GRM155R61A225KE95D

Chip Monolithic Ceramic Capacitor for General GRM155R61A105KE01_ (0402, X5R:EIA, 1uF, DC10V) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment. 　　 2.MURATA Part NO. System (Ex.) GRM 15 5 (2)T Dimensions (1)L/W Dimensions R6 1A (4)Rated Voltage (3)Temperature Characteristics 105 K (5)Nominal Capacitance (6)Capacitance Tolerance E01 (7)Murata’s Control Code 3. Type & Dimensions (Unit:mm) g (1)-1 L (1)-2 W (2) T e 1.0±0.05 0.5±0.05 0.5±0.05 0.15 to 0.35 0.3 min. 4.Rated value (3) Temperature Characteristics (Public STD Code):X5R(EIA) Temp. coeff Temp. Range or　Cap. Change (Ref.Temp.) -15 to 15 % -55 to 85 °C (25 °C) (4) Rated Voltage DC 10 V (6) (5) Nominal Capacitance Capacitance Tolerance 1 uF ±10 % Specifications and Test Methods (Operating Temp. Range) -55 to 85 °C 5.Package mark D W J (8) Packaging f180mm Reel PAPER W8P2 f180mm Reel PAPER W8P1 f330mm Reel PAPER W8P2 Packaging Unit 10000 pcs./Reel 20000 pcs./Reel 50000 pcs./Reel Product specifications in this catalog are as of Mar.6,2016,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and !Cautions first. GRM155R61A105KE01-01 1 D (8)Packaging Code ■ Specifications and Test Methods Item No 1 Rated Voltage Test Method (Ref. Standard:JIS C 5101, IEC60384） Specification Shown in Rated value. The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, should be maintained within the rated voltage range. 2 Appearance No defects or abnormalities. Visual inspection. 3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope) 4 Voltage proof No defects or abnormalities. Measurement Point　 Test Voltage 　 　 :Between the terminations 　　　　　 : 250% of the rated voltage Applied Time : 1 to 5 s Charge/discharge current : 50mA max. 5 Insulation Resistance(I.R.) More than 50Ω ∙ F Measurement Point 　 　 : Between the terminations Measurement Voltage : DC Rated Voltage Charging Time : 1 min Charge/discharge current : 50mA max. Measurement Temperature :Room Temperature 6 Capacitance Shown in Rated value. Measurement Temperature :Room Temperature 7 Dissipation Factor (D.F.) B1,R1,B3,R6,R7,C6,C7,C8,E7,D7 : 0.1 max. Capacitance C≦10μF (10V min.) C≦10μF (6.3V max.) D8,GRM31CR60J107 : 0.15 max GRM31CR71E106 : 0.125 max Frequency Voltage 1.0+/-0.1kHz 1.0+/-0.2Vrms 1.0+/-0.1kHz 0.5+/-0.1Vrms 120+/-24Hz 0.5+/-0.1Vrms C＞10μF 8 Temperature No bias B1,B3 : Within +/-10% (-25°C to +85°C) (-55°C to +125°C) The capacitance change should be measured after 5 min. Characteristics R1,R7 : Within +/-15% of Capacitance R6 : Within +/-15% (-55°C to +85°C) at each specified temp. stage. In case of applying voltage, the capacitance change should be C6 : Within +/-22% (-55°C to +85°C) measured after 1 min. with applying voltage in equilibration of C7 : Within+/-22% (-55°C to +125°C) each temp. stage. C8 : Within +/-22% (-55°C to +105°C) Capacitance value as a reference is the value in step 3. E7 : Within +22/-56% (-55°C to +125°C) D7 : Within +22/-33% (-55°C to +125°C) D8 : Within +22/-33% (-55°C to +105°C) · Measurement Voltage : 0.5+/-0.1Vrms Step 1 Temperature(C) Reference Temp.+/-2 Min.Operating Temp. +/-3 50% of B1: Within +10/-30% 2 the rated R1: Within +15/-40% 3 Reference Temp. +/-2 4 5 Max.Operating Temp. +/-3 Reference Temp. +/-2 6 Min.Operating Temp. +/-3 7 Reference Temp. +/-2 8 Max.Operating Temp.+/-3 voltage Applying Voltage(VDC) No bias 50% of the rated voltage (For B1,R1) ･Initial measurement Perform a heat treatment at 150+0/-10°C for 1h and then let sit for 24+/-2h at room temperature,then measure. 9 Adhesive Strength of Termination No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3. should occur. Type Applied Force(N) GRM02 1 GRM03 2 GRM15/GRM18 5 GRM21/GRM31/GRM32 Holding Time 10 : 10+/-1s Applied Direction : In parallel with the test substrate and vertical with the capacitor side. JEMCGS-02445B 2 Item No 10 Vibration Test Method (Ref. Standard:JIS C 5101, IEC60384） Specification Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. Capacitance Within the specified initial value. Kind of Vibration D.F. Within the specified initial value. : A simple harmonic motion 10Hz to 55Hz to 10Hz (1min) Total amplitude :1.5mm This motion should be applied for a period of 2h in each 3 mutually perpendicular directions(total of 6h). 11 Substrate Bending test Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1. Capacitance Within +/-10% Pressurization method Change 12 Solderability 13 Resistance 95% of the terminations is to be soldered evenly and continuously. Appearance : Shown in Fig.2 　　　: 1mm Flexure　 Holding Time 　 :5+/-1s Soldering Method : Reflow soldering Test Method : Solder bath method Flux Solution of rojin ethanol 25(wt)% Preheat : 80℃ to 120℃ for 10s to 30s Solder : Sn-3.0Ag-0.5Cu Solder Temp. : 245+/-5℃ Immersion time : No defects or abnormalities. 2+/-0.5s to Test Method : Solder bath method Soldering Solder : Sn-3.0Ag-0.5Cu Heat Solder Temp. : 270+/-5℃ : 24+/-2h : GRM31 size max.: 120℃ to 150℃ for 1 min Capacitance B1,R1,B3,R6,R7,C6,C7,C8,E7,D7,D8 　: Within +/-7.5% Immersion time :Exposure Time Change GRM188B30J106M Preheat : Within +/-12.5% 10+/-0.5s 　 GRM32 size　　　 : 100℃ to 120℃ for 1 min and 170℃ to 200℃ for 1 min · Initial measurement D.F. Within the specified initial value. Perform a heat treatment at 150+0/-10°C for 1h and then let sit for 24+/-2h at room temperature,then measure. I.R. Within the specified initial value. Voltage proof No defects. Test Method : Reflow soldering (hot plate) Solder : Sn-3.0Ag-0.5Cu Solder Temp. : 270+/-5℃ Reflow Time : 10+/-0.5s Test Substrate : Glass epoxy PCB Exposure Time : 24+/-2h Preheat : 120℃ to 150℃ for 1 min · Initial measurement Perform a heat treatment at 150+0/-10°C for 1h and then let sit for 24+/-2h at room temperature,then measure. 14 Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. Perform the five cycles according to the four heat treatments Sudden Change shown in the following table. Capacitance B1,R1,B3,R6,R7,C6,C7,C8,D7,D8 : Within +/-7.5% Change E7 : Within +/-30% D.F. I.R. Within the specified initial value. Within the specified initial value. Step Temp.(C) Time (min) 30+/-3 1 Min.Operating Temp.+0/-3 2 Room Temp 2 to 3 3 Max.Operating Temp.+3/-0 30+/-3 4 Room Temp 2 to 3 Exposure Time : 24+/-2h · Initial measurement Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h and then let sit for 24+/-2h at room temperature,then measure. · GRM188B30J106M Measurement after test: Perform a heat treatment at 150+0/-10°C for 1h and then let sit for 24+/-2h at room temperature,then measure. 15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. Temperature Test Temperature : 40+/-2℃ High Test Humidity : 90%RH to 95%RH Humidity Capacitance (Steady) Change Within +/-12.5% Test Time Applied Voltage : 500+/-12h : DC Rated Voltage Charge/discharge current : 50mA max. D.F. 0.2 max. I.R. More than 12.5Ω ∙ F Exposure Time : 24+/-2h · Initial measurement Perform a heat treatment at 150+0/-10°C for 1h and then let sit for 24+/-2h at room temperature,then measure. · Measurement after test Perform a heat treatment at 150+0/-10°C for 1h and then let sit for 24+/-2h at room temperature,then measure. JEMCGS-02445B 3 Item No 16 Durability Test Method (Ref. Standard:JIS C 5101, IEC60384） Specification Appearance No defects or abnormalities. Capacitance Within +/-12.5% Solder the capacitor on the test substrate shown in Fig.3. Test Temperature : Max. Operating Temp. +/-3℃ Test Time Change : 1000+/-12h Applied Voltage : 150% of the rated voltage Charge/discharge current : 50mA max. Exposure Time D.F. : 24+/-2h 0.2 max. · Initial measurement Perform a heat treatment at 150+0/-10°C for 1h and then let sit for 24+/-2h at room temperature,then measure. More than 25Ω ∙ F I.R. · Measurement after test Perform a heat treatment at 150+0/-10°C for 1h and then let sit for 24+/-2h at room temperature,then measure. Test method : Substrate Bending test ・Test substrate Material : Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin) Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm) Copper foil thickness : 0.035mm : Solder resist (Coat with heat resistant resin for solder) 4.0±0.1 3.5±0.05 0.05以下 100 (in mm) Fig.1 ・Kind of Solder : Sn-3.0Ag-0.5Cu ・Pressurization method Fig.2 (in mm) Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method) High Temperature High Humidity(Steady) , Durability ・Test substrate Material : Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin) Thickness : 1.6mm or 0.8mm Copper foil thickness : 0.035mm ・ Kind of Solder : Sn-3.0Ag-0.5Cu ・ Land Dimensions Chip Capacitor c Land b a Solder Resist 　 JEMCGS-02445B Fig.3 4 8.0±0.3 ＊2