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H11AA1M, H11AA4M
6-Pin DIP AC Input Phototransistor Optocouplers
Features
Description
■ Bi-polar Emitter Input
The H11AA1M and H11AA4M devices consist of two
gallium-arsenide infrared emitting diodes connected in
inverse parallel driving a single silicon phototransistor
output.
■ Built-in Reverse Polarity Input Protection
■ Safety and Regulatory Approvals:
– UL1577, 4,170 VACRMS for 1 Minute
– DIN-EN/IEC60747-5-5, 850 V Peak Working
Insulation Voltage
Applications
■ AC Line Monitor
■ Unknown Polarity DC Sensor
■ Telephone Line Interface
Schematic
Package Outlines
1
6 BASE
2
5 COLLECTOR
3
4 EMITTER
Figure 1. Schematic
Figure 2. Package Outlines
©2006 Fairchild Semiconductor Corporation
H11AA1M, H11AA4M Rev. 1.3
www.fairchildsemi.com
H11AA1M, H11AA4M — 6-Pin DIP AC Input Phototransistor Optocouplers
April 2015
As per DIN EN/IEC 60747-5-5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit
data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Parameter
Installation Classifications per DIN VDE
0110/1.89 Table 1, For Rated Mains Voltage
Characteristics
< 150 VRMS
I–IV
< 300 VRMS
I–IV
Climatic Classification
55/100/21
Pollution Degree (DIN VDE 0110/1.89)
2
Comparative Tracking Index
Symbol
175
Value
Unit
Input-to-Output Test Voltage, Method A, VIORM x 1.6 = VPR,
Type and Sample Test with tm = 10 s, Partial Discharge < 5 pC
1360
Vpeak
Input-to-Output Test Voltage, Method B, VIORM x 1.875 = VPR,
100% Production Test with tm = 1 s, Partial Discharge < 5 pC
1594
Vpeak
VIORM
Maximum Working Insulation Voltage
850
Vpeak
VIOTM
Highest Allowable Over-Voltage
VPR
Parameter
6000
Vpeak
External Creepage
≥7
mm
External Clearance
≥7
mm
External Clearance (for Option TV, 0.4" Lead Spacing)
≥ 10
mm
DTI
Distance Through Insulation (Insulation Thickness)
≥ 0.5
mm
TS
Case Temperature(1)
175
°C
IS,INPUT
Current(1)
350
mA
800
mW
Input
PS,OUTPUT Output
RIO
Power(1)
Insulation Resistance at TS, VIO =
500 V(1)
>
109
Ω
Note:
1. Safety limit values – maximum values allowed in the event of a failure.
©2006 Fairchild Semiconductor Corporation
H11AA1M, H11AA4M Rev. 1.3
www.fairchildsemi.com
2
H11AA1M, H11AA4M — 6-Pin DIP AC Input Phototransistor Optocouplers
Safety and Insulation Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Value
Unit
TOTAL DEVICE
TSTG
Storage Temperature
-40 to +125
°C
TOPR
Operating Temperature
-40 to +100
°C
TJ
TSOL
PD
Junction Temperature
-40 to +125
ºC
260 for 10 seconds
°C
Total Device Power Dissipation @ 25°C
270
mW
Derate Linearly From 25°C
2.94
mW/°C
60
mA
Forward Current – Peak (1 µs pulse, 300 pps)
±1.0
A
LED Power Dissipation @ 25°C
120
mW
Derate Linearly From 25°C
1.41
mW/°C
Continuous Collector Current
50
mA
Detector Power Dissipation @ 25°C
150
mW
Derate linearity from 25°C
1.76
mW/°C
Lead Solder Temperature
EMITTER
IF
IF(pk)
PD
Continuous Forward Current
DETECTOR
IC
PD
©2006 Fairchild Semiconductor Corporation
H11AA1M, H11AA4M Rev. 1.3
www.fairchildsemi.com
3
H11AA1M, H11AA4M — 6-Pin DIP AC Input Phototransistor Optocouplers
Absolute Maximum Ratings
TA = 25°C Unless otherwise specified.
Individual Component Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
1.17
1.50
V
EMITTER
VF
Input Forward Voltage
IF = ±10 mA
CJ
Capacitance
VF = 0 V, f = 1.0 MHz
80
pF
V
DETECTOR
BVCEO
Breakdown Voltage, Collector-to-Emitter
IC = 1.0 mA, IF = 0
30
100
BVCBO
Breakdown Voltage, Collector-to-Base
IC = 100 µA, IF = 0
70
120
V
BVEBO
Breakdown Voltage, Emitter-to-Base
IE = 100 µA, IF = 0
5
10
V
BVECO
Breakdown Voltage, Emitter-to-Collector
IE = 100 µA, IF = 0
7
10
V
Leakage Current, Collector-to-Emitter
VCE = 10 V, IF = 0
1
ICEO
50
nA
CCE
Capacitance Collector to Emitter
VCE = 0, f = 1 MHz
10
pF
CCB
Collector to Base
VCB = 0, f = 1 MHz
80
pF
CEB
Emitter to Base
VEB = 0, f = 1 MHz
15
pF
Transfer Characteristics
Symbol
CTRCE
VCE(SAT)
Characteristics
Test Conditions
Device
Min.
H11AA1M
20
%
H11AA4M
100
%
0.33
Current Transfer Ratio,
Collector-to-Emitter
IF = ±10 mA, VCE = 10 V
Current Transfer Ratio,
Symmetry
IF = ±10 mA, VCE = 10 V
(Figure 13)
All
Saturation Voltage,
Collector-to-Emitter
IF = ±10 mA, ICE = 0.5 mA
All
Typ.
Max.
Unit
3.00
0.40
V
Isolation Characteristics
Symbol
Characteristic
Test Conditions
VISO
Input-Output Isolation Voltage t = 1 Minute
CISO
Isolation Capacitance
RISO
Isolation Resistance
©2006 Fairchild Semiconductor Corporation
H11AA1M, H11AA4M Rev. 1.3
Min.
Typ.
4170
VI-O = 0 V, f = 1 MHz
VI-O = ±500 VDC, TA = 25°C
Unit
VACRMS
0.7
1011
Max.
pF
Ω
www.fairchildsemi.com
4
H11AA1M, H11AA4M — 6-Pin DIP AC Input Phototransistor Optocouplers
Electrical Characteristics
100
1.4
TA = 25°C
TA = 25°C
VCE = 5 V
80
Normalized to IF = 10 mA
60
1.0
40
NORMALIZED CTR
I F – INPUT CURRENT (mA)
1.2
20
0
-20
-40
0.8
0.6
0.4
-60
0.2
-80
0.0
-100
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
0
2.0
5
Figure 3. Input Voltage vs. Input Current
20
1.0
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
VCE = 5 V
Normalized to IF = 10 mA , TA = 25°C
1.2
IF = 10 mA
NORMALIZED CTR
15
Figure 4. Normalized CTR vs. Forward Current
1.4
1.0
IF = 5 mA
0.8
IF = 20 mA
0.6
0.4
0.2
-60
-40
-20
0
20
40
60
80
V
0.9
CE
= 5V
TA = 25°C
0.8
0.7
IF = 20mA
0.6
IF = 10 mA
0.5
IF = 5 mA
0.4
0.3
0.2
0.1
0.0
100
10
100
1.0
V
CE
= 0.3 V
TA = 25°C
0.8
0.7
IF = 20 m A
0.6
IF = 10 mA
0.5
IF = 5 mA
0.4
0.3
0.2
0.1
0.0
10
100
1000
RBE- BASE RESISTANCE (kΩ)
Figure 7. CTR vs. RBE (Saturated)
©2006 Fairchild Semiconductor Corporation
H11AA1M, H11AA4M Rev. 1.3
Figure 6. CTR vs. RBE (Unsaturated)
VCE (SAT) – COLLECTOR-EMITTER SATURATION VOLTAGE (V)
Figure 5. Normalized CTR vs. Ambient Temperature
0.9
1000
RBE – BASE RESISTANCE (kΩ)
TA – AMBIENT TEMPERATURE (°C)
NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN))
10
IF – FORWARD CURRENT (mA)
VF – INPUT VOLTAGE (V)
100
T = 25°C
A
10
1
IF = 2.5mA
IF = 5mA
0.1
IF = 10mA
0.01
0.001
0.01
0.1
IF = 20mA
1
10
IC - COLLECTOR CURRENT (mA)
Figure 8. Collector-Emitter Saturation Voltage
vs. Collector Current
www.fairchildsemi.com
5
H11AA1M, H11AA4M — 6-Pin DIP AC Input Phototransistor Optocouplers
Typical Performance Characteristics
1000
7
SWITCHING SPEED (μs)
A
NORMALIZED ton – (ton(RBE) / ton(open))
IF = 10 mA
VCC = 10 V
T = 25°C
Toff
100
Tf
10
Ton
Tr
1
VCC = 10 V
IC = 2 mA
RL = 100 Ω
T = 25°C
6
A
5
4
3
2
1
0
0.1
0.1
1
10
10
100
100
10000
100000
Figure 10. Normalized ton vs. RBE
Figure 9. Switching Speed vs. Load Resistor
3.0
10000
VCC = 10 V
IC = 2 mA
RL = 100 Ω
T = 25°C
2.5
ICEO – COLLECTOR -EMITTER DARK CURRENT (nA)
NORMALIZED toff – (toff(RBE) / toff(open))
1000
RBE- BASE RESISTANCE (kΩ)
R – LOAD RESISTOR (kΩ)
A
2.0
1.5
1.0
0.5
0.0
1000
100
VCE = 10 V
VCE = 30 V
10
1
0.1
10
100
1000
10000
100000
0
RBE – BASE RESISTANCE (kΩ)
20
40
60
80
100
TA – AMBIENT TEMPERATURE (°C)
Figure 11. Normalized toff vs. RBE
Figure 12. Dark Current vs. Ambient Temperature
10
NORMALIZED OUTPUT CURRENT
5
1
IF =
I - 10 mA I
IF =
I 10 mA I
0.5
NORMALIZED TO:
VCE = 10 V
IF = 10 mA
0.1
.05
THE MAXIMUM PEAK
OUTPUT CURRENT
WILL BE NO MORE
THAN THREE TIMES
THE MINIMUM PEAK
OUTPUT CURRENT AT
IF = ±10 mA
.01
.005
.01
.05
.1
.5
1
5
10
VCE – COLLECTOR TO EMITTER VOLTAGE (V)
Figure 13. Output Symmetry Characteristics
©2006 Fairchild Semiconductor Corporation
H11AA1M, H11AA4M Rev. 1.3
www.fairchildsemi.com
6
H11AA1M, H11AA4M — 6-Pin DIP AC Input Phototransistor Optocouplers
Typical Performance Characteristics (Continued)
H11AA1M, H11AA4M — 6-Pin DIP AC Input Phototransistor Optocouplers
Reflow Profile
300
260°C
280
260
> 245°C = 42 s
240
220
200
180
°C
Time above
183°C = 90 s
160
140
120
1.822°C/s Ramp-up rate
100
80
60
40
33 s
20
0
0
60
120
180
270
360
Time (s)
Figure 14. Reflow Profile
©2006 Fairchild Semiconductor Corporation
H11AA1M, H11AA4M Rev. 1.3
www.fairchildsemi.com
7
Part Number
Package
Packing Method
H11AA1M
DIP 6-Pin
Tube (50 Units)
H11AA1SM
SMT 6-Pin (Lead Bend)
Tube (50 Units)
H11AA1SR2M
SMT 6-Pin (Lead Bend)
Tape and Reel (1000 Units)
H11AA1VM
DIP 6-Pin, DIN EN/IEC60747-5-5 Option
Tube (50 Units)
H11AA1SVM
SMT 6-Pin (Lead Bend), DIN EN/IEC60747-5-5 Option
Tube (50 Units)
H11AA1SR2VM
SMT 6-Pin (Lead Bend), DIN EN/IEC60747-5-5 Option
Tape and Reel (1000 Units)
H11AA1TVM
DIP 6-Pin, 0.4” Lead Spacing, DIN EN/IEC60747-5-5 Option
Tube (50 Units)
Note:
2. The product orderable part number system listed in this table also applies to the H11AA4M device.
Marking Information
1
V
3
H11AA1
2
X YY Q
6
5
4
Figure 15. Top Mark
Table 1. Top Mark Definitions
1
Fairchild Logo
2
Device Number
3
DIN EN/IEC60747-5-5 Option (only appears on component ordered with this option)
4
One-Digit Year Code, e.g., “5”
5
Digit Work Week, Ranging from “01” to “53”
6
Assembly Package Code
©2006 Fairchild Semiconductor Corporation
H11AA1M, H11AA4M Rev. 1.3
www.fairchildsemi.com
8
H11AA1M, H11AA4M — 6-Pin DIP AC Input Phototransistor Optocouplers
Ordering Information
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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