Falling Trip Level for VIN VIN falling, TA = −40 to 85°C VIN_UV_F Default Over−Voltage Trip Level VIN rising, TA = −40 to 85°C VIN_OVLO 6.6 6.8 7.0 V OVLO set threshold VOVLO = 1.1 V to 1.3 V, the voltage of OVLO to trigger Over Voltage condition VOVLO_TH 1.16 1.19 1.22 V OVLO threshold hysteresis Adjustable OVLO range 2.5 2.4 VHYS_OVLO V 2 OV_MODE = 0, VOVLO > 0.5 V VOV_RNG 4 High Low VIH_OVLO VIL_OVLO 0.3 − % 23 V I/O THRESHOLDS OVLO Input Threshold Voltage Voltage Increasing, Logic High Voltage Decreasing, Logic Low V − − − 0.15 35 RESISTANCE VIN = 5 V, IOUT = 500 mA, TA = 25°C rON 25 De−bounce Time of Power FET turned on Time from 2.5 V < VIN < VIN_OVLO to VOUT = 0.1 × VIN tSW_DEB 15 ms Switch Turn−On rising Time (Note 8) VIN = 5 V, RL = 100 W, CL = 22 mF, VOUT from 0.1 × VIN to 0.9 × VIN tR 1 ms Switch Turn−Off Time (Note 8) RL = 10 W, CL = 0 mF, time from VIN > VOVLO to VOUT = 0.9 × VIN Internal OVP level External OVP level (Note 9) On−resistance of Power FET mW TIMING ns 40 100 THERMAL SHUTDOWN Thermal Shutdown Temperature (Note 8) TSD − 130 − °C Thermal Shutdown Hysteresis (Note 8) TSH − 20 − °C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 6. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 7. Refer to the APPLICATION INFORMATION section. 8. Values based on design and/or characterization. 9. Depends on the capacitance on OVLO pin. www.onsemi.com 4 FPF2286UCX Function Description Under Voltage Lockout FPF2286 power switch will be turned off when the voltage on IN is lower than the UVLO threshold VIN_UV_F. Whenever VIN voltage ramps up to higher than VIN_UV_R, the power FET will be turned on automatically after tDEB de−bounce time if there is no OV or OT condition. General FPF2286 is an OVP power switch to protect next stage system which is optimized to lower voltage working condition. The device includes ultra low on−resistance power FET (25 mW) and super fast OVP response time (40 ns). Over Voltage Lockout The power FET will be turned off whenever VIN voltage higher than VIN_OVLO. The value of VIN_OVLO can be set by external resistor ladder or just be default value VIN_OVLO. When VOVLO is smaller than VIL_OVLO, VOVLO will be decided by default value. When VOVLO is larger than VIH_OVLO, the power switch will be turned off once VOVLO > VOVLO_TH. The external resistor ladder can be decided according to the following equation: Power MOSFET The FPF2286 integrates an N−type MOSFET with 25 mW resistance. The power FET can work under 2.8 V ~ 23 V and up to 4 A DC current capability. Power Supply The FPF2286 is supplied by IN. IN will be firstly supplied by OUT when the device is working under USB On−The−Go (OTG) condition. V IN_OVLO + V OVLO_TH ǒ1 ) R1ńR2Ǔ (eq. 1) where R1 and R2 are the resistors in Figure 1. Enable Control There is no specified enable pin for FPF2286. However, the OVLO can be used as an active LOW enable pin to be controlled by a GPIO. When OVLO pin is connected to a high level (higher than 1.2 V), the internal FET will be turned off. When OVLO pin is connected to 0 V, the FET will be turned on as long as VIN is not higher than 6.8 V. Thermal Shutdown When the device is in the switch mode, to protect the device from over temperature, the power switch will be turned off when the junction temperature exceeds TSD. The switch will be turned on again when temperature drop below TSD − TSH. APPLICATIONS INFORMATION Input Decoupling (Cin) the FPF2286 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the FPF2286 can handle is given by: A ceramic or tantalum at least 0.1 mF capacitor is recommended and should be connected close to the FPF2286 package. Higher capacitance and lower ESR will improve the overall line and load transient response. P D(MAX) + Output Decoupling (Cout) The FPF2286 is a stable component and does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. The minimum output decoupling value is 0.1 mF and can be augmented to fulfill stringent load transient requirements. ƪTJ(MAX) * TAƫ R qJA (eq. 2) Since TJ is not recommended to exceed 125°C, then the FPF2286 soldered on 645 mm2, 1 oz copper area, and the ambient temperature (TA) is 25°C. The power dissipated by the FPF2286 can be calculated from the following equations: P D [ V in @ ǒI Q@I outǓ ) I out 2 @ r ON Thermal Considerations As power in the FPF2286 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When (eq. 3) Hints Vin and Vout printed circuit board traces should be as wide as possible. Place external components, especially the input capacitor and TVS, as close as possible to the FPF2286, and make traces as short as possible. ORDERING INFORMATION Device FPF2286UCX Default OV Level Marking Package Shipping† 6.8 V 3F WLCSP−6L 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP6 1.3x0.9x0.574 CASE 567UV ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON66547G WLCSP6 1.3x0.9x0.574 DATE 05 JUL 2017 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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