GRM188R71H222JA01D

Chip Monolithic Ceramic Capacitor for General GRM1885C1H182JA01_ (0603, C0G:EIA, 1800pF, DC50V) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment. 　　 2.MURATA Part NO. System (Ex.) GRM 18 8 (2)T Dimensions (1)L/W Dimensions 5C 1H (4)Rated Voltage (3)Temperature Characteristics 182 J (5)Nominal Capacitance (6)Capacitance Tolerance A01 (7)Murata’s Control Code 3. Type & Dimensions (1)-1 L (1)-2 W (2) T e 1.6±0.1 0.8±0.1 0.8±0.1 0.2 to 0.5 (Unit:mm) g 0.5 min. 4.Rated value (3) Temperature Characteristics (Public STD Code):C0G(EIA) Temp. coeff Temp. Range or　Cap. Change (Ref.Temp.) 0±30 ppm/°C 25 to 125 °C (25 °C) (4) Rated Voltage DC 50 V (6) (5) Nominal Capacitance Capacitance Tolerance 1800 pF ±5 % Specifications and Test Methods (Operating Temp. Range) -55 to 125 °C 5.Package mark D J (8) Packaging f180mm Reel PAPER W8P4 f330mm Reel PAPER W8P4 Packaging Unit 4000 pcs./Reel 10000 pcs./Reel Product specifications in this catalog are as of Mar.5,2016,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and !Cautions first. GRM1885C1H182JA01-01 1 D (8)Packaging Code ■ Specifications and Test Methods No 1 Item Rated Voltage Test Method (Ref. Standard:JIS C 5101, IEC60384） Specification Shown in Rated value. The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is larger, should be maintained within the rated voltage range. 2 Appearance No defects or abnormalities. Visual inspection. 3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope) 4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations Test Voltage : 300% of the rated voltage (Temperature compensating type) 250% of the rated voltage (High dielectric constant type) Applied Time : 1s to 5 s Charge/discharge current : 50mA max. 5 Insulation Resistance(I.R.) C≦0.047µF:More than 10000MΩ Measurement Point 　　 : Between the terminations C＞0.047µF:More than 500Ω·F Measurement Voltage : C:Nominal Capacitance Charging Time DC Rated Voltage : 2 min Charge/discharge current : 50mA max. Measurement Temperature : Room Temperature 6 Capacitance Shown in Rated value. 7 Q 30pF and over:Q≧1000 Measurement Temperature : Room Temperature Capacitance C≦1000pF C＞1000pF 30pF and below:Q≧400+20C Frequency 1.0+/-0.1MHz 1.0+/-0.1kHz Voltage 0.5 to 5.0Vrms 1.0+/-0.2Vrms C:Nominal Capacitance(pF) 8 Temperature No bias Nominal values of the temperature coefficient is shown in Rated value. The capacitance change should be measured after 5 min Characteristics of Capacitance at each specified temp. stage. But,the Capacitance Change under 25℃ is shown in Table A. In case of applying voltage, the capacitance change should be measured after 1 min with applying voltage in equilibration of Capacitance Drift each temp. stage. Within +/-0.2% or +/-0.05pF Capacitance value as a reference is the value in step 3. (Whichever is larger.) The capacitance drift is calculated by dividing the differences between the maximum and minimum measured values in the step 1,3 and 5 by the cap. value in step 3. Step 1 2 3 4 5 9 Adhesive Strength No removal of the terminations or other defect of Termination should occur. Temperature(C) Reference Temp.+/-2 Min. Operating Temp.+/-3 Reference Temp.+/-2 Max. Operating Temp.+/-3 Reference Temp.+/-2 Solder the capacitor on the test substrate shown in Fig.3. Type Applied Force(N) GRM02 1 GRM03 2 GRM15/GRM18 5 GRM21/GRM31/GRM32 Holding Time 10 : 10+/-1s Applied Direction : In parallel with the test substrate and vertical with the capacitor side. JEMCGS-0015S 2 No Item 10 Vibration Test Method (Ref. Standard:JIS C 5101, IEC60384） Specification Appearance No defects or abnormalities. Capacitance Within the specified initial value. Q Within the specified initial value. Solder the capacitor on the test substrate shown in Fig.3. Kind of Vibration : A simple harmonic motion 10Hz to 55Hz to 10Hz (1min) Total amplitude : 1.5mm This motion should be applied for a period of 2h in each 3 mutually perpendicular directions(total of 6h). 11 Substrate Bending test Appearance No defects or abnormalities. Capacitance Within +/-5% or +/-0.5pF Change (Whichever is larger) Solder the capacitor on the test substrate shown in Fig.1. Pressurization method : Shown in Fig.2 　　　: 1mm Flexure　 Holding Time 12 Solderability 95% of the terminations is to be soldered evenly and continuously. : 5+/-1s Soldering Method : Reflow soldering Test Method : Solder bath method Flux 13 Resistance to Soldering Heat Solution of rojin ethanol 25(wt)% Preheat : 80℃ to 120℃ for 10s to 30s Solder : Sn-3.0Ag-0.5Cu Solder Temp. : 245+/-5℃ Immersion time : 2+/-0.5s Appearance No defects or abnormalities. Capacitance Within +/-2.5% or +/- 0.25pF Test Method : Solder bath method Change (Whichever is larger) Solder : Sn-3.0Ag-0.5Cu Solder Temp. : 270+/-5℃ Q I.R. Within the specified initial value. Within the specified initial value. Immersion time : 10+/-0.5s Exposure Time : 24+/-2h Preheat : GRM31 size max.: 120℃ to 150℃ for 1 min 　 GRM32 size 　　 : 100℃ to 120℃ for 1 min Voltage proof No defects. and 170℃ to 200℃ for 1 min 14 Temperature Appearance No defects or abnormalities. Sudden Change Capacitance Change Within +/-2.5% or+/- 0.25pF Test Method : Reflow soldering (hot plate) Solder : Sn-3.0Ag-0.5Cu Solder Temp. : 270+/-5℃ Reflow Time : 10+/-0.5s Test Substrate : Glass epoxy PCB Exposure Time : 24+/-2h Preheat : 120℃ to 150℃ for 1 min Solder the capacitor on the test substrate shown in Fig.3. (Whichever is larger) Perform the five cycles according to the four heat treatments shown in the following table. Q I.R. Within the specified initial value. Within the specified initial value. Voltage proof No defects. Step Temp.(C) Time (min) 1 Min.Operating Temp.+0/-3 30+/-3 2 Room Temp. 2 to 3 3 Max.Operating Temp.+3/-0 30+/-3 4 Room Temp 2 to 3 Exposure Time JEMCGS-0015S 3 : 24+/-2h No Item 15 High Test Method (Ref. Standard:JIS C 5101, IEC60384） Specification Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. High Humidity Capacitance Within +/-7.5% or +/-0.75pF Test Temperature : 40+/-2℃ (Steady) Change (Whichever is larger) Test Humidity : 90%RH to 95%RH Temperature Test Time Q : 500+/-12h 30pF and over:Q≧200 Applied Voltage 30pF and below :Q≧100+10C/3 Charge/discharge current : 50mA max. Exposure Time : DC Rated Voltage : 24+/-2h C:Nominal Capacitance(pF) 16 Durability I.R. More than 500MΩ or 25Ω·F (Whichever is smaller) Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3. Capacitance Within +/-3% or +/-0.3pF Test Temperature Change (Whichever is larger) Test Time Applied Voltage Q Charge/discharge current : 50mA max. 10pF and over Exposure Time 10pF and below : Q≧200+10C C:Nominal Capacitance (pF) More than 1,000MΩ or 50Ω·F (Whichever is smaller) Table A Char. 5C 6C 6P 6R 6S 6T 7U -55C Max. 0.58 0.87 2.33 3.02 4.09 5.46 8.78 JEMCGS-0015S : 1000+/-12h : 200% of the rated voltage 30pF and over:Q≧350 30pF and below : Q≧275+5C/2 I.R. : Max. Operating Temp. +/-3℃ Capacitance Change from 25C -30C Min. Max. Min. -0.24 0.40 -0.17 -0.48 0.59 -0.33 0.72 1.61 0.50 1.28 2.08 0.88 2.16 2.81 1.49 3.28 3.75 2.26 5.04 6.04 3.47 (%) -10C Max. 0.25 0.38 1.02 1.32 1.79 2.39 3.84 Min. -0.11 -0.21 0.32 0.56 0.95 1.44 2.21 4 : 24+/-2h Substrate Bending test ・Test substrate Material : Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin) Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm) Copper foil thickness : 0.035mm 　　　　　　　　　　　: Solder resist a 100 *1,2：2.0±0.05 4.0±0.1 Dimension (mm) φ1.5 +0.1 b c ＊1 ＊2 -0 0.56 0.23 0.9 0.3 1.5 0.5 Ａ 3.0 1.2 4.0 1.65 0.05以下 5.0 2.0 5.0 2.9 3.5±0.05 40 GRM02 GRM03 GRM15 GRM18 GRM21 GRM31 GRM32 a 0.2 0.3 0.4 1.0 1.2 2.2 2.2 8.0±0.3 Type c c f4.5 Ｂ b Land 1.75±0.1 (Coat with heat resistant resin for solder) t Fig.1 (in mm) Kind substrate of Solder : Sn-3.0Ag-0.5Cu ・Test Pressurization ・Test substrate method 20 50 min. Pressurization speed 1.0mm/s Pressurize tor R5 Flexure:≦1 Support Capacitance meter 45 45 Fig.2 (in mm) Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method) High Temperature High Humidity(Steady) , Durability ・Test substrate Material : Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin) Thickness : 1.6mm or 0.8mm Copper foil thickness : 0.035mm Kind substrate of Solder : Sn-3.0Ag-0.5Cu ・Test Landsubstrate Dimensions ・Test Chip Capacitor Type Land c GRM02 GRM03 GRM15 GRM18 GRM21 GRM31 GRM32 b a Solder Resist a 0.2 0.3 0.4 1.0 1.2 2.2 2.2 Fig.3 JEMCGS-0015S 5 Dimension (mm) b 0.56 0.9 1.5 3.0 4.0 5.0 5.0 c 0.23 0.3 0.5 1.2 1.65 2.0 2.9 Package GRM Type 1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K) 1.1 Minimum Quantity(pcs./reel) φ180mm reel Paper Tape Plastic Tape Type Code:D/E Code:W Code:L GRM01 GRM02 40000(W4P1) 15000(W8P2) 15000(W8P2) 30000(W8P1) 10000(W8P2) 20000(W8P2) 10000(W8P2) 50000(W8P2) 50000(W8P2) 50000(W8P2) 50000(W8P2) 50000(W8P2) 5(LWT Dimensions Tolerance:±0.05) 10000(W8P2) 20000(W8P1) 50000(W8P2) 5(LWT Dimensions Tolerance:±0.1min.) 10000(W8P2) 40000(W8P2) 5 (LW Dimensions Tolerance:±0.1min. and T Dimensions Tolerance:±0.05) 10000(W8P2) 50000(W8P2) 5(LW Dimensions Tolerance:±0.2 and T Dimensions:0.5 +0/-0.1) 10000(W8P2) GRM18 GRM31 GRM32 GRM43 GRM55 4000 4000 4000 6 9 A/B 6/9 M/X C 9 A/M N C R/D/E M N/R/D E S M N/C/R/D E F 3000 3000 4000 10000 10000 10000 10000 10000 10000 3000 2000 4000 10000 6000 10000 3000 2000 2000 1000 1000 1000 500 500 1000 1000 500 300 1.2 Dimensions of Tape (1)GRM01/02 (W4P1 CODE:L) *1,2：1.0±0.02 *1 *2 1.8±0.02 φ0.8±0.04 2.0±0.04 Ｂ Ａ 10000 8000 6000 4000 5000 4000 2000 1500 5000 4000 1500 (in:mm) 2.0± ＊ 1,2：1.0± 0.02 ＊1 0.15～0.25 φ 0.8±0.04 Ａ Ｂ GRM21 Code:K 2 3 5 2 3/X 4.0±0.05 GRM15 Code:J/ F 50000(W4P1) 0.9±0.05 GRM03 φ330mm reel Paper Tape Plastic Tape 0.05以下 0.05 max. t Type GRM01 1 GRM02 2 Dimensions(Chip) L W T 0.25±0.013 0.125±0.013 0.125±0.013 0.4±0.02 0.2±0.02 0.2±0.02 0.4±0.05 0.2±0.05 0.2±0.05 JEMCGP-01796E A *3 0.145 0.23 0.26 *3 Nominal value 6 B *3 t 0.27 0.43 0.46 0.4 max. 0.5 max. Package GRM Type 　(2)GRM03/15(W8P2 CODE:D/E/J/F) *1 *2 3.5±0.05 +0.1 φ1.5 -0 (in:mm) 1.75±0.1 4.0±0.1 Ｂ Ａ 8.0±0.3 *1,2：2.0±0.05 Ａ 0.05 max. t Type L 2 GRM03 3 5 2 X 3 GRM15 5 0.6±0.03 0.6±0.05 0.6±0.09 1.0±0.05 Dimensions(Chip) W T 0.2 +0.02/-0.04 0.3±0.03 0.3±0.03 0.3±0.05 0.3±0.05 0.3±0.09 0.3±0.09 0.5±0.05 0.2 +0.02/-0.04 0.5±0.05 0.25±0.05 1.0±0.2 1.0±0.05 1.0±0.07 1.0±0.1 1.0±0.15 0.5±0.2 0.5±0.05 0.5±0.07 0.5±0.1 0.5±0.15 1.0±0.2 0.5±0.2 0.3±0.03 0.5±0.05 0.5±0.07 0.5±0.1 0.5±0.15 0.5 +0/-0.1 0.5±0.2 0.5±0.05 A *3 B *3 0.37 0.67 0.39 0.69 0.44 0.74 0.65 1.15 0.78 1.29 0.65 1.15 0.70 0.72 1.20 1.25 0.78 1.29 t 0.5 max. 0.6 max. 0.8 max. *3 Nominal value 　(3)GRM033/155(W8P1 CODE:W) (in:mm) +0.1 3.5±0.05 φ1.5 -0 Ｂ Ａ 8.0±0.3 1.75±0.1 4.0±0.1 1.0±0.05 1.0±0.05 t Type GRM03 GRM15 3 5 JEMCGP-01796E L 0.6±0.03 0.6±0.05 0.6±0.09 1.0±0.05 Dimensions(Chip) W 0.3±0.03 0.3±0.05 0.3±0.09 0.5±0.05 T 0.3±0.03 0.3±0.05 0.3±0.09 0.5±0.05 7 A *3 0.37 0.39 0.44 0.65 *3 Nominal value * B *3 0.67 0.69 0.74 1.15 t 0.5 max. 0.6 max. 0.8 max. Package GRM Type 　(4)GRM18/21/31/32 (in:mm) 4.0±0.1 2.0±0.1 +0.1 -0 φ1.5 3.5±0.05 3.5±0.05 Ｂ Ａ 4.0±0.1 Ａ Ｂ 2.0±0.1 φ1.5 -0 1.75±0.1 1.75±0.1 +0.1 4.0±0.1 8.0±0.3 4.0±0.1 t t Dimensions(Chip) Type L W 1.6±0.1 0.8±0.1 1.6±0.2 0.8±0.2 1.6±0.1 0.8±0.1 0.8±0.1 1.6±0.15 0.8±0.15 0.8±0.15 1.6±0.2 0.8±0.2 0.8±0.2 5 GRM18 6 7 8 T 0.5 +0/-0.1 9 B GRM31 1.25±0.1 C GRM32 0.6 +0/-0.1 1.05±0.10 1.85±0.10 1.10±0.10 2.00±0.10 Dimensions of Tape Paper Tape 1.15 max. 0.85±0.1 1.55±0.15 2.30±0.15 0.85 +0/-0.2 1.25±0.15 2.0±0.2 1.25±0.2 0.85 +0.15/-0.05 1.50±0.20 2.30±0.20 2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20 2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20 2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20 2.0±0.15 1.25±0.15 1.25±0.15 2.0±0.2 1.25±0.2 1.25±0.2 1.50±0.20 2.30±0.20 3.2±0.15 1.6±0.15 2.00±0.20 3.60±0.20 3.2±0.2 1.6±0.2 3.2±0.15 1.6±0.15 1.90±0.20 3.50±0.20 1.6±0.3 2.10±0.20 3.60±0.20 2.80±0.20 3.60±0.20 0.85±0.1 0.85±0.1 1.6±0.2 3.2±0.3 1.6±0.3 1.15±0.1 0.85 +0.15/-0.05 1.0 +0/-0.2 M 1.15±0.1 2.5±0.2 1.15 max. Paper Tape 1.7 max. Plastic Tape 2.80±0.20 1.6±0.2 1.8±0.2 D 2.0±0.2 E 2.5±0.2 2.5 max. 1.15 max. Paper Tape 1.7 max. 1.35±0.15 R JEMCGP-01796E 2.0 max. 1.2±0.1 1.6±0.2 3.2±0.3 Plastic Tape 1.25±0.1 1.15±0.15 3.2±0.2 1.7 max. 0.6±0.1 9 C 2.00±0.10 0.85±0.05 A N 1.10±0.10 2.0±0.15 M X 1.85±0.10 0.6 +0/-0.15 9 6 1.05±0.10 t 0.8 max. 0.5±0.05 0.85 +0.15/-0.1 B B 0.6±0.1 2.0±0.1 A A 0.7±0.1 6 GRM21 0.25±0.1(T≦2.0mm) 0.3±0.1(T：2.5mm) 8.0±0.3 3.50±0.20 2.5 max. 3.0 max. 3.7 max. 8 Plastic Tape Package GRM Type 8.0±0.1 * 4.0±0.1 +0.1 φ1.5 -0 (in:mm) 1.75±0.1 (5)GRM43/55 0.3±0.1 Ｂ Ａ 12.0±0.3 5.5±0.1 *：2.0±0.1 +0.2 φ1.5 -0 t Type M N R GRM43 D E S M N C GRM55 R D E F L 4.5±0.4 5.7±0.4 Dimensions(Chip) W 3.2±0.3 5.0±0.4 A *1 T 1.15±0.1 1.35±0.15 1.8±0.2 2.0±0.2 2.5±0.2 2.8±0.2 1.15±0.1 1.35±0.15 1.6±0.2 1.8±0.2 2.0±0.2 2.5±0.2 3.2±0.2 t 2.5 max. 3.6 4.9 3.7 max. 4.7 max. 2.5 max. 5.2 6.1 3.7 max. 4.7 max. *1 Nominal value JEMCGP-01796E B *1 9 め状態 (単位：mm) Package GRM Type φ21±0.8 ｗ1 W GRM01/02 GRM03/15/18/21/31/32 W 8.0 max. 16.5 w1 5±1.5 Top Tape : Thickness 0.06 Feeding Hole :As specified in 1.2. Hole for Chip : As specified in 1.2. Bottom Tape :Thickness 0.05 (Only a bottom tape existence ) Base Tape : As specified in 1.2. JEMCGP-01796E 10