CHIP MONOLITHIC CERAMIC CAPACITOR
GNM314R61A105MA13_ (1206, X5R, 1uF, 10Vdc)
_: packaging code
Reference Sheet
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor, Capacitor Arrays used for General Electronic
equipment.
2.MURATA Part NO. System
(Ex.)
GNM
31
4
R6
1A
105
M
A13
D
(2)Number of (3)Temperature (4)DC Rated (5)Nominal (6)Capacitance (7)Murata’s (8)Packaging
(1)L/W
Code
Elements Characteristics
Voltage
Capacitance Tolerance
Dimensions
Control Code
3. Type & Dimensions
L
T
W
P
(1)-1 L
(1)-2 W
(2) T
3.2±0.15
1.6±0.15
0.85±0.1
(Unit:mm)
p
0.8±0.1
4.Rated value
(3) Temperature Characteristics
(Public STD Code):F(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
-15 to 15 %
-55 to 85 °C
(25 °C)
(4)
DC Rated
Voltage
10 Vdc
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
1 uF
±20 %
Specifications and Test
Methods
(Operationg
Temp. Range)
-55 to 85 °C
5.Package
mark
D
J
B
(8) Packaging
f180mm Reel
PAPER
f330mm Reel
PAPER
Bulk Bag
Packaging Unit
4000 pcs./Reel
10000 pcs./Reel
1000 pcs./Bag
Product specifications in this catalog are as of Feb.15,2012,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GNM314R61A105MA13-01
1
■SPECIFICATIONS AND TEST METHODS
Specification
No
Item
1 Operating
Temperature Range
2 Rated Voltage
Temperature
Compensating Type
Δ C : －55℃ to 125℃
Test Method
High Dielectric Type
B1,F1 ：－25℃ to 85℃
R1,R7 ：－55℃ to 125℃
R6 ：－55℃ to 85℃
F5：－30℃ to 85℃
See the previous pages.
Standard Temperature : 20℃
(5C,R6,R7,F5 : 25℃)
The rated voltage is defined as the maximum voltage which may
be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated voltage
range.
3 Appearance
No defects or abnormalities.
Visual inspection.
4 Dimension
Within the specified dimensions.
Using calipers.
5 Dielectric Strength
No defects or abnormalities.
No failure should be observed when 300% of the rated voltage
(temperature compensating type) or 250% of the rated voltage
(high dielectric constant type) is applied between the terminations
for 1 to 5 seconds, provided the charge/discharge current is less
than 50mA.
6 Insulation
Resistance
More than 10,000MΩ or 500Ω ∙F
(whichever is smaller)
The insulation resistance should be measured with a DC voltage
not exceeding the rated voltage at 20/25℃ and 75%RH max.
and within 2 minutes of charging, provided the charge/discharge
current is less than 50mA.
7 Capacitance
Within the specified tolerance.
The capacitance/D.F. should be measured at 20/25℃ at the
frequency and voltage shown in the table.
8 Q/Dissipation
Factor (D.F.)
Char.
Item
Frequency
Voltage
30pF and over:Q≧1000
［B1,R1,R6,R7］
30pF and below:Q≧400+20C W.V.: 25Vmin. :0.025max.
C:Nominal Capacitance(pF)
W.V.:16V
W.V.:6.3V
:0.035max.
:0.05max.
2C,5C
B1,R1,R6,R7,F1,F5
1±0.1MHz
0.5 to 5Vrms
1±0.1kHz
1.0±0.2Vrms
[F1,F5]
W.V.:25Vmin : 0.05max.
W.V.:16V : 0.07max.
9 Capacitance
No bias
Temperature
Characteristics
Within the specified
tolerance.(Table A-1,A-2)
50% of
the rated
voltage
Capacitance
Drift
B1 : Within ±10%
(-25℃ to +85℃)
R1,R7 : Within ±15%
(-55℃ to +125℃)
R6 : Within ±15%
(-55℃ to +85℃)
F1 : Within +30/-80%
(-25℃ to +85℃)
F5 : Within +22/-82%
(-30℃ to +85℃)
B1 : Within +10/-30%
R1 : Within +15/-40%
F1 : Within +30/-95%
Within±0.2% or±0.05pF
(Whichever is larger.)
The capacitance change should be measured after 5min. at each
specified temp.stage.
(1)Temperature Compensating Type
The temperature coefficient is determind using the capacitance
measured in step 3 as a reference.
When cycling the temperature sequentially from step 1 through
5, the capacitance should be within the specified tolerance for
the temperature coefficient and capacitance change as Table A-1,A-2.
The capacitance drift is caluculated by dividing the differences
between the maximum and minimum measured values in the step
1,3 and 5 by the cap.value in step 3.
(2)High Dielectric Constant Type
The ranges of capacitance change compared with the 20℃/25℃
value over the temperature ranges shown in the table should be
within the specified ranges.
Step
Temperature(C)
1
20±2/25±2
-55±3(for R1,R6,R7)/
-25±3(for B1,F1)/
-30±3(for F5)
20±2/25±2
125±3(for R1,R7)/
85±3(for B1,R6,F1,F5)
20±2
-55±3(for R1)/
-25±3(for B1,F1)
20±2
125±3(for R1)/
85±3(for B1,F1)
2
3
4
5
6
7
8
Applying
Voltage(V)
No bias
50% of the
rated voltage
Initial measurement for high dielectric constant type
Perform a heat treatment at 150 +0/-10°C for one hour and then set
for 24±2 hours at room temperature.
Perform the initial measure-ment.
10 Adhesive Strength
of Termination
JEMCCS-0001K
No removal of the terminations or other defect
should occur.
2
Solder the capacitor on the test jig (glass epoxy board)shown in
Fig.3 using a eutectic solder. Then apply 5N force in parallel
with the test jig for 10±1sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
■SPECIFICATIONS AND TEST METHODS
Specification
No
Item
11 Vibration
Temperature
Compensating Type
Appearance
No defects or abnormalities.
Capacitance
Within the specified tolerance.
Q/D.F.
30pF and over:Q≧1000
Test Method
High Dielectric Type
Solder the capacitor on the test jig (glass epoxy board) in
Resistance
the same manner and under the same conditions as (10).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
［B1,R1,R6,R7］
30pF and beloow:Q≧400+20C W.V.: 25Vmin. :0.025max.
C:Nominal Capacitance(pF)
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
W.V.:16V
:0.035max.
traversed in approximately 1 minute. This motion should be
W.V.:6.3V
:0.05max.
applied for a period of 2 hours in each 3 mutually perpendicular
directions(total of 6 hours).
[F1,F5]
W.V.:25Vmin : 0.05max.
W.V.:16V
12 Deflection
Appearance
: 0.07max.
No defects or abnormalities.
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig.1 using an eutectic solder. Then apply a force in the direction
Capacitance
Change
Within ±5% or± 0.5pF
(Whichever is larger)
Within ±10%
shown in Fig 2 for 5±1 seconds. The soldering should be done
by the reflow method and should be conducted with care so that
the soldering is uniform and free of defects such as heat shock.
13 Solderability
of Termination
75% of the terminations is to be soldered evenly and
continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight propotion) .
Preheat at 80 to 120℃ for 10 to 30 seconds.
After preheating , immerse in an eutectic solder solution for
2±0.5 seconds at 230±5℃.
14 Resistance to
Soldering Heat
The measured and observed characteristics should satisfy Preheat the capacitor at 120 to 150℃ for 1 minute.
Immerse the capacitor in an eutectic solder solution at
the specifications in the following table.
270±5℃ for 10±0.5 seconds.
Appearance
No defects or abnormalities.
Let Sit at room temperature for 24±2 hours, then measure.
Capacitance Within ±2.5% or± 0.25pF
B1,R1,R6,R7 :Within ±7.5%
Change
(Whichever is larger)
F1,F5
Q/D.F.
30pF and over:Q≧1000
:Within ±20%
［B1,R1,R6,R7］
30pF and beloow:Q≧400+20C W.V.: 25Vmin. :0.025max.
W.V.:16V
:0.035max.
C:Nominal Capacitance(pF)
W.V.:6.3V
:0.05max.
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10C for one hour and
then set at room temperature for 24±2 hours.
Perform the initial measurement.
[F1,F5]
W.V.:25Vmin : 0.05max.
W.V.:16V : 0.07max.
I.R.
More than 10,000MW or 500W·F(Whichever is smaller)
Dielectric
No defects.
Strength
15 Temperature Cycle
The measured and observed characteristics should satisfy Fix the capacitor to the supporting jig in the same
manner and under the same conditions as (10).
the specifications in the following table.
Perform the five cycles according to the four heat
Appearance
No defects or abnormalities.
treatments shown in the following table.
Set for 24±2 hours at room temperature, then measure.
Capacitance Within ±2.5% or± 0.25pF
Change
(Whichever is larger)
Q/D.F.
B1,R1,R6,R7 :Within ±7.5%
F1,F5
:Within ±20%
［B1,R1,R6,R7］
30pF and beloow:Q≧400+20C W.V.: 25Vmin. :0.025max.
W.V.:16V
:0.035max.
C:Nominal Capacitance(pF)
W.V.:6.3V
:0.05max.
30pF and over:Q≧1000
[F1,F5]
W.V.:25Vmin : 0.05max.
W.V.:16V : 0.07max.
Step
Temp.(C)
Time (min)
1
Min.
Operating Temp.+0/-3
30±3
2
Room Temp
2 to 3
3
Max.
Operating Temp.+3/-0
30±3
4
Room Temp
2 to 3
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10C for one hour and
then set at room temperature for 24±2 hours.
I.R.
More than 10,000MW or 500W·F(Whichever is smaller)
Dielectric
No defects.
Strength
JEMCCS-0001K
3
Perform the initial measurement.
■SPECIFICATIONS AND TEST METHODS
Specification
No
Item
16 Humidit
Steady State
Appearance
Capacitance
Change
Q/D.F.
Temperature
High Dielectric Type
Compensating Type
The measured and observed characteristics should satisfy
the specifications in the following table.
No defects or abnormalities.
Within ±5% or± 0.5pF
(Whichever is larger)
30pF and over:Q≧350
10pF and over
30pF and below:Q≧275+5/2C
10pF and below:Q≧200+10C
B1,R1,R6,R7 :Within ±12.5%
F1,F5
:Within ±30%
［B1,R1,R6,R7］
W.V.: 25Vmin. :0.05max.
W.V.:16/10/6.3V :0.05max.
C:Nominal Capacitance(pF)
[F1,F5]
W.V.:25Vmin : 0.075max.
W.V.:16V : 0.1max.
I.R.
More than 1,000MW or 50W·F(Whichever is smaller)
Dielectric
Strength
No failure.
17 Humidity Load
Test Method
Set the capacitor at 40±2℃ and in 90 to 95% humiduty
for 500±12 hours.
Remove and set for 24±2 hours at room temperature, then
measure.
The measured and observed characteristics should satisfy
the specifications in the following table.
Apply the rated voltage at 40±2℃ and 90 to 95% humidity
for 500±12 hours. Remove and set for 24±2 hours at room
temprature then muasure. The charge/discharge current is
Appearance
No defects or abnormalities.
less than 50mA.
Capacitance
Change
Within ±7.5% or±0.75pF
(Whichever is larger)
B1,R1,R6,R7 :Within ±12.5%
F1,F5
:Within ±30%
Q/D.F.
30pF and over:Q≧200
30pF and below:Q≧100+10/3C
［B1,R1,R6,R7］
W.V.: 25Vmin. :0.05max.
W.V.:16/10/6.3V :0.05max.
C:Nominal Capacitance(pF)
[F1,F5]
W.V.:25Vmin : 0.075max.
W.V.:16V : 0.1max.
I.R.
More than 500MΩ or 25Ω·F(Whichever is smaller)
Dielectric
Strength
No failure.
18 High Temperature
Load
Appearance
Capacitance
Change
The measured and observed characteristics should satisfy
the specifications in the following table.
No defects or abnormalities.
Within ±3% or ±0.3pF
(Whichever is larger)
B1,R1,R6,R7 :Within ±12.5%
F1,F5
:Within ±30%
Q/D.F.
30pF and over:Q≧350
［B1,R1,R6,R7］
10pF and over
W.V.: 25Vmin. :0.04max.
30pF and below: Q≧275+5/2C W.V.:16/10/6.3V :0.05max.
10pF and below:Q≧200+10C
[F1,F5]
C:Nominal Capacitance (pF)
W.V.:25Vmin : 0.075max.
W.V.:16V : 0.1max.
I.R.
More than 1,000MW or 50W·F(Whichever is smaller)
Table A-1
Capacitance Change from 20C (%)
-25
-10
Max.
Min.
Max.
Min.
Max.
Min.
2C
0±60
0.82
-0.45
0.49
-0.27
0.33
-0.18
* Nominal values denote the temperature coefficient within a range of 20C to 125C
Char.
Nominal Values
(ppm/C) *
-55
Table A-2
Capacitance Change from 25C (%)
-30
-10
Max.
Min.
Max.
Min.
Max.
Min.
5C
0±30
0.58
-024
0.40
-0.17
0.25
-0.11
* Nominal values denote the temperature coefficient within a range of 25C to 125C
Char.
Nominal Values
(ppm/C) *
JEMCCS-0001K
-55
4
Apply 200% of the rated voltage at the maximum operating
temperature ±3℃ for 1000±12 hours.
Set for 24±2 hours at room temperature, then measure.
The charge/discharge current is less than 50mA.
･Initial measurement for high dielectric constant type.
Apply 200% of the rated DC voltage at the maximun operating
temperature ±3C for one hour. Remove and set for
24±2 hours at room temperature.
Perform initial measurement.
■SPECIFICATIONS AND TEST METHODS
Test method : Deflection
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : t:0.8mm
Copper foil thickness : 0.035mm
（Coat with heat resistant resin for solder）
・GN□□□4
40
40
・GNM□□2
100
100
5.0
a
b
Type
GNM1M2
GNM212
GNM214
GN□314
5.0
a
b
c
1.0
c
1.0
d
d
a
2.0±0.05
2.0±0.05
2.0±0.05
2.5±0.05
b
0.5±0.05
0.6±0.05
0.7±0.05
0.8±0.05
c
0.32±0.05
0.5±0.05
0.3±0.05
0.4±0.05
d
0.32±0.05
0.5±0.05
0.2±0.05
0.4±0.05
Fig. 1 (in:mm)
20
Pressurization
speed
1.0mm/s
50
Pressurize
R230
Flexure:≦1
Capacitance meter
45
45
Fig.2
(in:mm)
Adhesive Strength of Termination,Vibration Resistance,Temperature Cycle,
Humidity Steady State,Humidity Load,High Temperature Load
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm
Copper foil thickness : 0.035mm
・GNM□□2
・GN□□□4
b
a
b
a
c
d
c
d
Solder resist
Copper foil
Solder resist
Copper foil
Fig. 3
JEMCCS-0001K
(in:mm)
5
Type
GNM1M2
GNM212
GNM214
GN□314
a
0.5
0.6
0.6
0.8
b
1.6
1.8
2.0
2.5
c
0.32
0.5
0.25
0.4
d
0.32
0.5
0.25
0.4
Package
GNM Type
There are two type of packaging for chip monolithic ceramic capacitor.
Please specify the packaging code.
1.Bulk Packaging(Packaging Code=B):In a bag.
Minimum Quantity : 1000(pcs./bag)
2.Tape Carrier Packaging(Packaging Code:D/L/J/K)
2.1 Minimum Quantity(pcs./reel)
φ180mm reel
Paper Tape Plastic Tape
Code:D
Code:L
Type
GNM02
φ330mm reel
Paper Tape Plastic Tape
Code:J
Code:K
10000
50000
T:0.5mm
4000
10000
GNM1M T:0.6mm
4000
10000
T:0.8mm
4000
10000
T:0.6mm
4000
10000
T:0.85mm
4000
10000
T:0.8mm
4000
10000
GNM21
GNM31 T:1.0mm
T:1.15mm
3000
10000
3000
10000
2.2 Dimensions of Tape
(1)GNM0M2 Paper Tape
4.0±0.1
+0.1
*1
*2
3.5±0.05
φ1.5 -0
Ｂ
Ａ
8.0±0.3
*1,2：2.0±0.05
1.75±0.1
(in:mm)
0.05 max.
t
Code
A
B
ｔ
JEMCCP-0008L
GNM0M2
0.72±0.5
1.02±0.5
0.8 max.
6
Package
GNM Type
2.2 Dimensions of Tape
(in:mm)
(2)GNM1M/21/31 Paper Tape
1.75±0.1
+0.1
4.0±0.1
2.0±0.1
3.5±0.05
φ1.5 -0
Ｂ
Ａ
8.0±0.3
4.0±0.1
1.1 max.
Code
A
B
GNM1M
1.17±0.05
1.55±0.05
GNM21
1.55±0.15
2.3±0.15
GNM31
2.0±0.2
3.6±0.2
(3)GNM31 Plastic Tape
1.75±0.1
4.0±0.1
2.0±0.1
3.5±0.05
φ1.5
+0.1
-0
Ｂ
Ａ
0.25±0.1
8.0±0.3
4.0±0.1
＊
1.7max.(T≦1.15mm)
＊
記号
A
B
JEMCCP-0008L
GNM31
1.9±0.2
3.5±0.2
7
め状態
(単位：mm)
Package
GNM Type
Fig.1 Package Chips
(in：mm)
Chip
Fig.2 Dimensions of Reel
φ13±0.5
φ180+0/-3.0
φ330±2.0
φ21±0.8
φ50 min
2.0±0.5
10±1.5
16.5 max
Fig.3 Taping Diagram
Top Tape：Thickness 0.06
Feeding Hole : As specified in 2.2
Hole for Chip : As specified in 2.2
Bottom Tape : Thickness 0.05
Base Tape : As specified in 2.2
(Only a bottom tape existence)
JEMCCP-0008L
8
ﾁｯﾌﾟ詰め状態
Package
GNM Type
(単位：mm)
2.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
2.4 Part of the leader and part of the vacant section are attached as follows.
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
(in:mm)
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
2.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
2.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
2.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
2.8 There are no jointing for top tape and bottom tape.
2.9 There are no fuzz in the cavity.
2.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
2.11 Reel is made by resin and appeaser and dimension
is shown in Fig 2.
図1 ﾁｯﾌﾟ詰め状態
(単位：mm)
There are possibly to change the material and dimension due to some impairment.
2.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.
165～180°
Top tape
2.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
JEMCCP-0008L
9
!
Caution
■ Limitation of use
Please contact our sales representatives or product engineers before using our products for the applications
listed below which require of our products for other applications than specified in this product.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment
⑨Data-processing equipment
⑩Application of similar complexity and/or requirements to the applications listed in the above
■ Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store capacitors in the following conditions: Temperature of +5℃ to +40℃ and a Relative Humidity
of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
conditions during storage may affect the solderability and the packaging performance
Please use product within six months of receipt.
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,
hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
JEMCCC-0010Q
10
!
Caution
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes.
The following actions are recommended in order to insure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance.
Example: a time constant circuit., please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the intended environment and operating conditions.
20
15
10
5
0
-5
-10
-15
-20
□ Typical temperature characteristics Char.R7 (X7R)
Capacitance Change (%)
Capacitance Change (%)
□ Typical temperature characteristics Char.R6 (X5R)
-75
-50
-25
0
25
50
Temperature (℃)
75
100
20
15
10
5
0
-5
-10
-15
-20
-75 -50 -25
0 25 50 75 100 125 150
Temperature (℃)
□ Typical temperature characteristics Char.F5 (Y5V)
Capacitance Change (%)
40
20
0
-20
-40
-60
-80
-100
-50
-25
0
25
50
Temperature (℃)
75
100
2.Measurement of Capacitance
1. Measure capacitance with the voltage and the frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease when capacitance is high occasionally.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage
applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
JEMCCC-0010Q
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!
Caution
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the
rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the
rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the
rated DC voltage.
Typical voltage applied to the DC capacitor
DC voltage
DC voltage+AC
E
E
AC voltage
E
Pulse voltage
0
E
0
0
0
（E：Maximum possible applied voltage.）
1-2. Influence of overvoltage
Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the
breakdown of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4. Applied Voltage and Self-heating Temperature
1. When the capacitor is used in a high-frequency voltage, pulse voltage, application,
be sure to take into account self-heating may be caused by resistant factors of the capacitor.
1-1. The load should be contained to the level such that when measuring at atomospheric temperature
of 25℃,the product's self-heating remains below 20℃ and surface temperature of the capacitor in the
actual circuit remains wiyhin the maximum operating temperature.
JEMCCC-0010Q
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!
Caution
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC
voltage applied.
Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the capacitance.
(1) Whether the capacitance change caused by the
applied voltage is within the range allowed or not.
□ DC voltage characteristics
20
Capacitance Change(%)
(2) In the DC voltage characteristics, the rate of capacitance
change becomes larger as voltage increases.
Even if the applied voltage is below the rated voltage.
When a high dielectric constant type capacitor is in a
circuit that needs a tight (narrow) capacitance tolerance.
Example: a time constant circuit., please carefully
consider the characteristics of these capacitors, such as
their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the
intended environment and operating conditions.
0
-20
-40
-60
-80
-100
0
1
2
3
4
5
6
7
DC Voltage (VDC)
Capacitance Change (%)
2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
□ AC voltage characteristics
30
20
10
0
-10
-20
-30
-40
-50
-60
0.0
0.5
1.0
1.5
2.0
2.5
AC Voltage (Vr.m.s)
6. Capacitance Aging
1. The high dielectric constant type capacitors have the characteristic
in which the capacitance value decreases with passage of time.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance. Example: a time constant circuit., please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the intended environment and operating conditions.
Capacitance Change (%)
20
10
0
-10
5C
-20
RΔ
-30
-40
10.0
100.0
1000.0
Time(Hr)
JEMCCC-0010Q
13
10000.0
!
Caution
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor.
Do not use a fallen capacitor because the quality and reliability may be deteriorated.
Crack
Floor
3. When printed circuit boards are piled up or handled, the corners of another printed circuit board
should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor.
Mounting printed circuit board
Crack
■ Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing
or bending of the board.
[Component Direction]
①
Locate chip horizontal to the
direction in which stress acts
1A
[Chip Mounting Close to Board Separation Point]
Perforation
C
B
D
A
Chip arrangement
Worst A-C-(B~D) Best
Slit
③②
JEMCCC-0010Q
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!
Caution
2.Information before mounting
1. Do Not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the Solderability for the capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any bending damage or cracking. Please take into account the
following precautions and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
[Incorrect]
Suction Nozzle
Deflection
Board
Board Guide
[Correct]
Support Pin
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
JEMCCC-0010Q
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!
Caution
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
[Standard Conditions for Reflow Soldering]
Infrared Reflow
Temperature(℃)
Soldering
Peak Temperature
200℃
Gradual
Cooling
ΔT
170℃
150℃
130℃
Preheating
2. Solderability of Tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
Tin is used. Please confirm the Solderability of Tin plated
termination chips before use.
60-120 seconds
Time
30-60 seconds
Vapor Reflow
Temperature(℃)
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
Soldering
Peak Temperature
Gradual
Cooling
ΔT
170℃
150℃
130℃
Preheating
Table 1
Part Number
Temperature Differential
GNM0M/GNM1M/GNM21/
GNM31
Time
60-120 seconds 20 seconds max.
ΔT≦130℃
[Allowable Soldering Temperature and Time]
Pb-Sn Solder
Lead Free Solder
Infrared Reflow
Vapor Reflow
Peak Temperature
230～250℃
230～240℃
240～260℃
Atmosphere
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Soldering Temperature(℃)
Recommended Conditions
280
270
260
250
240
230
220
0
30
60
90
120
Soldering Time(sec.)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
0.2mm min
4-1. Overly thick application of solder paste results in
a excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
in section
the chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm min.
Inverting the PCB
JEMCCC-0010Q
Make sure not to impose any abnormal mechanical shocks to the PCB.
16
!
Caution
4-2.Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted,
chips may crack and solder joints may break.
Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping.
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate,
resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending printed circuit board by the pressure of a test pin, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder joints.
Provide support pins on the back side of the PCB to prevent warping or flexing.
1-2. Avoid vibration of the board by shock when a test pin contacts a printed circuit board.
□ Not recommended
□ Recommended
Support pin
Peeling
Test-pin
JEMCCC-0010Q
Test-pin
17
!
Caution
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is
caused by bending or twisting the board.
1-1. In cropping the board, the stress as shown right may cause the capacitor to crack.
Try not to apply this type of stress to a capacitor.
①
Bending
Twisting
1A
2. Check of the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus to prevent the
mechanical stress which can occur to the board.
(1) Example of a suitable jig
Recommended example: the board should be pushed as close to the near the cropping jig as possible
and from the back side of board in order to minimize the compressive stress applied to capacitor.
Not recommended example* when the board is pushed at a point far from the cropping jig and from
the front side of board as below, the capacitor may form a crack caused by the tensile stress applied
to capacitor.
Recommended
Outline of jig
V-groove
Printed circuit
board
Not recommended
Direction of load
Printed circuit
board
Direction of
load
Load point
Component
s
Printed circuit
board
Load point
Components
Board cropping jig
(2) Example of a suitable machine
An outline of a printed circuit board cropping machine is shown as follows. Along the lines with the
V-grooves on printed circuit board, the top and bottom blades are aligned to one another when
cropping the board.
The misalignment of the position between top and bottom blades may cause the capacitor to crack.
Outline of machine
Principle of operation
Top blade
Top blade
Cross-section diagram
Printed circuit board
Bottom blade
Printed circuit board
Recommended
JEMCCC-0010Q
V-groove
V-groove
Not recommended
Top-bottom misalignment
Left-right misalignment
Front-rear misalignment
Top blade
Top blade
Top blade
Top blade
Bottom blade
Bottom blade
Bottom blade
Bottom blade
18
!
Caution
■ Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of
a electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operation is under the specified conditions.
Do not use the equipment under the following environment.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to Ozone, ultraviolet rays or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying
continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be
caused by the capacitors high temperature.
2-2. Disposal of waste
When capacitors are disposed, they must be burned or buried by the industrial waste vender with
the appropriate licenses.
2-3. Circuit Design
GNM Series capacitors in this catalog are not safety recognized products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when
the product is used.
The above notices are for standard applications and conditions. Contact us when the products are
used in special mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
JEMCCC-0010Q
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Notice
■ Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1.Do not apply temperatures exceeding the upper operating temperature.
It is necessary to select a capacitor with a suitable rated temperature which will cover the operating
temperature range.
Also it is necessary to consider the temperature distribution in equipment and the seasonal temperature
variable factor.
1-2.Consider the self-heating of the capacitor
The surface temperature of the capacitor shall be the upper operating temperature or less when
including the self-heating factors.
2.Atmosphere surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. The capacitor, when used in the above, unsuitable, operating environments may deteriorate
due to the corrosion of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are
subject to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of
terminal electrodes may result in breakdown when the capacitor is exposed to corrosive or
volatile gases or solvents for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
JEMCCC-0010Q
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Notice
■ Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet
height.
1-2.There is a possibility of chip crack caused by PCB expansion/contraction with heat.
Because stress for chip is different depend on PCB material and structure.Especially metal PCB
such as alumina has a greater risk of chip crack because of large difference of thermal expansion coefficient.
In case of chip below 0402 size, there is also the same possibility of crack with a single-layered glass epoxy
board.
Pattern Forms
Prohibited
Correct
Chassis
Solder Resist
Solder (ground)
Placing Close to Chassis
Electrode Pattern
Lead Wire
Solder Resist
Placing of Chip
Components
and Leaded Components
Soldering Iron
Lead Wire
Solder Resist
Placing of Leaded
Components
after Chip Component
Solder Resist
ｿﾙﾀﾞﾚｼﾞｽﾄ
Lateral Mounting
JEMCCC-0010Q
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Notice
2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of PCB bending / etc if the land area
is larger than needed and has an excess amount of solder.
Please refer to the land dimensions in table 1 for reflow soldering.
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
GNM□□2
GNM□□4
Table 1 Reflow Soldering Method
Dimensions
L×W
a
b
c
p
GNM0M2
0.9×0.6
0.12 to 0.20 **
0.35 to 0.40 **
0.30
0.45
GNM1M2
1.37×1.0
0.4 to 0.5 *
0.35 to 0.45 *
0.3 to 0.35
0.64
GNM212
2.0×1.25
0.6 to 0.7
0.5 to 0.7
0.4 to 0.5
1.0
GNM214
2.0×1.25
0.6 to 0.7
0.5 to 0.7
0.25 to 0.35
0.5
GNM314
3.2×1.6
0.8 to 1.0
0.7 to 0.9
0.3 to 0.4
0.8
Part Number
(in mm)
* a+2b < 1.35
** 0.82≦a+2b≦1.0
JEMCCC-0010Q
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Notice
2.Washing
1. Please evaluate a capacitor by actual cleaning equipment and condition surely
for confirming the quality and select the applicable solvent.
2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the
performance of the capacitors.
3.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during
curing process.
The stress is affected by the amount of resin and curing contraction.
Select a resin with small curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and
capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, and
lead to the deterioration of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the
insulation resistance of a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
■ Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force
during transportation.
(1) Climatic condition
－ low air temperature：－40℃
－ change of temperature air/air：－25℃/＋25℃
－ low air pressure：30 kPa
－ change of air pressure：6 kPa/min
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forces are not directly
passed on to the inner packaging.
1-2. Do not apply excessive vibration, shock, and pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may
occur in the ceramic body of the capacitor.
(2) When a sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the
surface of capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
The capacitor dropped accidentally during processing may be damaged.
JEMCCC-0010Q
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!
NOTE
1.Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2.Your are requested not to use our product deviating from this product specification.
3.We consider it not appropriate to include any terms and conditions with regard to the business
transaction in the product specifications, drawings or other technical documents. Therefore,
if your technical documents as above include such terms and conditions such as warranty clause,
product liability clause, or intellectual property infringement liability clause, they will be deemed to
be invalid.
JEMCCC-0010Q
24
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