LQG15HSR10G02D

Spec No.: JELF243B_0010T-01 P1/13 CHIP COILS (CHIP INDUCTORS) LQG15HS□□□□02□ REFERENCE SPECIFICATION 1. Scope This reference specification applies to chip coils (chip inductors) LQG15HS_02 series for general electronic equipment. 2. Part Numbering (Ex.) LQ G 15 Product Structure Dimension ID (L × W) H S 1N0 Application Category Inductance and characteristic *B: Bulk packing is also available. S Tolerance 0 Performance 2 Electrode specification D Packaging D: taping *B: bulk 3. Part Number and Rating Operating temperature range Storage temperature range -55°C to +125°C -55°C to +125°C Inductance Customer Part number Murata Part number Nominal value (nH) Tolerance Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz min.) Rated current (mA) LQG15HS1N0B02D 1.0 B: ±0.1 nH 8 0.07 10000 1000 LQG15HS1N0C02D 1.0 C: ±0.2 nH 8 0.07 10000 1000 LQG15HS1N0S02D 1.0 S: ±0.3 nH 8 0.07 10000 1000 LQG15HS1N1B02D 1.1 B: ±0.1 nH 8 0.07 6000 1000 LQG15HS1N1C02D 1.1 C: ±0.2 nH 8 0.07 6000 1000 LQG15HS1N1S02D 1.1 S: ±0.3 nH 8 0.07 6000 1000 LQG15HS1N2B02D 1.2 B: ±0.1 nH 8 0.07 6000 1000 LQG15HS1N2C02D 1.2 C: ±0.2 nH 8 0.07 6000 1000 LQG15HS1N2S02D 1.2 S: ±0.3 nH 8 0.07 6000 1000 LQG15HS1N3B02D 1.3 B: ±0.1 nH 8 0.07 6000 1000 LQG15HS1N3C02D 1.3 C: ±0.2 nH 8 0.07 6000 1000 LQG15HS1N3S02D 1.3 S: ±0.3 nH 8 0.07 6000 1000 LQG15HS1N5B02D 1.5 B: ±0.1 nH 8 0.07 6000 1000 LQG15HS1N5C02D 1.5 C: ±0.2 nH 8 0.07 6000 1000 LQG15HS1N5S02D 1.5 S: ±0.3 nH 8 0.07 6000 1000 LQG15HS1N6B02D 1.6 B: ±0.1 nH 8 0.07 6000 1000 LQG15HS1N6C02D 1.6 C: ±0.2 nH 8 0.07 6000 1000 LQG15HS1N6S02D 1.6 S: ±0.3 nH 8 0.07 6000 1000 LQG15HS1N8B02D 1.8 B: ±0.1 nH 8 0.08 6000 950 LQG15HS1N8C02D 1.8 C: ±0.2 nH 8 0.08 6000 950 LQG15HS1N8S02D 1.8 S: ±0.3 nH 8 0.08 6000 950 LQG15HS2N0B02D 2.0 B: ±0.1 nH 8 0.09 6000 900 LQG15HS2N0C02D 2.0 C: ±0.2 nH 8 0.09 6000 900 LQG15HS2N0S02D 2.0 S: ±0.3 nH 8 0.09 6000 900 LQG15HS2N2B02D 2.2 B: ±0.1 nH 8 0.09 6000 900 LQG15HS2N2C02D 2.2 C: ±0.2 nH 8 0.09 6000 900 LQG15HS2N2S02D 2.2 S: ±0.3 nH 8 0.09 6000 900 LQG15HS2N4B02D 2.4 B: ±0.1 nH 8 0.11 6000 850 LQG15HS2N4C02D 2.4 C: ±0.2 nH 8 0.11 6000 850 LQG15HS2N4S02D 2.4 S: ±0.3 nH 8 0.11 6000 850 MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 P2/13 Inductance Customer Part number Murata Part number Nominal value (nH) Tolerance Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz min.) Rated current (mA) LQG15HS2N7B02D 2.7 B: ±0.1 nH 8 0.12 6000 800 LQG15HS2N7C02D 2.7 C: ±0.2 nH 8 0.12 6000 800 LQG15HS2N7S02D 2.7 S: ±0.3 nH 8 0.12 6000 800 LQG15HS3N0B02D 3.0 B: ±0.1 nH 8 0.125 6000 800 LQG15HS3N0C02D 3.0 C: ±0.2 nH 8 0.125 6000 800 LQG15HS3N0S02D 3.0 S: ±0.3 nH 8 0.125 6000 800 LQG15HS3N3B02D 3.3 B: ±0.1 nH 8 0.125 6000 800 LQG15HS3N3C02D 3.3 C: ±0.2 nH 8 0.125 6000 800 LQG15HS3N3S02D 3.3 S: ±0.3 nH 8 0.125 6000 800 LQG15HS3N6B02D 3.6 B: ±0.1 nH 8 0.14 6000 750 LQG15HS3N6C02D 3.6 C: ±0.2 nH 8 0.14 6000 750 LQG15HS3N6S02D 3.6 S: ±0.3 nH 8 0.14 6000 750 LQG15HS3N9B02D 3.9 B: ±0.1 nH 8 0.14 6000 750 LQG15HS3N9C02D 3.9 C: ±0.2 nH 8 0.14 6000 750 LQG15HS3N9S02D 3.9 S: ±0.3 nH 8 0.14 6000 750 LQG15HS4N3B02D 4.3 B: ±0.1 nH 8 0.14 6000 750 LQG15HS4N3C02D 4.3 C: ±0.2 nH 8 0.14 6000 750 LQG15HS4N3S02D 4.3 S: ±0.3 nH 8 0.14 6000 750 LQG15HS4N7B02D 4.7 B: ±0.1 nH 8 0.16 6000 700 LQG15HS4N7C02D 4.7 C: ±0.2 nH 8 0.16 6000 700 LQG15HS4N7S02D 4.7 S: ±0.3 nH 8 0.16 6000 700 LQG15HS5N1B02D 5.1 B: ±0.1 nH 8 0.18 5300 650 LQG15HS5N1C02D 5.1 C: ±0.2 nH 8 0.18 5300 650 LQG15HS5N1S02D 5.1 S: ±0.3 nH 8 0.18 5300 650 LQG15HS5N6B02D 5.6 B: ±0.1 nH 8 0.18 4500 650 LQG15HS5N6C02D 5.6 C: ±0.2 nH 8 0.18 4500 650 LQG15HS5N6S02D 5.6 S: ±0.3 nH 8 0.18 4500 650 LQG15HS6N2B02D 6.2 B: ±0.1 nH 8 0.20 4500 600 LQG15HS6N2C02D 6.2 C: ±0.2 nH 8 0.20 4500 600 LQG15HS6N2S02D 6.2 S: ±0.3 nH 8 0.20 4500 600 LQG15HS6N8G02D 6.8 G: ±2% 8 0.22 4500 600 LQG15HS6N8H02D 6.8 H: ±3% 8 0.22 4500 600 LQG15HS6N8J02D 6.8 J: ±5% 8 0.22 4500 600 LQG15HS7N5G02D 7.5 G: ±2% 8 0.24 4200 550 LQG15HS7N5H02D 7.5 H: ±3% 8 0.24 4200 550 LQG15HS7N5J02D 7.5 J: ±5% 8 0.24 4200 550 LQG15HS8N2G02D 8.2 G: ±2% 8 0.24 3700 550 LQG15HS8N2H02D 8.2 H: ±3% 8 0.24 3700 550 LQG15HS8N2J02D 8.2 J: ±5% 8 0.24 3700 550 LQG15HS9N1G02D 9.1 G: ±2% 8 0.26 3400 500 LQG15HS9N1H02D 9.1 H: ±3% 8 0.26 3400 500 LQG15HS9N1J02D 9.1 J: ±5% 8 0.26 3400 500 LQG15HS10NG02D 10 G: ±2% 8 0.26 3400 500 LQG15HS10NH02D 10 H: ±3% 8 0.26 3400 500 LQG15HS10NJ02D 10 J: ±5% 8 0.26 3400 500 MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 P3/13 Inductance Customer Part number Tolerance Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz min.) Rated current (mA) 12 G: ±2% 8 0.28 3000 500 12 H: ±3% 8 0.28 3000 500 Murata Part number Nominal value (nH) LQG15HS12NG02D LQG15HS12NH02D LQG15HS12NJ02D 12 J: ±5% 8 0.28 3000 500 LQG15HS15NG02D 15 G: ±2% 8 0.32 2500 450 LQG15HS15NH02D 15 H: ±3% 8 0.32 2500 450 LQG15HS15NJ02D 15 J: ±5% 8 0.32 2500 450 LQG15HS18NG02D 18 G: ±2% 8 0.36 2200 400 LQG15HS18NH02D 18 H: ±3% 8 0.36 2200 400 LQG15HS18NJ02D 18 J: ±5% 8 0.36 2200 400 LQG15HS22NG02D 22 G: ±2% 8 0.42 1900 350 LQG15HS22NH02D 22 H: ±3% 8 0.42 1900 350 LQG15HS22NJ02D 22 J: ±5% 8 0.42 1900 350 LQG15HS27NG02D 27 G: ±2% 8 0.46 1700 350 LQG15HS27NH02D 27 H: ±3% 8 0.46 1700 350 LQG15HS27NJ02D 27 J: ±5% 8 0.46 1700 350 LQG15HS33NG02D 33 G: ±2% 8 0.58 1600 350 LQG15HS33NH02D 33 H: ±3% 8 0.58 1600 350 LQG15HS33NJ02D 33 J: ±5% 8 0.58 1600 350 LQG15HS39NG02D 39 G: ±2% 8 0.65 1200 300 LQG15HS39NH02D 39 H: ±3% 8 0.65 1200 300 LQG15HS39NJ02D 39 J: ±5% 8 0.65 1200 300 LQG15HS47NG02D 47 G: ±2% 8 0.72 1000 300 LQG15HS47NH02D 47 H: ±3% 8 0.72 1000 300 LQG15HS47NJ02D 47 J: ±5% 8 0.72 1000 300 LQG15HS56NG02D 56 G: ±2% 8 0.82 800 250 LQG15HS56NH02D 56 H: ±3% 8 0.82 800 250 LQG15HS56NJ02D 56 J: ±5% 8 0.82 800 250 LQG15HS68NG02D 68 G: ±2% 8 0.92 800 250 LQG15HS68NH02D 68 H: ±3% 8 0.92 800 250 LQG15HS68NJ02D 68 J: ±5% 8 0.92 800 250 LQG15HS82NG02D 82 G: ±2% 8 1.20 700 200 LQG15HS82NH02D 82 H: ±3% 8 1.20 700 200 LQG15HS82NJ02D 82 J: ±5% 8 1.20 700 200 LQG15HSR10G02D 100 G: ±2% 8 1.25 600 200 LQG15HSR10H02D 100 H: ±3% 8 1.25 600 200 LQG15HSR10J02D 100 J: ±5% 8 1.25 600 200 LQG15HSR12G02D 120 G: ±2% 8 1.30 600 200 LQG15HSR12H02D 120 H: ±3% 8 1.30 600 200 LQG15HSR12J02D 120 J: ±5% 8 1.30 600 200 LQG15HSR15G02D 150 G: ±2% 8 2.99 550 150 LQG15HSR15H02D 150 H: ±3% 8 2.99 550 150 LQG15HSR15J02D 150 J: ±5% 8 2.99 550 150 LQG15HSR18G02D 180 G: ±2% 8 3.38 500 150 LQG15HSR18H02D 180 H: ±3% 8 3.38 500 150 LQG15HSR18J02D 180 J: ±5% 8 3.38 500 150 MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 P4/13 Inductance Customer Part number Q (Min.) DC resistance (Ω max.) Self-resonant frequency (MHz min.) Murata Part number Nominal value (nH) Tolerance Rated current (mA) LQG15HSR22G02D 220 G: ±2% 8 3.77 450 120 LQG15HSR22H02D 220 H: ±3% 8 3.77 450 120 LQG15HSR22J02D 220 J: ±5% 8 3.77 450 120 LQG15HSR27G02D 270 G: ±2% 8 4.94 400 110 LQG15HSR27H02D 270 H: ±3% 8 4.94 400 110 LQG15HSR27J02D 270 J: ±5% 8 4.94 400 110 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C) Humidity: ordinary humidity [25% to 85% (RH)] In case of doubt Temperature: 20°C±2°C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa 5. Appearance and Dimensions Unit mass (typical value): 0.001 g 6. Marking MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 P5/13 7. Electrical Performance No. Item 7.1 Inductance 7.2 Q 7.3 DC resistance 7.4 Self-resonant frequency 7.5 Rated current Specification Meet chapter 3 ratings. Meet chapter 3 ratings. Meet chapter 3 ratings. Meet chapter 3 ratings. Product temperature rise: 25°C max. Test method Measuring equipment: Keysight E4991A or the equivalent Measuring frequency: 100 MHz Measuring conditions: Measurement signal level: Approx. 0 dBm Measurement terminal distance: 0.5 mm Electrical length: 10 mm Weight: Approx. 1 N to 5 N Measuring fixture: Keysight 16197A Position the chip coil under test as shown in the measuring example below and connect it to the electrode by applying weight. Measurement example: Measuring method: see "Electrical performance: Measuring method for inductance/Q" in the Appendix. Measuring equipment: digital multimeter Measuring equipment: Keysight 8753C or the equivalent Apply the rated current specified in chapter 3. 8. Mechanical Performance No. Item 8.1 Shear test Specification No significant mechanical damage or no sign of electrode peeling off shall be observed. Test method Test substrate: glass-epoxy substrate Applying force: 5 N Holding time: 5 s±1 s Force application direction: 8.2 Bending test No significant mechanical damage or no sign of electrode peeling off shall be observed. Test substrate: glass-epoxy substrate (100 mm × 40 mm × 0.8 mm) Pressurizing speed: 1 mm/s Pressure jig: R340 Deflection: 2 mm Holding time: 30 s MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 No. Item 8.3 Vibration 8.4 Solderability 8.5 Resistance to soldering heat P6/13 Specification Appearance shall have no significant mechanical damage. Inductance change rate: within ±10% Test method Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for approx. 1 min Total amplitude: 1.5 mm Test time: 3 directions perpendicular to each other, 2 h for each direction (6 h in total) 90% or more of the outer electrode shall be Flux: immersed in ethanol solution with a rosin content covered with new solder seamlessly. of 25(wt)% for 5 s to 10 s Solder: Sn-3.0Ag-0.5Cu solder Pre-heating: 150°C±10°C/60 s to 90 s Solder temperature: 240°C±5°C Immersion time: 3 s±1 s Appearance: No significant mechanical Flux: immersed in ethanol solution with a rosin content damage shall be observed. of 25(wt)% for 5 s to 10 s Inductance change rate: within ±10% Solder: Sn-3.0Ag-0.5Cu solder Pre-heating: 150°C±10°C/1 min to 2 min Solder temperature: 270°C±5°C Immersion time: 10 s±1 s Post-treatment: left at a room condition for 24 h±2 h 9. Environmental Performance The product is soldered on a glass-epoxy substrate for test. No. Item Specification 9.1 Humidity Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% 9.2 Heat life Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% 9.3 Humidity load Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% 9.4 Temperature cycle Appearance: No significant mechanical damage shall be observed. Inductance change rate: within ±10% Test method Temperature: 40°C±2°C Humidity: 90% (RH) to 95% (RH) Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h Temperature: 125°C±2°C Applied current: Rated current specified in chapter 3 Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h Temperature: 40°C±2°C Humidity: 90% (RH) to 95% (RH) Applied current: Rated current specified in chapter 3 Test time: 1000 h (+48 h, -0 h) Post-treatment: left at a room condition for 24 h±2 h Single cycle conditions: Step 1: -55°C (+0°C, -3°C)/30 min±3 min Step 2: ordinary temperature/2 min to 3 min Step 3: +125°C (+3°C, -0°C)/30 min±3 min Step 4: ordinary temperature/2 min to 3 min Number of testing: 10 cycles Post-treatment: left at a room condition for 24 h±2 h MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 P7/13 10. Specification of Packaging 10.1 Appearance and dimensions of tape (8 mm width/paper tape) A 0.62±0.04 B 1.12±0.04 t 0.8 max. (in mm) 10.2 Taping specifications Packing quantity (Standard quantity) 10000 pcs/reel Packing method The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom tape when the cavities of the carrier tape are punched type). Feed hole position The feed holes on the carrier tape are on the right side when the cover tape (top tape when the cavities of the carrier tape are punched type) is pulled toward the user. Joint The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are seamless. Number of missing products Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 10.3 Break down force of tape Cover tape (or top tape) 5 N min. Bottom tape (only when the cavities of the carrier tape are punched type) 5 N min. 10.4 Peeling off force of tape Speed of peeling off Peeling off force 300 mm/min 0.1 N to 0.6 N (The lower limit is for typical value.) MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 P8/13 10.5 Dimensions of leader section, trailer section and reel A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.) 10.6 Marking for reel Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: (1) Factory code  □□ ○○○○ (2) Date First digit: year/last digit of year (1) (2) (3) Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No. *2 Expression of RoHS marking: (1) RoHS regulation conformity ROHSY () (2) Murata classification number (1) (2) 10.7 Marking on outer box (corrugated box) Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc. 10.8 Specification of outer box Label H D W 11. Dimensions of outer box (mm) W D H 186 186 93 Standard reel quantity in outer box (reel) 5 * Above outer box size is typical. It depends on a quantity of an order. Caution 11.1 Restricted applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea (4) Power plant control equipment equipment (5) Medical equipment (6) Transportation equipment (vehicles, (7) Traffic signal (8) Disaster/crime trains, ships, etc.) equipment prevention equipment (9) Data-processing (10) Applications of similar complexity and/or reliability equipment requirements to the applications listed in the above 11.2 Precautions on rating Avoid using in exceeded the rated temperature range, rated voltage, or rated current. Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault. 11.3 Inrush current If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious fault. MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 P9/13 12. Precautions for Use This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand. Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack. The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed. 12.1. Land dimensions The following diagram shows the recommended land dimensions for reflow soldering: a 0.4 b 1.2 c 0.5 (in mm) 12.2 Flux and solder used Flux • Use a rosin-based flux. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux. Solder • Use Sn-3.0Ag-0.5Cu solder. • Standard thickness of solder paste: 100 μm to 150 μm If you want to use a flux other than the above, please consult our technical department. 12.3 Soldering conditions (reflow) • Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Time. (s) Standard profile Limit profile Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s Heating Above 220°C/30 s to 60 s Above 230°C/60 s max. 245°C±3°C 260°C/10 s 2 times 2 times Peak temperature Number of reflow cycles MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 P10/13 12.4 Reworking with soldering iron The following requirements must be met to rework a soldered product using a soldering iron. Item Requirement Pre-heating 150°C/approx. 1 min Tip temperature of soldering iron 350°C max. Power consumption of soldering iron 80 W max. Tip diameter of soldering iron Soldering time ø3 mm max. 3 s (+1 s, -0 s) Number of reworking operations 2 times max. * Avoid a direct contact of the tip of the soldering iron with the product. Such a direction contact may cause cracks in the ceramic body due to thermal shock. 12.5 Solder volume Solder shall be used not to be exceeded the upper limits as shown below. An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance. 12.6 Product's location The following shall be considered when designing and laying out PCBs. (1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (length: a < b) to the mechanical stress. a b 〈 Poor example〉 〈 Good example〉 (2) Components location on PCB separation It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of measures Stress level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D*1 (2) Add slits in the board separation part. A>B (3) Keep the mounting position of the component away from the board separation surface. A>C *1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 P11/13 (3) Mounting components near screw holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 12.7 Handling of substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 12.8 Cleaning The product shall be cleaned under the following conditions. (1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C max. (2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in mounted products and the PCB. Item Requirement Power Time 20 W/L max. 5 min max. Frequency 28 kHz to 40 kHz (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no cleaner is left. * For other cleaning, consult our technical department. 12.9 Storage and transportation Storage period Use the product within 6 months after delivery. If you do not use the product for more than 6 months, check solderability before using it. Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity. The recommended temperature range is -10°C to +40°C. The recommended relative humidity range is 15% to 85%. Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor solderability. • Do not place the products directly on the floor; they should be placed on a palette so that they are not affected by humidity or dust. • Avoid keeping the products in a place exposed to direct sunlight, heat or vibration. • Do not keep products in bulk packaging. Bulk storage could result in collisions between the products or between the products and other parts, resulting in chipping or wire breakage. • Avoid storing the product by itself bare (i.e. exposed directly to air). Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when handling the products. MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 P12/13 12.10 Resin coating (including moisture-proof coating) When the product is coated/molded with resin, its electrical characteristics may change. A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading to wire breakage. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 12.11 Mounting conditions Check the mounting condition before using. Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors, misalignment, or damage to the product. 12.12 Operating environment Do not use this product under the following environmental conditions as it may cause deterioration of product quality. (1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc) (2) In the atmosphere where liquid such as organic solvent, may splash on the products. (3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew. 12.13 Mounting density If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures. If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality, resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating temperature for the product. 13. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD Spec No.: JELF243B_0010T-01 P13/13 Appendix Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included in the rating table.) Perform measurement using the method described below. (Perform correction for the error deriving from the measuring terminal.) (1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole terminal as shown in the figure below. (2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using the respective current and voltage for input/output. Zm= V1 I1 Zx= V2 I2 (3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows. Zx=α Zm-β 1-ZmΓ Here, α = D/A = 1 β = B/D = Zsm - (1 - Yom Zsm) Zss Γ = C/A = Yom Zsm: measured impedance of short chip Zss: residual impedance of short chip (0 nH) Yom: measured admittance when measuring terminal is open (4) Calculate inductance Lx and Qx using the equations shown below. Im(Zx) Lx: inductance of chip coil Lx= 2πf Qx: Q of chip coil Im(Zx) Qx= f: measuring frequency Re(Zx) MURATA MFG CO., LTD