RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR
GQM1885C2A1R1CB01_ (0603, C0G, 1.1pF, 100Vdc)
_: packaging code
Reference Sheet
1.Scope
This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GQM
18
(1)L/W
Dimensions
8
5C
(2)T
Dimensions
2A
(3)Temperature
Characteristics
1R1
(4)DC Rated
Voltage
C
(5)Nominal (6)Capacitance
Tolerance
Capacitance
B01
3. Type & Dimensions
L
W
T
e
g
e
(Unit:mm)
g
(1)-1 L
(1)-2 W
(2) T
e
1.6±0.1
0.8±0.1
0.8±0.1
0.2 to 0.5
0.5 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
DC Rated
Voltage
25 to 125 °C
(25 °C)
100 Vdc
0±30 ppm/°C
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
1.1 pF
±0.25 pF
Specifications and Test
Methods
(Operationg
Temp. Range)
-55 to 125 °C
5.Package
mark
D
J
(8) Packaging
f180mm Reel
PAPER W8P4
f330mm Reel
PAPER W8P4
Packaging Unit
4000 pcs./Reel
10000 pcs./Reel
Product specifications in this catalog are as of Jan.25,2013,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GQM1885C2A1R1CB01-01
1
D
(7)Murata’s (8)Packaging
Code
Control Code
■SPECIFICATIONS AND TEST METHODS
No
Item
1 Operating Temperature
Specification
Test Method
5C : -55℃ to 125℃
2 Rated Voltage
See the previous pages.
The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated
voltage range.
3 Appearance
No defects or abnormalities.
Visual inspection.
4 Dimension
Within the specified dimensions.
Using calipers.
5 Dielectric Strength
No defects or abnormalities.
No failure should be observed when 300% of the rated
voltage is applied between the terminations for 1 to 5
seconds, provided the charge/discharge current is less
than 50mA.
6 Insulation
Resistance
More than 10,000MΩ or 500Ω ・F .
(Ｗhichever is smaller)
The insulation resistance should be measured with a DC
voltage not exceeding the rated voltage at 25℃
and 75%RH max. and within 2 minutes of charging.
7 Capacitance
Within the specified tolerance.
The capacitance/Q should be measured at 25℃
at the frequency and voltage shown in the table.
8 Q
30pFmin. : Q≧1400
Char.
30pFmax.: Q≧800+20C
Item
C:NominalCapacitance (pF)
9 Capacitance
Temperature Within the specified tolerance.(Table A-1)
Coefficent
No removal of the terminations or other defect should occur.
Capacitance Within the specified tolerance.
30pFmin. : Q≧1400
30pFmax.: Q≧800+20C
C:NominalCapacitance (pF)
12 Deflection
Appearance No marking defects.
Capacitance Within ±5％ or ±0.5pF
Change
(Whichever is larger)
13 Solderability
of Termination
JEMCNS-0003Ｆ
0.5 to 5Vrms
Temperature(C)
1
252
2
-553
3
252
4
1253
5
252
Solder the capacitor on the test jig (glass epoxy
board)shown in Fig.3 using an eutectic solder. Then apply
10N* force in parallel with the test jig for 10+/-1sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*5N（GQM188)
Solder the capacitor on the test jig (glass epoxy board) in the
same manner and under the same conditions as (10).
The capacitor should be subjected to a simple harmonic
motion having a total amplitude of 1.5mm, the frequency
being varied uniformly between the approximate limits of 10
and 55Hz. The frequency range, from 10 to 55Hz and return
to 10Hz, should be traversed in approximately 1 minute. This
motion should be applied for a period of 2 hours in each 3
mutually perpendicular directions(total of 6 hours).
Solder the capacitor on the test jig (glass epoxy board)
shown in Fig.1 using an eutectic solder. Then apply a force
in the direction shown in Fig 2. The soldering
should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free
of defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101)
and rosin (JIS-K-5902) (25% rosin in weight propotion) .
Preheat at 80 to 120℃ for 10 to 30 seconds.
After preheating, immerse in an eutectic solder solution for
2+/-0.5 seconds at 230+/-5℃ or Sn-3.0Ag-0.5Cu solder
solution for 2+/-0.5 seconds at 245+/-5℃
Appearance No defects or abnormalities.
Q
10.1MHz
Voltage
Step
Capacitance Within ±0.2% or ±0.05pF
Drift
(Whichever is larger.)
11 Vibration
Resistance
Frequency
The temperature coefficient is determind using the
capacitance measured in step 3 as a reference.
When cycling the temperature sequentially from step 1
through 5 the capacitance should be within the specified
tolerance for the temperature coefficient and capacitance
change as Table A-1.
The capacitance drift is caluculated by dividing the
differences betweeen the maximum and minimum measured
values in the step 1,3 and 5 by the cap. value in step 3.
Capacitance Within the specified tolerance.(Table A-1)
Temperature Change
Characteristics
10 Adhesive Strength of
Termination
5C
(1000pF and below)
75% of the terminations is to be soldered evenly
and continuously.
2
■SPECIFICATIONS AND TEST METHODS
No
Item
14 Resistance to
Soldering Heat
Specification
Test Method
The measured and observed characteristics shall satisfy Preheat the capacitor at 120 to 150℃ for 1 minute.
Immerse the capacitor in an eutectic solder solution or
the specifications in the following table.
Sn-3.0Ag-0.5Cu solder solution at 270+/-5℃ for
Appearance No defects or abnormalities.
10+/-0.5 seconds. Let sit at room temperature for 24+/-2
hours.
Capacitance Within ±2.5% or ±0.25 pF
Change
(Whichever is larger)
30pFmin.:Q≧1400
30pFmax.:Q≧800+20C
C:NominalCapacitance (pF)
Q
More than 10,000MΩ or 500Ω •F
I.R.
Dielectric
Strength
15 Temperature
Cycle
(Whichever is smaller)
No defects.
The measured and observed characteristics shall satisfy Fix the capacitor to the supporting jig in the same
manner and under the same conditions as (10).
the specifications in the following table.
Perform the five cycles according to the four heat
Appearance No defects or abnormalities.
treatments listed in the following table.
Let sit for 24+/-2 hours at room temperature, then measure.
Capacitance Within ±2.5% or ±0.25pF
Change
(Whichever is larger)
Step
Temp.(C)
Time (min)
Q
I.R.
Dielectric
Strength
16 Humidity
Steady State
Appearance
Capacitance
Change
Q
I.R.
17 Humidity Load
Appearance
Capacitance
Change
Q
30pFmin. : Q≧1400
30pFmax.: Q≧800+20C
C:NominalCapacitance (pF)
More than 10,000MΩ or 500Ω •F
(Whichever is smaller)
No defects.
1
Min.
Operating Temp.+0/-3
30±3
2
Room Temp
2 to 3
3
Max.
Operating Temp.+3/-0
30±3
4
Room Temp
2 to 3
The measured and observed characteristics shall satisfy Sit the capacitor at 40±2℃ and 90 to 95% humiduty for
500±12 hours.
the specifications in the following table.
Remove and let sit for 24±2 hours (temperature compensating type)
No defects or abnormalities.
at room temperature, then measure.
Within ±5％ or ±0.5pF
(Whichever is larger)
30pF and over : Q≧350
10pF and over, 30pF and below : Q≧275+5C/2
10pF and below : Q≧200+10C
C:Nominal Capacitance(pF)
More than 1,000MΩ or 50Ω •F (Whichever is smaller)
The measured and observed characteristics shall satisfy Apply the rated voltage at 40±2℃ and 90 to 95% humidity
for 500±12 hours.
the specifications in the following table.
Remove and let sit for 24±2 hours at room temprature then
No defects or abnormalities.
muasure. The charge/discharge current is less than 50mA.
Within ±7.5% or ±0.75pF
(Whichever is larger)
30pF and over : Q≧200
30pF and below : Q≧100+10C/3
C:Nominal Capacitance(pF)
More than 500MΩ or 25Ω •F (Whichever is smaller)
The measured and observed characteristics shall satisfy Apply 200% of the rated voltage for 1000±12 hours at the
maximun operating temperature±3℃.
the specifications in the following table.
Let sit for 24±2 hours (temperature compensating type) aｔ
Appearance No defects or abnormalities.
room temperature, then measure.
The charge/discharge current is less than 50mA
Capacitance Within ±3% or ±0.3pF
Change
(Whichever is larger)
30pF and over : Q≧350
Q
10pF and over, 30pF and below : Q≧275+5C/2
10pF and below : Q≧200+10C
C:Nominal Capacitance(pF)
I.R.
More than 1,000MΩ or 50Ω •F (Whichever is smaller)
I.R.
18 High Temperature
Load
Table A-1
Char.
Nominal Values
(ppm/C) Note 1
Max.
Min.
5C
030
0. 58
-0.24
-55
Capacitance Change from 25C (%)
-30
Max.
Min.
0.40
-0.17
Note１：Nominal values denote the temperature coefficient within a range of 25℃ to 125℃ (for 5C)
JEMCNS-0003Ｆ
3
-10
Max.
Min.
0.25
-0.11
■SPECIFICATIONS AND TEST METHODS
Test method : Deflection
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
(Glass fabric base, epoxy resin)
Thickness : 1.6mm(GQM18/21: t:0.8mm)
Thickness : 1.6mm(GQM18/21: t:0.8mm)
Copper foil thickness : 0.035mm
Copper foil thickness : 0.035mm
Gray colored part of Fig.1: Solder resist
4.0±0.1
＊1
b
40
c
c
f4.5
Ａ
Solder resist
Ｂ
a
Baked electrode or
copper foil
Glass epoxy board
c
＊2
a
φ1.5 +0.1
-0
b
ﾗﾝﾄﾞ
*1,2：2.0±0.05
f4.5
8.0±0.3
b
3.5± 0.05
Land
1.75±0.1
c
（Coat with heat resistant resin for solder）
0.05以下
100
t
Fig.1
Fig.3
(in:mm)
(in:mm)
Type
a
b
c
Type
a
b
c
GQM18
1.0
3.0
1.2
GQM18
1.0
3.0
1.2
GQM21
1.2
4.0
1.65
GQM21
1.2
4.0
1.65
20
50
Pressurizing
speed
1.0mm/sec.
Pressurize
R230
Flexure:≦1
Support
Capacitance meter
45
45
Fig.2
JEMCNS-0003Ｆ
(in:mm)
4
PACKAGING
GQM Type
1.Tape Carrier Packaging(Packaging Code:D/E/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
Type
GQM18
GQM2
GQM2
φ180mm reel
Paper Tape
Plastic Tape
Code:D/E
Code:L
4000
4000
1000
φ330mm reel
Paper Tape
Plastic Tape
Code:J/ F
Code:K
10000
10000
4000
1.2 Dimensions of Tape
(1)GQM18/21
(in mm)
1.75±0.1
+0.1
4.0±0.1
2.0±0.05
3.5±0.05
φ1.5 -0
Ｂ
Ａ
8.0±0.3
4.0±0.1
1.1 max.
Code
A
B
GQM18
1.05±0.1
1.85±0.1
GQM21
1.55±0.15
2.3±0.15
(2)GQM22
4.0±0.1
1.75±0.1
2.0±0.1
+0.1
-0
3.5±0.05
φ1.5
Ｂ
Ａ
0.25±0.1
8.0±0.3
4.0±0.1
2.5 max.
Code
A
B
JEMCNP-01900
GQM22
2.8*
3.5*
*Nominal Value
5
状態
(単位：mm)
PACKAGING
GQM Type
(in mm)
Fig.1 Package Chips
Chip
Fig.2 Dimensions of Reel
φ13±0.5
φ180+0/-3.0
φ330±2.0
φ21±0.8
φ50 min.
2.0±0.5
10±1.5
16.5 max.
Fig.3 Taping Diagram
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
JEMCNP-01900
Base Tape : As specified in 1.2.
6
ﾌﾟ詰め状態
PACKAGING
GQM Type
(単位：mm)
1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N
min.
(Only a bottom tape existence )
ﾁｯﾌﾟ詰め状態
(単位：
mm)
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 1.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.
165～180°
Top tape
1.13 Label that show the customer part number, our part number, our company name, inspection
number and quantity, will be put in outside of reel.
JEMCNP-01900
7
!
Caution
■ Limitation of use
Please contact our sales representatives or product engineers before using our products for the applications
listed below which require of our products for other applications than specified in this product.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment
⑨Data-processing equipment
⑩Application of similar complexity and/or requirements to the applications listed in the above
■ Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store capacitors in the following conditions: Temperature of +5℃ to +40℃ and a Relative Humidity
of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
conditions during storage may affect the solderability and the packaging performance
Please use product within six months of receipt.
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,
hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
JEMCNC-0012L
8
!
Caution
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes.
The following actions are recommended in order to insure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance.
Example: a time constant circuit., please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the intended environment and operating conditions.
□ Typical temperature characteristics Char.R7 (X7R)
20
20
15
15
10
10
Capacitance Change (%)
Capacitance Change (%)
□ Typical temperature characteristics Char.R6 (X5R)
5
0
-5
-10
-15
-20
5
0
-5
-10
-15
-20
-75
-50
-25
0
25 (℃) 50
Temperature
75
100
-75
-50
-25
0
25
50
75
Temperature (℃)
100
125
150
□ Typical temperature characteristics Char.F5 (Y5V)
40
Capacitance Change (%)
20
0
-20
-40
-60
-80
-100
-50
-25
0
25
50
Temperature (℃)
75
100
2.Measurement of Capacitance
1. Measure capacitance with the voltage and the frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease when capacitance is high occasionally.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage
applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
JEMCNC-0012L
9
!
Caution
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the
rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the
rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the
rated DC voltage.
Typical voltage applied to the DC capacitor
DC voltage
DC voltage+AC
E
E
AC voltage
E
Pulse voltage
0
E
0
0
0
（E：Maximum possible applied voltage.）
1-2. Influence of overvoltage
Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the
breakdown of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4. Applied Voltage and Self-heating Temperature
1. When the capacitor is used in a high-frequency voltage, pulse voltage, application,
be sure to take into account self-heating may be caused by resistant factors of the capacitor.
1-1. The load should be contained to the level such that when measuring at atomospheric temperature of 25℃,
the product's self-heating remains below 20℃ and surface temperature of the capacitor in the actual circuit
remains wiyhin the maximum operating temperature.
JEMCNC-0012L
10
!
Caution
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC
voltage applied.
Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the capacitance.
(1) Whether the capacitance change caused by the
applied voltage is within the range allowed or not.
□ DC voltage characteristics
20
0
Capacitance Change(%)
(2) In the DC voltage characteristics, the rate of capacitance
change becomes larger as voltage increases.
Even if the applied voltage is below the rated voltage.
When a high dielectric constant type capacitor is in a
circuit that needs a tight (narrow) capacitance tolerance.
Example: a time constant circuit., please carefully
consider the characteristics of these capacitors, such as
their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the
intended environment and operating conditions.
-20
-40
-60
-80
-100
0
2
4
6
8
DC Voltage (VDC)
2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
□ AC voltage characteristics
30
Capacitance Change (%)
20
10
0
-10
-20
-30
-40
-50
-60
0.0
0.5
1.0
1.5
2.0
2.5
AC Voltage (Vr.ms.)
6. Capacitance Aging
1. The high dielectric constant type capacitors have the characteristic
in which the capacitance value decreases with passage of time.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance. Example: a time constant circuit., please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the intended environment and operating conditions.
20
Capacitor Change (%)
10
0
-10
-20
5
C
-30
-40
10.0
100.0
1000.0
10000.0
Time (Hr)
JEMCNC-0012L
11
!
Caution
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor.
Do not use a fallen capacitor because the quality and reliability may be deteriorated.
Crack
Floor
3. When printed circuit boards are piled up or handled, the corners of another printed circuit board
should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor.
Mounting printed circuit board
Crack
■ Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor
during flexing or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending
of the board.
[Component Direction]
Locate chip
horizontal to the
direction in
which stress
acts
[Chip Mounting Close to Board Separation Point]
C
Perforation
A
B
D
Chip arrangement
Worst A-C-(B~D) Best
Slit
JEMCNC-0012L
12
!
Caution
2.Information before mounting
1. Do Not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the Solderability for the capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any bending damage or cracking. Please take into account the
following precautions and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
[Incorrect]
Suction Nozzle
Deflection
Board
Board Guide
[Correct]
Support Pin
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
JEMCNC-0012L
13
!
Caution
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
[Standard Conditions for Reflow Soldering]
Infrared Reflow
Temperature(℃)
200℃
170℃
150℃
130℃
2. Solderability of Tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
Tin is used. Please confirm the Solderability of Tin plated
termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
Soldering
Gradual
Cooling
Peak Temperature
Preheating
Time
60-120 seconds 30-60 seconds
Vapor Reflow
Temperature(℃)
Soldering
Peak Temperature
170℃
150℃
130℃
Preheating
Table 1
Part Number
Gradual
Cooling
Temperature Differential
Time
ΔT≦190℃
60-120 seconds
GQM22
ΔT≦130℃
[Allowable Soldering Temperature and Time]
Recommended Conditions
Pb-Sn Solder
Lead Free Solder
Infrared Reflow
Vapor Reflow
Peak Temperature
230～250℃
230～240℃
240～260℃
Atmosphere
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Soldering Temperature(℃)
GQM18/21
20 seconds
280
270
260
250
240
230
220
0
30
60
90
120
Soldering Time(sec.)
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
0.2mm min.
4-1. Overly thick application of solder paste results in
a excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
in section
the chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm min.
Inverting the PCB
JEMCNC-0012L
Make sure not to impose any abnormal mechanical shocks to the PCB.
14
!
Caution
4-2.Flow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating should
be required for both of the components and the PCB board.
Preheating conditions are shown in table 2. It is required to
keep temperature differential between the solder and
the components surface (ΔT) as small as possible.
[Standard Conditions for Flow Soldering]
Temperature(℃)
Soldering Peak
Soldering
△Ｔ
Gradual
Cooling
Preheating Peak
Preheating
2. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between electrodes and end termination.
4. Do not apply flow soldering to GQM22 Series.
Table 2
Part Number
Temperature Differential
Time
[Allowable Soldering Temperature and Time]
280
Soldering Temperature(℃)
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and solvent within the range
shown in the table 2.
5 seconds max.
30-90 seconds
270
260
250
240
230
220
0
30
60
90
120
Soldering Time(sec.)
ΔT≦150℃
GQM18/21/31
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Pb-Sn Solder Lead Free Solder
Preheating Peak Temperature
90～110℃
100～120℃
Soldering Peak Temperature
240～250℃
250～260℃
Atmosphere
Air
N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Up to Chip Thickness
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
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15
Adhesive
in section
!
Caution
4-3.Correction with a Soldering Iron
1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of
the components will decrease because the extreme temperature change can cause deformations inside the
components. In order to prevent mechanical damage to the components, preheating is required for both
the components and the PCB board. Preheating conditions, (The "Temperature of the Soldering Iron tip",
"Preheating Temperature", "Temperature Differential" between the iron tip and the components and the
PCB), should be within the conditions of table 3. It is required to keep the temperature differential
between the soldering Iron and the component surfaces (ΔT) as small as possible.
2. After soldering, do not allow the component/PCB to rapidly cool down.
3. The operating time for the re-working should be as short as possible. When re-working time is
too long, it may cause solder leaching, and that will cause a reduction in the adhesive
strength of the terminations.
Table 3
Temperature
of Soldering
Iron tip
Preheating
Temperature
Temperature
Differential
(ΔT)
Atmosphere
GQM18/21
350℃ max.
150℃ min.
ΔT≦190℃
Air
GQM22
280℃ max.
150℃ min.
ΔT≦130℃
Air
Part Number
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder amount when re-working with a Soldering lron
Solder Amount
4-1. In case of sizes smaller than 0603, (GQM18), the top of
the solder fillet should be lower than 2/3's of the thickness
of the component or 0.5mm whichever is smaller.
In case of 0805 and larger sizes, (GQM21/22), the top of
the solder fillet should be lower than 2/3's of the thickness
of the component. If the solder amount is excessive, the
risk of cracking is higher during board bending or under
any other stressful condition.
in section
4-2. A Soldering iron with a tip of ø3mm or smaller should be used. It is also necessary to keep
the soldering iron from touching the components during the re-work.
4-3. Solder wire with ø0.5mm or smaller is required for soldering.
4-4.Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted,
chips may crack and solder joints may break.
Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping.
JEMCNC-0012L
16
!
Caution
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate,
resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending printed circuit board by the pressure of a test pin, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder joints.
Provide support pins on the back side of the PCB to prevent warping or flexing.
1-2. Avoid vibration of the board by shock when a test pin contacts a printed circuit board.
□ Not recommended
□ Recommended
← Support pin
← Peeling
← Test-pin
JEMCNC-0012L
← Test-pin
17
!
Caution
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is
caused by bending or twisting the board.
1-1. In cropping the board, the stress as shown right may cause the capacitor to crack.
Try not to apply this type of stress to a capacitor.
Bending
Twisting
2. Check of the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus to prevent the
mechanical stress which can occur to the board.
(1) Example of a suitable jig
Recommended example: the board should be pushed as close to the near the cropping jig as possible
and from the back side of board in order to minimize the compressive stress applied to capacitor.
Not recommended example* when the board is pushed at a point far from the cropping jig and from
the front side of board as below, the capacitor may form a crack caused by the tensile stress applied
to capacitor.
Recommended
Outline of jig
V-groove
Printed circuit
board
Printed circuit
board
Components
Not recommended
Direction of
load
Printed circuit
board
Load point
Direction of
load
Load point
Components
Board cropping jig
(2) Example of a suitable machine
An outline of a printed circuit board cropping machine is shown as follows. Along the lines with the
V-grooves on printed circuit board, the top and bottom blades are aligned to one another when
cropping the board.
The misalignment of the position between top and bottom blades may cause the capacitor to crack.
Outline of machine
Principle of operation
Top blade
Top blade
Cross-section diagram
Printed circuit board
Bottom blade
Printed circuit board
Recommended
JEMCNC-0012L
V-groove
V-groove
Not recommended
Top-bottom misalignment
Left-right misalignment
Front-rear misalignment
Top blade
Top blade
Top blade
Top blade
Bottom blade
Bottom blade
Bottom blade
Bottom blade
18
!
Caution
■ Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of
a electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operation is under the specified conditions.
Do not use the equipment under the following environment.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to Ozone, ultraviolet rays or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying
continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns
may be caused by the capacitors high temperature.
2-2. Disposal of waste
When capacitors are disposed, they must be burned or buried by the industrial waste vender with
the appropriate licenses.
2-3. Circuit Design
GQM Series capacitors in this specification are not safety recognized products.
And do not use for general power supplies and lighting.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product
is used.
The above notices are for standard applications and conditions. Contact us when the products are
used in special mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
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19
Notice
■ Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1.Do not apply temperatures exceeding the upper operating temperature.
It is necessary to select a capacitor with a suitable rated temperature which will cover the operating
temperature range.
Also it is necessary to consider the temperature distribution in equipment and the seasonal temperature
variable factor.
1-2.Consider the self-heating of the capacitor
The surface temperature of the capacitor shall be the upper operating temperature or less when
including the self-heating factors.
2.Atmosphere surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. The capacitor, when used in the above, unsuitable, operating environments may deteriorate
due to the corrosion of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are
subject to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of
terminal electrodes may result in breakdown when the capacitor is exposed to corrosive or
volatile gases or solvents for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
JEMCNC-0012L
20
Notice
■ Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet
height.
1-2.There is a possibility of chip crack caused by PCB expansion/contraction with heat.
Because stress for chip is different depend on PCB material and structure.Especially metal PCB
such as alumina has a greater risk of chip crack because of large difference of thermal expansion coefficient.
In case of chip below 0402 size, there is also the same possibility of crack with a single-layered glass epoxy
board.
Pattern Forms
Prohibited
Correct
Chassis
Solder (ground)
Solder Resist
Placing Close to Chassis
Electrode Pattern
Lead Wire
Solder Resist
Placing of Chip
Components
and Leaded Components
Soldering Iron
Lead Wire
Solder Resist
Placing of Leaded
Components
after Chip Component
Solder Resist
Lateral Mounting
JEMCNC-0012L
21
Notice
2. Land Dimensions
Chip Capacitor Lan
d
C
2-1. Chip capacitor can be cracked due to the stress of PCB
bending / etc if the land area is larger than needed and
has an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
a
b
Solder Resist
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Dimensions
Chip（L×W）
a
b
c
GQM18
1.6×0.8
0.6～1.0
0.8～0.9
0.6～0.8
GQM21
2.0×1.25
1.0～1.2
0.9～1.0
0.8～1.1
Part Number
(in mm)
Table 2 Reflow Soldering Method
Dimensions
Chip（L×W）
a
b
c
GQM18
1.6×0.8
0.6～0.8
0.6～0.7
0.6～0.8
GQM21
2.0×1.25
1.0～1.2
0.6～0.7
0.8～1.1
GQM22
2.8×2.8
2.2～2.5
0.8～1.0
1.9～2.3
Part Number
(in mm)
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22
Notice
2.Adhesive Application
1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain
the correct bonding strength.
The chip's electrode thickness and land thickness must also be taken into consideration.
Chip Capacitor
a=20～70μm
a b=30～35μm
c=50～105μm
c
b
Adhesive
Land
Board
2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity of
5000Pa • s (500ps) min. (at 25℃)
3. Adhesive Coverage
Part Number
Adhesive Coverage*
GQM18
0.05mg min.
GQM21
0.1mg min.
*Nominal Value
4. Do not apply flow soldering to GQM22 Series.
3.Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes
deterioration in the insulation resistance between the outer electrodes due to moisture absorption.
Control curing temperature and time in order to prevent insufficient hardening.
4.Flux Application
1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration
of Solderability.
So apply flux thinly and evenly throughout. (A foaming system is generally used for flow soldering).
2. Flux containing too a high percentage of halide may cause corrosion of the outer electrodes unless
there is sufficient cleaning. Use flux with a halide content of 0.2% max.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.
(*Water-soluble flux can be defined as non roｓin type flux
including wash-type flux and non-wash-type flux.)
5.Flow Soldering
A
B
D
Outer Electrode
C
Set temperature and time to ensure that leaching of the
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown right) and 25% of the length A-B shown below as
mounted on substrate.
JEMCNC-0012L
［As a Single Chip］
23
［As Mounted on Substrate］
A
B
Notice
6.Washing
1. Please evaluate a capacitor by actual cleaning equipment and condition surely for confirming the quality
and select the applicable solvent.
2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the
performance of the capacitors.
7.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during
curing process.
The stress is affected by the amount of resin and curing contraction.
Select a resin with small curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and
capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling,
and lead to the deterioration of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the
insulation resistance of a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
■ Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force
during transportation.
(1) Climatic condition
－ low air temperature：－40℃
－ change of temperature air/air：－25℃/＋25℃
－ low air pressure：30 kPa
－ change of air pressure：6 kPa/min
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forces are not
directly passed on to the inner packaging.
1-2. Do not apply excessive vibration, shock, and pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may
occur in the ceramic body of the capacitor.
(2) When a sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly
on the surface of capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
The capacitor dropped accidentally during processing may be damaged.
JEMCNC-0012L
24
!
NOTE
1.Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2.Your are requested not to use our product deviating from this product specification.
3.We consider it not appropriate to include any terms and conditions with regard to the business
transaction in the product specifications, drawings or other technical documents. Therefore,
if your technical documents as above include such terms and conditions such as warranty clause,
product liability clause, or intellectual property infringement liability clause, they will be deemed to
be invalid.
JEMCNC-0012L
25
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