LQG15HN27NJ02D

Reference Only Spec No. JELF243B-0009Q-01 P.1/10 CHIP COIL (CHIP INDUCTORS) LQG15HN□□□□02D REFERENCE SPECIFICATION 1. Scope This reference specification applies to LQG15HN_02 series, for Chip coil (Chip Inductors). 2. Part Numbering (ex) LQ G 15 H N 1N0 S 0 2 Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode (L×W) and Characteristics D Packaging D:Taping *B:BULK *Bulk packing (B) also available 3. Rating ・Operating Temperature Range ・Storage Temperature Range Customer Part Number MURATA Part Number LQG15HN1N0B02D LQG15HN1N0C02D LQG15HN1N0S02D LQG15HN1N1B02D LQG15HN1N1C02D LQG15HN1N1S02D LQG15HN1N2B02D LQG15HN1N2C02D LQG15HN1N2S02D LQG15HN1N3B02D LQG15HN1N3C02D LQG15HN1N3S02D LQG15HN1N5B02D LQG15HN1N5C02D LQG15HN1N5S02D LQG15HN1N6B02D LQG15HN1N6C02D LQG15HN1N6S02D LQG15HN1N8B02D LQG15HN1N8C02D LQG15HN1N8S02D LQG15HN2N0B02D LQG15HN2N0C02D LQG15HN2N0S02D LQG15HN2N2B02D LQG15HN2N2C02D LQG15HN2N2S02D LQG15HN2N4B02D LQG15HN2N4C02D LQG15HN2N4S02D LQG15HN2N7B02D LQG15HN2N7C02D LQG15HN2N7S02D LQG15HN3N0B02D LQG15HN3N0C02D LQG15HN3N0S02D LQG15HN3N3B02D LQG15HN3N3C02D LQG15HN3N3S02D –55°C to +125°C –55°C to +125°C Inductance (nH) Tolerance Q (min.) 1.0 DC Resistance (Ω max.) Self Resonant Frequency (MHz min.) Rated Current (mA) 0.07 1.1 1.2 1000 1.3 0.08 1.5 1.6 1.8 B:±0.1nH C:±0.2nH S:±0.3nH 8 6000 900 2.0 0.09 2.2 2.4 0.10 2.7 800 3.0 0.11 3.3 0.12 MURATA MFG.CO., LTD Spec No. JELF243B-0009Q-01 Customer Part Number MURATA Part Number LQG15HN3N6B02D LQG15HN3N6C02D LQG15HN3N6S02D LQG15HN3N9B02D LQG15HN3N9C02D LQG15HN3N9S02D LQG15HN4N3B02D LQG15HN4N3C02D LQG15HN4N3S02D LQG15HN4N7B02D LQG15HN4N7C02D LQG15HN4N7S02D LQG15HN5N1B02D LQG15HN5N1C02D LQG15HN5N1S02D LQG15HN5N6B02D LQG15HN5N6C02D LQG15HN5N6S02D LQG15HN6N2B02D LQG15HN6N2C02D LQG15HN6N2S02D LQG15HN6N8G02D LQG15HN6N8H02D LQG15HN6N8J02D LQG15HN7N5G02D LQG15HN7N5H02D LQG15HN7N5J02D LQG15HN8N2G02D LQG15HN8N2H02D LQG15HN8N2J02D LQG15HN9N1G02D LQG15HN9N1H02D LQG15HN9N1J02D LQG15HN10NG02D LQG15HN10NH02D LQG15HN10NJ02D LQG15HN12NG02D LQG15HN12NH02D LQG15HN12NJ02D LQG15HN15NG02D LQG15HN15NH02D LQG15HN15NJ02D LQG15HN18NG02D LQG15HN18NH02D LQG15HN18NJ02D LQG15HN22NG02D LQG15HN22NH02D LQG15HN22NJ02D LQG15HN27NG02D LQG15HN27NH02D LQG15HN27NJ02D LQG15HN33NG02D LQG15HN33NH02D LQG15HN33NJ02D LQG15HN39NG02D LQG15HN39NH02D LQG15HN39NJ02D Reference Only Inductance (nH) Tolerance Q (min.) DC Resistance (Ω max.) Self Resonant Frequency (MHz min.) P.2/10 Rated Current (mA) 3.6 0.13 3.9 700 4.3 4.7 0.15 B:±0.1nH C:±0.2nH S:±0.3nH 6000 0.16 5.1 5.6 0.18 5300 600 6.2 0.19 4300 6.8 0.21 4200 7.5 0.24 3900 0.25 3600 8.2 8 500 9.1 0.27 3400 10 0.29 3200 0.40 2800 12 15 G:±2% H:±3% J:±5% 18 400 0.45 2300 0.51 2100 350 22 0.58 27 1800 1600 0.67 33 39 MURATA MFG.CO., LTD 300 1500 1.06 1200 250 Reference Only Spec No. JELF243B-0009Q-01 Customer Part Number MURATA Part Number LQG15HN47NG02D LQG15HN47NH02D LQG15HN47NJ02D LQG15HN56NG02D LQG15HN56NH02D LQG15HN56NJ02D LQG15HN68NG02D LQG15HN68NH02D LQG15HN68NJ02D LQG15HN82NG02D LQG15HN82NH02D LQG15HN82NJ02D LQG15HNR10G02D LQG15HNR10H02D LQG15HNR10J02D LQG15HNR12G02D LQG15HNR12H02D LQG15HNR12J02D P.3/10 DC Resistance (Ω max.) Self Resonant Frequency (MHz min.) Rated Current (mA) 47 1.15 1000 250 56 1.20 Inductance (nH) Tolerance Q (min.) 800 68 G:±2% H:±3% J:±5% 82 1.25 200 8 100 1.60 600 120 150 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106kPa 5. Appearance and Dimensions Polarity Marking Electrode 0.5±0.05 1.0±0.05 0.5±0.05 0.5±0.0.5 ■Unit Mass (Typical value) 0.001g (in mm) 0.25±0.1 MURATA MFG.CO., LTD Spec No. JELF243B-0009Q-01 Reference Only P.4/10 6. Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. 6.2 Q Q shall meet item 3. Test Method Measuring Equipment: Agilent 4291A or equivalent Measuring Frequency: 100MHz Measuring Condition: Test signal level/ about 7dBm Electricallength/ 0.94cm Weight/about 1N to 5N Measuring Fixture: Agilent 16193A Position coil under test as shown in below and contact coil with each terminal by adding weight. Polarity marking should be a topside, and polarity marking should be in the direction of the fixture for position of chip coil. Polarity Marking 0.5mm 11.5mm 6.3 6.4 6.5 DC Resistance Self Resonant Frequency (S.R.F) Rated Current DC Resistance shall meet item 3. S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. Measuring Method: See P.10 [Electrical Performance: Measuring Method of Inductance/ Q] Measuring Equipment: Digital multi meter Measuring Equipment: Agilent 8753C or equivalent The rated current is applied. 7. Mechanical Performance No. 7.1 Item Shear Test Specification Chip coil shall not be damaged after tested as test method. Test Method Substrate: Glass-epoxy substrate Land 0.5 (in mm) 0.55 0.4 0.55 Force: 5N Hold Duration: 5s±1s Applied Direction: Parallel to PCB Chip Coil F Substrate MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0009Q-01 No. 7.2 Item Bending Test Specification Chip coil shall not be damaged after tested as test method. P.5/10 Test Method Substrate: Glass-epoxy substrate (100mm×40mm×0.8mm) Speed of Applying Force: 1mm / s Deflection: 2mm Hold Duration: 30s Pressure jig R340 F Deflection 45 7.3 Vibration Appearance: No damage Inductance Change: within ±10% 7.4 Solderability The wetting area of the electrode shall be at least 90% covered with new solder coating. 7.5 Resistance to Soldering Heat Appearance: No damage Inductance Change: within ±10% 45 Product (in mm) Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1 min Total Amplitude: 1.5mm Testing Time: A period of 2 hours in each of 3 mutually perpendicular directions. Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C / 60s to 90s Solder Temperature: 240°C±5°C Immersion Time: 3s±1s Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C / 1 min to 2 min Solder Temperature: 270°C±5°C Immersion Time: 10s±1s Then measured after exposure in the room condition for 24h±2h. 8. Environmental Performance It shall be soldered on the substrate. No. Item Specification 8.1 Humidity Appearance: No damage Inductance Change: within ±10% 8.2 Heat Life 8.3 Humidity Load 8.4 Temperature Cycle Test Method Temperature: 40°C±2°C Humidity: 90%(RH) to 95%(RH) Time: 1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Temperature: 125°C±2°C Current: Rated Current (See the 3.) Time: 1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Temperature: 40°C±2°C Humidity: 90%(RH) to 95%(RH) Current: Rated Current (See the 3.) Time: 1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. 1 cycle: 1 step: -55°C (+0°C,-3°C) / 30 min±3 min 2 step: Ordinary temp. / 2 min to 3 min 3 step: +125°C (+3°C,-0°C) / 30 min±3 min 4 step: Ordinary temp. / 2 min to 3 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0009Q-01 P.6/10 9. Specification of Packaging 4.0±0.1 0.1 φ1.5± 0 1.12±0.04 8.0±0.2 2.0±0.05 2.0±0.05 3.5±0.05 Polarity marking 1.75±0.1 9.1 Appearance and Dimensions of paper tape (8mm-wide) Direction of feed 0.62±0.04 0.8max. (in mm) 9.2 Specification of Taping (1) Packing quantity (standard quantity) 10,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Top tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength Top tape Bottom tape 5N min. 9.4 Peeling off force of cover tape Speed of Peeling off Peeling off force 300mm / min 0.1N to 0.6N (minimum value is typical) 165 to 180 degree Top tape F Bottom tape Base tape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. 2.0±0.5 Trailer 160 min. Leader Label 190 min. Empty tape 210 min. Top tape φ 13.0±0.2 +1 φ 60 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 +0 φ 180 -3 (in mm) MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0009Q-01 P.7/10 9.6 Marking for reel Customer part number, MURATA part number, Inspection number (∗1), RoHS marking Quantity etc ･･･ (∗2), □□ OOOO ××× ∗1) (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2), Quantity, etc ･･･ 9.8. Specification of Outer Case Label H Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5 D ∗ Above Outer Case size is typical. It depends on a quantity of an order. W 10. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (3) Undersea equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 11. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Chip Coil Land Solder Resist c a b c 0.4 1.4 to 1.5 0.5 to 0.6 a (in mm) b MURATA MFG.CO., LTD Spec No. JELF243B-0009Q-01 Reference Only P.8/10 11.2 Flux, Solder ・Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste : 100μm to 150μm. 11.3 Reflow soldering conditions ・Inductance value may be changed a little due to the amount of solder. So, the chip coil shall be soldered by reflow so that the solder volume can be controlled. ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. ・Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C, 90s±30s above 220°C, 30s～60s above 230°C, 60s max. 245°C±3°C 260°C, 10s 2 times 2 times 11.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1, -0)s Time 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・ Solder shall be used not to be exceededthe upper limits as shown below. ・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable t 1/3T≦t≦T T： thickness of product MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0009Q-01 P.9/10 11.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways direction (Length: a＜b) to the mechanical stress. b 〈 Poor example 〉 〈 Good example 〉 (2) Products location on P.C.B. separation Seam b A C B D Slit Lengh:a