0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
GJM1555C1H1R0WB01D

GJM1555C1H1R0WB01D

  • 厂商:

    MURATA-PS(村田)

  • 封装:

    0402

  • 描述:

    贴片电容(MLCC) 0402 1pF ±0.05pF 50V C0G(NP0)

  • 数据手册
  • 价格&库存
GJM1555C1H1R0WB01D 数据手册
Only Reflow Soldering CHIP MONOLITHIC CERAMIC CAPACITOR HIGH-Q TYPE FOR GENERAL GJM1555C1H1R0WB01_ (0402, C0G, 1pF, 50Vdc) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor High-Q Type used for General Electronic equipment.   This product is applied for Only Reflow Soldering. 2.MURATA Part NO. System (Ex.) GJM 15 (1)L/W Dimensions 5 5C (2)T Dimensions 1H (3)Temperature Characteristics 1R0 (4)DC Rated Voltage W (5)Nominal (6)Capacitance Tolerance Capacitance B01 3. Type & Dimensions L W T e g e (Unit:mm) g (1)-1 L (1)-2 W (2) T e 1.0±0.05 0.5±0.05 0.5±0.05 0.15 to 0.35 0.3 min. 4.Rated value (3) Temperature Characteristics (Public STD Code):C0G(EIA) Temp. coeff Temp. Range or Cap. Change (Ref.Temp.) 0±30 ppm/°C 25 to 125 °C (25 °C) (4) DC Rated Voltage 50 Vdc (6) (5) Nominal Capacitance Capacitance Tolerance 1 pF ±0.05 pF Specifications and Test Methods (Operationg Temp. Range) -55 to 125 °C 5.Package mark D W J (8) Packaging f180mm Reel PAPER W8P2 f180mm Reel PAPER W8P1 f330mm Reel PAPER W8P2 Packaging Unit 10000 pcs./Reel 20000 pcs./Reel 50000 pcs./Reel Product specifications in this catalog are as of Jan.25,2013,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and !Cautions first. GJM1555C1H1R0WB01-01 1 D (7)Murata’s (8)Packaging Code Control Code ■SPECIFICATIONS AND TEST METHODS No Item 1 Operating Temperature Range Specification △C:-55℃ to 125℃ Test Method Reference Temperature:20℃(2C,3C,4C) 25℃ (5C,6C) 2 Rated Voltage See the previous pages. The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, should be maintained within the rated voltage range. 3 Appearance No defects or abnormalities. Visual inspection. 4 Dimension Within the specified dimensions. Using calipers. (GJM02 size is based on Microscope) 5 Dielectric Strength No defects or abnormalities. No failure should be observed when 300% of the rated voltage is applied between the terminations for 1 to 5 seconds, provided the charge/discharge current is less than 50mA. 6 Insulation Resistance C≦0.047μ F:More than 10000MΩ C>0.047μ F:More than 500Ω·F The insulation resistance should be measured with a DC voltage not exceeding the rated voltage at 20℃/25℃ and 75%RH max. and within 2 minutes of charging, provided the charge/discharge current is less than 50mA. C:Nominal Capacitance 7 Capacitance Within the specified tolerance. 8 Q 30pF and over:Q≧1000 30pF and below:Q≧400+20C The capacitance/D.F. should be measured at 20℃/25℃at the frequency and voltage shown in the table. (1)Temperature Compensating Type C:Nominal Capacitance(pF) 9 Capacitance Temperature Within the specified tolerance.(Table A) Capacitance Frequency Voltage C≦1000pF 1±0.1MHz 0.5 to 5Vrms The capacitance change should be measured after 5min. at each specified temp.stage. The temperature coefficient is determind using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5 the capacitance should be within the specified tolerance for the temperature coefficient and capacitance change as Table A. The capacitance drift is caluculated by dividing the differences between the maximum and minimum measured values in the step 1,3 and 5 by the cap.value in step 3. Temperature Coefficent Characteristics Capacitance Within ±0.2% or ±0.05pF Drift (Whichever is larger.) Step 1 2 3 4 5 10 Adhesive Strength of Termination 11 Vibration Resistance No removal of the terminations or other defect Solder the capacitor on the test jig (glass epoxy board) shown in should occur. Fig.3 using an eutectic solder. Then apply 5N* force in parallel with the test jig for 10±1sec. The soldering should be done either with an iron or using the reflow method and should be conducted with care so that the soldering is uniform and free of defects such as heat shock. *1N(GJM02), 2N(GJM03) Appearance No defects or abnormalities. Solder the capacitor on the test jig (glass epoxy board) in the same manner and under the same conditions as (10). The capacitor should be subjected to a simple harmonic motion having a total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return to 10Hz, should be traversed in approximately 1 minute. This motion should be applied for a period of 2 hours in each 3 mutually perpendicular directions(total of 6 hours). Capacitance Within the specified tolerance. Q 30pF and over:Q≧1000 30pF and beloow:Q≧400+20C C:Nominal Capacitance(pF) 12 Deflection Appearance No defects or abnormalities. Solder the capacitor on the test jig (glass epoxy board) shown in Fig.1 using an eutectic solder. Then apply a force in the direction shown in Fig 2 for 5±1 seconds. The soldering should be done by the reflow method and should be conducted with care so that the soldering is uniform and free of defects such as heat shock. Capacitance Within ±5% or ±0.5pF Change (Whichever is larger) JEMCGS-0004H Temperature(C) Reference Temp.±2 -55±3 Reference Temp.±2 125±3 Reference Temp.±2 2 ■SPECIFICATIONS AND TEST METHODS Item No 13 Solderability of Termination 14 Resistance to Soldering Heat Specification Test Method 75% of the terminations is to be soldered evenly Immerse the capacitor in a solution of ethanol (JIS-K-8101) and and continuously. rosin (JIS-K-5902) (25% rosin in weight propotion) . Preheat at 80 to 120℃ for 10-to 30 seconds. After preheating, immerse in an eutectic solder solution for 2±0.5 seconds at 230±5℃ or Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±5℃. Appearance No defects or abnormalities. Preheat the capacitor at 120 to 150℃ for 1 minute. Immerse the capacitor in an eutectic solder solution* or Sn-3.0Ag-0.5Cu solder solution at 270±5℃ for 10±0.5 seconds. Let sit at room temperature for 24±2 hours, then measure. (only GJM02: Reflow method) *Not apply to GJM02 Capacitance Within ±2.5% or ±0.25pF Change (Whichever is larger) Q 30pF and over:Q≧1000 30pF and beloow:Q≧400+20C C:Nominal Capacitance(pF) I.R. 15 Temperature Cycle More than 10,000MΩ or 500Ω·F (Whichever is smaller) No defects. Dielectric Strength Appearance No defects or abnormalities. Fix the capacitor to the supporting jig in the same manner and under the same conditions as (10). Perform the five cycles according to the four heat treatments shown in the following table. Let sit for 24±2 hours at room temperature, then measure. Capacitance Within ±2.5% or ±0.25pF Change (Whichever is larger) Q 30pF and over:Q≧1000 30pF and beloow:Q≧400+20C C:Nominal Capacitance(pF) I.R. 16 Humidity (Steady State) More than 10,000MΩ or 500Ω·F (Whichever is smaller) No defects. Dielectric Strength Appearance No defects or abnormalities. Capacitance Within ±5% or ±0.5pF Change (Whichever is larger) Q 30pF and over:Q≧350 10pF and over, 30pF and below:Q≧275+5C/2 10pF and below:Q≧200+10C Step Temp.(C) 1 Min. Operating Temp.+0/-3 Time (min) 30±3 2 Room Temp 2 to 3 3 Max. Operating Temp.+3/-0 30±3 4 Room Temp 2 to 3 Set the capacitor at 40±2℃ and in 90 to 95% humiduty for 500±12 hours. Remove and set for 24±2 hours at room temperature, then measure. C:Nominal Capacitance(pF) More than 1,000MΩ or 50Ω·F (Whichever is smaller) Appearance No defects or abnormalities. I.R. 17 Humidity Load Apply the rated voltage at 40±2℃ and 90 to 95% humidity for 500±12 hours. Remove and set for 24±2 hours at room temprature, then muasure. The charge/discharge current is less than 50mA. Capacitance Within ±7.5% or ±0.75pF Change (Whichever is larger) Q 30pF and over:Q≧200 30pF and below:Q≧100+10C/3 C:Nominal Capacitance(pF) I.R. JEMCGS-0004H More than 500MΩ or 25Ω·F (Whichever is smaller) 3 ■SPECIFICATIONS AND TEST METHODS No Item Specification 18 High Temperature Appearance No defects or abnormalities. Load Capacitance Within ±3% or ±0.3pF Change (Whichever is larger) Q Test Method Apply 200% of the rated voltage at the maximum operating temperature±3℃ for 1000±12 hours. Set for 24±2 hours at room temperature, then measure. The charge/discharge current is less than 50mA. 30pF and over:Q≧350 10pF and over, 30pF and below: Q≧275+5C/2 10pF and below:Q≧200+10C C:Nominal Capacitance (pF) I.R. 19 ESR (GJM03/GJM15) ESR (GJM02) More than 1,000MΩ or 50Ω·F (Whichever is smaller) 0.1pF≦C≦1pF :350mΩ/pF below 1pF
GJM1555C1H1R0WB01D 价格&库存

很抱歉,暂时无法提供与“GJM1555C1H1R0WB01D”相匹配的价格&库存,您可以联系我们找货

免费人工找货
GJM1555C1H1R0WB01D
  •  国内价格
  • 10+0.34414
  • 100+0.31341
  • 500+0.28269
  • 1000+0.25196
  • 2000+0.23148
  • 4000+0.22533

库存:10