HMHAA280

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This literature is subject to all applicable copyright laws and is not for resale in any manner. HMHAA280 AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler Features Description ■ Compact 4-pin package (2.4mm maximum standoff The HMHAA280 series consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a single silicon phototransistor in a compact 4-pin mini-flat package. The lead pitch is 1.27mm. ■ ■ ■ ■ height) Half pitch leads for optimum board space savings Current Transfer Ratio: 50–600% Available in tape and reel quantities of 2500 CSA (File #1201524), UL (File #E90700) and VDE (File #136480) certified Applications ■ AC line monitor ■ Unknown polarity DC sensor ■ Telephone line receiver Package Dimensions PIN 1 0.050 (1.27) 0.020 (0.51) 0.012 (0.30) 0.287 (7.29) 0.248 (6.30) 0.106 (2.69) 0.091 (2.31) 0.173 (4.40) TYP 0.094 (2.39) 0.079 (2.01) 0.035 (0.89) 0.012 (0.30) 0.008 (0.20) 0.000 (0.0) 0.030 (0.75) 0.022 (0.55) 1 4 COLLECTOR 2 3 EMITTER Equivalent Circuit Note: All dimensions are in inches (millimeters) ©2011 Fairchild Semiconductor Corporation HMHAA280 Rev. 1.1.1 www.fairchildsemi.com HMHAA280 — AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler April 2011 Symbol Parameter Value Units TOTAL PACKAGE TSTG Storage Temperature -55 to +125 °C TOPR Operating Temperature -55 to +100 °C EMITTER IF (avg) Continuous Forward Current 50 mA IF (pk) Peak Forward Current (1µs pulse, 300pps.) 1 A VR Reverse Input Voltage 6 V PD Power Dissipation 60 mW 0.6 mW/°C Continuous Collector Current 50 mA Power Dissipation 150 mW 1.5 mW/°C Derate linearly (above 25°C) DETECTOR PD Derate linearly (above 25°C) VCEO Collector-Emitter Voltage 80 V VECO Emitter-Collector Voltage 7 V ©2011 Fairchild Semiconductor Corporation HMHAA280 Rev. 1.1.1 www.fairchildsemi.com 2 HMHAA280 — AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler Absolute Maximum Ratings (TA = 25°C unless otherwise specified) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Test Conditions Min. Typ.* Max. Unit 1.4 V 5 µA INDIVIDUAL COMPONENT CHARACTERISTICS Emitter VF Forward Voltage IF = ±5mA IR Reverse Current VR = 5V BVCEO Breakdown Voltage Collector to Emitter IC = 0.5mA, IF = 0 80 BVECO Emitter to Collector IE = 100µA, IF = 0 7 ICEO Collector Dark Current VCE = 80V, IF = 0 CCE Capacitance VCE = 0V, f = 1MHz Detector V 100 10 nA pF TRANSFER CHARACTERISTICS CTR DC Current Transfer Ratio IF = ±5mA, VCE = 5V 50 600 CTR Symmetry IF = ± 5mA, VCE = 5V 0.33 3.0 Saturation Voltage IF = ± 8mA, IC = 2.4mA tr Rise Time (Non-Saturated) IC = 2mA, VCE = 5V, RL = 100Ω 3 tf Fall Time (Non-Saturated) IC = 2mA, VCE = 5V, RL = 100Ω 3 VCE (SAT) 0.4 % V µs ISOLATION CHARACTERISTICS VISO Steady State Isolation Voltage 1 Minute 3750 VRMS *All typicals at TA = 25°C ©2011 Fairchild Semiconductor Corporation HMHAA280 Rev. 1.1.1 www.fairchildsemi.com 3 HMHAA280 — AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler Electrical Characteristics (TA = 25°C) Fig. 1 Forward Current vs. Forward Voltage Fig. 2 Collector Current vs. Forward Current 100 100 VCE = 10 V IC - COLLECTOR CURRENT (mA) IF - FORWARD CURRENT (mA) TA = 25˚C 10 VCE = 5 V 10 VCE = 0.4 V 1 0.1 1 0.6 0.8 1.0 1.2 1.4 1 1.6 10 VF - FORWARD VOLTAGE (V) Fig. 3 Current Transfer Ratio vs. Forward Current Fig. 4 Normalized CTR vs. Temperature 2.0 1000 TA = 25˚C NORMALIZED CTR (IF) / CTR (5mA) IC /IF - CURRENT TRANSFER RATIO (%) 100 IF - FORWARD CURRENT (mA) VCE = 10 V VCE = 5 V 100 VCE = 0.4 V Normalized to: IF = 5 mA VCE = 5 V TA = 25˚C 1.5 IF = 5 mA 1.0 IF = 10 mA IF = 1 mA 0.5 IF = 0.5mA 0.0 -0.5 10 1 10 -40 100 -20 IF - FORWARD CURRENT (mA) 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE (°C) Fig. 5 Collector Current vs. Temperature 100 IC - COLLECTOR CURRENT (mA) VCE = 5 V IF = 25 mA 10 IF = 10 mA IF = 5 mA IF = 1 mA 1 IF = 0.5 mA 0.1 -40 -20 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE (°C) ©2011 Fairchild Semiconductor Corporation HMHAA280 Rev. 1.1.1 www.fairchildsemi.com 4 HMHAA280 — AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler Typical Performance Characteristics Fig. 6 Collector Current vs. Collector-Emitter Voltage Fig. 7 Collector Current vs. Collector-Emitter Voltage 50 18 40 IC - COLLECTOR CURRENT (mA) IC - COLLECTOR CURRENT (mA) TA = 25˚C IF = 50 mA IF = 40 mA IF = 30 mA 30 IF = 20 mA IF = 10 mA 20 IF = 5.0 mA 10 16 IF = 50 mA IF = 40 mA 14 IF = 30 mA 12 IF = 20 mA 10 8 IF = 10 mA 6 IF = 5 mA 4 IF = 2 mA 2 IF = 0.5 mA IF = 1.0 mA 0 0 1 2 3 4 5 6 7 8 9 0 0.0 10 0.2 VCE - COLLECTOR-EMITTER VOLTAGE (V) 0.6 0.8 1.0 VCE - COLLECTOR-EMITTER VOLTAGE (V) Fig. 8 Collector Dark Current vs. Temperature Fig. 9 Switching Time vs. Load Resistance 1000 10 SWITCHING TIME (µs) ICEO - COLLECTOR DARK CURRENT (µA) 0.4 IF = 1.0 mA 1 VCE = 48 V VCE = 24 V 0.1 VCE = 10 V 0.01 TA = 25˚C IF = 16 mA VCC = 5 V tOFF 100 tS 10 1 VCE = 5 V tON 0.1 0.001 0 20 40 60 80 100 1 10 VCE(SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) TA - AMBIENT TEMPERATURE (˚C) ©2011 Fairchild Semiconductor Corporation HMHAA280 Rev. 1.1.1 100 RL - LOAD RESISTANCE (KΩ) Fig. 10 Collector-Emitter Saturation Voltage vs. Temperature 0.30 IF = 5 mA IC = 1 mA 0.28 0.26 0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 -40 -20 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE (˚C) www.fairchildsemi.com 5 HMHAA280 — AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler Typical Performance Characteristics (Continued) HMHAA280 — AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler Ordering Information Option Description V VDE Approved R2 Tape and Reel (2500 units) R2V Tape and Reel (2500 units) and VDE Approved Marking Information 1 280 2 V X YY M1 6 3 4 5 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 One digit year code 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code ©2011 Fairchild Semiconductor Corporation HMHAA280 Rev. 1.1.1 6 www.fairchildsemi.com K0 P2 P0 t D0 E A0 W1 W B0 d F D1 P 1.27 Pitch Symbol Dimensions (mm) Tape Width W 12.00 +0.30 / -0.10 Tape Thickness t Sprocket Hole Pitch P0 4.00 ±0.10 Sprocket Hole Diameter D0 1.50 +0.10 / -0.0 Sprocket Hole Location E 1.75 ±0.10 Pocket Location F 5.50 ±0.10 P2 2.00 ±0.10 Pocket Pitch P 8.00 ±0.10 Pocket Dimension A0 2.80 ±0.10 B0 7.30 ±0.10 K0 2.30 ±0.10 D1 1.50 Min. Description Pocket Hole Diameter Cover Tape Width W1 Cover Tape Thickness d Max. Component Rotation or Tilt 9.20 0.065 ±0.010 10° Max. Devices Per Reel 2500 Reel Diameter ©2011 Fairchild Semiconductor Corporation HMHAA280 Rev. 1.1.1 0.30 ±0.05 330mm (13") www.fairchildsemi.com 7 HMHAA280 — AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler Tape and Reel Dimensions 0.024 (0.61) 0.060 (1.52) 0.310 (7.87) 0.190 (4.83) 0.050 (1.27) Reflow Profile0 Package Surface Temperature T (°C) (Heating) to 30 s 230°C (peak temperature) 210°C 180°C to 60 s 150 s 90 s 80 s Time (s) • Peak reflow temperature: 230°C (package surface temperature) for 30 seconds • Time of temperature higher than 210°C: 60 seconds or less • One time soldering reflow is recommended ©2011 Fairchild Semiconductor Corporation HMHAA280 Rev. 1.1.1 www.fairchildsemi.com 8 HMHAA280 — AC Input, Half Pitch Mini-Flat Package 4-Pin Optocoupler Footprint Drawing for PCB Layout 0.3-0.51 2 1 1.52 0.61 3 4.83 7.87 4.40 (Typ) 6.30-7.29 PIN ONE 4 0.55-0.75 2.31-2.69 1.27 2.39 (Max) 1.95-2.11 0-0.20 LAND PATTERN RECOMMENDATION R0.15 (Typ) R0.15 (Typ) 1.27+/- .127 0.30-0.89 1.19 (Typ) NOTES: A) NO STANDARD APPLIES TO THIS PACKAGE B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSION D) DRAWING FILENAME AND REVSION : MKT-MFP04AREV4. 0.18-0.25 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. 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