FSA3000L10X-F131

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This literature is subject to all applicable copyright laws and is not for resale in any manner. FSA3000 — Two-Port, High-Speed, MHL™ Switch Features Description  Low On Capacitance: 2.7 pF/4.1 pF MHL/USB (Typical)     Low Power Consumption: 30 μA Maximum The FSA3000 is a bi-directional, low-power, two-port, high-speed, USB2.0 and video data switch that supports the Mobile High-Definition Link (MHL) Specification Rev. 2.0. Configured as a double-pole, double-throw (DPDT) switch for data, FSA3000 is optimized for USB2.0 and MHL data sources. MHL Data Rate: 4.92 Gbps (f3dB = 2.46 GHz) Packaged in 10-Lead MicroPak™ Over-Voltage Tolerance (OVT) on all USB and MHL Ports; Up to 5.25 V without External Components Applications  Cell Phones and Digital Cameras The FSA3000 contains circuitry on the switch I/O pins that allows the device to withstand an over-voltage condition in applications where the VCC supply is powered off (VCC=0). The FSA3000 minimizes current consumption even when the voltage applied to the control pins is lower than the supply voltage (VCC). This feature is especially valuable in mobile applications, such as cell phones; allowing direct interface with the general-purpose I/Os of the baseband processor. Other applications include switching and connector sharing in portable cell phones, digital cameras, and notebook computers. Ordering Information Part Number Top Mark FSA3000L10X LK FSA3000L10X_F131 LK Operating Temperature Range Package 10-Lead, MicroPakTM 1.6 x 2.1 mm JEDEC MO255B -40 to +85°C 10-Lead, MicroPakTM 1.6 x 2.1 mm JEDEC MO255B, Package Rotated 90° in Tape and Reel USB+ D+ MH L+ USB- D- MH LS el C o n tro l /O E Figure 1. Analog Symbol All trademarks are the property of their respective owners. © 2010 Fairchild Semiconductor Corporation FSA3000 • Rev. 1.10 www.fairchildsemi.com FSA3000 — Two-Port, High-Speed, MHL Switch January 2016 SEL (1) (1) /OE Function X HIGH USB and MHL paths both high impedance LOW LOW D+/D- connected to USB+/USB- HIGH LOW D+/D- connected to MHL+/MHL- Note: 1. Control inputs should never be left floating or unconnected. Pin Configurations V cc USB+ 1 USB - 10 9 SEL 2 8 D+ MHL+ 3 7 D- MHL - 4 6 /OE FSA3000 — Two-Port, High-Speed, MHL™ Switch Data Switch Select Truth Table 5 GND Figure 2. Pin Assignments (Top-Through View) Pin Definitions Pin# Name 1 USB+ USB Differential Data (Positive) 2 USB- USB Differential Data (Negative) 3 MHL+ MHL Differential Data (Positive) 4 MHL- MHL Differential Data (Negative) 5 GND Ground 6 /OE Output Enable (Active LOW) 7 D- Data Switch Output (Negative) 8 D+ Data Switch Output (Positive) 9 SEL Data Switch Select 10 VCC Supply © 2010 Fairchild Semiconductor Corporation FSA3000 • Rev. 1.10 Description www.fairchildsemi.com 2 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol VCC VCNTRL Parameter Supply Voltage DC Input Voltage (SEL, /OE) (2) (2,3) VSW DC Switch I/O Voltage IIK DC Input Diode Current Max. Unit -0.5 5.5 V -0.5 VCC V -0.50 5.25 V -50 IOUT DC Output Current TSTG Storage Temperature MSL Moisture Sensitivity Level (JEDEC J-STD-020A) -65 Human Body Model, JEDEC: JESD22-A114 ESD Min. mA 100 mA +150 °C 1 All Pins 3.5 IEC 61000-4-2, Level 4, for D+/D- and VCC Pins (4) Contact 8 IEC 61000-4-2, Level 4, for D+/D- and VCC Pins (4) Air 15 Charged Device Model, JESD22-C101 kV 2 Notes: 2. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed. 3. VSW refers to analog data switch paths (USB and MHL). 4. Testing performed in a system environment using TVS diodes. FSA3000 — Two-Port, High-Speed, MHL™ Switch Absolute Maximum Ratings Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol VCC tRAMP(VCC) VCNTRL JA Parameter Supply Voltage Power Supply Slew Rate Control Input Voltage (SEL, /OE) (5) Min. Max. Unit 2.7 4.3 V 100 1000 µs/V 0 4.3 V 313 C°/W V Thermal Resistance VSW(USB) Switch I/O Voltage (USB Switch Path) -0.5 3.6 VSW(MHL) Switch I/O Voltage (MHL Switch Path) 1.65 3.45 V Operating Temperature -40 +85 °C TA Note: 5. The control inputs must be held HIGH or LOW; they must not float. © 2010 Fairchild Semiconductor Corporation FSA3000 • Rev. 1.10 www.fairchildsemi.com 3 All typical value are at TA=25°C unless otherwise specified. Symbol Parameter Condition VCC (V) VIK Clamp Diode Voltage IIN=-18 mA 2.7 VIH Control Input Voltage High SEL, /OE 2.7 to 4.3 VIL Control Input Voltage Low SEL, /OE 2.7 to 4.3 Control Input Leakage VSW=0 to 3.6 V, VCNTRL=0 to VCC 4.3 IOZ(MHL) Off-State Leakage for Open MHLn Data Paths VSW=1.65 MHL 3.45 V IOZ(USB) Off-State Leakage for Open USBn Data Paths ICL(MHL) ICL(USB) TA= -40ºC to +85ºC Min. Typ. Max. -1.2 1.25 Unit V V 0.6 V -500 500 nA 4.3 -500 500 nA VSW=0 USB 3.6 V 4.3 -500 500 nA On-State Leakage for Closed (6) MHLn Data Paths VSW=1.65 MHL 3.45 V 4.3 -500 500 nA On-State Leakage for Closed (6) USBn Data Paths VSW=0 USB 3.6 V 4.3 -500 500 nA Power-Off Leakage Current (All I/O Ports) VSW=0 V or 3.6 V, Figure 4 0 -500 500 nA RON(USB) HS Switch On Resistance (USB to Dn Path) VSW=0.4 V, ION=-8 mA, Figure 3 2.7 3.5 4.8  RON(MHL) HS Switch On Resistance (MHL to Dn Path) VSW=VCC-1050 mV, ION=-8 mA, Figure 3 2.7 4.7 6.0  Difference in R Between VSW=VCC-1050 mV, ION=-8 mA, Figure 3, 2.7 0.03  ON ∆RON(USB) USB Positive-Negative Difference in R Between VSW=0.4V, ION=-8mA, Figure 3 2.7 0.18  RONF(MHL) Flatness for RON MHL Path VSW=1.65 to 3.45 V, ION=-8 mA, Figure 3 2.7 0.9  IIN IOFF ON ∆RON(MHL) MHL Positive-Negative ICC Quiescent Supply Current V/OE=0, VSEL=0 or VCC, IOUT=0 4.3 30 µA ICCZ Quiescent Supply Current (High Impedance) VSEL=X, V/OE=VCC, IOUT=0 4.3 1 µA ICCT Increase in Quiescent Supply Current VSEL=X, V/OE =1.65 V 4.3 10 µA 5 FSA3000 — Two-Port, High-Speed, MHL™ Switch DC Electrical Characteristics Note: 6. For this test, the data switch is closed with the respective switch pin floating. © 2010 Fairchild Semiconductor Corporation FSA3000 • Rev. 1.10 www.fairchildsemi.com 4 All typical value are for VCC=3.3 V and TA=25°C unless otherwise specified. Symbol Parameter Condition VCC (V) TA= -40ºC to +85ºC Unit Min. Typ. Max. tON MHL Turn-On Time, SEL to Output RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V, VSW(MHL)=3.3 V, Figure 5, Figure 6 2.7 to 3.6 V 350 600 ns tOFF MHL Turn-Off Time, SEL to Output RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V, VSW(MHL)=3.3 V, Figure 5, Figure 6 2.7 to 3.6 V 125 300 ns tZHM,ZLM MHL Enable Time, /OE to Output RL=50 Ω, CL=5 pF, VSW(MHL)=3.3 V, Figure 5, Figure 6 2.7 to 3.6 V 60 150 µs tZHU,ZLU USB Enable Time, /OE to Output RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V, Figure 5, Figure 6 2.7 to 3.6 V 100 300 ns tLZM,HZM MHL Disable Time, /OE to Output RL=50 Ω, CL=5 pF, VSW(MHL)=3.3 V, Figure 5, Figure 6 2.7 to 3.6 V 35 100 ns tLZU,HZU USB Disable Time, /OE to Output RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V, Figure 5, Figure 6 2.7 to 3.6 V 35 100 ns tPD Propagation Delay CL=5 pF, RL=50 Ω, Figure 5, Figure 7 2.7 to 3.6 V 0.25 tBBM Break-Before-Make RL=50 Ω, CL=5 pF, VID=VMHL=3.3 V, VUSB= 0.8 V, Figure 9 2.7 to 3.6 V VS=1 Vpk-pk, RL=50 Ω, f=240 MHz, Figure 11 2.7 to 3.6 V -55 dB VS=400 mVpk-pk, RL=50 Ω, f=240 MHz, Figure 11 2.7 to 3.6 V -45 dB VS=1 Vpk-pk, R=50 Ω, f=240 MHz, Figure 12 2.7 to 3.6 V -47 dB VS=400 mVpk-pk, RL=50 Ω, f=240 MHz, Figure 12 2.7 to 3.6 V -45 dB (7) (7) OIRR(MHL) Off Isolation (7) OIRR(USB) XtalkMHL XtalkUSB BW (Insertion Loss) Non-Adjacent (7) Channel Crosstalk Differential (7) -3db Bandwidth VIN=1 Vpk-pk, MHL Path, RL=50 Ω, CL=0 Pf, Figure 10, Figure 15 VIN=400 mVpk-pk, USB Path, RL=50 Ω, CL=0 pF, Figure 10, Figure 16 2.7 to 3.6 V 2 ns 13 FSA3000 — Two-Port, High-Speed, MHL™ Switch AC Electrical Characteristics ns 2.46 GHz 1.22 Note: 7. Guaranteed by characterization. © 2010 Fairchild Semiconductor Corporation FSA3000 • Rev. 1.10 www.fairchildsemi.com 5 Typical values are for VCC=3.3 V and TA=25°C unless otherwise specified. Symbol tSK(P) tJ Parameter Condition Skew of Opposite Transitions of the (8) Same Output Total Jitter (8) VCC (V) Typ. Unit CL=5 pF, RL=50 Ω, Figure 8 3.0 to 3.6 6 ps RL=50 Ω, CL=5 pf, tR=tF=500 ps (10-90%) at 480 Mbps, PN7 3.0 to 3.6 15 ps VCC (V) Typ. Unit RPU=50 to VCC, CL=0 pF 3.0 to 3.6 V 6 ps f=2.25 Gbps, PN7, RPU=50 to VCC, CL=0 pF 3.0 to 3.6 V 15 ps Max. Unit Note: 8. Guaranteed by characterization. MHL AC Electrical Characteristics Typical values are for VCC=3.3 V and TA=25°C unless otherwise specified. Symbol tSK(P) tJ Parameter Condition Skew of Opposite Transitions of the (9) Same Output Total Jitter (9) FSA3000 — Two-Port, High-Speed, MHL™ Switch USB High-Speed AC Electrical Characteristics Note: 9. Guaranteed by characterization. Capacitance Typical values are for VCC=3.3 V and TA=25°C unless otherwise specified. Symbol CIN Parameter Condition Typ. VCC=0 V, f=1 MHz 2.1 USB Path On Capacitance (10) VCC=3.3 V, f=240 MHz, Figure 14 4.1 5.0 pF COFF(USB) USB Path Off Capacitance (10) VCC=3.3 V, f=240 MHz, Figure 13 2.8 3.2 pF CON(MHL) MHL Path On Capacitance (10) VCC=3.3 V, f=240 MHz, Figure 14 2.7 3.0 pF MHL Path Off Capacitance (10) VCC=3.3 V, f=240 MHz, Figure 13 1.1 1.5 pF CON(USB) COFF(MHL) Control Pin Input Capacitance (10) pF Note: 10. Guaranteed by characterization, not production tested. © 2010 Fairchild Semiconductor Corporation FSA3000 • Rev. 1.10 www.fairchildsemi.com 6 Note: 11. HSD refers to the high-speed data on USB or MHL paths. VON I Dn(OFF) NC A HSDn Dn VSW VSW Select GND I ON GND Select = VO / ION RO N V Se l = V Sel = GND 0 or VCC 0 orV V cc **Each switch port is tested separately N Figure 3. On Resistance HSD n Figure 4. Off Leakage tRISE = 2.5ns Dn VSW GND RS tFALL = 2.5ns FSA3000 — Two-Port, High-Speed, MHL™ Switch Test Diagrams RL CL VCC VOUT 90% Input – VSEL. /OE GND VSel VCNTRL-HI 10% GND 90% VCNTRL-HI 10% VOH GND 90% 90% Output- VOUT RL , RS and CL are function of application environment (see AC Tables for specific values) CL includes test fixture and stray capacitance VOL Figure 5. AC Test Circuit Load tO N tO FF Figure 6. Turn-On / Turn-Off Waveforms tRISE = 500ps tFALL = 500ps +400mV 90% 0V - 400mV 10% 90% 10% Output t PHL Figure 7. Propagation Delay (tRtF – 500 ps) © 2010 Fairchild Semiconductor Corporation FSA3000 • Rev. 1.10 t PLH Figure 8. Intra-Pair Skew Test tSK(P) www.fairchildsemi.com 7 tRISE = 2.5ns Vcc HSDn VSW1 0V VOUT GND CL VSW2 90% Vcc/2 Input VSel 10% Dn RL VOUT GND GND 0.9*Vout 0.9*Vout RS tBBM VSel RL , RS and CL are function of application GND environment (see AC Tables for specific values) CL includes test fixture and stray capacitance Figure 9. Break-Before-Make Interval Timing Network Analyzer VS Network Analyzer FSA3000 RS RS VIN RT VOUT RT GND RS VS Network Analyzer RT VIN VSel VOUT V IN VS GND GND V OUT GND GND GND FSA3000 — Two-Port, High-Speed, MHL™ Switch Test Diagrams (Continued) GND RS and RT are functions of the application environment (see AC Tables for specific values). VS, RS and RT are function of application environment (see AC/DC Tables for values) RT GND Off isolation = 20 Log (V OUT / VIN) Figure 10. Insertion Loss Figure 11. Channel Off Isolation Network Analyzer NC RS V IN GND VS VSel GND GND RT GND GND RT RS and RT are functions of the application environment (see AC Tables for specific values). V OUT GND Crosstalk = 20 Log (VOUT / VIN) Figure 12. Non-Adjacent Channel-to-Channel Crosstalk HSDn Capacitance Meter S Capacitance Meter S VSel = 0 or Vcc V Sel = 0 or Vcc HSDn HSDn Figure 13. Channel Off Capacitance © 2010 Fairchild Semiconductor Corporation FSA3000 • Rev. 1.10 HSDn Figure 14. Channel On Capacitance www.fairchildsemi.com 8 Typical Application One of the key factors for the FSA3000 in mobile digital video applications is the small amount of insertion loss in the received signal as it passes through the switch. This results in minimal degradation of the received eye. One of the ways to measure the quality of the high data rate channels is using balanced ports and 4-port differential S-parameter analysis, particularly SDD21. Figure 17 shows a typical mobile application using the FSA3000 for MHL switching. The FSA3157 is used for OTG dual-role device implementations where the CBUS of MHL and the ID pin for USB needs to be switched. The 3M resistor for MHL_SEL is optional to ensure that on power up the USB switch path is selected as default. VBAT Bandwidth is measured using the S-parameter SDD21 methodology. Figure 15 shows the bandwidth (GHz) for the MHL path and Figure 16 shows the bandwidth curve for the USB path. To USB Battery Charging Block Baseband or Application Processor VBUS Vcc USB_D+ USB_D- HDMI to MHL MHL+ Bridge MHL- USB+ USB- D+ FSA3000 D- MHL+ D+ DID GND MHL- CBUS Sel MHL_SEL 3M /OE MicroUSB Connector Enable GND FSA3157 ID_USB Figure 17. Typical Mobile MHL Application FSA3000 — Two-Port, High-Speed, MHL™ Switch Insertion Loss Figure 15. MHL (MDV) Path SDD21 Insertion Loss Curve Figure 16. USB Path SDD21 Insertion Loss Curve © 2010 Fairchild Semiconductor Corporation FSA3000 • Rev. 1.10 www.fairchildsemi.com 9 FSA3000 — Two-Port, High-Speed, MHL™ Switch Packing Specifications Figure 18. MicroPakTM 1.6 x 2.1 mm, Packing Drawing, Page 1 © 2010 Fairchild Semiconductor Corporation FSA3000 • Rev. 1.10 www.fairchildsemi.com 10 FSA3000 — Two-Port, High-Speed, MHL™ Switch Packing Specifications (Continued) Figure 19. MicroPakTM 1.6 x 2.1 mm, Packing Drawing, Page 2 © 2010 Fairchild Semiconductor Corporation FSA3000 • Rev. 1.10 www.fairchildsemi.com 11 A 2.10±0.10 PIN#1 IDENT IS 2X LONGER THAN OTHER LINES B 1.60±0.10 1.62 KEEPOUT ZONE, NO TRACES OR VIAS ALLOWED (0.11) TOP VIEW 0.025±0.025 0.50±0.05 1.12 0.56 C (0.35) 10X SIDE VIEW (0.25) 10X 0.50 C (0.36) 2X RECOMMENDED LAND PATTERN 0.60±0.05 (0.09) 10X DETAIL A 1 4 0.20±0.05 (0.10±0.10) 0.20±0.05 0.56 5 10 0.30±0.05 9X (0.31) 9 0.30±0.05 0.15±0.05 6 0.50 1.62 (0.20) BOTTOM VIEW 0.20±0.05 9X 0.10 C A B 0.05 C ALL FEATURES NOTES: A. PACKAGE CONFORMS TO JEDEC REGISTRATION MO-255, VARIATION UABD. B. DIMENSIONS ARE IN MILLIMETERS. C. PRESENCE OF CENTER PAD IS PACKAGE SUPPLIER DEPENDENT. IF PRESENT IT IS NOT INTENDED TO BE SOLDERED AND HAS A BLACK OXIDE FINISH. D. DRAWING FILENAME: MKT-MAC10ArevG. E. DIMENSIONS WITHIN ( ) ARE UNCONTROLLED. 0.30±0.05 DETAIL A SCALE 2:1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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