LQG18HN82NJ00D

Reference Only Spec No. JELF243B-0002T-01 P.1/9 CHIP COIL (CHIP INDUCTORS) LQG18HN□□□□00D REFERENCE SPECIFICATION 1. Scope This reference specification applies to LQG18HN series, for Chip coil (Chip Inductors). 2. Part Numbering (ex) LQ G 18 H N Product ID Structure Dimension Applications Category (L×W) and Characteristics 1N2 S 0 0 Inductance Tolerance Features Electrode D Packaging D:Taping *B:BULK *Bulk packing (B) also available 3. Rating ・Operating Temperature Range ・Storage Temperature Range Customer Part Number MURATA Part Number LQG18HN1N2S00D LQG18HN1N5S00D LQG18HN1N8S00D LQG18HN2N2S00D LQG18HN2N7S00D LQG18HN3N3S00D LQG18HN3N9S00D LQG18HN4N7S00D LQG18HN5N6S00D LQG18HN6N8J00D LQG18HN8N2J00D LQG18HN10NJ00D LQG18HN12NJ00D LQG18HN15NJ00D LQG18HN18NJ00D LQG18HN22NJ00D LQG18HN27NJ00D LQG18HN33NJ00D LQG18HN39NJ00D LQG18HN47NJ00D LQG18HN56NJ00D LQG18HN68NJ00D LQG18HN82NJ00D LQG18HNR10J00D –40°C to + 85°C –55°C to +125°C Inductance (nH) 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 Tolerance Q (min.) DC Resistance (Ω max.) Self Resonant Frequency (MHz min.) 0.10 Rated Current (mA) 1100 6000 S:±0.3nH 0.12 1000 0.15 900 0.20 12 0.30 0.35 0.37 0.50 J: ± 5% 0.54 0.60 0.70 0.75 0.80 0.85 0.90 5000 4000 3500 3000 2800 2600 2300 2000 1700 1500 1200 1100 1000 900 800 800 650 600 500 450 400 350 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Humidity Atmospheric Pressure : 86kPa to 106kPa MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0002T-01 P.2/9 5. Appearance and Dimensions Polarity Marking Electrode 0.8±0.15 1.6±0.15 ■Unit Mass (Typical value) 0.003g 0.8±0.15 (in mm) 0.3±0.2 6. Electrical Performance No. 6.1 Item Inductance Specification Inductance shall meet item 3. 6.2 Q Q shall meet item 3. Test Method Measuring Equipment: KEYSIGHT 4291Aor equivalent Measuring Frequency: 100MHz Measuring Condition: Test signal level/ about 7dBm Electrical length/ 0.94cm Weight/ about 1N to 5N Measuring Fixture: KEYSIGHT 16193A Position coil under test as shown in below and contact coil with each terminal by adding weight. Polarity marking should be a topside,and polarity marking should be in the direction of the fixture for position of chip coil. 1mm Polarity Marking 6.97mm 6.3 6.4 6.5 DC Resistance Self Resonant Frequency (S.R.F) Rated Current DC Resistance shall meet item 3. S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. Measuring Method: the endnote [Electrical Performance: Measuring Method of Inductance/ Q] Measuring Equipment: Digital multi meter Measuring Equipment: KEYSIGHT 8753C or equivalent The rated current is applied. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0002T-01 P.3/9 7. Mechanical Performance No. 7.1 Item Shear Test Specification Chip coil shall not be damaged after tested as test method. Test Method Substrate: Glass-epoxy substrate Land 1.2 1.0 1.0 1.0 im mm Force: 10N Hold Duration: 5s±1s Applied Direction: Parallel to PCB Chip Coil F Substrate 7.2 Bending Test Chip coil shall not be damaged after tested as test method. Substrate: Glass-epoxy substrate (100mm×40mm×1.0mm) Speed of Applying Force: 1mm / s Deflection: 2mm Hold Duration: 30 s Pressure jig R340 F Deflection 45 7.3 Vibration Appearance: No damage Inductance Change: within ±10% 7.4 Solderability The wetting area of the electrode shall be at least 90% covered with new solder coating. 7.5 Resistance to Soldering Heat Appearance: No damage Inductance Change: within ±10% 45 Product (in mm) Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1 min Total Amplitude: 1.5mm Testing Time: A period of 2 hours in each of 3 mutually perpendicular directions. Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C / 60s to 90s Solder Temperature: 240°C±5°C Immersion Time: 3s±1s Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C / 1min to 2min Solder Temperature: 270°C±5°C Immersion Time: 10s±1s Then measured after exposure in the room condition for 24h±2h. 8. Environmental Performance It shall be soldered on the substrate. No. Item Specification 8.1 Humidity Appearance: No damage Inductance Change: within ±10% Test Method Temperature: 40°C±2°C Humidity: 90%(RH) to 95%(RH) Time: 1000h (+48h, -0h) Then measured after exposure in the room condition for 24h±2h. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0002T-01 No. 8.2 Item Heat Life 8.3 Humidity Load 8.4 Temperature Cycle Specification Appearance: No damage Inductance Change: within ±10% P.4/9 Test Method Temperature: 85°C±2°C Current: Rated Current (See the 3.) Time: 1000h (+48h, -0h) Then measured after exposure in the room condition for 24h±2h. Temperature: 40°C±2°C Humidity: 90%(RH) to 95%(RH) Current: Rated Current (See the 3.) Time: 1000h (+48h, -0h) Then measured after exposure in the room condition for 24h±2h. 1 cycle: 1 step: -40°C (+0°C,-3°C) / 30 min±3 min 2 step: Ordinary temp. / 2 min to 3 min 3 step: +85°C (+3°C,-0°C) / 30 min±3 min 4 step: Ordinary temp. / 2 min to 3 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. 9. Specification of Packaging 9.1 Appearance and Dimensions of paper tape (8mm-wide) Polarity marking 0.1 φ1.5± 0 1.85±0.1 3.5±0.05 1.75±0.1 8.0±0.3 2.0±0.05 4.0±0.1 4.0±0.1 1.05±0.1 Direction of Feed (in mm) 1.1max 9.2 Specification of Taping (1) Packing quantity (standard quantity) 4,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Top tape has no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength Top tape Bottom tape 5N min. 9.4 Peeling off force of top tape Speed of Peeling off Peeling off force 165 to 180 degree 300mm / min 0.1N to 0.6N (minimum value is typical) Bottom tape MURATA MFG.CO., LTD Top tape F Base tape Reference Only Spec No. JELF243B-0002T-01 P.5/9 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. 2.0±0.5 Trailer 160 min. Leader Label 190 min. 210 min. Top tape Empty tape  13.0±0.2 +1  60 -0  21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 (in mm) +0  180 -3 9.6 Marking for reel Customer part number, MURATA part number, Inspection number (1), RoHS marking (2), Quantity etc ･･･ □□ OOOO  1) (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (2), Quantity, etc ･･･ 9.8. Specification of Outer Case Label H D W Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5   Above Outer Case size is typical. It depends on a quantity of an order. 10. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability (5) Medical equipment requirements to the applications listed in the above MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0002T-01 P.6/9 11. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Chip Coil Land Solder Resist c a b c a 0.6 to 0.8 1.8 to 2.2 0.6 to 0.8 b (in mm) 11.2 Flux, Solder ・Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste: 100μm to 150μm. 11.3 Reflow soldering conditions ・Inductance value may be changed a little due to the amount of solder. So, the chip coil shall be soldered by reflow so that the solder volume can be controlled. ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ･Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C, 90s±30s above 220°C, 30s～60s above 230°C, 60s max. 245°C±3°C 260°C, 10s 2 times 2 times MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0002T-01 P.7/9 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating Tip temperature Soldering iron output Tip diameter Soldering time Times 150°C, 1 min 350°C max. 80W max. Φ3mm max. 3(+1, -0)s 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・Solder shall be used not to be exceed the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable t 1/3T≦t≦T T： thickness of product 11.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 Products shall be located in the sideways direction (Length: a‹b) to the mechanical stress. 〈 Good example〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C Perforation C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommend MURATA MFG.CO., LTD Spec No. JELF243B-0002T-01 Reference Only P.8/9 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 11.9 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.10 Storage and Handing Requirements (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C to 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ・Products should be stored under the airtight packaged condition. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. MURATA MFG.CO., LTD Reference Only Spec No. JELF243B-0002T-01 P.9/9 12．! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I2 I1 A Zm B V2 V1 C Test Head D Test fixture Zx V1 I1 = A B C D V2 I2 Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. V1 V2 Zm= I Zx= I 2 ， 1 (3) Thus, the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx=  1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm:measured impedance of short chip Zss:residual impedance of short chip (0.771nH) Yom:measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Lx= Qx= 2πf ， Re(Zx) Lx : Inductance of chip coil Qx: Q of chip coil f : Measuring frequency MURATA MFG.CO., LTD