LQG15HH2N2S02D

Reference Only SpecNo.JELF243B-9101L-01 P.1 / 11 CHIP COIL (CHIP INDUCTORS) LQG15HH□□□□02D Murata Standard REFERENCE SPECIFICATION [AEC-Q200] 1.Scope This reference specification applies to LQG15HH series Chip coil (Chip Inductors) for Automotive Electoronics based on AEC-Q200. 2.Part Numbering (ex) LQ G 15 H H 1N0 S 0 2 D Product ID Struture Dimension Applications Category Inductance Tolerance Features Electrode (L×W) and for Automotive Characteristics Electoronics Pakaging D:Taping 3.Rating ・Operating Temperature Range. ・Storage Temperature Range. Customer Part Number MURATA Part Number LQG15HH1N0B02D LQG15HH1N0C02D LQG15HH1N0S02D LQG15HH1N1B02D LQG15HH1N1C02D LQG15HH1N1S02D LQG15HH1N2B02D LQG15HH1N2C02D LQG15HH1N2S02D LQG15HH1N3B02D LQG15HH1N3C02D LQG15HH1N3S02D LQG15HH1N5B02D LQG15HH1N5C02D LQG15HH1N5S02D LQG15HH1N6B02D LQG15HH1N6C02D LQG15HH1N6S02D LQG15HH1N8B02D LQG15HH1N8C02D LQG15HH1N8S02D LQG15HH2N0B02D LQG15HH2N0C02D LQG15HH2N0S02D LQG15HH2N2B02D LQG15HH2N2C02D LQG15HH2N2S02D LQG15HH2N4B02D LQG15HH2N4C02D LQG15HH2N4S02D LQG15HH2N7B02D LQG15HH2N7C02D LQG15HH2N7S02D LQG15HH3N0B02D LQG15HH3N0C02D LQG15HH3N0S02D LQG15HH3N3B02D LQG15HH3N3C02D LQG15HH3N3S02D LQG15HH3N6B02D LQG15HH3N6C02D LQG15HH3N6S02D –55°C to +125°C –55°C to +125°C DC Self Resonant Resistance Frequency (Ω max. ) (MHz min. ) (*1)(refer to below comment) Inductance Q Tolerance (nH) (min.) Rated Current (mA) ESD Rank 1C:1kV 10000 1.0 1.1 1.2 0.07 1000 0.08 950 1.3 1.5 1.6 1.8 2.0 B:±0.1nH C:±0.2nH S:±0.3nH 8 1C 6000 0.09 900 2.4 0.11 850 2.7 0.12 2.2 800 3.0 0.125 3.3 3.6 MURATA MFG.CO., LTD 0.14 750 SpecNo.JELF243B-9101L-01 Customer Part Number Reference Only MURATA Part Number LQG15HH3N9B02D LQG15HH3N9C02D LQG15HH3N9S02D LQG15HH4N3B02D LQG15HH4N3C02D LQG15HH4N3S02D LQG15HH4N7B02D LQG15HH4N7C02D LQG15HH4N7S02D LQG15HH5N1B02D LQG15HH5N1C02D LQG15HH5N1S02D LQG15HH5N6B02D LQG15HH5N6C02D LQG15HH5N6S02D LQG15HH6N2B02D LQG15HH6N2C02D LQG15HH6N2S02D LQG15HH6N8G02D LQG15HH6N8H02D LQG15HH6N8J02D LQG15HH7N5G02D LQG15HH7N5H02D LQG15HH7N5J02D LQG15HH8N2G02D LQG15HH8N2H02D LQG15HH8N2J02D LQG15HH9N1G02D LQG15HH9N1H02D LQG15HH9N1J02D LQG15HH10NG02D LQG15HH10NH02D LQG15HH10NJ02D LQG15HH12NG02D LQG15HH12NH02D LQG15HH12NJ02D LQG15HH15NG02D LQG15HH15NH02D LQG15HH15NJ02D LQG15HH18NG02D LQG15HH18NH02D LQG15HH18NJ02D LQG15HH22NG02D LQG15HH22NH02D LQG15HH22NJ02D LQG15HH27NG02D LQG15HH27NH02D LQG15HH27NJ02D LQG15HH33NG02D LQG15HH33NH02D LQG15HH33NJ02D LQG15HH39NG02D LQG15HH39NH02D LQG15HH39NJ02D DC Self Resonant Resistance Frequency (Ω max. ) (MHz min. ) (*1)(refer to below comment) Inductance Q Tolerance (nH) (min.) P.2 / 11 Rated Current (mA) ESD Rank 1C:1kV 3.9 0.14 6000 4.3 4.7 5.1 750 0.16 B:±0.1nH C:±0.2nH S:±0.3nH 700 5300 0.18 650 5.6 6.2 0.20 4500 600 6.8 0.22 7.5 4200 0.24 8.2 550 3700 8 1C 9.1 0.26 3400 10 12 500 0.28 3000 0.32 2500 450 18 0.36 2200 400 22 0.42 1900 27 0.46 1700 33 0.58 1600 39 0.65 1200 15 G:±2% H:±3% J:±5% MURATA MFG.CO., LTD 350 300 Reference Only SpecNo.JELF243B-9101L-01 Customer Part Number MURATA Part Number Inductance Q Tolerance (min.) (nH) DC Resistance (Ω max. ) Self Resonant Frequency (MHz min. ) (*1)(refer to below comment) LQG15HH47NG02D LQG15HH47NH02D LQG15HH47NJ02D LQG15HH56NG02D LQG15HH56NH02D LQG15HH56NJ02D LQG15HH68NG02D LQG15HH68NH02D LQG15HH68NJ02D LQG15HH82NG02D LQG15HH82NH02D LQG15HH82NJ02D LQG15HHR10G02D LQG15HHR10H02D LQG15HHR10J02D LQG15HHR12G02D LQG15HHR12H02D LQG15HHR12J02D LQG15HHR15G02D LQG15HHR15H02D LQG15HHR15J02D LQG15HHR18G02D LQG15HHR18H02D LQG15HHR18J02D LQG15HHR22G02D LQG15HHR22H02D LQG15HHR22J02D LQG15HHR27G02D LQG15HHR27H02D LQG15HHR27J02D 47 0.72 56 0.82 68 0.92 82 1.20 100 G:±2% H:±3% J:±5% 120 P.3 / 11 Rated Current (mA) 1000 300 800 250 700 1.25 200 600 8 1C 1.30 150 2.99 550 150 180 3.38 500 220 3.77 450 120 270 4.94 400 110 (*1) Standard Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : 20°C ± 2°C Temperature : Ordinary Temperature / 15°C to 35°C : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Humidity Atmospheric Pressure : 86kPa to 106 kPa 4. Appearance and Dimensions Polarity Marking Electrode 0.5±0.05 ■Unit Mass (Typical value) 0.001g 1.0±0.05 0.5±0.05 0.5±0.0.5 (in mm) 0.25±0.1 MURATA MFG.CO., LTD ESD Rank 1C:1kV SpecNo.JELF243B-9101L-01 Reference Only P.4 / 11 5.Electrical Performance No. 5.1 Item Inductance Specification Inductance shall meet item 3. 5.2 Q Q shall meet item 3. Test Method Measuring Equipment: Keysight E4991A or equivalent Measuring Frequency: 100MHz Measuring Condition: Test signal level/ about 0dBm Electrode spaces / 0.5mm Electricallength/ 10mm Weight/about 1N to 5N Measuring Fixture: Keysight 16197A Position coil under test as shown in below and contact coil with each terminal by adding weight. Polarity marking should be a topside,and polarity marking should be in the direction of the fixture for position of chip coil. 0.5mm 11.5mm 5.3 5.4 5.5 DC Resistance Self Resonant Frequency(S.R.F) Rated Current DC Resistance shall meet item 3. S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. Polarity Marking Measuring Method:See the endnote [Electrical Performance:Measuring Method of Inductance/Q] Measuring Equipment:Digital multi meter Measuring Equipment: Keysight 8753C or equivalent The allowable current is applied. 6.Q200 Requirement 6.1.Performance (based on Table 5 for Magnetics(Inductors / Transformer) AEC-Q200 Rev.D issued June 1. 2010 AEC-Q200 No Stress 3 High Temperature Exposure 4 Murata Specification / Deviation Test Method 1000hours at 125 deg C Set for 24hours at room temperature, then measured. Temperature Cycling Meet Table A after testing. Table A Appearance No damage Inductance Change Within ±10% (at 100MHz) 1000cycles -40 deg C to +125 deg C Set for 24hours at room temperature,then measured. 7 Biased Humidity 1000hours at 85 deg C, 85%RH unpowered. 8 Operational Life Apply 125 deg C 1000hours Set for 24hours at room temperature, then measured 9 External Visual Visual inspection 10 Physical Dimension Meet ITEM 4 （Style and Dimensions） Meet Table A after testing. 12 Resistance to Solvents Not Applicable Per MIL-STD-202 Method 215 Meet Table A after testing. Meet Table A after testing. No abnormalities No defects MURATA MFG.CO., LTD Reference Only SpecNo.JELF243B-9101L-01 P.5 / 11 AEC-Q200 Murata Specification / Deviation No Stress Test Method 13 Mechanical Shock Per MIL-STD-202 Meet Table A after testing. Method 213 Condition C : 100g’s(0.98N), 6ms, Half sine, 12.3ft/s 14 Vibration 5g's(0.049N) for 20 minutes, Meet Table A after testing. 12cycles each of 3 oritentations Test from 10-2000Hz. 15 Resistance No-heating to Soldering Heat Solder temperature 260C+/-5 deg C Immersion time 10s 17 ESD Per AEC-Q200-002 Meet Table A after testing. Pre-heating 150C +/-10 deg C, 60s to 90s 18 Solderbility Per J-STD-002 Method b : Not Applicable 90% of the terminations is to be soldered. 19 Electrical Characterization 20 Flammability 21 Board Flex Measured : Inductance No defects Per UL-94 Epoxy-PCB(1.6mm) Deflection 2mm(min) Holding time 60s Not Applicable Meet Table B after testing. Table B Appearance No damage DC resistance Within ±10% Change ESD Rank: refer to the Item3 (Rating). Meet Table A after testing 22 Terminal Strength Per AEC-Q200-006 A force of 17.7N for 60s Murata Deviation Request: 5N No defects 7.Specification of Packaging 4.0±0.1 0.1 φ1.5± 0 1.12±0.04 0.62±0.04 Direction of feed 8.0±0.2 2.0±0.05 2.0±0.05 3.5±0.05 Polarity marking 1.75±0.1 7.1 Appearance and Dimensions of paper tape (8mm-wide) 0.8max. (in mm) 7.2 Specification of Taping (1) Packing quantity (standard quantity) 10,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Top tape has no spliced point. (5) Missing components number Missing components number within 0.025 % of the number per reel or 1 pc., whichever is greater,and are not continuous. The Specified quantity per reel is kept. MURATA MFG.CO., LTD Reference Only SpecNo.JELF243B-9101L-01 P.6 / 11 7.3 Pull Strength Top tape Bottom tape 5N min. 7.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 300mm/min 0.1N to 0.6N (minimum value is typical) 165 to 180 degree Top tape F Bottom tape Base tape 7.5 Dimensions of Leader-tape,Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. Trailer 160 min. 2.0±0.5 Leader Label 190 min. 210 min. Top tape Empty tape  13.0±0.2 +1  60 -0  21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 +0  180 -3 (in mm) 7.6 Marking for reel Customer part number, MURATA part number, Inspection number(1) ,RoHS Marking(2), Quantity etc ･･･ □□ OOOO  1) (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit: Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digi : Day (3) Serial No. 2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 7.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking(2) ,Quantity, etc ･･･ 7.8. Specification of Outer Case Label H D Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5  Above Outer Case size is typical. It depends on a quantity of an order. W MURATA MFG.CO., LTD Reference Only SpecNo.JELF243B-9101L-01 8. P.7 / 11 ! △ Caution 8.1 Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.) (7) Traffic signal equipment (2) Aerospace equipment (8) Disaster prevention / crime prevention equipment (3) Undersea equipment (4) Power plant control equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability (5) Medical equipment requirements to the applications listed in the above 8.2 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 8.3 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 9. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. Please check the mounting condition before using. Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 9.1 Land pattern designing Chip Coil Land Solder Resist c a b c 0.4 1.2 0.5 a (in mm) b 9.2 Flux, Solder ・Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste : 100μm to 150μm. MURATA MFG.CO., LTD SpecNo.JELF243B-9101L-01 Reference Only P.8 / 11 9.3 Reflow soldering conditions ・Inductance value may be changed a little due to the amount of solder. So, the chip coil shall be soldered by reflow so that the solder volume can be controlled. ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ・Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C 、90s±30s above 220°C､30s～60s above 230°C､60s max. 245°C±3°C 260°C,10s 2 times 2 times 9.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre-heating Tip temperature Soldering iron output Tip diameter Soldering time Time 150°C,1 min 350°C max. 80W max. φ3mm max. 3(+1,-0)s 2 times Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 9.5 Solder Volume ・ Solder shall be used not to be exceed the upper limits as shown below. ・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable t 1/3T≦t≦T T：thickness of product 9.6 Mount Shock Over Mechanical stress to products at mounting process causes crack and electrical failure etc. MURATA MFG.CO., LTD SpecNo.JELF243B-9101L-01 Reference Only P.9 / 11 9.7 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subjected to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length:a＜b) to the mechanical stress. 〈 Good example 〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Perforation Stress Level A > D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommend 9.8 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. MURATA MFG.CO., LTD SpecNo.JELF243B-9101L-01 Reference Only P.10 / 11 9.9 Resin coating The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 9.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 9.11 Storage and Handing Requirements (1) Storage period Use the products within 6 months after deliverd. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature: -10°C to 40°C Humidity: 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should be storaged on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be storaged in the warehouse without heat shock, vibration, direct sunlight and so on. ・Products should be storaged under the airtight packaged condition. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. ! Note 10．△ (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD Reference Only SpecNo.JELF243B-9101L-01 P.11 / 11 (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I2 I1 A Zm B C Test Head V1 I1 = Zx V2 V1 D Test fixture A B C D V2 I2 Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. Zm= V1 I1 ， Zx= V2 I2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx=  β= B / D =Zsm-(1-Yom Zsm)Zss 1-ZmΓ Γ= C / A =Yom Zsm:measured impedance of short chip Zss:residual impedance of short chip (0nH) Yom:measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Lx :Inductance of chip coil Lx= Qx= 2πf ， Re(Zx) Qx:Q of chip coil f :Measuring frequency MURATA MFG.CO., LTD