LFL211G95TF2D298

Specification No. JEMFGL-1139E Messrs.: MANTECH TECHNOLGY CO.,LTD. Product Specification Issued Date: Nov. 27. 2013 Part Description: CHIP MULTILAYER LC FILTER Customer Part No.: MURATA Part No.: LFL211G95TF2D298 Acknowledgement of reception We have received the attached specification Date: Company: Dept.: Representative Received by (Signature) (Type) Sales office (Signature) (Type) Technical Dept. Prepared by (Signature) (Type) (Signature) (Type) Naho SUGAYA Representative (Signature) Ken TONEGAWA (Company name/Dept.) (Type) Manager Product Engineering Section II Multilayer Products Dept. Communication System Division MURATA MFG. CO., LTD. (Company name/Dept.) G0F082 (Y15) P1/15 Spec No. JEMFGL-1139E INDEX 1. Part Number … p2 2. Operating Temperature Range … p2 3. RoHS Compliance … p2 4. Construction, Dimensions, Marking and Terminal Configurations … p3 5. Electrical Characteristics … p4 6. Other Specification And Methods … p5 7. Tape and Reel Packing … p9 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet. MURATA MFG. CO., LTD. P2/15 Spec No. JEMFGL-1139E 1．Part Number LFL211G95TF2D298 2．Operating Temperature Range -40 °C ~ +85 °C 3．RoHS compliance This component can meet with RoHS compliance. MURATA MFG. CO., LTD. P3/15 Spec No. JEMFGL-1139E 4．Construction, Dimensions, Marking and Terminal Configurations (in mm) Mark Dimension Mark Dimension L 2.00 ± 0.15 a2 0.60 ± 0.10 W 1.25 ± 0.10 a3 0.95 ± 0.10 T 1.00 max. e1 0.25 ± 0.05 a1 0.275 ± 0.100 - - Mark Meaning A Directional Input Mark TERMINAL CONFIGURATION Terminal No. Terminal Name Terminal No. Terminal Name (1) IN (3) OUT (2) GND - - MURATA MFG. CO., LTD. P4/15 Spec No. JEMFGL-1139E 5．Electrical Characteristics (-40°C ~ +85°C) Nominal Characteristics Impedance 50 (Nominal) Nominal Center Frequency 1952.50 MHz Pass Band 1880.00 ~ 2025.00 MHz (Band34/39) Insertion Loss in BW 1.35 max. at 25 °C 1.50 dB max. at -40 ~ +85 °C 38.0 dB max. at 2400.00 ~ 2500.00 MHz Attenuation (Absolute value) 25.0 dB max. at 4020.00 ~ 4045.00 MHz 27.0 dB max. at 6030.00 ~ 6075.00 MHz V.S.W.R. in BW 1.90 max. Power Capacity 3.0 W max. NOTE : The above-mentioned values have been obtained according to our own measuring methods(testing jig : Fig.1,Zo=50 ) and may vary depending on the circuit, in which this component is actually incorporated. You are, therefore, kindly requested to test the performance of this component incorporating in your set. MURATA MFG. CO., LTD. P5/15 Spec No. JEMFGL-1139E 6．Other Specification And Methods No. 1 Items Vibration Resistance Specifications Appearance No severe damages Electrical Satisfy specifications listed in paragraph 5 over operational temperature range Specifications Test Methods Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Frequency : 10~2000~10 Hz 2 Acceleration : 196 m/s Direction : X,Y,Z 3 axis Period : 2 h on each direction Total 6 h. 2 Shock Appearance No severe damages Electrical Satisfy specifications listed in paragraph 5 over operational temperature range Specifications Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. 2 Acceleration : 980 m/s Period : 6 ms. Cycle : 10 times 3 Deflection No damage with 2mm deflection Solder specimens on the testing jig (glass epoxy boards) shown in appended Fig.3 by a solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. 4 Soldering strength 9.8 N Minimum Solder specimens onto test jig shown bel ow. Apply pushing force at 0.5mm/s until (Push Strength) electrode pads are pealed off or ceramics are broken. Pushing force is applied to longitudinal direction. Pushing Direction Specimen 5 Solderability of Termination Jig 75% of the terminations is to be Immerse specimens first a ethanol soldered evenly and continuously. (JIS-K-8101) solution of rosin (JIS-K-5902) (25% rosin in weight proportion), then in a solder solution for 2±0.5 s at 230±5 °C. Preheat : 100 ~ 120 °C､60 s Solder Paste : Sn-Ag-Cu Flux : Solution of ethanol and rosin (25 % rosin in weight proportion) MURATA MFG. CO., LTD. P6/15 Spec No. JEMFGL-1139E 6 Resistance Appearance No severe damages Immerse the chip in the solder solution of to Soldering 270±5 °C for 20±0.5 s (flow soldering bath) Heat after preheating for 1 min at 120 to 150 °C. (Dipping) Then set it for 2 to 24 h at room temperature and measure. 7 Resistance Appearance No severe damages to Soldering Electrical Heat specifications Satisfy specifications listed in paragraph 5 over operational temperature range (Reflow) 8 High Temp. Appearance No severe damages Exposure Electrical Satisfy specifications listed in paragraph 5 over operational temperature range specifications 9 Temperature Cycle Appearance No severe damages Electrical Satisfy specifications listed in paragraph 5 over operational temperature range specifications Preheat Temperature Preheat Period Peak Temperature Peak Temp. Period Specimens are soldered twice with the above condition, then kept in room condition for 24 h before measurements. Temperature : 85±2 °C Period : 1000+48/-0 h Room Condition : 2 ~ 24 h Set the specimens to the supporting jig in the same manner and under the same conditions as Fig.1 and conduct the 100. cycles according to the temperatures and time shown in the following table. Set it for 2 to 24 h at room temperature, then measure. Step 1 Temp.(°C) Time(min) 10 Humidity Appearance No severe damages (Steady Electrical State) specifications Satisfy specifications listed in paragraph 5 over operational temperature range : 150±10 °C : 60 s. min. : 255±5 °C : 10 s. 2 Min. Operating Max. Operating Temp.+0/-3 Temp.+3/-0 30±3 30±3 Temperature Humidity Period Room Condition : : : : 85±2 °C 85±5 %RH 1000+48/-0 h 2 ~ 24 h Excessive mechanical force or thermal stress may damage the products. Appropriate handling is required. MURATA MFG. CO., LTD. P7/15 Spec No. JEMFGL-1139E Fig.1; Measurement Board Fig.2; Land Pattern (in mm) Land Solder resist No pattern Solder resist Through Hole Φ0.30 MURATA MFG. CO., LTD. P8/15 Spec No. JEMFGL-1139E Fig.3; Testing Board 40 100 0 . 475 Glass epoxy board t=1.6mm 0 . 825 Copper thickness 35 μm Land 0. 3 0 . 55 (in mm) Mounted Situation CHIP 45 45 (in mm) Testing Method 20 50 R230 deflection (in mm) MURATA MFG. CO., LTD. P9/15 Spec No. JEMFGL-1139E 7. Tape and Reel Packing (1) Dimensions of Tape (Plastic tape)  4.0±0.1 2.00±0.05 1.5+0.1/-0 0.25±0.05 3.50±0.05 4.0±0.1 1.0+0.2/-0 1.45±0.10 1.5 max. (in mm) Feeding direction (2) Dimensions of Reel 9.0+1.0/-0.0 ( 60) 2.0±0.5  13±0.2 ( 180) 2.25±0.10 8.0±0.20 1.75±0.10  Cumulative tolerance of max. ± 0.3 every 10 pitches 14.0 max (in mm) MURATA MFG. CO., LTD. P10/15 Spec No. JEMFGL-1139E (3) Taping Diagrams [1] Feeding Hole : [2] Hole for chip : As specified in (1) As specified in (1) [3] Top tape : 62 m in thickness [4] Base tape : As specified in (1) [3] [1] [2] [3] [4] Feeding Hole Feeding Direction Chip Package chips (4) Leader and Tail tape Tail tape (No components) Components No components Leader tape (Top tape alone) 40 to 200 mm 150 mm min. MURATA MFG. CO., LTD. 250 mm min. P11/15 Spec No. JEMFGL-1139E (5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. (6) The top tape and base tape are not adhered at no components area for 250 mm min. (7) Tear off strength against pulling of top tape : 5 N min. (8) Packaging unit : 4000 pcs. / reel (9) Material : Base tape ......Plastic Reel ......Plastic (10) Peeling of force : in the direction of peeling as shown below. Peeling speed : 300mm/min ±10mm/min Tape width 8mm 12-56mm 72-200mm Peeling of force (max) 1.0N 1.3N 1.5N Peeling of force 165 to 180 ° top tape Base tape MURATA MFG. CO., LTD. P12/15 Spec No. JEMFGL-1139E NOTICE 1. Storage Conditions This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020) To avoid damaging the solderability of the external electrodes, be sure to observe the following points. - Store products where the ambient temperature is 15 to 35 °C and humidity 45 to 75% RH. (Packing materials, In particular, may be deformed at the temperature over 40 °C.). - Store products in non corrosive gas (Cl2, NH3,SO2, Nox, etc.). - Stored products should be used within 6 months of receipt. Solderability should be verified if this period is exceeded. 2. Handling Conditions : Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability. 3. Standard PCB Design (Land Pattern and Dimensions) : All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 4. Notice for Chip Placer : When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. MURATA MFG. CO., LTD. P13/15 Spec No. JEMFGL-1139E 5. Soldering Conditions： The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions (Example) Within 3s 240 ～ 250 °C 220 °C Cooling down Slowly 180 °C 150 °C Pre-heating Within 120s Within 60s time(s) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 6. Cleaning : The total cleaning time of soaking, ultrasonic and steam methods should be within 5 minutes. Consult with Murata concerning the cleaning solvent. In order to totally abolish ODC (Freon, Trichrolethan), Murata has carried out testing on non-cleaning and water cleaning (water- soluble flux, water-soluble cream solder, water-based cleaning solvent). Therefore, be sure to contact Murata beforehand for details when applying any of the above mentioned cleaning fluid. The ultrasonic cleaning conditions are indicated below : Cleaning solution Pineapple alpha, Water Frequency 50 - 60 kHz Temperature