GRM32DR72H104KW10L

Chip Monolithic Ceramic Capacitor for General GRM32DR72H104KW10_ (1210, X7R:EIA, 0.1uF, DC500V) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.Do not use these products in any automotive power train or safety equipment including battery chargers for electric vehicles and plugin hybrids. 　　 2.MURATA Part NO. System (Ex.) GRM 32 D (2)T Dimensions (1)L/W Dimensions R7 2H 104 (4)Rated (3)Temperature Characteristics (5)Nominal Capacitance Voltage K (6)Capacitance Tolerance W10 (7)Murata’s Control Code 3. Type & Dimensions (1)-1 L (1)-2 W (2) T e 3.2±0.3 2.5±0.2 2.0+0/-0.3 0.3 min. (Unit:mm) g 1.2 min. 4.Rated value (3) Temperature Characteristics (Public STD Code):X7R(EIA) Temp. coeff Temp. Range or　Cap. Change (Ref.Temp.) -15 to 15 % -55 to 125 °C (25 °C) (4) Rated Voltage DC 500 V (6) (5) Nominal Capacitance Capacitance Tolerance 0.1 uF ±10 % Specifications and Test Methods (Operating Temp. Range) -55 to 125 °C ・Soldering Method Reflow 5.Package mark L K (8) Packaging f180mm Reel EMBOSSED W8P4 f330mm Reel EMBOSSED W8P4 Packaging Unit 1000 pcs./Reel 4000 pcs./Reel Product specifications in this catalog are as of Sep.14,2016,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and !Cautions first. GRM32DR72H104KW10-01 1 L (8)Packaging Code ■ Specifications and Test Methods Item No Test Method (Ref. Standard:JIS C 5101, IEC60384） Specification 1 Appearance No defects or abnormalities. Visual inspection. 2 Dimension Within the specified dimensions. Using calipers and micrometers. 3 Voltage proof No defects or abnormalities. Measurement Point　　 : Between the terminations Test Voltage 　　　　 　　 : DC750V(150% of the rated voltage) Applied Time 1 to 5 s : Charge/discharge current : 50mA max. 4 Insulation Resistance(I.R.) C ≥0.01µF : 100 MΩ ∙ µF or more Measurement Point 　　 : Between the terminations C < 0.01µF : 10000 MΩ or more Measurement Voltage : DC500+/-50V Charging Time 60+/-5s : Measurement Temperature: Room Temperature 5 Capacitance Shown in Rated value. 6 Dissipation Factor (D.F.) 0.025 max. 7 Temperature R7 : Within +/-15% Measurement Temperature: Room Temperature (-55°C to +125°C) Measurement Frequency : 1.0+/-0.1kHz Measurement Voltage :AC1.0+/-0.2V(r.m.s.) The capacitance change should be measured after 5 min. Characteristics at each specified temp. stage. of Capacitance Capacitance value as a reference is the value in step 3. Step 1 Temperature(C) Reference Temp.+/-2 2 Min.Operating Temp. +/-3 3 Reference Temp. +/-2 4 5 Max.Operating Temp. +/-3 Reference Temp. +/-2 Ste Temp ･Pretreatment Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then let sit for 24+/-2h at room condition*. 8 Vibration Appearance No defects or abnormalities. Capacitance Within the specified initial value. Solder the capacitor on the test substrate A shown in "Complement of Test method”. Kind of Vibration : A simple harmonic motion 10Hz to 55Hz to 10Hz (1min) Total amplitude D.F. Within the specified initial value. : 1.5mm This motion should be applied for a period of 2h in each 3 mutually perpendicular directions(total of 6h). 9 Solderability 95% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method Flux　　　　　　　　　　　　　: Solution of rosin ethanol 25(wt)% Preheat : 80℃ to 120℃ for 10s to 30s Solder : Sn-3.0Ag-0.5Cu (Lead Free Solder) Solder Temp. : Immersion time 10 Resistance Appearance No defects or abnormalities. to Soldering Capacitance Heat Change D.F. Within +/-10% 25+/-2.5mm/s. Test Method : Solder bath method Solder : Sn-3.0Ag-0.5Cu (Lead Free Solder) : Immersion time 260+/-5℃ : 10+/-1s Immersing in speed　　 : 25+/-2.5mm/s. Exposure Time : 24+/-2h at room condition*. Preheat : GRM31 size max.: 120℃ to 150℃ for 1 min 　　　　 I.R. 2+/-0.5s Immersing in speed　　 : Solder Temp. Within the specified initial value. 245+/-5℃ : GRM32 size min. : 100℃ to 120℃ for 1 min Within the specified initial value. and 170℃ to 200℃ for 1 min ･Pretreatment Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then Voltage proof No defects. let sit for 24+/-2h at room condition*. *Room Condition : Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa JEMCGS-03070A 2 Item No 11 Adhesive Strength of Termination Test Method (Ref. Standard:JIS C 5101, IEC60384） Specification No removal of the terminations or other defect Solder the capacitor on the test substrate A shown in "Complement of Test should occur. method”. 10N , 10+/-1s Applied Direction : In parallel with the test substrate and vertical with the capacitor side. 12 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate B shown in "Complement of Test method”. Bending test Then apply the force in the direction shown in “Test Method of Substrate Bending test” of “Complement of Test method”. Capacitance Within +/-12.5% 13 Temperature Appearance 　　　: Flexure　 Change No defects or abnormalities. 1mm Holding Time 　 : 5+/-1s Soldering Method : Reflow soldering Fix the capacitor to the supporting Test substrate A (glass epoxy board) shown in “Complement of Test method”. Sudden Change Perform the 5 cycles according to the four heat treatments Capacitance Within +/-7.5% shown in the following table. Change D.F. I.R. Step Temp.(C) Time (min) 1 Min.Operating Temp.+0/-3 30+/-3 2 Room Temp 2 to 3 3 Max.Operating Temp.+3/-0 30+/-3 4 Room Temp 2 to 3 Within the specified initial value. Within the specified initial value. Exposure Time : 24+/-2h at room condition*. ･Pretreatment Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then Voltage proof No defects. let sit for 24+/-2h at room condition*. 14 High Appearance No defects or abnormalities. High Capacitance Within +/-15% Humidity Change Fix the capacitor to the supporting Test substrate A (glass epoxy board) shown in “Complement of Test method”. Temperature (Steady) D.F. I.R. 0.05 max. : 40+/-2℃ Test Humidity : 90% to 95%RH Test Time : 500+24/-0h Applied Voltage : DC500V(DC Rated Voltage) Exposure Time : 24+/-2h at room condition*. C ≥0.01µF : 10 MΩ ∙ µF or more C < 0.01µF : 1000 MΩ or more 15 Durability Test Temperature ･Pretreatment Apply test voltage for 1h+/-5min at test temperature. Voltage proof No defects. Remove and let sit for 24+/-2h at room condition*. Appearance Fix the capacitor to the supporting Test substrate A (glass epoxy board) No defects or abnormalities. shown in “Complement of Test method”. Capacitance Within +/-15% Change Test Temperature : Max. Operating Temp. +/-3℃ Test Time : 1000+48/-0h Applied Voltage : DC600V(120% of the rated voltage) Charge/discharge current : 50mA max. Exposure Time D.F. : 24+/-2h at room condition*. 0.05 max. ･Pretreatment Apply test voltage for 1h+/-5min at test temperature. I.R. C ≥0.01µF : 10 MΩ ∙ µF or more Remove and let sit for 24+/-2h at room condition*. C < 0.01µF : 1000 MΩ or more Voltage proof No defects. *Room Condition : Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa JEMCGS-03070A 3 Complement of Test Method 1.Test substrate The test substrate should be Substrate A or Substrate B as described in “Specifications and Test methods”. The specimen should be soldered by the conditions as described below. Soldering Method : Reflow soldering Solder : Sn-3.0Ag-0.5Cu (1) Test Substrate A ･Land Dimensions Chip Capacitor Type GRM18 GRM21 GRM31 GRM32 GRM42 GRM43 GRM52 GRM55 c a b ･Material Solder Resist Dimension (mm) b 3.0 4.0 5.0 5.0 7.0 7.0 8.0 8.0 a 1.0 1.2 2.2 2.2 3.5 3.5 4.5 4.5 Land c 1.2 1.65 2.0 2.9 2.4 3.7 3.2 5.6 : Glass Epoxy Board ･Thickness : 1.6mm ･Thickness of copper foil : 0.035mm (1) Test Substrate B a 40 (f4.5) b 100 1.6 Copper foil Solder resist Dimension of pettern (mm) b c 3.0 1.2 4.0 1.65 5.0 2.0 5.0 2.9 7.0 2.4 7.0 3.7 8.0 3.2 8.0 5.6 a 1.0 1.2 2.2 2.2 3.5 3.5 4.5 4.5 GRM18 GRM21 GRM31 GRM32 GRM42 GRM43 GRM52 GRM55 c d Type d 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 (unit : mm) ･Material : Glass Epoxy Board ･Thickness of copper foil : 0.035mm 2. Test Method of Substrate Bending test a) Support state (b) Test state Test Substrate B 20 Test Substrate B b Capacitor 50 min. a Support stand(f5) 45+/-2 45+/-2 Pressure stick Test stand (unit : mm) Support stand a:+/-2 gap between support stand center and test stand 　　　　　　　　　　　b:+/-5 gap between support stand center and test stand center ·Material of Test stand and pressure stick 　　　　　The material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized. ·Pressurizing speed 　　　　　The pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value. Pressure stick 　　　　　 F Capacitor R5 L 45 JEMCGS-03070A 45 Support 4 Support stand Package (1) Appearance of taping (a) Paper Tape Bottom Tape (Thickness: Around 50m) is attached below Base Tape with sprocket and put Top Tape (Thickness: Around 50m) on capacitor. (b) Plastic Tape Cover Tape (Thickness: Around 60m) is put on capacitor on Base Tape (Blister carrier Tape). (c) The sprocket holes are to the right as the Tape is pulled toward the user. (2) Packed chips Capacitor 1.75±0.1 (3) Dimensions of Tape (a) Type A (Dimensions of chip : Apply to 1.6x0.8 , 2.0x1.25 , 3.2x1.6 , 3.2x2.5) f1.5+0.1/-0 4.0±0.1 (Plastic Tape) 4.0±0.1 0.25±0.1 B 3.5±0.05 2.0±0.05 8.0±0.3 (Paper Tape) 2.5max. A 1.1max. (Unit : mm) Dimensions of chip [L×W] 1.6×0.8 2.0×1.25 3.2×1.6 3.2×2.5 A* B* 1.05 1.45 2.0 2.9 1.85 2.25 3.6 3.6 Dimensions of A,B : Nominal value 1.75±0.1 (b) Type B (Dimensions of chip : Apply to 4.5x2.0) f1.5+0.1/-0 4.0±0.1 4.0±0.1 5.5±0.05 B 12.0±0.3 3.7max. A Dimensions of chip [L×W] 4.5×2.0 JEMCGP-03074A 0.3±0.1 2.0±0.05 (Unit : mm) A* B* 2.5 5.1 5 Dimensions of A,B : Nominal value Package 1.75±0.1 (c) Type C (Dimensions of chip : Apply to 4.5x3.2 to 5.7x5.0) 2.0±0.05 f1.5+0.1/-0 B 12.0±0.3 0.3±0.1 5.5±0.05 4.0±0.1 8.0±0.1 3.7max. A Dimensions of chip [L×W] 4.5×3.2 5.7×2.8 5.7×5.0 (Unit : mm) A* B* 3.6 3.2 5.4 4.9 6.1 6.1 Dimensions of A,B : Nominal value (4) Dimensions of Reel 13.0±1.0 : Tape width 8mm 17.0±1.0 : Tape width 12mm f21±0.8 f13±0.2 180+0/-1.5 330+0/-3.0 60+1/-0(f180mmReel) 100+1/-0(f330mmReel) 2.0±0.5 (Unit : mm) 9.0+1.0/-0 : Tape width 8mm 13.0+1.0/-0 : Tape width 12mm (5) Part of the leader and part of the empty tape shall be attached to the end of the tape as follows. Vacant section : 160 min. Chip-mounting unit Vacant section : 190 min. 210 min. (Unit : mm) Direction of feed (6) The top tape or cover tape and base tape are not attached at the end of the tape for a minimum of 5 pitches. (7) Missing capacitors number within 0.1% of the number per reel or 1pc, whichever is greater, and not continuous. (8) The top tape or cover tape and bottom tape shall not protrude beyond the edges of the tape and shall not cover sprocket holes. (9) Cumulative tolerance of sprocket holes, 10 pitches : ±0.3mm. (10) Peeling off force : 0.1 to 0.6N in the direction shown on the follows. 165 to 180° Top Tape or Cover Tape Base Tape JEMCGP-03074A 6 ! Caution ■Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability 　 for the prevention of defects which might directly cause damage to the third party's life, body or property. 　　　①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment 　　　⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment 　　　⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment 　　　⑩Application of similar complexity and/or reliability requirements to the applications listed in the above. ■Storage and Operation condition 1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions. 1-1. Store the capacitors in the following conditions: Room Temperature of +5℃ to +40℃ and a Relative Humidity of 20% to 70%. 　 (1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity conditions during storage may affect solderability and packaging performance. Therefore, please maintain the storage temperature and humidity. Use the product within six months after receipt , as prolonged storage may cause oxidation of the terminations (outer electrodes). (2) Please confirm solderability before using after six months. Store the capacitors without opening the original bag. Even if the storage period is short, do not exceed the specified atmospheric conditions. 1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.). 1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity conditions JEMCGC-03007A 7 ! Caution ■Rating 1.Temperature Dependent Characteristics 1. The electrical characteristics of the capacitor can change with temperature. 1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes. The following actions are recommended in order to ensure suitable capacitance values. (1) Select a suitable capacitance for the operating temperature range. (2) The capacitance may change within the rated temperature. When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and carefully confirm the various characteristics in actual use conditions and the actual system. 2.Measurement of Capacitance 1. Measure capacitance with the voltage and frequency specified in the product specifications. 1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high. Please confirm whether a prescribed measured voltage is impressed to the capacitor. 1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied. Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit. 3.Applied Voltage 1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications. 1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage. (1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage. When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage. (2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage. Typical Voltage Applied to the DC capacitor DC Voltage DC Voltage+AC E E 0 0 AC Voltage E Pulse Voltage 0 E 0 (E：Maximum possible applied voltage.) 1-2. Influence of over voltage Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the internal dielectric layers . The time duration until breakdown depends on the applied voltage and the ambient temperature. 2. Use a safety standard certified capacitor in a power supply input circuit (AC filter), as it is also necessary to consider the withstand voltage and impulse withstand voltage defined for each device. JEMCGC-03007A 8 ! Caution 4.Type of Applied Voltage and Self-heating Temperature 1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the continuous application of an AC voltage or pulse voltage. When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current or pulse current will flow into the capacitor; therefore check the self-heating condition. Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss. 1-1. The load should be contained so that the self-heating of the capacitor body remains below 20°C, when measuring at an ambient temperature of 25°C. In addition, use a K thermocouple of ø0.1mm with less heat capacity when measuring, and measure in a condition where there is no effect from the radiant heat of other components or air flow caused by convection. Excessive generation of heat may cause deterioration of the characteristics and reliability of the capacitor. (Absolutely do not perform measurements while the cooling fan is operating, as an accurate measurement may not be performed.) 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied. Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit. 1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage. (See figure) Please confirm the following in order to secure the capacitance. (1) Determine whether the capacitance change caused by the applied voltage is within the allowed range . (2) In the DC voltage characteristics, the rate of capacitance change becomes larger as voltageincreases, even if the applied voltage is below the rated voltage. When a high dielectric constant type capacitor is used in a circuit that requires a tight (narrow) capacitance tolerance (e.g., a time constant circuit), please carefully consider the voltage characteristics, and confirm the various characteristics in the actual operating conditions of the system. 2. The capacitance values of high dielectric constant type capacitors changes depending on the AC voltage applied. Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit. 6. Capacitance Aging 1. The high dielectric constant type capacitors have an Aging characteristic in which the capacitance value decreases with the passage of time. When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance tolerance (e.g., a time-constant circuit), please carefully consider the characteristics of these capacitors, such as their aging, voltage, and temperature characteristics. In addition, check capacitors using your actual appliances at the intended environment and operating conditions. 7.Vibration and Shock 1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance. Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals. 2. Mechanical shock due to being dropped may cause damage or a crack in the dielectric material of the capacitor. Do not use a dropped capacitor because the quality and reliability may be deteriorated. Crack Floor 3. When printed circuit boards are piled up or handled, the corner 　of another printed circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor. JEMCGC-03007A 9 Mounting printed circuit board Crack ! Caution ■Soldering and Mounting 1.Mounting Position 1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board. 1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. 　 [Component Direction] ① Locate chip horizontal to the direction in which stress acts. 1A (Bad Example) (Good Example) [Chip Mounting Close to Board Separation Point] It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. Stress Level A　>　D *1 (2) Add slits in the board separation part. A　>　B (3) Keep the mounting position of the component away from the board separation surface. A　>　C Perforation ① C B D A 1A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. ③② [Mounting Capacitors Near Screw Holes] When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible. Screw Hole 　 Recommended 2.Information before Mounting 1. Do not re-use capacitors that were removed from the equipment. 2. Confirm capacitance characteristics under actual applied voltage. 3. Confirm the mechanical stress under actual process and equipment use. 4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly. 5. Prior to use, confirm the solderability of capacitors that were in long-term storage. 6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage. 7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC. Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance. JEMCGC-03007A 10 1C 1B ! Caution 3.Maintenance of the Mounting (pick and place) Machine 1. Make sure that the following excessive forces are not applied to the capacitors. 1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum to prevent them from any damage or cracking. Please take into account the following precautions and recommendations for use in your process. (1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board. (2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting. 　 [Incorrect] Suction Nozzle Deflection Board Board Guide 　 [Correct] Support Pin 2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving smoothly. This imposes greater force upon the chip during mounting, causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained, checked and replaced periodically. JEMCGC-03007A 11 ! Caution 4-1.Reflow Soldering 2. Solderability of tin plating termination chips might be deteriorated when a low temperature soldering profile where the peak solder temperature is below the melting point of tin is used. Please confirm the solderability of tin plated termination chips before use. 3. When components are immersed in solvent after mounting, be sure to maintain the temperature difference (ΔT) between the component and the solvent within the range shown in the table 1. Table 1 Series Chip　Dimension(L/W)　Code Temperature Differential G□□ 18/21/31 ΔT≦190℃ G□□ 32/42/43/52/55 ΔT≦130℃ [Standard Conditions for Reflow Soldering] Temperature (℃) Soldering Peak Temperature Gradual Cooling 220℃(200℃) 190℃(170℃) 170℃(150℃) 150℃(130℃) ΔT Preheating Time Temperature 60 - 120 s Incase of Lead Splder ( ):In case of Pb-Sn Solder 30 - 60 s [Allowable Reflow Soldering Temperature and Time] Soldering Temperature(℃) 1. When sudden heat is applied to the components, the mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent mechanical damage to the components, preheating is required for both the components and the PCB. Preheating conditions are shown in table 1. It is required to keep the temperature differential between the solder and the components surface (ΔT) as small as possible. 280 270 260 250 240 230 220 0 30 60 90 120 Soldering Time(s) 　　　　　　　　In the case of repeated soldering, the accumulated 　　　　　　　　soldering time must be within the range shown above. Recommended Conditions Peak Temperature Atmosphere Pb-Sn Solder Lead Free Solder 230 to 250°C 240 to 260℃ Air Air or N2 Pb-Sn Solder : Sn-37Pb Lead Free Solder : Sn-3.0Ag-0.5Cu 4. Optimum Solder Amount for Reflow Soldering 4-1. Overly thick application of solder paste results in a excessive solder fillet height. This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack. 4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose from the PCB. 4-3. Please confirm that solder has been applied smoothly to the termination. Inverting the PCB Make sure not to impose any abnormal mechanical shocks to the PCB. JEMCGC-03007A 12 ! Caution 4-2.Flow Soldering 　　　　　[Standard Conditions for Flow Soldering] 1. Do not apply flow soldering to chips not listed in Table 2. G□□ Temperature(℃) Soldering Peak Temperature Temperature Differential Chip　Dimension(L/W)　Code ΔT≦150℃ 18/21/31 2. When sudden heat is applied to the components, the mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent mechanical damage to the components, preheating is required for both of the components and the PCB. Preheating conditions are shown in table 2. It is required to keep the temperature differential between the solder and the components surface (ΔT) as low as possible. Gradual Cooling ΔT Preheating 30-90 seconds 280 270 260 250 240 230 220 0 10 20 Pb-Sn Solder Lead Free Solder Preheating Peak Temperature 90 to 110°C 100 to 120℃ Soldering Peak Temperature 240 to 250°C 250 to 260℃ Air Air or N2 Pb-Sn Solder : Sn-37Pb Lead Free Solder : Sn-3.0Ag-0.5Cu 5. Optimum Solder Amount for Flow Soldering Up to Chip Thickness 5-1. The top of the solder fillet should be lower than the thickness of the components. If the solder amount is excessive, the risk of cracking is higher during board bending or any other stressful condition. JEMCGC-03007A Adhesive 13 30 40 Soldering Time(s) In the case of repeated soldering, the accumulated soldering time must be within the range shown above. Recommended Conditions Atmosphere Time 5 seconds max. [Allowable Flow Soldering Temperature and Time] 3. Excessively long soldering time or high soldering temperature can result in leaching of the terminations, causing poor adhesion or a reduction in capacitance value due to loss of contact between the inner electrodes and terminations. 4. When components are immersed in solvent after mounting, be sure to maintain the temperature differential (ΔT) between the component and solvent within the range shown in the table 2. Soldering Preheating Peak Temperature Soldering mperature(℃) Table 2 Series in section ! Caution 4-3.Correction of Soldered Portion When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally, and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks. Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes. 1. Correction with a Soldering Iron 1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board. Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating. 1-2. After soldering, do not allow the component/PCB to cool down rapidly. 1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long, there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration of the adhesive strength and other problems. Table 3 Chip　Dimension Temperature of Preheating Temperature Series Atmosphere (L/W)　Code Soldering Iron Tip Temperature Differential(ΔT) G□□ 18/21/31 350℃ max. 150℃ min. ΔT≦190℃ Air G□□ 32/42/43/52/55 280℃ max. 150℃ min. ΔT≦130℃ Air *Applicable for both Pb-Sn and Lead Free Solder. Pb-Sn Solder : Sn-37Pb Lead Free Solder : Sn-3.0Ag-0.5Cu *Please manage Δ T in the temperature of soldering iron and the preheating temperature. 2. Correction with Spot Heater Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board, a spot heater can also prevent concerns of the soldering iron making direct contact with the component. 2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to thermal shock. To prevent this problem, follow the conditions shown in Table 4. 2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown in Figure 1. Table 4 Distance 5mm or more Hot Air Application angle 45° *Figure 1 Hot Air Temperature Nozzle Outlet 400°C max. Less than 10 seconds Application Time (3216M / 1206 size or smaller) Less than 30 seconds (3216M , 3225M : Metric size code) (3225M / 1210 size or larger) [Figure 1] One-hole Nozzle an Angle of 45° 3. Optimum solder amount when re-working with a soldering iron 3-1. If the solder amount is excessive, the risk of cracking is higher 　　　 during board bending or any other stressful condition. Too little solder amount results in a lack of adhesive strength on the termination, which may result in chips breaking loose from the PCB. Please confirm that solder has been applied smoothly is and rising to the end surface of the chip. 3-2. A soldering iron with a tip of ø3mm or smaller should be used. It is also necessary to keep the soldering iron from touching the components during the re-work. 3-3. Solder wire with ø0.5mm or smaller is required for soldering. JEMCGC-03007A 14 Solder Amount in section ! Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board. 1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc. The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder joints. Provide support pins on the back side of the PCB to prevent warping or flexing. Install support pins as close to the test-probe as possible. 1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board. [Not Recommended] [Recommended] Support Pin Peeling Test-probe Test-probe 7.Printed Circuit Board Cropping 1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that caused bending or twisting the board. 1-1. In cropping the board, the stress as shown may cause the capacitor to crack. Cracked capacitors may cause deterioration of the insulation resistance, and result in a short. Avoid this type of stress to a capacitor. ① [Bending] [Twisting] 1A 2. Check the cropping method for the printed circuit board in advance. 2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router type separator, etc.) to prevent the mechanical stress that can occur to the board. Board Separation Method Level of stress on board Recommended Notes Hand Separation Nipper Separation High × Hand and nipper separation apply a high level of stress. Use another method. (1) Board Separation Jig Medium △* Board Separation Apparatus 2) Disc Separator 3) Router Type Separator Medium Low △* ◯ · Board handling · Board handling · Layout of slits · Board bending direction · Design of V groove · Layout of capacitors · Arrangement of blades · Controlling blade life Board handling * When a board separation jig or disc separator is used, if the following precautions are not observed, a large board deflection stress will occur and the capacitors may crack. Use router type separator if at all possible. JEMCGC-03007A 15 Caution ! (1) Example of a suitable jig [In the case of Single-side Mounting] An outline of the board separation jig is shown as follows. Recommended example: Stress on the component mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress being applied to the component mounting position, if the portion away from the jig is held and bent in the direction opposite the side where the capacitors are mounted. [Outline of jig] [Hand Separation] Recommended Not recommended Direction of load Printed Circuit Board V-groove Printed circuit board Direction of load Load point Component s Printed circuit board Load point Board Cropping Jig Components [In the case of Double-sided Mounting] Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the above method. Therefore, implement the following measures to prevent stress from being applied to the components. 　 (Measures) (1) Consider introducing a router type separator. 　 　If it is difficult to introduce a router type separator, implement the following measures. (Refer to item 1. Mounting Position) (2) Mount the components parallel to the board separation surface. (3) When mounting components near the board separation point, add slits in the separation position near the component. (4) Keep the mounting position of the components away from the board separation point. (2) Example of a Disc Separator An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board. In the following case, board deflection stress will be applied and cause cracks in the capacitors. (1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom, left-right or front-rear directions (2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned top-bottom IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the V groove with consideration about strength of material of the printed circuit board. [ Outline of Machine ] [ Principle of Operation ] [ Cross-section Diagram ] Top Blade Printed Circuit Board Top Blade V-groove Bottom Blade Printed Circuit Board V-groove [Disc Separator] Recommended Top Blade Top-bottom Misalignment Top Blade Bottom Blade Not recommended Left-right Misalignment Top Blade Bottom Blade Front-rear Misalignment Top Blade Bottom Blade Bottom Blade [V-groove Design] Example of Recommended V-groove Design JEMCGC-03007A Left-right Misalignment Not Recommended Low-Angle Depth too Shallow 16 Depth too Deep ! (3) Example of Router Type Separator The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the cutting process, stress on the board can be suppressed during board separation. When attaching or removing boards to/from the router type separator, carefully handle the boards to prevent bending. [ Outline Drawing ] Router 8. Assembly 1. Handling If a board mounted with capacitors is held with one hand, the board may bend. Firmly hold the edges of the board with both hands when handling. If a board mounted with capacitors is dropped, cracks may occur in the capacitors. Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired. 2. Attachment of Other Components 2-1. Mounting of Other Components Pay attention to the following items, when mounting other components on the back side of the board after capacitors have been mounted on the opposite side. When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied to the capacitors on the back side (bottom side), and cracks may occur in the capacitors. · After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board. · Periodically check and adjust the bottom dead point. Suction Nozzle 2-2. Inserting Components with Leads into Boards When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the capacitors or cracks in the solder. Pay attention to the following. · Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion. · Fix the board with support pins or a dedicated jig before insertion. · Support below the board so that the board does not bend. When using multiple support pins on the board, periodically confirm that there is no difference in the height of each support pin. Component with Leads 2-3. Attaching/Removing Sockets When the board itself is a connector, the board may bend when a socket is attached or removed. Plan the work so that the board does not bend when a socket is attached or removed. Socket 2-4. Tightening Screws The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or chassis. Pay attention to the following items before performing the work. · Plan the work to prevent the board from bending. · Use a torque screwdriver, to prevent over-tightening of the screws. · The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied to the chips by forcibly flattening the board when tightening the screws. Screwdriver JEMCGC-03007A 17 Caution ! Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions. 1-3. Confirm the environment in which the equipment will operate is under the specified conditions. Do not use the equipment under the following environments. (1) Being spattered with water or oil. (2) Being exposed to direct sunlight. (3) Being exposed to ozone, ultraviolet rays, or radiation. (4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) (5) Any vibrations or mechanical shocks exceeding the specified limits. (6) Moisture condensing environments. 1-4. Use damp proof countermeasures if using under any conditions that can cause condensation. 2. Others 2-1. In an Emergency (1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment. If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power. (2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused by the capacitor's high temperature. 2-2. Disposal of waste When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate licenses. 2-3. Circuit Design (1) Addition of Fail Safe Function Capacitors that are cracked by dropping or bending of the board may cause deterioration of the insulation resistance, and result in a short. If the circuit being used may cause an electrical shock, smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse, to prevent secondary accidents. (2) Capacitors used to prevent electromagnetic interference in the primary AC side circuit, or as a connection/insulation, must be a safety standard certified product, or satisfy the contents stipulated in the Electrical Appliance and Material Safety Law. Install a fuse for each line in case of a short. (3) This series is not safety standard certified products. 2-4. Remarks Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used. The above notices are for standard applications and conditions. Contact us when the products are used in special mounting conditions. Select optimum conditions for operation as they determine the reliability of the product after assembly. The data herein are given in typical values, not guaranteed ratings. JEMCGC-03007A 18 Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1. Do not apply temperatures exceeding the maximum operating temperature. It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable factor. 1-2. Consider the self-heating factor of the capacitor The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating. 2.Atmosphere Surroundings (gaseous and liquid) 1. Restriction on the operating environment of capacitors. 1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor. 1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject to moisture condensation. 1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal 　　electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents for long periods of time. 3.Piezo-electric Phenomenon 1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates at specific frequencies and noise may be generated. Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur. JEMCGC-03007A 19 Notice ■Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height. 1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress on a chip is different depending on PCB material and structure.When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason. Pattern Forms Prohibited Correct Chassis Solder Resist Solder (ground) Placing Close to Chassis Electrode Pattern in section Lead Wire in section Solder Resist Placing of Chip Components and Leaded Components in section Soldering Iron in section Lead Wire Placing of Leaded Components after Chip Component Solder Resist in section in section Solder Resist ｿﾙﾀﾞﾚｼﾞｽﾄ Lateral Mounting JEMCGC-03007A 20 Notice 2. Land Dimensions Chip Capacitor 2-1. Chip capacitors can be cracked due to the stress of PCB bending , etc. if the land area is larger than needed and has an excess amount of solder. Please refer to the land dimensions in table 1 for flow soldering, table 2 for reflow soldering. c Land Please confirm the suitable land dimension by evaluating of the actual SET / PCB. Table 1 Flow Soldering Method Chip　Dimension Series (L/W)　Code b a Solder Resist Chip(L×W) a b c G□□ 18 1.6×0.8 0.6 to 1.0 0.8 to 0.9 0.6 to 0.8 G□□ 21 2.0×1.25 1.0 to 1.2 0.9 to 1.0 0.8 to 1.1 G□□ 31 3.2×1.6 2.2 to 2.6 1.0 to 1.1 1.0 to 1.4 Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm. Table 2 Reflow Soldering Method Chip　Dimension Series (L/W)　Code (in mm) Chip(L×W) a b c G□□ 18 1.6×0.8 0.6 to 0.8 0.6 to 0.7 0.6 to 0.8 G□□ 21 2.0×1.25 1.0 to 1.4 0.6 to 0.8 1.2 to 1.4 G□□ 31 3.2×1.6 1.8 to 2.0 0.9 to 1.2 1.5 to 1.7 G□□ 32 3.2×2.5 2.0 to 2.4 1.0 to 1.2 1.8 to 2.3 G□□ 42 4.5×2.0 2.8 to 3.4 1.2 to 1.4 1.4 to 1.8 G□□ 43 4.5×3.2 3.0 to 3.5 1.2 to 1.4 2.3 to 3.0 G□□ 52 5.7×2.8 4.0 to 4.6 1.4 to 1.6 2.1 to 2.6 G□□ 55 5.7×5.0 4.0 to 4.6 1.4 to 1.6 3.5 to 4.8 (in mm) JEMCGC-03007A 21 Chip Capacitor Sli t Solder Resist L d W e 2-2. Dimensions of Slit (Example) Preparing the slit helps flux cleaning and resin coating on the back of the capacitor. However, the length of the slit design should be as short as possible to prevent mechanical damage in the capacitor. A longer slit design might receive more severe mechanical stress from the PCB. Recommended slit design is shown in the Table. Lan d L×W 1.6×0.8 2.0×1.25 3.2×1.6 3.2×2.5 4.5×2.0 4.5×3.2 5.7×2.8 5.7×5.0 d e 1.0～2.0 1.0～2.0 1.0～2.8 1.0～2.8 1.0～4.0 1.0～4.0 3.2～3.7 4.1～4.6 3.6～4.1 4.8～5.3 4.4～4.9 6.6～7.1 Notice 3. Board Design When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size and material of the board. Relationship with amount of strain to the board thickness, length, width, etc.] ε= 3PL 2Ewh2 Relationship between load and strain P Y h ε：Strain on center of board (μst) L：Distance between supporting points (mm) w ：Board width (mm) h ：Board thickness (mm) E ：Elastic modulus of board (N/m2=Pa) Y ：Deflection (mm) P ：Load (N) w L When the load is constant, the following relationship can be established. · As the distance between the supporting points (L) increases,the amount of strain also increases. →Reduce the distance between the supporting points. · As the elastic modulus (E) decreases, the amount of strain increases. →Increase the elastic modulus. · As the board width (w) decreases, the amount of strain increases. →Increase the width of the board. · As the board thickness (h) decreases, the amount of strain increases. →Increase the thickness of the board. Since the board thickness is squared, the effect on the amount of strain becomes even greater. 2.Adhesive Application 1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering. The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain the correct bonding strength. The chip's electrode thickness and land thickness must also be taken into consideration. Chip Capacitor a=20 to 70μm b=30 to 35μm c=50 to 105μm a c Board Adhesive Land b 2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity of 5000Pa • s (500ps) min. (at 25℃) 3. Adhesive Coverage Size (L×W) (in mm) 1.6 × 0.8 2.0 × 1.25 3.2 × 1.6 Adhesive Coverage* 0.05mg min. 0.1mg min. 0.15mg min. *Nominal Value 3.Adhesive Curing 1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes deterioration in the insulation resistance between the terminations due to moisture absorption. Control curing temperature and time in order to prevent insufficient hardening. 4.Flux (for Flow soldering) 1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability, so apply flux thinly and evenly throughout. (A foaming system is generally used for flow solderring.) 2. Flux containing too high a percentage of halide may cause corrosion of the terminations unless there is sufficient cleaning. Use flux with a halide content of 0.1% max. 3. Do not use strong acidic flux. 4. Do not use water-soluble flux.* (*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.) JEMCGC-03007A 22 Notice 5.Flow Soldering ［As a Single Chip］ Set temperature and time to ensure that leaching of the terminations does not exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D shown at right) and 25% of the length A-B shown as mounted on substrate. A B D Termination (Outer Electrode) C ［As Mounted on Substrate］ B A 6.Reflow soldering The halogen system substance and organic acid are included in solder paste, and a chip corrodes 　 by this kind of solder paste. Do not use strong acid flux. Do not use water-soluble flux.* (*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.) 7.Washing 1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality, and select the solvent for cleaning. 2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of electrical characteristics and the reliability of the capacitors. 3. Select the proper cleaning conditions. 3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the performance of the capacitors. 8.Coating 1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process. The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction. The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration of insulation resistance or dielectric breakdown. Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible. A silicone resin can be used as an under-coating to buffer against the stress. 2. Select a resin that is less hygroscopic. Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance of a capacitor. An epoxy resin can be used as a less hygroscopic resin. 3．The halogen system substance and organic acid are included in coating material, and a chip corrodes 　　by the kind of Coating material. Do not use strong acid type. JEMCGC-03007A 23 Notice ■ Others 1.Transportation 1. The performance of a capacitor may be affected by the conditions during transportation. 1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation. (1) Climatic condition 　･ low air temperature : -40℃ ･ change of temperature air/air : -25℃/+25℃ ･ low air pressure : 30 kPa ･ change of air pressure : 6 kPa/min. (2) Mechanical condition Transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed on to the inner packaging. 1-2. Do not apply excessive vibration, shock, or pressure to the capacitor. (1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur in the ceramic body of the capacitor. (2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface of the capacitor, the capacitor may crack and short-circuit. 1-3. Do not use a capacitor to which excessive shock was applied by dropping etc. A capacitor dropped accidentally during processing may be damaged. 2.Characteristics Evaluation in the Actual System 1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification values in a finished product before using. 2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic capacitors, the capacitance may change depending on the operating conditions in the actual system. Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity, which will affect the capacitance value of the capacitor. 3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in the actual system. Evaluate the surge resistance in the actual system as required. JEMCGC-03007A 24 ! 1.Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2.Your are requested not to use our product deviating from this product specification. 3.We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents. Therefore, if your technical documents as above include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement liability clause, they will be deemed to be invalid. JEMCGC-03007A 25 NOTE