Chip Monolithic Ceramic Capacitor for General
GRM0335C1H3R8BA01_ (0201, C0G:EIA, 3.8pF, DC50V)
_: packaging code
Reference Sheet
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GRM
03
3
(2)T
Dimensions
(1)L/W
Dimensions
5C
1H
3R8
(4)Rated
(3)Temperature
Characteristics
(5)Nominal
Capacitance
Voltage
B
(6)Capacitance
Tolerance
A01
(7)Murata’s Control
Code
3. Type & Dimensions
(1)-1 L
(1)-2 W
(2) T
e
0.6±0.03
0.3±0.03
0.3±0.03
0.1 to 0.2
(Unit:mm)
g
0.2 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
0±30 ppm/°C
25 to 125 °C
(25 °C)
(4)
Rated
Voltage
DC 50 V
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
3.8 pF
±0.1 pF
Specifications and Test
Methods
(Operating
Temp. Range)
-55 to 125 °C
5.Package
mark
D
W
J
(8) Packaging
f180mm Reel
PAPER W8P2
f180mm Reel
PAPER W8P1
f330mm Reel
PAPER W8P2
Packaging Unit
15000 pcs./Reel
30000 pcs./Reel
50000 pcs./Reel
Product specifications in this catalog are as of Mar.7,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM0335C1H3R8BA01-01
1
D
(8)Packaging Code
■ Specifications and Test Methods
No
1
Item
Rated Voltage
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Specification
Shown in Rated value.
The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
VP-P or VO-P, whichever is larger, should be maintained
within the rated voltage range.
2
Appearance
No defects or abnormalities.
Visual inspection.
3
Dimension
Within the specified dimensions.
Using calipers. (GRM02 size is based on Microscope)
4
Voltage proof
No defects or abnormalities.
Measurement Point
: Between the terminations
Test Voltage
: 300% of the rated voltage
(Temperature compensating type)
250% of the rated voltage
(High dielectric constant type)
Applied Time
: 1s to 5 s
Charge/discharge current : 50mA max.
5
Insulation Resistance(I.R.)
C≦0.047µF:More than 10000MΩ
Measurement Point : Between the terminations
C＞0.047µF:More than 500Ω·F
Measurement Voltage :
C:Nominal Capacitance
Charging Time
DC Rated Voltage
: 2 min
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
6
Capacitance
Shown in Rated value.
7
Q
30pF and over:Q≧1000
Measurement Temperature : Room Temperature
Capacitance
C≦1000pF
C＞1000pF
30pF and below:Q≧400+20C
Frequency
1.0+/-0.1MHz
1.0+/-0.1kHz
Voltage
0.5 to 5.0Vrms
1.0+/-0.2Vrms
C:Nominal Capacitance(pF)
8
Temperature
No bias
Nominal values of the temperature coefficient is shown in Rated value. The capacitance change should be measured after 5 min
Characteristics
of Capacitance
at each specified temp. stage.
But,the Capacitance Change under 25℃ is shown in Table A.
In case of applying voltage, the capacitance change should be
measured after 1 min with applying voltage in equilibration of
Capacitance Drift
each temp. stage.
Within +/-0.2% or +/-0.05pF
Capacitance value as a reference is the value in step 3.
(Whichever is larger.)
The capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in the
step 1,3 and 5 by the cap. value in step 3.
Step
1
2
3
4
5
9
Adhesive Strength
No removal of the terminations or other defect
of Termination
should occur.
Temperature(C)
Reference Temp.+/-2
Min. Operating Temp.+/-3
Reference Temp.+/-2
Max. Operating Temp.+/-3
Reference Temp.+/-2
Solder the capacitor on the test substrate shown in Fig.3.
Type
Applied Force(N)
GRM02
1
GRM03
2
GRM15/GRM18
5
GRM21/GRM31/GRM32
Holding Time
10
: 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with
the capacitor side.
JEMCGS-0015S
2
No
Item
10 Vibration
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Specification
Appearance
No defects or abnormalities.
Capacitance
Within the specified initial value.
Q
Within the specified initial value.
Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration
: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude
: 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate
Bending test
Appearance
No defects or abnormalities.
Capacitance
Within +/-5% or +/-0.5pF
Change
(Whichever is larger)
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization method : Shown in Fig.2
: 1mm
Flexure
Holding Time
12 Solderability
95% of the terminations is to be soldered evenly and continuously.
:
5+/-1s
Soldering Method
: Reflow soldering
Test Method
: Solder bath method
Flux
13 Resistance to
Soldering Heat
Solution of rojin ethanol 25(wt)%
Preheat
: 80℃ to 120℃ for 10s to 30s
Solder
: Sn-3.0Ag-0.5Cu
Solder Temp.
: 245+/-5℃
Immersion time
: 2+/-0.5s
Appearance
No defects or abnormalities.
Capacitance
Within +/-2.5% or +/- 0.25pF
Test Method
: Solder bath method
Change
(Whichever is larger)
Solder
: Sn-3.0Ag-0.5Cu
Solder Temp.
: 270+/-5℃
Q
I.R.
Within the specified initial value.
Within the specified initial value.
Immersion time
: 10+/-0.5s
Exposure Time
: 24+/-2h
Preheat
: GRM31 size max.: 120℃ to 150℃ for 1 min
GRM32 size : 100℃ to 120℃ for 1 min
Voltage proof No defects.
and 170℃ to 200℃ for 1 min
14 Temperature
Appearance
No defects or abnormalities.
Sudden Change Capacitance
Change
Within +/-2.5% or+/- 0.25pF
Test Method
: Reflow soldering (hot plate)
Solder
: Sn-3.0Ag-0.5Cu
Solder Temp.
: 270+/-5℃
Reflow Time
: 10+/-0.5s
Test Substrate
: Glass epoxy PCB
Exposure Time
: 24+/-2h
Preheat
: 120℃ to 150℃ for 1 min
Solder the capacitor on the test substrate shown in Fig.3.
(Whichever is larger)
Perform the five cycles according to the four heat treatments
shown in the following table.
Q
I.R.
Within the specified initial value.
Within the specified initial value.
Voltage proof No defects.
Step
Temp.(C)
Time (min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp.
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
Exposure Time
JEMCGS-0015S
3
: 24+/-2h
No
Item
15 High
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Specification
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
High Humidity
Capacitance
Within +/-7.5% or +/-0.75pF
Test Temperature
: 40+/-2℃
(Steady)
Change
(Whichever is larger)
Test Humidity
: 90%RH to 95%RH
Temperature
Test Time
Q
: 500+/-12h
30pF and over:Q≧200
Applied Voltage
30pF and below :Q≧100+10C/3
Charge/discharge current : 50mA max.
Exposure Time
: DC Rated Voltage
: 24+/-2h
C:Nominal Capacitance(pF)
16 Durability
I.R.
More than 500MΩ or 25Ω·F (Whichever is smaller)
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Capacitance
Within +/-3% or +/-0.3pF
Test Temperature
Change
(Whichever is larger)
Test Time
Applied Voltage
Q
Charge/discharge current : 50mA max.
10pF and over
Exposure Time
10pF and below : Q≧200+10C
C:Nominal Capacitance (pF)
More than 1,000MΩ or 50Ω·F (Whichever is smaller)
Table A
Char.
5C
6C
6P
6R
6S
6T
7U
-55C
Max.
0.58
0.87
2.33
3.02
4.09
5.46
8.78
JEMCGS-0015S
: 1000+/-12h
: 200% of the rated voltage
30pF and over:Q≧350
30pF and below : Q≧275+5C/2
I.R.
: Max. Operating Temp. +/-3℃
Capacitance Change from 25C
-30C
Min.
Max.
Min.
-0.24
0.40
-0.17
-0.48
0.59
-0.33
0.72
1.61
0.50
1.28
2.08
0.88
2.16
2.81
1.49
3.28
3.75
2.26
5.04
6.04
3.47
(%)
-10C
Max.
0.25
0.38
1.02
1.32
1.79
2.39
3.84
Min.
-0.11
-0.21
0.32
0.56
0.95
1.44
2.21
4
: 24+/-2h
Substrate Bending test
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
a
100
*1,2：2.0±0.05
4.0±0.1
Dimension
(mm)
φ1.5 +0.1
b
c ＊1 ＊2
-0
0.56
0.23
0.9
0.3
1.5
0.5
Ａ
3.0
1.2
4.0
1.65
0.05以下
5.0
2.0
5.0
2.9
3.5±0.05
40
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
a
0.2
0.3
0.4
1.0
1.2
2.2
2.2
8.0±0.3
Type
c
c
f4.5
Ｂ
b
Land
1.75±0.1
(Coat with heat resistant resin for solder)
t
Fig.1
(in mm)
Kind substrate
of Solder : Sn-3.0Ag-0.5Cu
・Test
Pressurization
・Test
substrate method
20
50 min.
Pressurization
speed
1.0mm/s
Pressurize
tor
R5
Flexure:≦1
Support
Capacitance meter
45
45
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
Kind substrate
of Solder : Sn-3.0Ag-0.5Cu
・Test
Landsubstrate
Dimensions
・Test
Chip Capacitor
Type
Land
c
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
b
a
Solder Resist
a
0.2
0.3
0.4
1.0
1.2
2.2
2.2
Fig.3
JEMCGS-0015S
5
Dimension (mm)
b
0.56
0.9
1.5
3.0
4.0
5.0
5.0
c
0.23
0.3
0.5
1.2
1.65
2.0
2.9
Package
GRM Type
1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
φ180mm reel
Paper Tape
Plastic Tape
Type
Code:D/E
Code:W
Code:L
GRM01
GRM02
40000(W4P1)
15000(W8P2)
15000(W8P2) 30000(W8P1)
10000(W8P2)
20000(W8P2)
10000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
5(LWT Dimensions Tolerance:±0.05)
10000(W8P2) 20000(W8P1)
50000(W8P2)
5(LWT Dimensions Tolerance:±0.1min.)
10000(W8P2)
40000(W8P2)
5 (LW Dimensions Tolerance:±0.1min.
and T Dimensions Tolerance:±0.05)
10000(W8P2)
50000(W8P2)
5(LW Dimensions Tolerance:±0.2
and T Dimensions:0.5 +0/-0.1)
10000(W8P2)
GRM18
GRM31
GRM32
GRM43
GRM55
4000
4000
4000
6
9
A/B
6/9
M/X
C
9
A/M
N
C
R/D/E
M
N/R/D
E
S
M
N/C/R/D
E
F
3000
3000
4000
10000
10000
10000
10000
10000
10000
3000
2000
4000
10000
6000
10000
3000
2000
2000
1000
1000
1000
500
500
1000
1000
500
300
1.2 Dimensions of Tape
(1)GRM01/02 (W4P1 CODE:L)
*1,2：1.0±0.02
*1
*2
1.8±0.02
φ0.8±0.04
2.0±0.04
Ｂ
Ａ
10000
8000
6000
4000
5000
4000
2000
1500
5000
4000
1500
(in:mm)
2.0±
＊ 1,2：1.0± 0.02
＊1
0.15～0.25
φ 0.8±0.04
Ａ
Ｂ
GRM21
Code:K
2
3
5
2
3/X
4.0±0.05
GRM15
Code:J/ F
50000(W4P1)
0.9±0.05
GRM03
φ330mm reel
Paper Tape Plastic Tape
0.05以下
0.05 max.
t
Type
GRM01
1
GRM02
2
Dimensions(Chip)
L
W
T
0.25±0.013 0.125±0.013 0.125±0.013
0.4±0.02
0.2±0.02
0.2±0.02
0.4±0.05
0.2±0.05
0.2±0.05
JEMCGP-01796E
A *3
0.145
0.23
0.26
*3 Nominal value
6
B *3
t
0.27
0.43
0.46
0.4 max.
0.5 max.
Package
GRM Type
(2)GRM03/15(W8P2 CODE:D/E/J/F)
*1
*2
3.5±0.05
+0.1
φ1.5 -0
(in:mm)
1.75±0.1
4.0±0.1
Ｂ
Ａ
8.0±0.3
*1,2：2.0±0.05
Ａ
0.05 max.
t
Type
L
2
GRM03
3
5
2
X
3
GRM15
5
0.6±0.03
0.6±0.05
0.6±0.09
1.0±0.05
Dimensions(Chip)
W
T
0.2 +0.02/-0.04
0.3±0.03
0.3±0.03
0.3±0.05
0.3±0.05
0.3±0.09
0.3±0.09
0.5±0.05
0.2 +0.02/-0.04
0.5±0.05
0.25±0.05
1.0±0.2
1.0±0.05
1.0±0.07
1.0±0.1
1.0±0.15
0.5±0.2
0.5±0.05
0.5±0.07
0.5±0.1
0.5±0.15
1.0±0.2
0.5±0.2
0.3±0.03
0.5±0.05
0.5±0.07
0.5±0.1
0.5±0.15
0.5 +0/-0.1
0.5±0.2
0.5±0.05
A *3
B *3
0.37
0.67
0.39
0.69
0.44
0.74
0.65
1.15
0.78
1.29
0.65
1.15
0.70
0.72
1.20
1.25
0.78
1.29
t
0.5 max.
0.6 max.
0.8 max.
*3 Nominal value
(3)GRM033/155(W8P1 CODE:W)
(in:mm)
+0.1
3.5±0.05
φ1.5 -0
Ｂ
Ａ
8.0±0.3
1.75±0.1
4.0±0.1
1.0±0.05
1.0±0.05
t
Type
GRM03
GRM15
3
5
JEMCGP-01796E
L
0.6±0.03
0.6±0.05
0.6±0.09
1.0±0.05
Dimensions(Chip)
W
0.3±0.03
0.3±0.05
0.3±0.09
0.5±0.05
T
0.3±0.03
0.3±0.05
0.3±0.09
0.5±0.05
7
A *3
0.37
0.39
0.44
0.65
*3 Nominal value
*
B *3
0.67
0.69
0.74
1.15
t
0.5 max.
0.6 max.
0.8 max.
Package
GRM Type
(4)GRM18/21/31/32
(in:mm)
4.0±0.1
2.0±0.1
+0.1
-0
φ1.5
3.5±0.05
3.5±0.05
Ｂ
Ａ
4.0±0.1
Ａ
Ｂ
2.0±0.1
φ1.5 -0
1.75±0.1
1.75±0.1
+0.1
4.0±0.1
8.0±0.3
4.0±0.1
t
t
Dimensions(Chip)
Type
L
W
1.6±0.1
0.8±0.1
1.6±0.2
0.8±0.2
1.6±0.1
0.8±0.1
0.8±0.1
1.6±0.15
0.8±0.15
0.8±0.15
1.6±0.2
0.8±0.2
0.8±0.2
5
GRM18
6
7
8
T
0.5 +0/-0.1
9
B
GRM31
1.25±0.1
C
GRM32
0.6 +0/-0.1
1.05±0.10
1.85±0.10
1.10±0.10
2.00±0.10
Dimensions
of Tape
Paper Tape
1.15 max.
0.85±0.1
1.55±0.15
2.30±0.15
0.85 +0/-0.2
1.25±0.15
2.0±0.2
1.25±0.2
0.85 +0.15/-0.05
1.50±0.20
2.30±0.20
2.0±0.1
1.25±0.1
1.0 +0/-0.2
1.45±0.20
2.25±0.20
2.0±0.2
1.25±0.2
1.0±0.2
1.50±0.20
2.30±0.20
2.0±0.1
1.25±0.1
1.25±0.1
1.45±0.20
2.25±0.20
2.0±0.15
1.25±0.15
1.25±0.15
2.0±0.2
1.25±0.2
1.25±0.2
1.50±0.20
2.30±0.20
3.2±0.15
1.6±0.15
2.00±0.20
3.60±0.20
3.2±0.2
1.6±0.2
3.2±0.15
1.6±0.15
1.90±0.20
3.50±0.20
1.6±0.3
2.10±0.20
3.60±0.20
2.80±0.20
3.60±0.20
0.85±0.1
0.85±0.1
1.6±0.2
3.2±0.3
1.6±0.3
1.15±0.1
0.85 +0.15/-0.05
1.0 +0/-0.2
M
1.15±0.1
2.5±0.2
1.15 max.
Paper Tape
1.7 max.
Plastic Tape
2.80±0.20
1.6±0.2
1.8±0.2
D
2.0±0.2
E
2.5±0.2
2.5 max.
1.15 max.
Paper Tape
1.7 max.
1.35±0.15
R
JEMCGP-01796E
2.0 max.
1.2±0.1
1.6±0.2
3.2±0.3
Plastic Tape
1.25±0.1
1.15±0.15
3.2±0.2
1.7 max.
0.6±0.1
9
C
2.00±0.10
0.85±0.05
A
N
1.10±0.10
2.0±0.15
M
X
1.85±0.10
0.6 +0/-0.15
9
6
1.05±0.10
t
0.8 max.
0.5±0.05
0.85 +0.15/-0.1
B
B
0.6±0.1
2.0±0.1
A
A
0.7±0.1
6
GRM21
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
8.0±0.3
3.50±0.20
2.5 max.
3.0 max.
3.7 max.
8
Plastic Tape
Package
GRM Type
8.0±0.1
*
4.0±0.1
+0.1
φ1.5 -0
(in:mm)
1.75±0.1
(5)GRM43/55
0.3±0.1
Ｂ
Ａ
12.0±0.3
5.5±0.1
*：2.0±0.1
+0.2
φ1.5 -0
t
Type
M
N
R
GRM43
D
E
S
M
N
C
GRM55 R
D
E
F
L
4.5±0.4
5.7±0.4
Dimensions(Chip)
W
3.2±0.3
5.0±0.4
A *1
T
1.15±0.1
1.35±0.15
1.8±0.2
2.0±0.2
2.5±0.2
2.8±0.2
1.15±0.1
1.35±0.15
1.6±0.2
1.8±0.2
2.0±0.2
2.5±0.2
3.2±0.2
t
2.5 max.
3.6
4.9
3.7 max.
4.7 max.
2.5 max.
5.2
6.1
3.7 max.
4.7 max.
*1 Nominal value
JEMCGP-01796E
B *1
9
め状態
(単位：mm)
Package
GRM Type
Fig.1
Package Chips
(in:mm)
Chip
Fig.2
Dimensions of Reel
φ13±0.5
φ180+0/-3.0
φ330±2.0
φ21±0.8
φ50 min.
2.0±0.5
ｗ1
W
Fig.3
Taping Diagram
GRM01/02
GRM03/15/18/21/31/32
GRM43/55
W
8.0 max.
16.5 max.
20.5 max.
w1
5±1.5
10±1.5
14±1.5
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
Base Tape : As specified in 1.2.
JEMCGP-01796E
10
ﾁｯﾌﾟ詰め状態
Package
GRM Type
(単位：mm)
1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
(in:mm)
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
1.5 Accumulate pitch : 10 of sprocket holes pitch = 20±0.3mm(GRM01/02)
40±0.3mm(GRM03 min.)
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension
is shown in Fig 2.
図1 ﾁｯﾌﾟ詰め状態
(単位：mm)
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N* in the direction as shown below.
* GRM01/02/03:0.05N～0.5N
165～180°
Top tape
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
JEMCGP-01796E
11
!
Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment
⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5℃ to +40℃ and a Relative Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity
conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months,
as prolonged storage may cause oxidation of the terminations (outer electrodes).
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)]
Sample: 0.1μF, Rated Voltage 50VDC
[Example of Temperature Characteristics X5R(R6)]
Sample: 22μF, Rated Voltage 4VDC
20
Capacitance Change (%)
Capacitance Change (%)
20
15
10
5
0
-5
-10
10
5
0
-5
-10
-15
-15
-20
-75
15
-50
-25
0
25
50
75
100
125
150
-20
-75
JEMCGC-2701X
-50
-25
0
25
Temperature ( C)
Temperature ( C)
12
50
75
100
!
Caution
2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage
DC Voltage+AC
E
AC Voltage
E
E
Pulse Voltage
E
0
0
0
0
(E：Maximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
[Example of Temperature Rise (Heat Generation) in Chip
Monolithic Ceramic Capacitors in Contrast to Ripple Current]
Sample: R(R1) characteristics 10μF, Rated voltage: DC10V
Ripple Current
100
Temperature Rise ( C)
1-1. The load should be contained to the level
such that when measuring at atmospheric
temperature of 25°C, the product's self-heating
remains below 20°C and the surface
temperature of the capacitor in the actual circuit
remains within the maximum operating
temperature.
10
100kHz
500kHz
1MHz
1
0
1
2
3
Current (Ar.m.s.)
JEMCGC-2701X
13
4
5
6
!
Caution
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
[Example of DC Voltage Characteristics]
Capacitance Change (%)
Sample: X7R(R7) Characteristics 0.1μF, Rated Voltage 50VDC
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in the actual operating conditions
of the system.
20
0
-20
-40
-60
-80
-100
0
10
20
30
DC Voltage (V)
40
50
[Example of AC Voltage Characteristics]
Sample: X7R(R7) Characteristics 10μF, Rated Voltage 6.3VDC
Capacitance Change (%)
30
20
10
0
-10
-20
-30
-40
-50
-60
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in a
AC circuit.
0
0.5
1
1.5
2
AC Voltage (Vr.m.s.)
6. Capacitance Aging
[ Example of Change Over Time (Aging characteristics) ]
1. The high dielectric constant type capacitors
have an Aging characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
Capacitance Change(%)
20
10
0
-10
C0G(5C)
-20
X7R(R7)
-30
X5R(R6)
-40
10
100
1000
10000
Time(h)
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
JEMCGC-2701X
14
Crack
Floor
Mounting printed circuit board
Crack
!
Caution
■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
①
Locate chip horizontal to the
direction in which stress acts.
1A
(Bad Example)
(Good Example)
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
Stress Level
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
Perforation
①
C
B
D
A
1A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
③②
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
Screw Hole
Recommended
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
JEMCGC-2701X
15
1C 1B
!
Caution
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any damage or cracking. Please take into account the following precautions
and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
[Incorrect]
Suction Nozzle
Deflection
Board
Board Guide
[Correct]
Support Pin
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
JEMCGC-2701X
16
!
Caution
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
[Standard Conditions for Reflow Soldering]
Temperature(℃)
Soldering
Peak Temperature
220℃
Gradual
Cooling
ΔT
190℃
170℃
150℃
Preheating
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated
termination chips before use.
Table 1
Series
Chip Dimension(L/W) Code
Temperature Differential
01/02/03/15/18/21/31
ΔT≦190℃
GRM
GRM
ΔT≦130℃
32/43/55
Time
30-60 seconds
[Allowable Reflow Soldering Temperature and Time]
Soldering Temperature(℃)
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
60-120 seconds
280
270
260
250
240
230
220
0
30
60
90
120
Soldering Time(s)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Lead Free Solder
Peak Temperature
Atmosphere
240 to 260℃
Air or N2
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a excessive solder fillet height.
This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.
4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose
from the PCB.
4-3. Please confirm that solder has been applied smoothly to the termination.
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks to the PCB.
JEMCGC-2701X
17
!
Caution
4-2.Flow Soldering
[Standard Conditions for Flow Soldering]
1. Do not apply flow soldering to chips not listed in Table 2.
Chip Dimension(L/W) Code
GRM
Temperature(℃)
Soldering
Peak
Temperature
Temperature Differential
ΔT≦150℃
18/21/31
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as low as possible.
3. Excessively long soldering time or high soldering
temperature can result in leaching of the terminations,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the inner electrodes and terminations.
4. When components are immersed in solvent after mounting,
be sure to maintain the temperature differential (ΔT)
between the component and solvent within the range
shown in the table 2.
Soldering
Gradual
Cooling
ΔT
Preheating
Peak
Temperature
Preheating
30-90 seconds
280
270
260
250
240
230
220
0
10
20
Lead Free Solder
100 to 120℃
Soldering Peak Temperature
250 to 260℃
Atmosphere
Air or N2
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
Up to Chip Thickness
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
JEMCGC-2701X
Adhesive
18
30
40
Soldering Time(s)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Preheating Peak Temperature
Time
5 seconds max.
[Allowable Flow Soldering Temperature and Time]
Soldering mperature(℃)
Table 2
Series
in section
!
Caution
4-3.Correction of Soldered Portion
When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally,
and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending
on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.
Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.
1-2. After soldering, do not allow the component/PCB to cool down rapidly.
1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,
there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration of the
adhesive strength and other problems.
Table 3
Chip Dimension
Temperature of
Preheating
Temperature
Series
Atmosphere
(L/W) Code
Soldering Iron Tip
Temperature
Differential(ΔT)
GRM
03/15/18/21/31
350℃ max.
150℃ min.
ΔT≦190℃
Air
GRM
32/43/55
280℃ max.
150℃ min.
ΔT≦130℃
Air
Lead Free Solder: Sn-3.0Ag-0.5Cu
* Please manage Δ T in the temperature of soldering iron and the preheating temperature.
2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component
and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,
a spot heater can also prevent concerns of the soldering iron making direct contact with the component.
2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to
thermal shock. To prevent this problem, follow the conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown
in Figure 1.
Table 4
Distance
5mm or more
Hot Air Application angle
45° *Figure 1
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
Application Time
(3216M / 1206 size or smaller)
Less than 30 seconds
(3216M , 3225M : Metric size code)
(3225M / 1210 size or larger)
[Figure 1]
One-hole Nozzle
an Angle of 45
3. Optimum solder amount when re-working with a soldering iron
3-1. If the solder amount is excessive, the risk of cracking is higher
during board bending or any other stressful condition.
Too little solder amount results in a lack of adhesive strength
on the termination, which may result in chips breaking
loose from the PCB.
Please confirm that solder has been applied smoothly is
and rising to the end surface of the chip.
3-2. A soldering iron with a tip of ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from touching
the components during the re-work.
3-3. Solder wire with ø0.5mm or smaller is required for soldering.
JEMCGC-2701X
19
Solder Amount
in section
!
Caution
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended]
[Recommended]
Support Pin
Peeling
Test-probe
Test-probe
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
①
[Bending]
[Twisting]
1A
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
Board Separation Method
Level of stress on board
Recommended
Notes
Hand Separation
Nipper Separation
High
×
Hand and nipper
separation apply a high
level of stress.
Use another method.
(1) Board Separation Jig
Medium
△*
Board Separation Apparatus
2) Disc Separator
3) Router Type Separator
Medium
Low
△*
◯
· Board handling
· Board handling
· Layout of slits
· Board bending direction · Design of V groove
· Layout of capacitors
· Arrangement of blades
· Controlling blade life
Board handling
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
JEMCGC-2701X
20
Caution
!
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the component mounting position, if the portion away from the jig is held and bent in the
direction opposite the side where the capacitors are mounted.
[Outline of jig]
[Hand Separation]
Recommended
Not recommended
Direction of load
Printed Circuit Board
V-groove
Printed circuit
board
Direction of
load
Load point
Component
s
Printed circuit
board
Load point
Board Cropping Jig
Components
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
(Measures)
(1) Consider introducing a router type separator.
If it is difficult to introduce a router type separator, implement the following measures.
(Refer to item 1. Mounting Position)
(2) Mount the components parallel to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disc Separator
An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top
blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflection stress will be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,
left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the
V groove with consideration about strength of material of the printed circuit board.
[ Outline of Machine ]
[ Principle of Operation ]
[ Cross-section Diagram ]
Top Blade
Printed Circuit Board
Top Blade
V-groove
Bottom Blade
Printed Circuit Board
V-groove
[Disc Separator]
Recommended
Top Blade
Top-bottom Misalignment
Top Blade
Bottom Blade
Not recommended
Left-right Misalignment
Top Blade
Bottom Blade
Front-rear Misalignment
Top Blade
Bottom Blade
Bottom Blade
[V-groove Design]
Example of
Recommended
V-groove Design
JEMCGC-2701X
Left-right Misalignment
Not Recommended
Low-Angle
Depth too Shallow
21
Depth too Deep
!
(3) Example of Router Type Separator
The router type separator performs cutting by a router
rotating at a high speed. Since the board does not
bend in the cutting process, stress on the board can
be suppressed during board separation.
When attaching or removing boards to/from the router type
separator, carefully handle the boards to prevent bending.
[ Outline Drawing ]
Router
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend.
Firmly hold the edges of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other components on the back side of the board after
capacitors have been mounted on the opposite side.
When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.
· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.
· Periodically check and adjust the bottom dead point.
Suction Nozzle
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the
capacitors or cracks in the solder. Pay attention to the following.
· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.
· Fix the board with support pins or a dedicated jig before insertion.
· Support below the board so that the board does not bend. When using multiple support pins on the board,
periodically confirm that there is no difference in the height of each support pin.
Component with Leads
2-3. Attaching/Removing Sockets
When the board itself is a connector, the board may bend when a socket is attached or removed.
Plan the work so that the board does not bend when a socket is attached or removed.
Socket
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or
chassis. Pay attention to the following items before performing the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening of the screws.
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening the board when tightening the screws.
Screwdriver
JEMCGC-2701X
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Caution
!
Caution
■ Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions.
Do not use the equipment under the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused
by the capacitor's high temperature.
2-2. Disposal of waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate
licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or bending of the board may cause deterioration of the
insulation resistance, and result in a short. If the circuit being used may cause an electrical shock,
smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,
to prevent secondary accidents.
(2) This series are not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.
The above notices are for standard applications and conditions. Contact us when the products are used in special
mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
JEMCGC-2701X
23
Notice
■ Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the maximum operating temperature.
It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.
It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable
factor.
1-2. Consider the self-heating factor of the capacitor
The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.
2.Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
JEMCGC-2701X
24
Notice
■Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking.
When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility
of excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.When the thermal expansion coefficient
greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to
the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit
board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.
Pattern Forms
Prohibited
Correct
Chassis
Solder Resist
Solder (ground)
Placing Close to Chassis
Electrode Pattern
in section
Lead Wire
in section
Solder Resist
Placing of Chip
Components
and Leaded
Components
in section
Soldering Iron
in section
Lead Wire
Placing of Leaded
Components
after Chip Component
Solder Resist
in section
in section
Solder Resist
ｿﾙﾀﾞﾚｼﾞｽﾄ
Lateral Mounting
JEMCGC-2701X
25
Notice
2. Land Dimensions
Chip Capacitor
2-1. Chip capacitors can be cracked due to the stress
of PCB bending , etc. if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1
for flow soldering, table 2 for reflow soldering.
c
Land
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Chip Dimension
Series
(L/W) Code
b
a
Solder Resist
Chip(L×W)
a
b
c
GRM
18
1.6×0.8
0.6 to 1.0
0.8 to 0.9
0.6 to 0.8
GRM
21
2.0×1.25
1.0 to 1.2
0.9 to 1.0
0.8 to 1.1
GRM
31
3.2×1.6
2.2 to 2.6
1.0 to 1.1
1.0 to 1.4
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.
(in mm)
Table 2 Reflow Soldering Method
Series
Chip Dimension
(L/W) Code
Chip(L×W)
(Dimensions
Tolerance)
a
b
c
GRM
01
0.25×0.125
0.10 to 0.11
0.07 to 0.12
0.125 to 0.145
GRM
02
0.4×0.2
0.16 to 0.2
0.12 to 0.18
0.2 to 0.23
GRM
03
0.6×0.3
0.2 to 0.3
0.2 to 0.35
0.2 to 0.4
0.3 to 0.5
0.35 to 0.45
0.4 to 0.6
GRM
15
0.4 to 0.6
0.4 to 0.5
0.5 to 0.7
0.6 to 0.8
0.6 to 0.7
0.6 to 0.8
0.7 to 0.9
0.7 to 0.8
0.8 to 1.0
1.2
0.6
1.25
1.2
0.6 to 0.8
1.2 to 1.4
1.0 to 1.4
0.6 to 0.8
1.2 to 1.4
1.8 to 2.0
0.9 to 1.2
1.5 to 1.7
1.9 to 2.1
1.0 to 1.3
1.7 to 1.9
GRM
GRM
GRM
18
21
31
1.0×0.5
(within ±0.10)
1.0×0.5
（±0.15/±0.20）
1.6×0.8
(within ±0.10)
1.6×0.8
(±0.15/±0.20)
2.0×1.25
(within ±0.10)
2.0×1.25
(±0.15)
2.0×1.25
(±0.20)
3.2×1.6
(within±0.20)
3.2×1.6
(±0.30)
GRM
32
3.2×2.5
2.0 to 2.4
1.0 to 1.2
1.8 to 2.3
GRM
43
4.5×3.2
3.0 to 3.5
1.2 to 1.4
2.3 to 3.0
GRM
55
5.7×5.0
4.0 to 4.6
1.4 to 1.6
3.5 to 4.8
(in mm)
JEMCGC-2701X
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Notice
3. Board Design
When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size
and material of the board.
Relationship with amount of strain to the board thickness, length, width, etc.]
ε=
3PL
2Ewh2
Relationship between load and strain
P
Y
h
ε：Strain on center of board (μst)
L：Distance between supporting points (mm)
w ：Board width (mm)
h ：Board thickness (mm)
E ：Elastic modulus of board (N/m2=Pa)
Y ：Deflection (mm)
P ：Load (N)
w
L
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (L) increases,the amount of strain also increases.
→Reduce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.
→Increase the elastic modulus.
· As the board width (w) decreases, the amount of strain increases.
→Increase the width of the board.
· As the board thickness (h) decreases, the amount of strain increases.
→Increase the thickness of the board.
Since the board thickness is squared, the effect on the amount of strain becomes even greater.
2.Adhesive Application
1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain the correct bonding
strength. The chip's electrode thickness and land thickness must also be taken into consideration.
Chip Capacitor
a=20 to 70μm
b=30 to 35μm
c=50 to 105μm
a
c
Board
Adhesive
Land
b
2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity of
5000Pa • s (500ps) min. (at 25℃)
3. Adhesive Coverage
Size (L×W) (in mm)
1.6 × 0.8
2.0 × 1.25
3.2 × 1.6
Adhesive Coverage*
0.05mg min.
0.1mg min.
0.15mg min.
*Nominal Value
3.Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes
deterioration in the insulation resistance between the terminations due to moisture absorption.
Control curing temperature and time in order to prevent insufficient hardening.
4.Flux (for Flow soldering)
1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability,
so apply flux thinly and evenly throughout. (A foaming system is generally used for flow solderring.)
2. Flux containing too high a percentage of halide may cause corrosion of the terminations unless there is
sufficient cleaning. Use flux with a halide content of 0.1% max.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)
JEMCGC-2701X
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Notice
5.Flow Soldering
［As a Single Chip］
Set temperature and time to ensure that leaching of the
terminations does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown at right) and 25% of the length A-B shown as
mounted on substrate.
A
B
D
Termination
C
［As Mounted on Substrate］
B
A
6.Reflow soldering
The halogen system substance and organic acid are included in solder paste, and a chip corrodes
by this kind of solder paste.
Do not use strong acid flux.
Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)
7.Washing
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,
and select the solvent for cleaning.
2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the performance
of the capacitors.
8.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process.
The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor
may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration
of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance
of a capacitor. An epoxy resin can be used as a less hygroscopic resin.
3．The halogen system substance and organic acid are included in coating material, and a chip corrodes
by the kind of Coating material. Do not use strong acid type.
JEMCGC-2701X
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Notice
■ Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation.
(1) Climatic condition
･ low air temperature : -40℃
･ change of temperature air/air : -25℃/+25℃
･ low air pressure : 30 kPa
･ change of air pressure : 6 kPa/min.
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed
on to the inner packaging.
1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur
in the ceramic body of the capacitor.
(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface
of the capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
A capacitor dropped accidentally during processing may be damaged.
2.Characteristics Evaluation in the Actual System
1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification
values in a finished product before using.
2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic
capacitors, the capacitance may change depending on the operating conditions in the actual system.
Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity,
which will affect the capacitance value of the capacitor.
3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in
the actual system. Evaluate the surge resistance in the actual system as required.
JEMCGC-2701X
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!
1.Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2.Your are requested not to use our product deviating from this product specification.
3.We consider it not appropriate to include any terms and conditions with regard to the business
transaction in the product specifications, drawings or other technical documents. Therefore,
if your technical documents as above include such terms and conditions such as warranty clause,
product liability clause, or intellectual property infringement liability clause, they will be deemed to
be invalid.
JEMCGC-2701X
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NOTE
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