Spec. No. JELF243B-0034C-01
P.1/9
LQB18 Series
Reference Specification
1. Scope
This reference specification applies to LQB18N series, Chip Coil.
2. Part Numbering
(ex.)
LQ
B
18
N
N
R22
N
1
0
D
(1)
(2)
(3)
(4)
(5)
(6)
(7) (8) (9)
(10)
(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Category (5)Applications and Characteristics
(6)Inductance (7)Tolerance (8)Features (9)Electrode (10)Packaging (D:Taping / *B:Bulk)
*Bulk packing also available.
3. Rating
Customer
Part Number
MURATA
Part Number
LQB18NNR22J10D
LQB18NNR22K10D
LQB18NNR22M10D
LQB18NNR22N10D
LQB18NNR27J10D
LQB18NNR27K10D
LQB18NNR27M10D
LQB18NNR27N10D
LQB18NNR33J10D
LQB18NNR33K10D
LQB18NNR33M10D
LQB18NNR33N10D
LQB18NNR39J10D
LQB18NNR39K10D
LQB18NNR39M10D
LQB18NNR39N10D
LQB18NNR47J10D
LQB18NNR47K10D
LQB18NNR47M10D
LQB18NNR47N10D
LQB18NNR56J10D
LQB18NNR56K10D
LQB18NNR56M10D
LQB18NNR56N10D
Inductance
(nH)
220
270
330
390
470
560
Operating Temperature : -55°C to +125°C
Tolerance
J：±5%
K：±10%
M：±20%
N：±30%
J：±5%
K：±10%
M：±20%
N：±30%
J：±5%
K：±10%
M：±20%
N：±30%
J：±5%
K：±10%
M：±20%
N：±30%
J：±5%
K：±10%
M：±20%
N：±30%
J：±5%
K：±10%
M：±20%
N：±30%
Q
(min.)
Self
Resonant
Frequency
(MHz min.)
25
Rated
Current
(mA)
450
0.37
0.47
450
0.45
0.55
450
0.45
0.55
450
0.58
0.68
400
0.58
0.68
300
0.85
0.95
80
Storage Temperature : -55°C to +125°C
MURATA MFG.CO., LTD.
DC Resistance
( max.)
Initial
Values
Values
After
Testing
Spec. No. JELF243B-0034C-01
P.2/9
4. Style and Dimensions
1.6 ± 0.15
0.8 ± 0.15
0.8 ± 0.15
0.4 ± 0.2
■ Unit Mass (Typical value)
0.005g
: Electrode
(in : mm)
5. Marking
No marking.
6. Standard Testing Conditions
Unless otherwise specified
Temperature : Ordinary Temp. (15 °C to 35 °C )
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))
In case of doubt
Temperature : 20°C±2 °C
Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7. Specifications
7-1. Electrical Performance
No.
7-1-1
7-1-2
7-1-3
7-1-4
Item
Inductance
Q
SRF
DC
Resistance
7-1-5 Rated
Current
Specification
Meet item 3.
Test Method
Measuring Frequency : 25MHz
Measuring Equipment : Agilent 4291A or the equivalent
Test Fixture : Agilent 16192A or the equivalent
Meet item 3.
Measuring Equipment : Digital multi meter
Self temperature rise shall be The rated current is applied.
limited to 25°C max.
MURATA MFG.CO., LTD.
Spec. No. JELF243B-0034C-01
P.3/9
7-2. Mechanical Performance
No.
Item
7-2-1 Appearance
and
Dimensions
7-2-2 Bonding
Strength
Specification
Meet item 4.
Test Method
Visual Inspection and measured with Slide Calipers.
Meet Table 1.
It shall be soldered on the substrate.
Applying Force (F) : 6.8N
Applying Time : 5s±1s
Applied direction: Parallel to substrate
Table 1
Appearance No damage
DC
Meet item 3.
Resistance
Side view
Ｆ
Ｆ
R0.5
Substrate
7-2-3 Bending
Strength
It shall be soldered on the substrate.
Subsatrate: Glass-epoxy 100mm40mm1.6mm
Deflection : 1.0mm
Pressure jig
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
R340
F
Deflection
45mm
7-2-4 Vibration
7-2-5 Resistance
to Soldering
Heat
7-2-6 Drop
7-2-7 Solderability
45mm
Product
It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min
Total Amplitude : 1.5mm
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6h)
Pre-Heating : 150°C±10°C, 60s～90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition for 48h±4h.
Products shall be no failure It shall be dropped on concrete or steel board.
after tested.
Method : free fall
Height : 75cm
Attitude from which the product is dropped : 3 direction
The number of times : 3 times for each direction (Total 9 times)
The electrodes shall be at
Flux : Ethanol solution of rosin, 25(wt)%
least 95% covered with new Pre-Heating : 150°C±10°C, 60s～90s
solder coating.
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
MURATA MFG.CO., LTD.
Spec. No. JELF243B-0034C-01
P.4/9
7-3. Environmental Performance
It shall be soldered on the substrate.
No.
Item
Specification
7-3-1 Temperature Meet Table 1.
Cycle
Test Method
1 cycle:
1 step: -55°C (+0°C, -3°C) / 30min±3min
2 step: Ordinary temp. / 10min to 15min
3 step: +125°C (+3°C, -0°C) / 30min±3min
4 step: Ordinary temp. / 10min to 15min
Total of 100 cycles
Then measured after exposure in the room condition for 48h±4h.
Temperature : 40°C±2°C
Humidity : 90%(RH) to 95%(RH)
Time : 1000h (+48h, -0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : 125°C±3°C
Applying Current : Rated Current
Time : 1000h (+48h, -0h)
Then measured after exposure in the room condition for 48h±4h.
Temperature : -55°C±2°C
Time : 1000h (+48h, -0h)
Then measured after exposure in the room condition for 48h±4h.
7-3-2 Humidity
7-3-3 Heat Life
7-3-4 Cold
Resistance
1.85±0.1
1.05±0.1
8.0±0.3
+0.1
1.5 -0
3.5±0.05
2.0±0.05
4.0±0.1
4.0±0.1
1.75±0.1
8. Specification of Packaging
8-1. Appearance and Dimensions (8mm-wide paper tape 4mm-pitch)
1.1max.
Direction of feed
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape continuously and sealed by top tape and
bottom tape.
(2) Sprocket hole: The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
8-2. Tape Strength
(1) Pull Strength
Top tape
Bottom tape
5N min.
165 to 180 degree
(2) Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off: 300mm/ min
Bottom tape
MURATA MFG.CO., LTD.
Top tape
F
Base tape
Spec. No. JELF243B-0034C-01
P.5/9
8-3. Taping Condition
(1) Standard quantity per reel: 4000pcs. / reel
(2) There shall be leader-tape (top tape and empty tape ) and trailer- tape (empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for
more than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number (1), RoHS marking (2), Quantity, etc)
1) « Expression of Inspection No. »
□□ OOOO
(1)
(1) Factory Code
(2) Date
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS
marking (2), Quantity, etc)
(6) Dimensions of reel and taping (leader-tape, trailer-tape)
2.0±0.5
Trailer
160 min.
Leader
Label
190 min.
Empty tape
210 min.
Top tape
13.0±0.2
+1
60 -0
21.0±0.8
9.0 +1
-0
Direction of feed
13.0±1.4
+0
180 -3
(in mm)
8-4. Specification of Outer Case
Label
H
D
W
Outer Case Dimensions
Standard Reel Quantity
(mm)
in Outer Case (Reel)
W
D
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity
of an order.
MURATA MFG.CO., LTD.
Spec. No. JELF243B-0034C-01
P.6/9
9. ！ Caution
9-1. Limitation of Applications
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment
(7) Traffic signal equipment
(2) Aerospace equipment
(8) Disaster prevention / crime prevention equipment
(3) Undersea equipment
(9) Data-processing equipment
(4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment
to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
Standard land dimensions
Chip Coil
Soldering
Flow
Reflow
c
a
Solder Resist
b
Pattern
a
0.7
b
2.2 to 2.6
1.8 to 2.0
c
0.7
(in mm)
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux, Solder
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Flux
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder
Solder
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is
limited to 150°C max. Also cooling into solvent after soldering should be in such a way that the temperature
difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
MURATA MFG.CO., LTD.
Spec. No. JELF243B-0034C-01
P.7/9
(3) soldering profile
Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
60s min.
Pre-heating
Heating
Cycle of flow
Standard Profile
Time. (s)
Standard Profile
Limit Profile
150°C, 60s min.
250°C, 4s～6s
265°C ±3°C, 5s max.
2 times
2 times
Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s～60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time. (s)
Standard Profile
Limit Profile
150°C～180°C, 90s ± 30s
above 220°C, 30s～60s
above 230°C, 60s max.
245°C ± 3°C
260°C, 10s
2 times
2 times
10-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min
Tip temperature: 350°C max.
Soldering time : 3(+1, -0) seconds.
Soldering iron output: 80W max.
Tip diameter: 3mm max.
Times : 2times max.
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the
ferrite material due to the thermal shock.
10-4. Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Recommendable
t
1/3T≦t≦T
(T: Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
MURATA MFG.CO., LTD.
Spec. No. JELF243B-0034C-01
P.8/9
10-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
a
Products shall be located in the sideways
direction (Length: ab) to the mechanical
stress.
b
〈 Poor example 〉
〈 Good example〉
(2)Products location on P.C.B. separation.
Products (A, B, C, D) shall be located carefully so
that products are not subject to the mechanical
stress due to warping the board.
Because they may be subjected the mechanical
stress in order of ACB D.
Seam
b
C
B
D
A
Slit
Length:a b
a
10-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with
heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
10-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and / or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10-8. Resin coating
The inductance value may change and/or it may affect on the product's performance due to high cure-stress
of resin to be used for coating / molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
10-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power: 20W/ max. Frequency: 28kHz to 40kHz Time: 5 min max.
(3) Cleaner
1. Alternative cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
10-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO., LTD.
Spec. No. JELF243B-0034C-01
P.9/9
10-11. Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
11.
!
△
Notes
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
MURATA MFG.CO., LTD.
