Reference Only
SpecNo.JELF243A-0053R-01
CHIP COIL(CHIP INDUCTORS)LQH2MCN□□□□02L
P1/8
REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQH2MCN_02 series, Chip coil (Chip Inductors).
2.Part Numbering
(ex)
LQ
H
2M
C
N
Product ID Structure Dimension Applications
(L×W)
and
Characteristics
100
K
0
2
Category Inductance Tolerance Features
L
Electrode
Packaging
L:Taping
3.Rating
Operating Temperature Range.
Storage Temperature Range.
Customer
Part Number
-40 to +85°C
-40 to +85°C
Inductance
MURATA
Part Number
(µH)
Tolerance
DC
Resistance
()
Self
Resonant
Frequency
(MHz min)
*Rated
Current
(mA)
LQH2MCN1R0M02L
1.0
0.30 ±30%
100
485
LQH2MCN1R5M02L
1.5
0.40 ±30%
95
445
LQH2MCN2R2M02L
2.2
0.48 ±30%
70
425
LQH2MCN3R3M02L
3.3
0.60 ±30%
65
375
LQH2MCN4R7M02L
4.7
0.8 ±30%
60
300
LQH2MCN5R6M02L
5.6
0.9 ±30%
60
280
LQH2MCN6R8M02L
6.8
1.0 ±30%
55
255
LQH2MCN8R2M02L
8.2
1.1 ±30%
50
235
LQH2MCN100K02L
10
1.2 ±30%
48
225
LQH2MCN120K02L
12
1.4 ±30%
44
210
LQH2MCN150K02L
15
1.6 ±30%
40
200
LQH2MCN180K02L
18
1.8 ±30%
35
190
LQH2MCN220K02L
22
2.1 ±30%
30
185
LQH2MCN270K02L
27
2.5 ±30%
30
180
LQH2MCN330K02L
33
2.8 ±30%
28
160
LQH2MCN390K02L
39
4.4 ±30%
24
125
LQH2MCN470K02L
47
5.1 ±30%
18
120
LQH2MCN560K02L
56
5.7 ±30%
17
110
LQH2MCN680K02L
68
6.6 ±30%
14
100
LQH2MCN820K02L
82
7.5 ±30%
14
90
M:±20%
K:±10%
*When applied Rated current to the Products, Inductance will be within ± 10% of initial Inductance value.
When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited to
40℃ max.
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature (15 to 35°C)
Humidity
: Ordinary Humidity
(25 to 85 %(RH))
《In case of doubt》
Temperature : 20 ± 2°C
Humidity
: 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0053R-01
P2/8
0.90±0.05
0.1 min.
5.Appearance and Dimensions
2.0±0.2
1.6±0.2
1.0±0.2
■Unit Mass (Typical value)
0.010g
No marking.
0.6±0.2
0.8±0.2
0.6±0.2
(in mm )
6.Electrical Performance
No.
6.1
Item
Inductance
Specification
Inductance shall meet item 3.
6.2
6.3
DC Resistance
Self Resonant
Frequency(S.R.F)
Rated Current
DC Resistance shall meet item 3.
S.R.F shall meet item 3.
6.4
Self temperature rise shall be limited
to 40°C max.
Inductance Change: within ± 10%
Test Method
Measuring Equipment : Agilent 4192A or equivalent
Measuring Frequency:1MHz
Measuring Equipment:Digital multi meter
Measuring Equipment: Agilent 4991A or equivalent
The rated current is applied.
7.Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip coil shall not be damaged.
Test Method
Substrate: Glass-epoxy substrate
Chip coil
Force: 5N
Hold Duration: 5±1s
F
Substrate
7.2
Bending Test
Substrate: Glass-epoxy substrate
(100×40×0.8mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 5seconds.
Pressure jig
R230
F
Deflection
45
7.3
Vibration
45
Product
(in mm)
Oscillation Frequency: 10~55~10Hz for 1 minute
Total Amplitude: 1.5mm
Testing Time: A period of 2 hours in each of 3
mutually perpendicular directions.
(Total 6 hours)
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0053R-01
No.
7.4
Item
Solderability
Specification
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
7.5
Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±5%
P3/8
Test Method
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 80 to 120°C / 10 to 30seconds.
Solder Temperature: 245±3°C
Immersion Time: 3±1 s
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 1 to 2 minutes
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room condition
for 24±2 hours.
8.Environmental Performance (It shall be soldered on the substrate.)
No.
8.1
Item
Heat Resistance
8.2
Cold Resistance
8.3
Humidity
8.4
Temperature
Cycle
Specification
Appearance:No damage
Inductance Change: within ± 5%
DC Resistance Change:
within ± 5%
Test Method
Temperature: 85±2°C
Time: 1000± 48
0 hours
Then measured after exposure in the room condition
for 24±2 hours.
Temperature: -40±2°C
48
Time: 1000± 0 hours
Then measured after exposure in the room condition
for 24±2 hours.
Temperature: 40±2°C
Humidity: 90~95%(RH)
48
Time: 1000± 0 hours
Then measured after exposure in the room condition
for 24±2 hours.
1 cycle:
1 step: -40±2°C / 30±3 minutes
2 step:Ordinary temp. / 10 to 15 minutes
3 step:+85±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the room condition
for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
+0.1
1.5 -0
※ Lead- in/out wire
1.75±0.1
(0.25)
4.0±0.1
4.0±0.1
1.9±0.1
in taping are unified with the in/out
positions of the lead wire.
8.0±0.2
2.3±0.1
3.5±0.05
※The packing directions of the chip coil
2.0±0.05
Direction of feed
1.05±0.1
Dimension of the Cavity is measured at the bottom side.
MURATA MFG.CO., LTD
(in mm)
Reference Only
SpecNo.JELF243A-0053R-01
P4/8
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
Cover tape
10N min.
10N min.
165 to 180 degree
9.4 Peeling off force of cover tape
Speed of Peeling off
F
300mm/min
0.2 to 0.7N
(minimum value is typical)
Peeling off force
Cover tape
Plastic tape
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Trailer : 160 min.
Leader
2.0±0.5
190 min
Label
210 min
Empty tape Cover tape
13.0±0.2
60± 1
0
21.0±0.8
9± 1
0
Direction of feed
13±1.4
(in mm)
0
180± 3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS Marking(2), Quantity etc ・・・
□□ OOOO
1)
(1)
(1) Factory Code
(2) Date
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS Marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (2) ,Quantity, etc ・・・
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0053R-01
P5/8
9.8. Specification of Outer Case
Label
H
D
Outer Case Dimensions
Standard Reel Quantity in Outer
(mm)
Case (Reel)
W
D
H
186
186
93
5
Above Outer Case size is typical. It depends on a quantity of an order
W
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(7) Traffic signal equipment
(2) Aerospace equipment
(8) Disaster prevention / crime prevention equipment
(3) Undersea equipment
(9) Data-processing equipment
(4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment
to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
11. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
2.6
Chip Coil
Land
1.0
Solder Resist
(in mm)
0.8
11.2 Flux, Solder
・Use rosin-based flux.
・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder
Solder
・Standard thickness of solder paste : 100μm to 150μm
Other flux (except above) Please contact us for details, then use.
Flux
11.3 soldering conditions (Reflow)
Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0053R-01
Temp.
P6/8
260℃
245℃±3℃
220℃
(℃)
230℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Time(s)
Standard Profile
150~180°C 、90s±30s
above 220°C、30s~60s
245±3°C
2 times
Limit Profile
above 230°C、60s max.
260°C,10s
2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
Tip temperature
350°C max.
Soldering iron output
80W max.
Tip diameter
φ3mm max.
*Reworking should be limited to only once.
Soldering time
3 s max.
Times
1 time
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
・ Solder shall be used not to be exceeded the upper limits as shown below.
・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable
T
1/3T≦ t ≦T
(T: Lower flange thickness)
t
11.6 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
a
b
〈 Poor example 〉
〈 Good example〉
Products shall be located in the sideways
direction (Length:ab) to the mechanical
stress.
MURATA MFG.CO., LTD
SpecNo.JELF243A-0053R-01
Reference Only
(2) Products location on P.C.B. separation
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of ACB D.
11.7
Seam
b
P7/8
C
B
D
A
Slit
Length:a b
a
Cleaning Conditions
Products shall be cleaned on the following conditions. But, Products can be used without cleaning,too.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please
pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to
use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
11.9 Temperature rating of the circuit board and components located around
Temperature may rise up to max. 40 ℃ when applying the rated current to the Products.
Be careful of the temperature rating of the circuit board and components located around.
11.10 Caution for use
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be
touched to the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw
to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0053R-01
P8/8
11.12 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
Products should not be stored on bulk packaging condition to prevent the chipping of the core and the
breaking of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD