LBAD0ZZ1SE-743

LBAD0ZZ1SE Features • • • • • • • • • • • • • • • LTE CAT M1/NB-IoT Module LTE Cat M1 – Class 3, up to 23dBm NB-IoT (NB1) Rel. 13 STM32L462RE/Cortex M4 w/512KB Flash and 160 KB SRAM 1MB on-board Serial Flash Dimension: 15.4 x 18.0 x 2.5 mm (max) Package: LGA SIM card: internal eSIM (WLCSP) Antenna configurations: U.FL antenna connection 3GPP eDRX and PSM modes Power Consumption: enables up to 10-year battery life Operating temperature range: -40 °c to 85 °c Global Certifications: GCF and PTCRB IPv4/IPv6 stack with TCP and UDP protocol SSL/TLS LTE universal modem supports (low-band and mid-band): • Low-band B5/B8/B12/B13/B14(CAT M1 Only)/B17/B18/B19/B20/B26/B28 • Mid-band B1/B2/B3/B4/B25 Benefits • Certified as a host device for ease of integration with several different types of applications. • Quicker time to market (no additional carrier or regulatory certification). • Less development time and costs for developer/device manufacturer in need of LTE Cat M1/NB-loT connectivity • eSIM included in certification. • Build/Develop applications with the use of ST's vast set of software modules. • Availability of ST's Community and Development Forums. Notice • This module cannot be used in a smartphone or other wireless telephone or a tablet and any device that is capable of providing a wireless hotspot for other devices, is capable of providing two-way voice communication. Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 1 of 26 www.murata.com Revision History Revision Date Author Change Description 1.0 10/05/2020 RF PD Initial release 1.1 02/25/2021 RF PD Add Introduction section title and include block diagram, acronyms and reference to this section. 1.2 11/11/2021 RF PD Add Notice to Page1. Updated 7 Packaging and Marking Information Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 2 of 26 www.murata.com Table of Contents FEATURES ............................................................................................................................................................................. 1 BENEFITS............................................................................................................................................................................... 1 NOTICE ................................................................................................................................................................................... 1 REVISION HISTORY .............................................................................................................................................................. 2 TABLE OF CONTENTS ......................................................................................................................................................... 3 1 INTRODUCTION ............................................................................................................................................................ 0 1.1 1.2 1.3 1.4 2 MECHANICAL SPECIFICATION .................................................................................................................................. 2 2.1 2.2 2.3 2.4 3 Tx Output Power ........................................................................................................................................................ 7 Rx Sensitivity .............................................................................................................................................................. 7 ENVIRONMENTAL SPECIFICATION ........................................................................................................................... 7 4.1 4.2 4.3 5 Module Dimensions .................................................................................................................................................... 2 Top and Side View ..................................................................................................................................................... 2 PCB Footprint Top View............................................................................................................................................. 3 Pin Configuration ........................................................................................................................................................ 4 DC ELECTRICAL SPECIFICATION.............................................................................................................................. 7 3.1 3.2 4 Scope ......................................................................................................................................................................... 0 Block Diagram ............................................................................................................................................................ 0 Acronyms ................................................................................................................................................................... 1 Reference ................................................................................................................................................................... 1 Absolute Maximum Rating ......................................................................................................................................... 7 Recommended Operating Condition .......................................................................................................................... 7 Temperature Range ................................................................................................................................................... 7 APPLICATION INFORMATION ..................................................................................................................................... 8 5.1 5.2 5.3 Recommended PCB Landing Pattern ........................................................................................................................ 8 External Antenna ........................................................................................................................................................ 8 Development Kit and Reference Design .................................................................................................................... 8 6 ASSEMBLY INFORMATION ......................................................................................................................................... 9 7 PACKAGING AND MARKING INFORMATION .......................................................................................................... 10 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 8 Dimensions of Tape (Plastic tape) ........................................................................................................................... 10 Dimensions of Reel .................................................................................................................................................. 10 Taping Diagrams ...................................................................................................................................................... 11 Leader and Tail tape ................................................................................................................................................ 12 Peeling Force ........................................................................................................................................................... 13 PACKAGE (Humidity proof Packaging) ................................................................................................................... 13 Module Marking Information..................................................................................................................................... 14 Moisture Sensitivity Level......................................................................................................................................... 14 REGULATORY INFORMATION .................................................................................................................................. 15 8.1 8.2 8.3 8.4 FCC Info ................................................................................................................................................................... 15 FCC Test Data ......................................................................................................................................................... 15 ISED Test Data ........................................................................................................................................................ 16 List of Applicable FCC Rules ................................................................................................................................... 16 Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 3 of 26 www.murata.com 8.5 8.6 8.7 Labeling Requirements ............................................................................................................................................ 17 Additional Testing Requirements ............................................................................................................................. 17 Test Modes............................................................................................................................................................... 17 9 ROHS INFORMATION ................................................................................................................................................. 18 10 ORDERING INFORMATION ........................................................................................................................................ 18 11 NOTICE ........................................................................................................................................................................ 19 11.1 11.2 11.3 11.4 11.5 11.6 12 Storage Conditions ................................................................................................................................................... 19 Handling Conditions ................................................................................................................................................. 19 Standard PCB Design (Land Pattern and Dimensions) ........................................................................................... 19 Notice for Chip Placer .............................................................................................................................................. 19 Operational Environment Conditions ....................................................................................................................... 20 Input Power Capacity ............................................................................................................................................... 20 PRECONDITIONS TO USE MURATA PRODUCTS ................................................................................................... 21 LIST OF FIGURES Figure 1 Type 1SE Block Diagram .......................................................................................................................................... 0 Figure 2.1 Module Top and Side View (Unit: mm) .................................................................................................................. 2 Figure 2.2 Module Footprint Top View (Unit: mm) .................................................................................................................. 3 Figure 6.1 Reflow Profile ......................................................................................................................................................... 9 Figure 7.1 Tape Dimensions (Unit in mm) ............................................................................................................................ 10 Figure 7.2 Reel Dimensions (Unit in mm) ............................................................................................................................. 10 Figure 7.4 Tape Leader and Tail ........................................................................................................................................... 12 Figure 7.5 Peeling Force Diagram ........................................................................................................................................ 13 Figure 7.6 Packaging Diagram.............................................................................................................................................. 13 Figure 7.7 Module Marking Diagram ..................................................................................................................................... 14 LIST OF TABLES Table 1-1 Module Specifications ............................................................................................................................................. 0 Table 2-1: Module Dimensions ............................................................................................................................................... 2 Table 2-2 Pinouts .................................................................................................................................................................... 4 Table 3-1 Rx Sensitivity .......................................................................................................................................................... 7 Table 4-1 Absolute Maximum Rating ...................................................................................................................................... 7 Table 4-2 Recommended Operating Condition ...................................................................................................................... 7 Table 4-3 Temperature Range ................................................................................................................................................ 7 Table 8-1 FCC Test Data ...................................................................................................................................................... 15 Table 8-2 ISED Test Data ..................................................................................................................................................... 16 Table 10-1 Ordering Information ........................................................................................................................................... 18 Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 4 of 26 www.murata.com 1 Introduction 1.1 Scope This product is designed to meet 3GPP Rel-13 specifications. Table 1-1 Module Specifications Part Number LBAD0ZZ1SE Connectivity 3GPP Release 13/Optimized for LTE Class 3 output power (+23 dBm) Universal LTE (LB & MB) Low-band: B5/B8/B12/B13/B14(CAT M1 Only) /B17/B18/B19/B20/B26/B28 Mid-band: B1/B2/B3/B4/B25 Voltage Input 3.3-5V Antenna Off board multi-band antenna Dimension 15.4 x 18.0 x 2.5 mm (max) Peripheral Interfaces GPIO, ADC, I2C, PWM, SPI, UART Operating Temp -40° to 85° C 1.2 Block Diagram Figure 1 Type 1SE Block Diagram Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 0 of 26 www.murata.com 1.3 Acronyms - LTE - UART - eUICC - LGA - BB - RFIC - LB - MB - PSM - eDRX Long Term Evolution Universal Asynchronous Receiver Transmitter Embedded SIM (Subscriber Identity Module Land Grid Array Baseband Radio Frequency Integrated Circuit Low Band (699 MHz to 915 MHz frequency range) Mid Band (1710 MHz to 2025 MHz frequency range) Power Save Mode Extended Discontinuous Receive 1.4 Reference [1] STMicroelectronics, STM32L462CE STM32L462RE STM32L462VE datasheet, May 2018. [2] STMicroelectronics, B-L462E-CELL1 Discovery Kit for NB/M1 communication Discovery Board, UM2743, User Manual Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 1 of 26 www.murata.com 2 Mechanical Specification 2.1 Module Dimensions Table 2-1: Module Dimensions Parameter Dimension (L x W x H) Typical 15.4 ±0.2mm x 18.0 ±0.2mm x 2.5 (max) Unit mm 2.2 Top and Side View Figure 2.1 Module Top and Side View (Unit: mm) Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 2 of 26 www.murata.com 2.3 PCB Footprint Top View Figure 2.2 Module Footprint Top View (Unit: mm) Tolerance Subject Product Outline Peripheral pin size Peripheral pin size（Corner） Center pin size（except pin103） Location between pin to pin Location between pin to PCB edge Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 3 of 26 18.0 0.60 0.60 0.80 Tolerance(mm) ± 0.20 × 15.4 ± ± 0.10 × 0.30 ± ± 0.10 × 0.55 ± ± 0.10 × 0.80 ± ±0.10 ± 0.20 0.20 0.10 0.10 0.10 www.murata.com 2.4 Pin Configuration For further detail of the built-in STM32, please refer to the STM32L462CE STM32L462RE STM32L462VE datasheet [1]. Table 2-2 Pinouts Pin # Pin Name STM32L462 Type Description 1 USART2_RTS E6 I/O PA1/USART2_RTS 2 USART2_RX F6 I/O PA3/USART2_RX 3 USART2_TX G7 I/O PA2/USART2_TX 4 USART2_CTS H8 I/O PA0/USART2_CTS 5 VDDA F7 Power ADC power; connect to VDD_1V8 if not used 6 VSSA G8 Power ADC GND 7 NRST F8 Reset Reset STM32 8 NC No Connect 9 NC No Connect 10 GPIO_EXTI7 11 NC_RST_IND E1 I/O PC7/GPIO_EXTI7 I/O Reserved for internal usage and testing 12 NC No Connect 13 NC No Connect 14 NC No Connect 15 NC No Connect 16 RFT_UART2_CTS I Recovery UART_CTS 17 RFT_UART2_TX O Recovery UART_RX 18 RFT_UART2_RTS O Recovery UART_RTS 19 RFT_UART2_RX I Recovery UART_TX 20 NC No Connect 21 NC No Connect 22 NC No Connect 23 RFT_UART1_RTS O Log UART_RTS 24 RFT_UART1_TX O Log UART_TX 25 RFT_UART1_RX I Log UART_RX 26 RFT_UART1_CTS I Log UART_CTS 27 NC 28 GND 29 NC No Connect 30 NC No Connect 31 NC No Connect 32 NC No Connect 33 NC No Connect 34 NC No Connect 35 NC No Connect No Connect GND GND Copyright © Murata Manufacturing Co., Ltd. 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October 2018 LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 4 of 26 www.murata.com Pin # Pin Name STM32L462 Type Description 36 NC No Connect 37 PMU_AT_IN 38 NC No Connect 39 NC No Connect 40 NC No Connect 41 NC No Connect 42 GND GND 43 VDD Power Power supply for Type1SE 44 VDD Power Power supply for Type1SE 45 VDD Power Power supply for Type1SE 46 GND GND GND 47 NC No Connect 48 NC No Connect 49 NC_SIM_CLK O SIM clock 50 NC_VSIM O SIM power supply 51 GND GND GND 52 NC_SIM_DETECT I SIM detect 53 NC_SIM_RST O SIM reset 54 PH1_OSC_OUT E8 I/O PH1/RCC_OSC_OUT 55 PH0_OSC_IN D8 I/O PH0/RCC_OSC_IN 56 NC 57 NC_SIM_IO 58 ADC1_IN1 59 I Connect to GND No Connect I/O SIM data D7 I/O PC0/ADC1_IN1 ADC1_IN3 D6 I/O PC2/ADC1_IN3 60 ADC1_IN2 D5 I/O PC1/ADC1_IN2 61 ADC1_IN4 E7 I/O PC3/ADC1_IN4 62 RTC_TAMP1 B8 I/O PC13/RTC_TAMP1 63 BOOT0 B6 I/O PH3/BOOT0 64 SF_EN B5 I/O PB6/SF_EN 65 RCC_MCO E3 I/O PA8/RCC_MCO 66 NC No Connect 67 NC No Connect 68 VDD_1V8 69 I2C1_SDA 70 Power Reserved for codec supply/MCU VBAT/MCU VDDA C6 I/O PB9/I2C1_SDA I2C1_SCL A6 I/O PB8/I2C1_SCL 71 VBAT B7 Power Backup supply; connect to VDD_1V8 if not used 72 SPI1_SCK F5 I/O PA5/SPI1_SCK 73 SPI1_MOSI C5 I/O PB5/SPI1_MOSI 74 SPI1_MISO A4 I/O PB4/SPI1_MISO/NJTRST 75 SPI1_NSS A2 I/O PA15/SPI1_NSS/JTDI Copyright © Murata Manufacturing Co., Ltd. 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October 2018 LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 5 of 26 www.murata.com Pin # Pin Name STM32L462 76 TIM2_CH2 B4 77 NC No Connect 78 NC No Connect 79 GND 80 NC 81 eSIM_SWP 82 NC No Connect 83 NC 84 VDDUSB A1 Power 85 SWCLK C3 I/O No Connect 3.0 to 3.6 V supply for USB; connect to VDD_1V8 if not used PA14/JTCK/SWCLK 86 SWDIO C2 I/O PA13/JTMS/SWDIO 87 USB_DP D3 I/O PA12/USB_DP 88 USB_DM D2 I/O PA11/USB_DM 89 USART1_RX C1 I PA10/USART1_RX 90 USART1_TX D1 O PA9/USART1_TX 91 TIM15_CH2 F1 I/O PB15/TIM15_CH2 92 TIM15_CH1 G1 I/O PB14/TIM15_CH1 93 TIM3_CH4 E2 I/O PC9/TIM3_CH4 94 TIM3_CH1 F2 I/O PC6/TIM3_CH1 95 QUADSPI_IO0 F4 I/O PB1/QUADSPI_BK1_IO0 96 QUADSPI_CLK H4 I/O 97 QUADSPI_nCS H3 I/O 98 SF_nCS I/O PB10/QUADSPI_CLK PB11/QUADSPI_BK1_NCS; connect to 98 to use internal serial flash Internal serial flash chip select 99 QUADSPI_IO1 H5 I/O PB0/QUADSPI_BK1_IO1 100 QUADSPI_IO3 H6 I/O PA6/QUADSPI_BK1_IO3 101 QUADSPI_IO2 E5 I/O PA7/QUADSPI_BK1_IO2 GND Ground 102126 GND Type Description I/O PB3/TIM2_CH2/JTDO/TRACESWO GND GND No Connect I/O SWP for NFC to ST33 Copyright © Murata Manufacturing Co., Ltd. All rights reserved. October 2018 LBAD0ZZ1SE Data Sheet, v1.2, 11/11/2021 Page 6 of 26 www.murata.com 3 DC Electrical Specification 3.1 Tx Output Power The module is compliant to the 3GPP spec for release 13 and rated at a Class 3 device (23 dBm) 3.2 Rx Sensitivity Table 3-1 Rx Sensitivity Items Frequency Range LB MB MCS5, BER