Chip Multilayer Ceramic Capacitors for General Purpose
GRM1885C2E180JW07_ (0603, C0G:EIA, 18pF, DC250V)
_: packaging code
Reference Sheet
1.Scope
This product specification is applied to Chip Multilayer Ceramic Capacitors used for General Electronic equipment.
Do not use these products in any automotive power train or safety equipment including battery chargers for electric vehicles and plugin hybrids.
2.MURATA Part NO. System
(Ex.)
GRM
18
8
(2)T
Dimensions
(1)L/W
Dimensions
5C
2E
180
(4)Rated
(3)Temperature
Characteristics
(5)Nominal
Capacitance
Voltage
J
(6)Capacitance
Tolerance
W07
(7)Murata’s Control
Code
3. Type & Dimensions
(1)-1 L
(1)-2 W
(2) T
e
1.6±0.1
0.8±0.1
0.8±0.1
0.2 to 0.5
(Unit:mm)
g
0.4 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
0±30 ppm/°C
25 to 125 °C
(25 °C)
(4)
Rated
Voltage
DC 250 V
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
18 pF
±5 %
Specifications and Test
Methods
(Operating
Temp. Range)
-55 to 125 °C
・Soldering Method
Flow / Reflow
5.Package
mark
D
J
(8) Packaging
f180mm Reel
PAPER W8P4
f330mm Reel
PAPER W8P4
Packaging Unit
4000 pcs./Reel
10000 pcs./Reel
Product specifications in this catalog are as of Sep.14,2018,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM1885C2E180JW07-01
1
D
(8)Packaging Code
■ Specifications and Test Methods
Item
No
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Specification
1
Appearance
No defects or abnormalities.
Visual inspection.
2
Dimension
Within the specified dimensions.
Using calipers and micrometers.
3
Voltage proof
No defects or abnormalities.
Measurement Point :
Between the terminations
Test Voltage :
200% of the rated voltage
(Rated voltage:DC200V,DC250V)
150% of the rated voltage
(Rated voltage:DC500V,DC630V)
130% of the rated voltage
(Rated voltage:DC1kV,DC2kV)
(Rated voltage(7U only):DC3.15kV)
Applied Time
:
1 to 5 s
Charge/discharge current : 50mA max.
4
Insulation Resistance(I.R.)
More than 10000MΩ or 100MΩ・μF
Measurement Point :
Between the terminations
(Whichever is smaller)
Measurement Voltage :
DC200+/-20V(Rated voltage:DC200V)
DC250+/-25V(Rated voltage:DC250V)
DC500+/-50V
(Rated voltage:DC500V,DC630V,DC1kV,DC2kV)
(Rated voltage(7U only):DC3.15kV)
Charging Time
:
60+/-5s
Measurement Temperature: Room Temperature
5
6
7
Capacitance
Shown in Rated value.
Q
Measurement Temperature: Room Temperature
1000 min.
Temperature
5C:0+/-30 ppm/°C
Characteristics
Voltage
AC 0.5 to 5.0V(r.m.s)
C≥1000pF
1.0+/-0.1khz
AC 1.0+/-0.2V(r.m.s)
(Temp.Range:+25 to +125°C)
The capacitance change should be measured after 5 min.
(Temp.Range:-55 to +25°C)
at each specified temp. stage.
7U：-750+/-120 ppm/°C
(Temp.Range:+25 to +125℃)
Capacitance value as a reference is the value in step 3.
-750+120/-347 ppm/°C (Temp.Range:-55 to +25℃)
Vibration
Frequency
1.0+/-0.1Mhz
0+30/-72 ppm/°C
of Capacitance
8
Capacitance
C＜1000pF
Step
1
Temperature(C)
Reference Temp.+/-2
2
Min.Operating Temp. +/-3
3
Reference Temp. +/-2
4
5
Max.Operating Temp. +/-3
Reference Temp. +/-2
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate A shown in "Complement of Test
Capacitance
Within the specified initial value.
method”.
Q
Within the specified initial value.
Kind of Vibration
:
A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude
:
1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
9
Solderability
95% of the terminations is to be soldered evenly and
continuously.
Test Method
:
Solder bath method
Flux :
Solution of rosin ethanol 25(wt)%
Preheat
:
80℃ to 120℃ for 10s to 30s
Solder
:
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.
:
Immersion time
10 Resistance
Appearance
No defects or abnormalities.
to
Soldering
Capacitance
Heat
Change
Within +/-2% or +/-0.3pF (Whichever is larger)
245+/-5℃
:
2+/-0.5s
Immersing in speed :
25+/-2.5mm/s.
Test Method
:
Solder bath method
Solder
:
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp.
:
Immersion time
260+/-5℃
:
10+/-1s
Immersing in speed :
25+/-2.5mm/s.
Q
Within the specified initial value.
Exposure Time
:
24+/-2h at room condition*.
I.R.
Within the specified initial value.
Preheat
:
GRM31 size max.: 120℃ to 150℃ for 1 min
Voltage proof No defects.
and 170℃ to 200℃ for 1 min
*Room Condition : Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa
JEMCGS-04233D
GRM32 size min. : 100℃ to 120℃ for 1 min
2
Item
No
11 Adhesive Strength
of Termination
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Specification
No removal of the terminations or other defect
Solder the capacitor on the test substrate A shown in "Complement of Test
should occur.
method”.
10N, 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
12 Substrate
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate B shown in "Complement of Test
method”.
Bending test
Then apply the force in the direction shown in “Test Method of Substrate
Capacitance
Bending test” of “Complement of Test method”.
Within +/-2% or +/-0.3pF (Whichever is larger)
Change
13 Temperature
Appearance
:
Flexure
No defects or abnormalities.
1mm
Holding Time
:
5+/-1s
Soldering Method
:
Reflow soldering
Fix the capacitor to the supporting Test substrate A (glass epoxy board)
shown in “Complement of Test method”.
Sudden Change
Perform the 5 cycles according to the four heat treatments
Capacitance
Within +/-2% or +/-0.3pF (Whichever is larger)
shown in the following table.
Change
Q
I.R.
Step
Temp.(C)
Time
(min)
30+/-3
500 min.
Within the specified initial value.
1
Min.Operating Temp.+0/-3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
Exposure Time
:
24+/-2h at room condition*.
Voltage proof No defects.
14 Humidity
Appearance
No defects or abnormalities.
Capacitance
Within +/-2% or +/-0.3pF (Whichever is larger)
Fix the capacitor to the supporting Test substrate A (glass epoxy board)
shown in “Complement of Test method”.
(Steady state)
Change
Q
350 min.
I.R.
More than 1000MΩ or 10MΩ・μF
Test Temperature
:
40+/-2℃
Test Humidity
:
90% to 95%RH
Test Time
:
500+24/-0h
Exposure Time
:
24+/-2h at room condition*.
(Whichever is smaller)
Voltage proof No defects.
15 Durability
Appearance
No defects or abnormalities.
Fix the capacitor to the supporting Test substrate A (glass epoxy board)
shown in “Complement of Test method”.
Capacitance
Within +/-2% or +/-0.3pF (Whichever is larger)
Change
Test Temperature
:
Max. Operating Temp. +/-3℃
Test Time
:
1000+48/-0h
Applied Voltage
:
150% of the rated voltage
(Rated voltage:DC200V,DC250V)
120% of the rated voltage
Q
(Rated voltage:DC500V,DC630V,DC1kV,DC2kV)
350 min.
(Rated voltage(7U only):DC3.15kV)
I.R.
More than 1000MΩ or 10MΩ・μF
Charge/discharge current : 50mA max.
(Whichever is smaller)
Exposure Time
Voltage proof No defects.
*Room Condition : Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa
JEMCGS-04233D
3
:
24+/-2h at room condition*.
Complement of Test Method
1.Test substrate
The test substrate should be Substrate A or Substrate B as described in “Specifications and Test methods”.
The specimen should be soldered by the conditions as described below.
Soldering Method : Reflow soldering
Solder : Sn-3.0Ag-0.5Cu
(1) Test Substrate A
･Land Dimensions
Chip Capacitor
Type
Land
GRM18
GRM21
GRM31
GRM32
GRM42
GRM43
GRM52
GRM55
c
a
b
･Material
a
1.0
1.2
2.2
2.2
3.5
3.5
4.5
4.5
Solder Resist
Dimension (mm)
b
3.0
4.0
5.0
5.0
7.0
7.0
8.0
8.0
c
1.2
1.65
2.0
2.9
2.4
3.7
3.2
5.6
: Glass Epoxy Board
･Thickness : 1.6mm
･Thickness of copper foil : 0.035mm
(1) Test Substrate B
a
40
(f4.5)
b
100
1.6
Copper foil
Solder resist
Dimension of pettern (mm)
b
c
3.0
1.2
4.0
1.65
5.0
2.0
5.0
2.9
7.0
2.4
7.0
3.7
8.0
3.2
8.0
5.6
a
1.0
1.2
2.2
2.2
3.5
3.5
4.5
4.5
GRM18
GRM21
GRM31
GRM32
GRM42
GRM43
GRM52
GRM55
c
d
Type
d
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
(unit : mm)
･Material : Glass Epoxy Board
･Thickness of copper foil : 0.035mm
2. Test Method of Substrate Bending test
a) Support state
(b) Test state
Test Substrate B
20
Test Substrate B
b
Capacitor
50 min.
a
Support stand(f5)
45+/-2
45+/-2
Pressure stick
Test stand
Support stand
a:+/-2 gap between support stand center and test stand
(unit : mm)
b:+/-5 gap between support stand center and test stand center
·Material of Test stand and pressure stick
The material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized.
·Pressurizing speed
The pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value.
Pressure stick
F
Capacitor
R5
L
45
JEMCGS-04233D
45
Support
4
Support
stand
Package
(1) Appearance of taping
(a) Paper Tape
Bottom Tape (Thickness: Around 50m) is attached below Base Tape with sprocket and put Top Tape
(Thickness: Around 50m) on capacitor.
(b) Plastic Tape
Cover Tape (Thickness: Around 60m) is put on capacitor on Base Tape (Blister carrier Tape).
(c) The sprocket holes are to the right as the Tape is pulled toward the user.
(2) Packed chips
Capacitor
1.75±0.1
(3) Dimensions of Tape
(a) Type A (Dimensions of chip : Apply to 1.6x0.8 , 2.0x1.25 , 3.2x1.6 , 3.2x2.5)
f1.5+0.1/-0
4.0±0.1
(Plastic Tape)
4.0±0.1
B
3.5±0.05
2.0±0.05
8.0±0.3
(Paper Tape)
0.25±0.1(T≦2.0mm)
0.3±0.1(T=2.5mm)
2.5 max.
(T≦2.0mm)
3.7 max.
(T=2.5mm)
1.1 max.
A
(Unit : mm)
Dimensions of chip
[L×W]
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
A*
B*
1.05
1.45
2.0
2.9
1.85
2.25
3.6
3.6
Dimensions of A,B : Nominal value
1.75±0.1
(b) Type B (Dimensions of chip : Apply to 4.5x2.0)
f1.5+0.1/-0
4.0±0.1
4.0±0.1
5.5±0.05
B
12.0±0.3
3.7max.
A
Dimensions of chip
[L×W]
4.5×2.0
JEMCGP-03074B
0.3±0.1
2.0±0.05
(Unit : mm)
A*
B*
2.5
5.1
5
Dimensions of A,B : Nominal value
Package
1.75±0.1
(c) Type C (Dimensions of chip : Apply to 4.5x3.2 to 5.7x5.0)
2.0±0.05
f1.5+0.1/-0
B
12.0±0.3
0.3±0.1
5.5±0.05
4.0±0.1
8.0±0.1
3.7max.
A
Dimensions of chip
[L×W]
4.5×3.2
5.7×2.8
5.7×5.0
(Unit : mm)
A*
B*
3.6
3.2
5.4
4.9
6.1
6.1
Dimensions of A,B : Nominal value
(4) Dimensions of Reel
13.0±1.0 : Tape width 8mm
17.0±1.0 : Tape width 12mm
f21±0.8
f13±0.2
180+0/-1.5
330+0/-3.0
60+1/-0(f180mmReel)
100+1/-0(f330mmReel)
2.0±0.5
(Unit : mm)
9.0+1.0/-0 : Tape width 8mm
13.0+1.0/-0 : Tape width 12mm
(5) Part of the leader and part of the empty tape shall be attached to the end of the tape as follows.
Vacant section : 160 min.
Chip-mounting unit
Vacant section : 190 min.
210 min.
(Unit : mm)
Direction of feed
(6) The top tape or cover tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
(7) Missing capacitors number within 0.1% of the number per reel or 1pc, whichever is greater, and not continuous.
(8) The top tape or cover tape and bottom tape shall not protrude beyond the edges of the tape and shall not
cover sprocket holes.
(9) Cumulative tolerance of sprocket holes, 10 pitches : ±0.3mm.
(10) Peeling off force : 0.1 to 0.6N in the direction shown on the follows.
165 to 180°
Top Tape or Cover Tape
Base Tape
JEMCGP-03074B
6
!
Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment
⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip multilayer ceramic capacitors (henceforth just "capacitors") may be affected by the
storage conditions. Please use them promptly after delivery.
1-1. Maintain appropriate storage for the capacitors using the following conditions:
Room Temperature of +5℃ to +40℃ and a Relative Humidity of 20% to 70%.
High temperature and humidity conditions and/or prolonged storage may cause deterioration of the packaging
materials. If more than six months have elapsed since delivery, check packaging, mounting, etc. before use.
In addition, this may cause oxidation of the electrodes. If more than one year has elapsed since delivery,
also check the solderability before use.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
JEMCGC-05049F
7
!
Caution
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage
DC Voltage+AC
E
E
0
0
AC Voltage
E
Pulse Voltage
0
E
0
(E：Maximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
2. Use a safety standard certified capacitor in a power supply input circuit (AC filter), as it is also necessary to
consider the withstand voltage and impulse withstand voltage defined for each device.
JEMCGC-05049F
8
Caution
!
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
1-1. Since the self-heating is low in the low loss series, the allowable power becomes extremely high
compared to the common X7R(R7) characteristics.
However, when a load with self-heating of 20 C is applied at the rated voltage, the allowable power
may be exceeded. When the capacitor is used in a high-frequency voltage circuit of 1kHz or more,
the frequency of the applied voltage should be less than 500kHz sine wave (less than 100kHz for a
product with rated voltage of DC3.15kV), to limit the voltage load so that the load remains within the
derating shown in the following figure. In the case of non-sine wave, high-frequency components
exceeding the fundamental frequency may be included. In such a case, please contact Murata.
The excessive generation of heat may cause deterioration of the characteristics and reliability of the capacitor.
(Absolutely do not perform measurements while the cooling fan is operating, as an accurate
measurement may not be performed.)
The surface temperature of the capacitor : 125°C or less
(including self-heating)
2012M/0805(2012M:Metric size code)
C0G(5C) Char. Rated Voltage : DC200V
C0G(5C) Char. Rated Voltage : DC250V
Allowable Sine Wave Voltage[Vp-p]
Allowable Sine Wave Voltage [Vp-p]
1000
~3900pF
4700pF
6800pF
10000pF
100
10
10
100
1000
Frequency [kHz]
Except for 2012M/0805 and 3216M/1206
(2012M,3216M:Metric size code)
C0G(5C) Char. Rated Voltage : DC250V
Allowable Sine Wave Voltage[Vp-p]
3216M/1206(3216M:Metric size code)
C0G(5C) Char. Rated Voltage : DC250V
Frequency VS Allowable Sine Wave Voltage
JEMCGC-05049F
9
!
Caution
The surface temperature of the capacitor : 125°C or less
(including self-heating)
2012M/0805(2012M:Metric size code)
C0G(5C) Char. Rated Voltage : DC500V
C0G(5C) Char. Rated Voltage : DC630V
(630V)
~470pF
Allowable Sine Wave Voltage [Vp-p]
Allowable Sine Wave Voltage[Vp-p]
1000
680pF
1000pF
1200pF
2200pF
100
10
10
100
Frequency [kHz]
Except for 2012M/0805(2012M:Metric size code)
C0G(5C) Char. Rated Voltage : DC630V
Allowable Sine Wave Voltage[Vp-p]
C0G(5C) Char. Rated Voltage : DC1kV
Allowable Sine Wave Voltage[Vp-p]
C0G(5C) Char. Rated Voltage : DC3.15kV
The capacitors less than 22pF can be
applied maximum 4.0kV peak to peak
at 100kHz or less only for the ballast or
the resonance usage in the CFL inverter
circuit.
Frequency VS Allowable Sine Wave Voltage
JEMCGC-05049F
10
1000
!
Caution
The surface temperature of the capacitor : 125°C or less
(including self-heating)
U2J(7U) Char. Rated Voltage : DC250V
Allowable Sine Wave Voltage[Vp-p]
Allowable Sine Wave Voltage[Vp-p]
U2J(7U) Char. Rated Voltage : DC200V
U2J(7U) Char. Rated Voltage : DC630V
Allowable Sine Wave Voltage[Vp-p]
Allowable Sine Wave Voltage[Vp-p]
U2J(7U) Char. Rated Voltage : DC500V
U2J(7U) Char. Rated Voltage : DC2 kV
Allowable Sine Wave Voltage[Vp-p]
Allowable Sine Wave Voltage[Vp-p]
U2J(7U) Char. Rated Voltage : DC1 kV
Frequency VS Allowable Sine Wave Voltage
JEMCGC-05049F
11
!
Caution
The surface temperature of the capacitor : 125°C or less
(including self-heating)
Allowable Sine Wave Voltage[Vp-p]
U2J(7U) Char. Rated Voltage : DC3.15kV
Frequency VS Allowable Sine Wave Voltage
5.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
JEMCGC-05049F
12
Crack
Floor
Mounting printed circuit board
Crack
!
Caution
■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
①
Locate chip horizontal to the
direction in which stress acts.
1A
(Bad Example)
(Good Example)
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
Stress Level
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
Perforation
①
C
B
D
A
1A
Slit
③②
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
Screw Hole
Recommended
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
JEMCGC-05049F
13
1C 1B
!
Caution
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
Check the mounting in the actual device under actual use conditions ahead of time.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any damage or cracking. Please take into account the following precautions
and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
[Incorrect]
Suction Nozzle
Deflection
Board
Board Guide
[Correct]
Support Pin
2.Dirt particles and dust accumulated in the suction nozzle and suction mechanism prevent the nozzle from
moving smoothly. This creates excessive force on the capacitor during mounting, causing cracked chips.
causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
JEMCGC-05049F
14
!
Caution
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
[Standard Conditions for Reflow Soldering]
Temperature(℃)
Soldering
Peak Temperature
220℃
Gradual
Cooling
ΔT
190℃
170℃
150℃
Preheating
2. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
60-120 seconds
Time
30-60 seconds
[Allowable Reflow Soldering Temperature and Time]
Series
Chip Dimension(L/W) Code
Temperature
Differential
GR□
18/21/31
ΔT≦190℃
GR□
32/42/43/52/55
ΔT≦130℃
Soldering Temperature(℃)
Table 1
280
270
260
250
240
230
220
0
30
60
90
120
Soldering Time(s)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Lead Free Solder
Peak Temperature
Atmosphere
240 to 260℃
Air or N2
Lead Free Solder : Sn-3.0Ag-0.5Cu
3. When a capacitor is mounted at a temperature lower than the peak reflow temperature recommended by the
solder manufacturer, the following quality problems can occur. Consider factors such as the placement of
peripheral components and the reflow temperature setting to prevent the capacitor’s reflow temperature from
dropping below the peak temperature specified. Be sure to evaluate the mounting situation beforehand and
verify that none of the following problems occur.
･Drop in solder wettability
･Solder voids
･Possible occurrence of whiskering
･Drop in bonding strength
･Drop in self-alignment properties
･Possible occurrence of tombstones and/or shifting on the land patterns of the circuit board
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a excessive solder fillet height.
This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.
4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose
from the PCB.
4-3. Please confirm that solder has been applied smoothly to the termination.
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks to the PCB.
JEMCGC-05049F
15
!
Caution
4-2.Flow Soldering
[Standard Conditions for Flow Soldering]
1. Do not apply flow soldering to chips not listed in Table 2.
Chip Dimension(L/W) Code
GR□
Temperature(℃)
Soldering
Peak
Temperature
Temperature Differential
ΔT≦150℃
18/21/31
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as low as possible.
3. Excessively long soldering time or high soldering
temperature can result in leaching of the terminations,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the inner electrodes and terminations.
4. When components are immersed in solvent after mounting,
be sure to maintain the temperature differential (ΔT)
between the component and solvent within the range
shown in the table 2.
Soldering
Gradual
Cooling
ΔT
Preheating
Peak
Temperature
Preheating
30-90 seconds
280
270
260
250
240
230
220
0
10
20
Lead Free Solder
100 to 120℃
Soldering Peak Temperature
250 to 260℃
Atmosphere
Air or N2
Lead Free Solder : Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
Up to Chip Thickness
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
JEMCGC-05049F
Adhesive
16
30
40
Soldering Time(s)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Preheating Peak Temperature
Time
5 seconds max.
[Allowable Flow Soldering Temperature and Time]
Soldering mperature(℃)
Table 2
Series
in section
!
Caution
4-3.Correction of Soldered Portion
When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally,
and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending
on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.
Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.
1-2. After soldering, do not allow the component/PCB to cool down rapidly.
1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,
there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration of the
adhesive strength and other problems.
Table 3
Chip Dimension
Temperature of
Preheating
Temperature
Series
Atmosphere
(L/W) Code
Soldering Iron Tip
Temperature
Differential(ΔT)
GR□
18/21/31
350℃ max.
150℃ min.
ΔT≦190℃
Air
GR□
32/42/43/52/55
280℃ max.
150℃ min.
ΔT≦130℃
Air
* Lead Free Solder : Sn-3.0Ag-0.5Cu
*Please manage Δ T in the temperature of soldering iron and the preheating temperature.
2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component
and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,
a spot heater can also prevent concerns of the soldering iron making direct contact with the component.
2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to
thermal shock. To prevent this problem, follow the conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown
in Figure 1.
Table 4
Distance
5mm or more
Hot Air Application angle
45° *Figure 1
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
Application Time
(3216M / 1206 size or smaller)
Less than 30 seconds
(3216M , 3225M : Metric size code)
(3225M / 1210 size or larger)
[Figure 1]
One-hole Nozzle
an Angle of 45°
3. Optimum solder amount when re-working with a soldering iron
3-1. If the solder amount is excessive, the risk of cracking is higher
during board bending or any other stressful condition.
Too little solder amount results in a lack of adhesive strength
on the termination, which may result in chips breaking
loose from the PCB.
Please confirm that solder has been applied smoothly is
and rising to the end surface of the chip.
3-2. A soldering iron with a tip of ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from touching
the components during the re-work.
3-3. Solder wire with ø0.5mm or smaller is required for soldering.
JEMCGC-05049F
17
Solder Amount
in section
!
Caution
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure
it does not degrade the capacitors.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended]
[Recommended]
Support Pin
Peeling
Test-probe
Test-probe
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
①
[Bending]
[Twisting]
1A
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
Board Separation Method
Level of stress on board
Recommended
Notes
Hand Separation
Nipper Separation
High
×
Hand and nipper
separation apply a high
level of stress.
Use another method.
(1) Board Separation Jig
Medium
△*
Board Separation Apparatus
2) Disc Separator
3) Router Type Separator
Medium
Low
△*
◯
· Board handling
· Board handling
· Layout of slits
· Board bending direction · Design of V groove
· Layout of capacitors
· Arrangement of blades
· Controlling blade life
Board handling
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
JEMCGC-05049F
18
!
Caution
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the component mounting position, if the portion away from the jig is held and bent in the
direction opposite the side where the capacitors are mounted.
[Outline of jig]
[Hand Separation]
Recommended
Direction of load
Printed Circuit Board
V-groove
Printed circuit
board
Not recommended
Direction of
load
Load point
Component
s
Printed circuit
board
Load point
Board Cropping Jig
Components
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
(Measures)
(1) Consider introducing a router type separator.
If it is difficult to introduce a router type separator, implement the following measures.
(Refer to item 1. Mounting Position)
(2) Mount the components parallel to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disc Separator
An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top
blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflection stress will be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,
left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the
V groove with consideration about strength of material of the printed circuit board.
[ Outline of Machine ]
[ Principle of Operation ]
[ Cross-section Diagram ]
Top Blade
Printed Circuit Board
Top Blade
V-groove
Bottom Blade
Printed Circuit Board
V-groove
[Disc Separator]
Recommended
Top Blade
Top-bottom Misalignment
Top Blade
Bottom Blade
Not recommended
Left-right Misalignment
Top Blade
Bottom Blade
Front-rear Misalignment
Top Blade
Bottom Blade
Bottom Blade
[V-groove Design]
Example of Recommended
V-groove Design
JEMCGC-05049F
Left-right Misalignment
Not Recommended
Low-Angle
Depth too Shallow
19
Depth too Deep
!
(3) Example of Router Type Separator
The router type separator performs cutting by a router
rotating at a high speed. Since the board does not
bend in the cutting process, stress on the board can
be suppressed during board separation.
When attaching or removing boards to/from the router type
separator, carefully handle the boards to prevent bending.
[ Outline Drawing ]
Router
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend.
Firmly hold the edges of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other components on the back side of the board after
capacitors have been mounted on the opposite side.
When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.
· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.
· Periodically check and adjust the bottom dead point.
Suction Nozzle
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the
capacitors or cracks in the solder. Pay attention to the following.
· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.
· Fix the board with support pins or a dedicated jig before insertion.
· Support below the board so that the board does not bend. When using support pins on the board,
periodically confirm that there is no difference in the height of each support pin.
Component with Leads
2-3. Attaching/Removing Sockets and/or Connectors
Insertion and removal of sockets and connectors, etc., might cause the board to bend.
Please insure that the board does not warp during insertion and removal of sockets and connectors, etc.,
or the bending may damage mounted components on the board.
Socket
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or
chassis. Pay attention to the following items before performing the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening of the screws.
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening the board when tightening the screws.
Screwdriver
JEMCGC-05049F
20
Caution
!
Caution
■ Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions.
Do not use the equipment under the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused
by the capacitor's high temperature.
2-2. Disposal of waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate
licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or bending of the board may cause deterioration of the
insulation resistance, and result in a short. If the circuit being used may cause an electrical shock,
smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,
to prevent secondary accidents.
(2) Capacitors used to prevent electromagnetic interference in the primary AC side circuit, or as a
connection/insulation, must be a safety standard certified product, or satisfy the contents
stipulated in the Electrical Appliance and Material Safety Law. Install a fuse for each line in case of a short.
(3) This series is not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.
The above notices are for standard applications and conditions. Contact us when the products are used in special
mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
JEMCGC-05049F
21
Notice
■ Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the maximum operating temperature.
It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.
It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable
factor.
1-2. Consider the self-heating factor of the capacitor
The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.
2.Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
JEMCGC-05049F
22
Notice
■Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking.
When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility
of excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.When the thermal expansion coefficient
greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to
the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit
board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.
Pattern Forms
Prohibited
Correct
Chassis
Solder Resist
Solder (ground)
Placing Close to Chassis
Electrode Pattern
in section
Lead Wire
in section
Solder Resist
Placing of Chip
Components
and Leaded
Components
in section
Soldering Iron
in section
Lead Wire
Placing of Leaded
Components
after Chip Component
Solder Resist
in section
in section
Solder Resist
ｿﾙﾀﾞﾚｼﾞｽﾄ
Lateral Mounting
JEMCGC-05049F
23
Notice
2. Land Dimensions
Chip Capacitor
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
c
Land
b
Table 1 Flow Soldering Method
Chip Dimension
Series
(L/W) Code
a
Solder Resist
Chip(L×W)
a
b
c
GR□
18
1.6×0.8
0.6 to 1.0
0.8 to 0.9
0.6 to 0.8
GR□
21
2.0×1.25
1.0 to 1.2
0.9 to 1.0
0.8 to 1.1
GR□
31
3.2×1.6
2.2 to 2.6
1.0 to 1.1
1.0 to 1.4
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.
(in mm)
Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.
Table 2 Reflow Soldering Method
Chip Dimension
Series
(L/W) Code
Chip(L×W)
a
b
c
GR□
18
1.6×0.8
0.6 to 0.8
0.6 to 0.7
0.6 to 0.8
GR□
21
2.0×1.25
1.0 to 1.4
0.6 to 0.8
1.2 to 1.4
GR□
31
3.2×1.6
1.0 to 2.0
0.9 to 1.2
1.5 to 1.7
GR□
32
3.2×2.5
2.0 to 2.4
1.0 to 1.2
1.8 to 2.3
GR□
42
4.5×2.0
2.8 to 3.4
1.2 to 1.4
1.4 to 1.8
GR□
43
4.5×3.2
3.0 to 3.5
1.2 to 1.4
2.3 to 3.0
GR□
52
5.7×2.8
4.0 to 4.6
1.4 to 1.6
2.1 to 2.6
GR□
55
5.7×5.0
4.0 to 4.6
1.4 to 1.6
3.5 to 4.8
(in mm)
JEMCGC-05049F
24
Chip
Capacitor
Sli
t
Solder
Resist
L
d
W
e
2-2. Dimensions of Slit (Example)
Preparing the slit helps flux cleaning and resin coating
on the back of the capacitor.
However, the length of the slit design should be
as short as possible to prevent mechanical damage
in the capacitor.
A longer slit design might receive more severe
mechanical stress from the PCB.
Recommended slit design is shown in the Table.
Lan
d
L×W
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
4.5×2.0
4.5×3.2
5.7×2.8
5.7×5.0
d
e
1.0～2.0
1.0～2.0
1.0～2.8
1.0～2.8
1.0～4.0
1.0～4.0
3.2～3.7
4.1～4.6
3.6～4.1
4.8～5.3
4.4～4.9
6.6～7.1
Notice
3. Board Design
Relationship with amount of strain to the board thickness, length, width, etc.]
When designing the board, keep in mind that
the amount of strain which occurs will increase
depending on the sizeand material of the board.
ε=
3PL
2Ewh2
Relationship between load and strain
P
Y
h
L
ε：Strain on center of board (μst)
L：Distance between supporting points (mm)
w ：Board width (mm)
h ：Board thickness (mm)
E ：Elastic modulus of board (N/m2=Pa)
Y ：Deflection (mm)
P ：Load (N)
w
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (L) increases,the amount of strain also increases.
→Reduce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.
→Increase the elastic modulus.
· As the board width (w) decreases, the amount of strain increases.
→Increase the width of the board.
· As the board thickness (h) decreases, the amount of strain increases.
→Increase the thickness of the board.
Since the board thickness is squared, the effect on the amount of strain becomes even greater.
2.Item to be confirmed for Flow sordering
If you want to temporarily attach the capacitor
to the board using an adhesive agent before
soldering the capacitor, first be sure that the
conditions are appropriate for affixing the
capacitor. If the dimensions of the land, the type of adhesive,the amount of coating, the contact surface area,
the curing temperature, or other conditions are inappropriate, the characteristics of the capacitor may deteriorate.
1. Selection of Adhesive
1-1. Depending on the type of adhesive, there may be a decrease in insulation resistance. In addition, there is a chance
that the capacitor might crack from contractile stress due to the difference in the contraction rate of the capacitor
and the adhesive.
1-2. If there is not enough adhesive, the contact surface area is too small, or the curing temperature or curing time
are inadequate, the adhesive strength will be insufficient and the capacitor may loosen or become disconnected
during transportation or soldering. If there is too much adhesive, for example if it overflows onto the land, the result
could be soldering defects, loss of electrical connection, insufficient curing, or slippage after the capacitor is mounted.
Furthermore, if the curing temperature is too high or the curing time is too long, not only will the adhesive strength
be reduced, but solderability may also suffer due to the effects of oxidation on the terminations (outer electrodes)
of the capacitor and the land surface on the board.
(1) Selection of Adhesive
Epoxy resins are a typical class of adhesive. To select the proper adhesive, consider the following points.
1) There must be enough adhesive strength to prevent the component from loosening or slipping during the
mounting process.
2) The adhesive strength must not decrease when exposed to moisture during soldering.
3) The adhesive must have good coatability and shape retention properties.
4) The adhesive must have a long pot life.
5) The curing time must be short.
6) The adhesive must not be corrosive to the exterior of the capacitor or the board.
7) The adhesive must have good insulation properties.
8) The adhesive must not emit toxic gases or otherwise be harmful to health.
9) The adhesive must be free of halogenated compounds.
(2) Use the following illustration as a guide to the amount of adhesive to apply.
Chip Dimension (L/W) Code:18/21/31
Adhesive
Land
Resist
Resist
JEMCGC-05049F
Cross Sectional View
Side View
25
Notice
2.Flux
2-1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability,
so apply flux thinly and evenly throughout. (A foaming system is generally used for flow solderring.)
2-2. Flux containing too high a percentage of halide may cause corrosion of the terminations unless there is
sufficient cleaning. Use flux with a halide content of 0.1% max.
2-3. Strong acidic flux can corrode the capacitor and degrade its performance.
Please check the quality of capacitor after mounting.
3.Leaching of the terminations
［As a Single Chip］
Set temperature and time to ensure that leaching of the
terminations does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown at right) and 25% of the length A-B shown as
mounted on substrate.
A
B
D
Termination
C
［As Mounted on Substrate］
B
A
3.Reflow soldering
The flux in the solder paste contains halogen-based substances and organic acids as activators.
Strong acidic flux can corrode the capacitor and degrade its performance.
Please check the quality of capacitor after mounting.
4.Washing
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,
and select the solvent for cleaning.
2. Unsuitable cleaning may leave residual flux or other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
5.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process.
The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor
may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration
of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance
of a capacitor. An epoxy resin can be used as a less hygroscopic resin.
3．The halogen system substance and organic acid are included in coating material, and a chip corrodes
by the kind of Coating material. Do not use strong acid type.
JEMCGC-05049F
26
Notice
■ Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation.
(1) Climatic condition
･ low air temperature : -40℃
･ change of temperature air/air : -25℃/+25℃
･ low air pressure : 30 kPa
･ change of air pressure : 6 kPa/min.
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed
on to the inner packaging.
1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur
in the ceramic body of the capacitor.
(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface
of the capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
A capacitor dropped accidentally during processing may be damaged.
2.Characteristics Evaluation in the Actual System
1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification
values in a finished product before using.
2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic
capacitors, the capacitance may change depending on the operating conditions in the actual system.
Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity,
which will affect the capacitance value of the capacitor.
3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in
the actual system. Evaluate the surge resistance in the actual system as required.
JEMCGC-05049F
27
!
1.Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2.Your are requested not to use our product deviating from this product specification.
3.We consider it not appropriate to include any terms and conditions with regard to the business
transaction in the product specifications, drawings or other technical documents. Therefore,
if your technical documents as above include such terms and conditions such as warranty clause,
product liability clause, or intellectual property infringement liability clause, they will be deemed to
be invalid.
JEMCGC-05049F
28
NOTE
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