LQG15HH1N5S02D

Spec No.: JELF243B_9101M-01 P1/12 CHIP COILS (CHIP INDUCTORS) LQG15HH□□□□02□ Murata Standard Reference Specification [AEC-Q200] 1. Scope This reference specification applies to chip coils (chip inductors) LQG15HH_02 series for automotive electronics based on AEC-Q200. 2. Part Numbering (Ex.) LQ G 15 Product Structure Dimension ID (L × W) H H 1N0 S 0 2 D Application Category Inductance Tolerance Performance Electrode Packaging and (For specification D: taping characteristic automotive) *B: bulk *B: Bulk packing is also available. 3. Part Number and Rating Operating temperature range Storage temperature range -55°C to +125°C -55°C to +125°C Inductance Customer Part number Murata Part number Nominal value (nH) Tolerance Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz min.) Rated current (mA) ESD Rank 1C:1kV LQG15HH1N0B02D 1.0 B: ±0.1 nH 8 0.07 10000 1000 1C LQG15HH1N0C02D 1.0 C: ±0.2 nH 8 0.07 10000 1000 1C LQG15HH1N0S02D 1.0 S: ±0.3 nH 8 0.07 10000 1000 1C LQG15HH1N1B02D 1.1 B: ±0.1 nH 8 0.07 6000 1000 1C LQG15HH1N1C02D 1.1 C: ±0.2 nH 8 0.07 6000 1000 1C LQG15HH1N1S02D 1.1 S: ±0.3 nH 8 0.07 6000 1000 1C LQG15HH1N2B02D 1.2 B: ±0.1 nH 8 0.07 6000 1000 1C LQG15HH1N2C02D 1.2 C: ±0.2 nH 8 0.07 6000 1000 1C LQG15HH1N2S02D 1.2 S: ±0.3 nH 8 0.07 6000 1000 1C LQG15HH1N3B02D 1.3 B: ±0.1 nH 8 0.07 6000 1000 1C LQG15HH1N3C02D 1.3 C: ±0.2 nH 8 0.07 6000 1000 1C LQG15HH1N3S02D 1.3 S: ±0.3 nH 8 0.07 6000 1000 1C LQG15HH1N5B02D 1.5 B: ±0.1 nH 8 0.07 6000 1000 1C LQG15HH1N5C02D 1.5 C: ±0.2 nH 8 0.07 6000 1000 1C LQG15HH1N5S02D 1.5 S: ±0.3 nH 8 0.07 6000 1000 1C LQG15HH1N6B02D 1.6 B: ±0.1 nH 8 0.07 6000 1000 1C LQG15HH1N6C02D 1.6 C: ±0.2 nH 8 0.07 6000 1000 1C LQG15HH1N6S02D 1.6 S: ±0.3 nH 8 0.07 6000 1000 1C LQG15HH1N8B02D 1.8 B: ±0.1 nH 8 0.08 6000 950 1C LQG15HH1N8C02D 1.8 C: ±0.2 nH 8 0.08 6000 950 1C LQG15HH1N8S02D 1.8 S: ±0.3 nH 8 0.08 6000 950 1C LQG15HH2N0B02D 2.0 B: ±0.1 nH 8 0.09 6000 900 1C LQG15HH2N0C02D 2.0 C: ±0.2 nH 8 0.09 6000 900 1C LQG15HH2N0S02D 2.0 S: ±0.3 nH 8 0.09 6000 900 1C LQG15HH2N2B02D 2.2 B: ±0.1 nH 8 0.09 6000 900 1C LQG15HH2N2C02D 2.2 C: ±0.2 nH 8 0.09 6000 900 1C LQG15HH2N2S02D 2.2 S: ±0.3 nH 8 0.09 6000 900 1C LQG15HH2N4B02D 2.4 B: ±0.1 nH 8 0.11 6000 850 1C LQG15HH2N4C02D 2.4 C: ±0.2 nH 8 0.11 6000 850 1C MURATA MFG CO., LTD Spec No.: JELF243B_9101M-01 P2/12 Inductance Customer Part number Murata Part number Nominal value (nH) Tolerance Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz min.) Rated current (mA) ESD Rank 1C:1kV LQG15HH2N4S02D 2.4 S: ±0.3 nH 8 0.11 6000 850 1C LQG15HH2N7B02D 2.7 B: ±0.1 nH 8 0.12 6000 800 1C LQG15HH2N7C02D 2.7 C: ±0.2 nH 8 0.12 6000 800 1C LQG15HH2N7S02D 2.7 S: ±0.3 nH 8 0.12 6000 800 1C LQG15HH3N0B02D 3.0 B: ±0.1 nH 8 0.125 6000 800 1C LQG15HH3N0C02D 3.0 C: ±0.2 nH 8 0.125 6000 800 1C LQG15HH3N0S02D 3.0 S: ±0.3 nH 8 0.125 6000 800 1C LQG15HH3N3B02D 3.3 B: ±0.1 nH 8 0.125 6000 800 1C LQG15HH3N3C02D 3.3 C: ±0.2 nH 8 0.125 6000 800 1C LQG15HH3N3S02D 3.3 S: ±0.3 nH 8 0.125 6000 800 1C LQG15HH3N6B02D 3.6 B: ±0.1 nH 8 0.14 6000 750 1C LQG15HH3N6C02D 3.6 C: ±0.2 nH 8 0.14 6000 750 1C LQG15HH3N6S02D 3.6 S: ±0.3 nH 8 0.14 6000 750 1C LQG15HH3N9B02D 3.9 B: ±0.1 nH 8 0.14 6000 750 1C LQG15HH3N9C02D 3.9 C: ±0.2 nH 8 0.14 6000 750 1C LQG15HH3N9S02D 3.9 S: ±0.3 nH 8 0.14 6000 750 1C LQG15HH4N3B02D 4.3 B: ±0.1 nH 8 0.14 6000 750 1C LQG15HH4N3C02D 4.3 C: ±0.2 nH 8 0.14 6000 750 1C LQG15HH4N3S02D 4.3 S: ±0.3 nH 8 0.14 6000 750 1C LQG15HH4N7B02D 4.7 B: ±0.1 nH 8 0.16 6000 700 1C LQG15HH4N7C02D 4.7 C: ±0.2 nH 8 0.16 6000 700 1C LQG15HH4N7S02D 4.7 S: ±0.3 nH 8 0.16 6000 700 1C LQG15HH5N1B02D 5.1 B: ±0.1 nH 8 0.18 5300 650 1C LQG15HH5N1C02D 5.1 C: ±0.2 nH 8 0.18 5300 650 1C LQG15HH5N1S02D 5.1 S: ±0.3 nH 8 0.18 5300 650 1C LQG15HH5N6B02D 5.6 B: ±0.1 nH 8 0.18 4500 650 1C LQG15HH5N6C02D 5.6 C: ±0.2 nH 8 0.18 4500 650 1C LQG15HH5N6S02D 5.6 S: ±0.3 nH 8 0.18 4500 650 1C LQG15HH6N2B02D 6.2 B: ±0.1 nH 8 0.20 4500 600 1C LQG15HH6N2C02D 6.2 C: ±0.2 nH 8 0.20 4500 600 1C LQG15HH6N2S02D 6.2 S: ±0.3 nH 8 0.20 4500 600 1C LQG15HH6N8G02D 6.8 G: ±2% 8 0.22 4500 600 1C LQG15HH6N8H02D 6.8 H: ±3% 8 0.22 4500 600 1C LQG15HH6N8J02D 6.8 J: ±5% 8 0.22 4500 600 1C LQG15HH7N5G02D 7.5 G: ±2% 8 0.24 4200 550 1C LQG15HH7N5H02D 7.5 H: ±3% 8 0.24 4200 550 1C LQG15HH7N5J02D 7.5 J: ±5% 8 0.24 4200 550 1C LQG15HH8N2G02D 8.2 G: ±2% 8 0.24 3700 550 1C LQG15HH8N2H02D 8.2 H: ±3% 8 0.24 3700 550 1C LQG15HH8N2J02D 8.2 J: ±5% 8 0.24 3700 550 1C LQG15HH9N1G02D 9.1 G: ±2% 8 0.26 3400 500 1C LQG15HH9N1H02D 9.1 H: ±3% 8 0.26 3400 500 1C LQG15HH9N1J02D 9.1 J: ±5% 8 0.26 3400 500 1C LQG15HH10NG02D 10 G: ±2% 8 0.26 3400 500 1C LQG15HH10NH02D 10 H: ±3% 8 0.26 3400 500 1C MURATA MFG CO., LTD Spec No.: JELF243B_9101M-01 P3/12 Inductance Customer Part number Murata Part number Nominal value (nH) Tolerance Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz min.) Rated current (mA) ESD Rank 1C:1kV LQG15HH10NJ02D 10 J: ±5% 8 0.26 3400 500 1C LQG15HH12NG02D 12 G: ±2% 8 0.28 3000 500 1C LQG15HH12NH02D 12 H: ±3% 8 0.28 3000 500 1C LQG15HH12NJ02D 12 J: ±5% 8 0.28 3000 500 1C LQG15HH15NG02D 15 G: ±2% 8 0.32 2500 450 1C LQG15HH15NH02D 15 H: ±3% 8 0.32 2500 450 1C LQG15HH15NJ02D 15 J: ±5% 8 0.32 2500 450 1C LQG15HH18NG02D 18 G: ±2% 8 0.36 2200 400 1C LQG15HH18NH02D 18 H: ±3% 8 0.36 2200 400 1C LQG15HH18NJ02D 18 J: ±5% 8 0.36 2200 400 1C LQG15HH22NG02D 22 G: ±2% 8 0.42 1900 350 1C LQG15HH22NH02D 22 H: ±3% 8 0.42 1900 350 1C LQG15HH22NJ02D 22 J: ±5% 8 0.42 1900 350 1C LQG15HH27NG02D 27 G: ±2% 8 0.46 1700 350 1C LQG15HH27NH02D 27 H: ±3% 8 0.46 1700 350 1C LQG15HH27NJ02D 27 J: ±5% 8 0.46 1700 350 1C LQG15HH33NG02D 33 G: ±2% 8 0.58 1600 350 1C LQG15HH33NH02D 33 H: ±3% 8 0.58 1600 350 1C LQG15HH33NJ02D 33 J: ±5% 8 0.58 1600 350 1C LQG15HH39NG02D 39 G: ±2% 8 0.65 1200 300 1C LQG15HH39NH02D 39 H: ±3% 8 0.65 1200 300 1C LQG15HH39NJ02D 39 J: ±5% 8 0.65 1200 300 1C LQG15HH47NG02D 47 G: ±2% 8 0.72 1000 300 1C LQG15HH47NH02D 47 H: ±3% 8 0.72 1000 300 1C LQG15HH47NJ02D 47 J: ±5% 8 0.72 1000 300 1C LQG15HH56NG02D 56 G: ±2% 8 0.82 800 250 1C LQG15HH56NH02D 56 H: ±3% 8 0.82 800 250 1C LQG15HH56NJ02D 56 J: ±5% 8 0.82 800 250 1C LQG15HH68NG02D 68 G: ±2% 8 0.92 800 250 1C LQG15HH68NH02D 68 H: ±3% 8 0.92 800 250 1C LQG15HH68NJ02D 68 J: ±5% 8 0.92 800 250 1C LQG15HH82NG02D 82 G: ±2% 8 1.20 700 200 1C LQG15HH82NH02D 82 H: ±3% 8 1.20 700 200 1C LQG15HH82NJ02D 82 J: ±5% 8 1.20 700 200 1C LQG15HHR10G02D 100 G: ±2% 8 1.25 600 200 1C LQG15HHR10H02D 100 H: ±3% 8 1.25 600 200 1C LQG15HHR10J02D 100 J: ±5% 8 1.25 600 200 1C LQG15HHR12G02D 120 G: ±2% 8 1.30 600 200 1C LQG15HHR12H02D 120 H: ±3% 8 1.30 600 200 1C LQG15HHR12J02D 120 J: ±5% 8 1.30 600 200 1C LQG15HHR15G02D 150 G: ±2% 8 2.99 550 150 1C LQG15HHR15H02D 150 H: ±3% 8 2.99 550 150 1C LQG15HHR15J02D 150 J: ±5% 8 2.99 550 150 1C LQG15HHR18G02D 180 G: ±2% 8 3.38 500 150 1C LQG15HHR18H02D 180 H: ±3% 8 3.38 500 150 1C MURATA MFG CO., LTD Spec No.: JELF243B_9101M-01 P4/12 Inductance Customer Part number Self-resonant frequency (MHz min.) Rated current (mA) ESD Rank 1C:1kV Nominal value (nH) LQG15HHR18J02D 180 J: ±5% 8 3.38 500 150 1C LQG15HHR22G02D 220 G: ±2% 8 3.77 450 120 1C LQG15HHR22H02D 220 H: ±3% 8 3.77 450 120 1C LQG15HHR22J02D 220 J: ±5% 8 3.77 450 120 1C LQG15HHR27G02D 270 G: ±2% 8 4.94 400 110 1C LQG15HHR27H02D 270 H: ±3% 8 4.94 400 110 1C LQG15HHR27J02D 270 J: ±5% 8 4.94 400 110 1C Tolerance Q (Min.) DC resistance (Ω max.) Murata Part number 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C) Humidity: ordinary humidity [25% to 85% (RH)] In case of doubt Temperature: 20°C±2°C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa 5. Appearance and Dimensions Unit mass (typical value): 0.001 g 6. Marking MURATA MFG CO., LTD Spec No.: JELF243B_9101M-01 P5/12 7. Electrical Performance No. Item 7.1 Inductance 7.2 Q 7.3 DC resistance 7.4 Self-resonant frequency 7.5 Rated current Specification Meet chapter 3 ratings. Meet chapter 3 ratings. Meet chapter 3 ratings. Meet chapter 3 ratings. Product temperature rise: 25°C max. Test method Measuring equipment: Keysight E4991A or the equivalent Measuring frequency: 100 MHz Measuring conditions: Measurement signal level: Approx. 0 dBm Measurement terminal distance: 0.5 mm Electrical length: 10 mm Weight: Approx. 1 N to 5 N Measuring fixture: Keysight 16197A Position the chip coil under test as shown in the measuring example below and connect it to the electrode by applying weight. Measurement example: Measuring method: see "Electrical performance: Measuring method for inductance/Q" in the Appendix. Measuring equipment: digital multimeter Measuring equipment: Keysight 8753C or the equivalent Apply the rated current specified in chapter 3. 8. AEC-Q200 Requirement 8.1 Performance [based on table 5 for magnetics (inductors/transformer) AEC-Q200 Rev. D issued June 1, 2010] AEC-Q200 No. 3 Stress High temperature exposure Murata specification/deviation Test method 1000 h at 125°C Set for 24 h at room condition, then measured. Meet table A after testing. Table A Appearance Inductance change rate (at 100 MHz) 4 Temperature cycling 1000 cycles -40°C to +125°C Set for 24 h at room condition, then measured. 7 Biased humidity 1000 h at 85°C, 85% (RH). Unpowered. Set for 24 h at room condition, then measured. Meet table A after testing. 8 Operational life Meet table A after testing. Apply 125°C 1000 h Set for 24 h at room condition, then measured. Meet table A after testing. 9 External visual Visual inspection No abnormalities 10 Physical dimension Meet chapter 5, "Appearance and Dimensions". No defects 12 Resistance to solvents Per MIL-STD-202 Method 215 Not applicable MURATA MFG CO., LTD No damage Within ±10% Spec No.: JELF243B_9101M-01 P6/12 AEC-Q200 Murata specification/deviation No. Stress Test method 13 Mechanical shock Per MIL-STD-202 Meet table A after testing. Method 213 Condition C: 100 g’s (0.98 N), 6 ms, half sine, 12.3 ft/s 14 Vibration 5 g's (0.049 N) for 20 min, 12 cycles each Meet table A after testing. of 3 orientations Test from 10 Hz to 2000 Hz 15 Resistance to soldering heat No-heating Solder temperature 260°C±5°C Immersion time 10 s Pre-heating: 150°C±10°C, 60 s to 90 s Meet table A after testing. 17 ESD Per AEC-Q200-002 ESD rank: Refer to chapter 3 ratings. Meet table A after testing. 18 Solderbility Per J-STD-002 Method b: not applicable 90% of the terminations is to be soldered. 19 Electrical Measured: inductance characterization 20 Flammability Per UL-94 Not applicable 21 Board flex Epoxy-PCB (1.6 mm) Deflection 2 mm (min.) Holding time 60 s Meet table B after testing. Table B Appearance No defects No damage DC resistance change rate 22 Terminal strength Per AEC-Q200-006 A force of 17.7 N for 60 s Within ±10% Murata deviation request: 5 N No defects 9. Specification of Packaging 9.1 Appearance and dimensions of tape (8 mm width/paper tape) A 0.62±0.04 B 1.12±0.04 t 0.8 max. (in mm) MURATA MFG CO., LTD Spec No.: JELF243B_9101M-01 P7/12 9.2 Taping specifications Packing quantity (Standard quantity) 10000 pcs/reel Packing method The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom tape when the cavities of the carrier tape are punched type). Feed hole position The feed holes on the carrier tape are on the right side when the cover tape (top tape when the cavities of the carrier tape are punched type) is pulled toward the user. Joint The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are seamless. Number of missing products Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Break down force of tape Cover tape (or top tape) 5 N min. Bottom tape (only when the cavities of the carrier tape are punched type) 5 N min. 9.4 Peeling off force of tape Speed of peeling off Peeling off force 300 mm/min 0.1 N to 0.6 N (The lower limit is for typical value.) 9.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.) 9.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  (2) Date □□ ○○○○ First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) MURATA MFG CO., LTD Spec No.: JELF243B_9101M-01 P8/12 9.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 9.8 Specification of outer box Dimensions of outer box (mm) Label H D H 186 93 5 * Above outer box size is typical. It depends on a quantity of an order. D W 10. W 186 Standard reel quantity in outer box (reel) Caution 10.1 Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea (4) Power plant control equipment equipment (5) Medical equipment (6) Transportation equipment (7) Traffic signal (8) Disaster/crime (trains, ships, etc.) equipment prevention equipment (9) Data-processing (10) Applications of similar complexity and/or equipment reliability requirements to the applications listed in the above 10.2 Precautions on rating Avoid using in exceeded the rated temperature range, rated voltage, or rated current. Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault. 10.3 Inrush current If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious fault. 10.4 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 11. Precautions for Use This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. 11.1. Land dimensions The following diagram shows the recommended land dimensions for reflow soldering: a 0.4 b 1.2 c 0.5 (in mm) MURATA MFG CO., LTD Spec No.: JELF243B_9101M-01 P9/12 11.2 Flux and solder used Flux • Use a rosin-based flux. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux. Solder • Use Sn-3.0Ag-0.5Cu solder. • Standard thickness of solder paste: 100 μm to 150 μm If you want to use a flux other than the above, please consult our technical department. 11.3 Soldering conditions (reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard profile Limit profile Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s Heating Above 220°C/30 s to 60 s Above 230°C/60 s max. 245°C±3°C 260°C/10 s 2 times 2 times Peak temperature Number of reflow cycles 11.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating 150°C/approx. 1 min Tip temperature of soldering iron 350°C max. Power consumption of soldering iron 80 W max. Tip diameter of soldering iron Soldering time Number of reworking operations ø3 mm max. 3 s (+1 s, -0 s) 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. 11.5 Solder volume Solder shall be used not to be exceeded the upper limits as shown below. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. MURATA MFG CO., LTD Spec No.: JELF243B_9101M-01 P10/12 11.6 Product's location The following shall be considered when designing and laying out PCBs. (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (length: a < b) to the mechanical stress. a b 〈 Poor example〉 〈 Good example〉 (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the board separation surface. A>C *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 11.7 Handling of substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG CO., LTD Spec No.: JELF243B_9101M-01 P11/12 11.8 Cleaning The product shall be cleaned under the following conditions. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in mounted products and the PCB. Item Requirement Power Time 20 W/L max. 5 min max. Frequency 28 kHz to 40 kHz (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, consult our technical department. 11.9 Storage and transportation Storage period Use the product within 6 months after delivery. If you do not use the product for more than 6 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor solderability. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. • Do not keep products in bulk packaging. Bulk storage could result in collisions between the products or between the products and other parts, resulting in chipping or wire breakage. • Avoid storing the product by itself bare (i.e. exposed directly to air). Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. 11.10 Resin coating (including moisture-proof coating) When the product is coated/molded with resin, its electrical characteristics may change. A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading to wire breakage. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.11 Mounting conditions Check the mounting condition before using. Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 11.12 Operating environment Do not use this product under the following environmental conditions as it may cause deterioration of product quality. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc) (2) In the atmosphere where liquid such as organic solvent, may splash on the products. (3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew. 11.13 Mounting density If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures. If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating temperature for the product. MURATA MFG CO., LTD Spec No.: JELF243B_9101M-01 12． ! P12/12 Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. Appendix Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included in the rating table.) Perform measurement using the method described below. (Perform correction for the error deriving from the measuring terminal.) (1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole terminal as shown in the figure below. (2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using the respective current and voltage for input/output. Zm= V1 I1 Zx= V2 I2 (3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows. Zx=α Zm-β 1-ZmΓ Here, α = D/A = 1 β = B/D = Zsm - (1 - Yom Zsm) Zss Γ = C/A = Yom Zsm: measured impedance of short chip Zss: residual impedance of short chip (0 nH) Yom: measured admittance when measuring terminal is open (4) Calculate inductance Lx and Qx using the equations shown below. Im(Zx) Lx: inductance of chip coil Lx= 2πf Qx: Q of chip coil Im(Zx) Qx= f: measuring frequency Re(Zx) MURATA MFG CO., LTD